ELM-TECH ELM18807BA-S

Dual P-channel MOSFET
ELM18807BA-S
■General description
■Features
ELM18807BA-S uses advanced trench technology to
provide excellent Rds(on) and low gate charge. Internal
ESD protection is included.
•
•
•
•
•
•
■Maximum absolute ratings
Parameter
Drain-source voltage
Gate-source voltage
Ta=25°C
Ta=70°C
Continuous drain current
Pulsed drain current
Vds=-12V
• ESD Protected
Id=-6.5A (Vgs=-4.5V)
Rds(on) < 20mΩ (Vgs=-4.5V)
Rds(on) < 24mΩ (Vgs=-2.5V)
Rds(on) < 30mΩ (Vgs=-1.8V)
Rds(on) < 36mΩ (Vgs=-1.5V)
Symbol
Vds
Limit
-12
Unit
V
Vgs
±8
V
Id
-6.5
-5.0
A
Idm
Ta=25°C
Power dissipation
Ta=70°C
Junction and storage temperature range
-60
1.4
Pd
0.9
-55 to 150
Tj, Tstg
Note
A
3
W
2
°C
■Thermal characteristics
Parameter
Symbol
Maximum junction-to-ambient
Maximum junction-to-ambient
Maximum junction-to-lead
t≤10s
Steady-state
Steady-state
Typ.
Max.
Unit
Note
73
96
63
90
125
75
°C/W
°C/W
°C/W
1
1, 4
Rθja
Rθjl
■Pin configuration
TSSOP-8(TOP VIEW)
1
8
2
7
3
6
4
5
■Circuit
Pin No. Pin name Pin No. Pin name
1
DRAIN1
5
GATE2
2
SOURCE1
6
SOURCE2
3
4
SOURCE1
GATE1
D2
D1
G1
Rg
7
8
G2
Rg
S2
S1
4- 1
SOURCE2
DRAIN2
Dual P-channel MOSFET
ELM18807BA-S
■Electrical characteristics
Parameter
STATIC PARAMETERS
Drain-source breakdown voltage
Zero gate voltage drain current
Gate-body leakage current
Gate threshold voltage
On state drain current
Symbol
Condition
Min.
BVdss Id=-250μA, Vgs=0V
-12
Idss
Vds=-12V, Vgs=0V
Static drain-source on-resistance
Tj=125°C
Rds(on) Vgs=-2.5V, Id=-6A
Vgs=-1.8V, Id=-5.5A
Vgs=-1.5V, Id=-5A
Forward transconductance
Gfs Vds=-5V, Id=-6.5A
Diode forward voltage
Vsd Is=-1A, Vgs=0V
Max. body-diode continuous current
Is
DYNAMIC PARAMETERS
Input capacitance
Ciss
Output capacitance
Coss Vgs=0V, Vds=-6V, f=1MHz
Reverse transfer capacitance
Crss
Gate resistance
Rg Vgs=0V, Vds=0V, f=1MHz
SWITCHING PARAMETERS
Total gate charge
Qg
Gate-source charge
Qgs Vgs=-4.5V, Vds=-6V, Id=-6.5A
Gate-drain charge
Qgd
Turn-on delay time
td(on)
Vgs=-4.5V, Vds=-6V
Turn-on rise time
tr
Turn-off delay time
td(off) RL=0.9Ω, Rgen=3Ω
Turn-off fall time
tf
Body diode reverse recovery time
trr If=-6.5A, dl/dt=100A/μs
Body diode reverse recovery charge
Qrr If=-6.5A, dl/dt=100A/μs
NOTE :
V
Tj=55°C
Igss Vds=0V, Vgs=±8V
Vgs(th) Vds=Vgs, Id=-250μA
Id(on) Vgs=-4.5V, Vds=-5V
Vgs=-4.5V
Id=-6.5A
Typ.
-0.35
-60
Ta=25°C
Max. Unit
-0.53
16
23
19
23
28
45
-0.56
-1
-5
±10
-0.85
20
28
24
30
36
-1.00
-1.4
1740
334
200
1.3
2100
19.0
4.5
5.3
240.0
580.0
7.0
4.2
22
17
23.0
1.7
27
μA
μA
V
A
mΩ
S
V
A
pF
pF
pF
kΩ
nC
nC
nC
ns
ns
ns
ns
ns
nC
1. The value of Rθja is measured with the device mounted on 1in² FR-4 board with 2oz. Copper, in still air environment
with Ta=25°C. The value in any given applications depends on the user's specific board design.
2. The power dissipation Pd is based on Tj(Max.)=150°C, using ≤ 10s junction-to-ambient thermal resistance.
3. Repetitive rating, pulse width limited by junction temperature Tj(Max.)=150°C. Ratings are based on low frequency
and duty cycles to keep initial Tj=25°C.
4. The Rθja is the sum of the thermal impedence from junction to lead Rθjl and lead to ambient.
5. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
6. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted
on 1in2 FR-4 board with 2oz. Copper, assuming a maximum junction temperature of Tj(Max.)=150°C. The SOA
curve provides a single pulse rating.
4- 2
Dual P-channel MOSFET
AO8807
ELM18807BA-S
■Typical electrical and thermal characteristics
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
60
60
-4.5V
50
-2.5V
-3V
40
40
-2V
-ID(A)
-ID (A)
VDS=-5V
50
30
30
20
20
VGS=-1.5V
10
125°C
10
0
25°C
0
0
1
2
3
4
5
0
45
Normalized On-Resistance
VGS=-1.5V
35
VGS=-2.5V
30
VGS=-1.8V
25
20
15
VGS=-4.5V
10
0
1.5
2
2.5
3
2
4
6
8
10
12
14
ID=-6A, VGS=-2.5V
1.4
ID=-6.5A, VGS=-4.5V
1.2
ID=-5A, VGS=-1.5V
ID=-5.5A, VGS=-1.8V
1.0
0.8
16
18
20
0
25
-ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage(Note E)
50
75
100
125
150
175
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature(Note E)
1E+01
50
ID=-6.5A
45
1E+00
125°C
40
1E-01
35
30
-IS (A)
RDS(ON) (m�)
1
1.6
40
RDS(ON) (m�)
0.5
-VGS(Volts)
Figure 2: Transfer Characteristics(Note E)
-VDS (Volts)
Figure 1: On-Region Characteristics(Note E)
125°C
25
25°C
1E-02
1E-03
20
1E-04
15
25°C
1E-05
10
0
2
4
6
8
0.0
0.2
0.4
0.6
0.8
1.0
-VSD (Volts)
Figure 6: Body-Diode Characteristics(Note E)
-VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source
Voltage(Note E)
Alpha & Omega Semiconductor, Ltd.
www.aosmd.com
4- 3
Dual P-channel MOSFET
AO8807
ELM18807BA-S
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
2800
4.5
VDS=-6V
ID=-6.5A
4
2400
Capacitance (pF)
-VGS (Volts)
3.5
3
2.5
2
1.5
1
1600
1200
800
0.5
400
0
0
0
4
8
12
16
Ciss
2000
20
Coss
Crss
0
-Qg (nC)
Figure 7: Gate-Charge Characteristics
4
6
8
10
12
-VDS (Volts)
Figure 8: Capacitance Characteristics
100
80
10�s
RDS(ON)
limited
1ms
1
0.1s
10s
0
DC
TJ(Max)=150°C
TA=25°C
0
0.01
1
10
VDS (Volts)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note F)
Z�JA Normalized Transient
Thermal Resistance
10
D=Ton/T
TJ,PK=TA+PDM.Z�JA.R�JA
R�JA=125°C/W
40
20
1s
0.1
TJ(Max)=150°C
TA=25°C
60
100�s
Power (W)
10
ID (Amps)
2
0
0.0001
100
0.001
0.01
0.1
1
10
100
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note F)
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
PD
0.1
0.01
0.00001
Ton
Single Pulse
0.0001
0.001
0.01
0.1
1
T
10
100
1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance(Note F)
Alpha & Omega Semiconductor, Ltd.
www.aosmd.com
4- 4