IXYS IXGH32N120A3

IXGH32N120A3
IXGT32N120A3
GenX3TM 1200V
IGBTs
VCES = 1200V
IC110 = 32A
VCE(sat) ≤ 2.35V
Ultra-Low Vsat PT IGBTs for
up to 3 kHz Switching
TO-268 (IXGT)
Symbol
Test Conditions
Maximum Ratings
VCES
VCGR
TJ = 25°C to 150°C
TJ = 25°C to 150°C, RGE = 1MΩ
VGES
VGEM
1200
1200
V
V
Continuous
Transient
±20
±30
V
V
IC25
IC110
ICM
TC = 25°C
TC = 110°C
TC = 25°C, 1ms
75
32
230
A
A
A
IA
EAS
TC = 25°C
TC = 25°C
20
120
A
mJ
SSOA
VGE = 15V, TJ = 125°C, RG = 20Ω
ICM = 150
A
(RBSOA)
Clamped Inductive Load
PC
TC = 25°C
VCE ≤ 0.8 • VCES
TJ
TJM
Tstg
300
W
-55 ... +150
150
-55 ... +150
°C
°C
°C
TL
1.6mm (0.063in) from Case for 10s
300
°C
TSOLD
Plastic Body for 10s
260
°C
Md
Mounting Torque (TO-247)
1.13/10
Nm/lb.in.
Weight
TO-247
TO-268
6.0
4.0
g
g
G
E
C (Tab)
TO-247 (IXGH)
G
BVCES
IC
= 250μA, VGE = 0V
1200
VGE(th)
IC
= 250μA, VCE = VGE
3.0
ICES
VCE = VCES, VGE = 0V
z
z
V
50 μA
1 mA
IGES
VCE = 0V, VGE = ±20V
±100 nA
VCE(sat)
IC
IC
2.35
= IC110, VGE = 15V, Note 1
= 400A, VGE = 30V, Note 1
© 2011 IXYS CORPORATION, All rights Reserved
11
Optimized for Low Conduction Losses
International Standard Packages
Advantages
z
z
TJ = 125°C
C
= Collector
Tab = Collector
High Power Density
Low Gate Drive Requirement
Applications
V
5.0
C (Tab)
Features
z
Characteristic Values
Min.
Typ.
Max.
E
G = Gate
E = Emitter
z
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified)
C
V
V
z
z
z
z
z
z
z
z
Power Inverters
Capacitor Discharge
UPS
Motor Drives
SMPS
PFC Circuits
Battery Chargers
Welding Machines
Lamp Ballasts
Inrush Current Protection Circuits
DS99608C(03/11)
IXGH32N120A3
IXGT32N120A3
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
gfs
IC = 50A, VCE = 10V, Note 1
14
IC(on)
Cies
Coes
Cres
20
S
VCE = 10V, VGE = 15V, Note 1
94
A
VCE = 25V, VGE = 0V, f = 1MHz
2150
130
14
pF
pF
pF
89
nC
15
nC
34
nC
39
200
140
1240
ns
ns
ns
ns
0.21
0.42 °C/W
°C/W
Qg
IC = 50A, VGE = 15V, VCE = 0.5 • VCES
Qge
Qgc
td(on)
tr
td(off)
tf
Resistive Switching Times, TJ = 25°C
VGE = 20V, VCE = 0.8 • VCES, IC = 100A
RG = 10Ω (External)
RthJC
RthCK
Note
TO-247
1.
TO-247 AD Outline
Pulse test, t ≤ 300μs, duty cycle, d ≤ 2%.
1
2
3
Terminals: 1 - Gate
3 - Emitter
Dim.
Millimeter
Min. Max.
A
4.7
5.3
2.2
2.54
A1
2.2
2.6
A2
b
1.0
1.4
1.65
2.13
b1
b2
2.87
3.12
C
.4
.8
D
20.80 21.46
E
15.75 16.26
e
5.20
5.72
L
19.81 20.32
L1
4.50
∅P 3.55
3.65
Q
5.89
6.40
R
4.32
5.49
S
6.15 BSC
2 - Collector
Inches
Min. Max.
.185 .209
.087 .102
.059 .098
.040 .055
.065 .084
.113 .123
.016 .031
.819 .845
.610 .640
0.205 0.225
.780 .800
.177
.140 .144
0.232 0.252
.170 .216
242 BSC
TO-268 Outline
Terminals: 1 - Gate
3 - Emitter
2, 4 - Collector
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXGH32N120A3
IXGT32N120A3
Fig. 1. Output Characteristics @ T J = 25ºC
Fig. 2. Extended Output Characteristics @ T J = 25ºC
200
250
VGE = 30V
25V
20V
180
160
200
175
15V
IC - Amperes
IC - Amperes
140
120
100
80
10V
15V
150
125
100
60
75
40
50
20
25
0
10V
0
0
1
2
3
4
5
6
0
5
10
VCE - Volts
Fig. 3. Output Characteristics @ T J = 125ºC
Fig. 4. Dependence of VCE(sat) on
Junction Temperature
20
6
VGE = 30V
25V
20V
160
VGE = 15V
5
VCE(sat) - Normalized
180
140
15V
120
100
80
10V
60
40
I
= 192A
3
I
C
= 96A
I
C
= 32A
2
1
0
C
4
20
0
0
1
2
3
4
5
6
7
-50
-25
0
25
50
75
100
125
150
10
11
TJ - Degrees Centigrade
VCE - Volts
Fig. 5. Collector-to-Emitter Voltage
vs. Gate-to-Emitter Voltage
Fig. 6. Input Admittance
100
10
9
TJ = - 40ºC
25ºC
125ºC
90
TJ = 25ºC
80
8
C
70
= 150A
IC - Amperes
I
7
VCE - Volts
15
VCE - Volts
200
IC - Amperes
VGE = 30V
25V
20V
225
6
5
100A
4
60
50
40
30
50A
3
20
2
10
1
0
6
8
10
12
14
16
18
20
22
VGE - Volts
© 2011 IXYS CORPORATION, All rights Reserved
24
26
28
30
3
4
5
6
7
VGE - Volts
8
9
IXGH32N120A3
IXGT32N120A3
Fig. 8. Dependence of BVCES & V(th)GE on
Junction Temperature
Fig. 7. Transconductance
24
1.6
1.18
1.5
1.15
20
g f s - Siemens
16
TJ = - 40ºC
25ºC
125ºC
12
8
V(th)GE
1.12
BVCES
1.3
1.09
1.2
1.06
1.1
1.03
1.0
1.00
0.9
0.97
0.8
0.94
BVCES - Normalized
V(th)GE - Normalized
1.4
4
0
0.7
0
10
20
30
40
50
60
70
80
90
100
-50
-25
0
25
IC - Amperes
75
100
0.91
150
125
TJ - Degrees Centigrade
Fig. 9. Single-Pulsed Avalanche Energy
vs. Junction Temperature
Fig. 10. Resistive Turn-on Rise Time
vs. Gate Voltage
140
1300
I
120
C
RG = 10Ω, IC = 100A
= 20A
VCE = 960V
1100
VGE = 15V
t r - Nanoseconds
Eas - MilliJoules
50
100
80
60
900
700
500
TJ = 125ºC
40
300
20
100
TJ = 25ºC
25
35
45
55
65
75
85
95
105
115
125
8
10
12
14
16
18
20
22
24
26
28
30
VGE - Volts
TJ - Degrees Centigrade
Fig. 12. Capacitance
Fig. 11. Gate Charge
16
10,000
14
VCE = 600V
12
I G = 10mA
f = 1 MHz
Capacitance - PicoFarads
VGE - Volts
I C = 50A
10
8
6
4
Cies
1,000
Coes
100
Cres
2
10
0
0
10
20
30
40
50
60
70
80
90
QG - NanoCoulombs
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
0
5
10
15
20
VCE - Volts
25
30
35
40
IXGH32N120A3
IXGT32N120A3
Fig. 13. Resistive Turn-on Switching Times
vs. Gate Resistance
Fig. 14. Resistive Turn-on Rise Time
vs. Junction Temperature
420
td(on) - - - -
TJ = 125ºC, VGE = 20V
380
340
64
320
61
VCE = 960V
t r - Nanoseconds
58
340
55
I C = 150A
I C = 100A
320
52
300
49
280
46
260
I C = 50A
240
220
10
14
18
22
26
30
34
38
42
46
t d(on) - Nanoseconds
360
RG = 10Ω, VGE = 20V
VCE = 960V
I
300
t r - Nanoseconds
tr
400
67
I C = 100A
260
240
220
200
40
180
37
160
I
25
35
45
55
RG - Ohms
75
85
95
105
115
125
Fig. 16. Resistive Turn-off Switching Times
vs. Gate Resistance
320
RG = 10Ω, VGE = 20V
VCE = 960V
1980
500
1970
450
I
1960
t f - Nanoseconds
TJ = 125ºC
260
240
220
200
TJ = 25ºC
180
C
= 50A, 100A, 150A
400
1950
350
1940
300
1930
250
I C = 100A
1920
1910
tf
1900
TJ = 125ºC, VGE = 20V
200
t d(off) - Nanoseconds
280
t r - Nanoseconds
65
= 50A
C
TJ - Degrees Centigrade
Fig. 15. Resistive Turn-on Rise Time
vs. Collector Current
300
= 150A
280
43
50
C
150
td(off) - - - -
100
VCE = 960V
160
1890
60
65
70
75
80
85
90
95
100
105
110
115
120
50
10
15
20
25
30
IC - Amperes
td(off) - - - -
RG = 10Ω, VGE = 20V
1800
2000
190
1900
170
160
I C = 150A, 100A, 50A
140
130
1300
1200
120
1200
110
125
1100
75
85
95
TJ - Degrees Centigrade
© 2011 IXYS CORPORATION, All rights Reserved
105
115
160
1400
1300
65
170
VCE = 960V
150
140
55
180
1500
1400
45
td(off) - - - -
RG = 10Ω, VGE = 20V
1600
150
35
tf
1700
1500
1100
190
TJ = 125ºC
130
TJ = 25ºC
120
50
60
70
80
90
100
110
IC - Amperes
120
130
140
110
150
t d(off) - Nanoseconds
1700
25
50
200
1800
t d(off) - Nanoseconds
t f - Nanoseconds
200
180
VCE = 960V
1600
45
Fig. 18. Resistive Turn-off Switching Times
vs. Collector Current
t f - Nanoseconds
2000
tf
40
RG - Ohms
Fig. 17. Resistive Turn-off Switching Times
vs. Junction Temperature
1900
35
IXGH32N120A3
IXGT32N120A3
Fig. 19. Reverse-Bias Safe Operating Area
160
140
IC - Amperes
120
100
80
60
40
TJ = 125ºC
20
RG = 20Ω
dv / dt < 10V / ns
0
200
300
400
500
600
700
800
900
1000
1100
1200
VCE - Volts
Fig. 20. Maximum Transient Thermal Impedance
Z(th)JC - ºC / W
1
0.1
0.01
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS REF: IXG_32N120A3(4A)03-04-11-A