NEC MC-7832-HA

DATA SHEET
GaAs MULTI-CHIP MODULE
MC-7832-HA
1 GHz CATV 22 dB PUSH-PULL AMPLIFIER
DESCRIPTION
The MC-7832-HA is a GaAs Multi-chip Module designed for use in input stages in CATV applications up to 1 GHz.
This unit has low distortion, low noise figure and return loss across the entire frequency band.
Reliability and performance uniformity are assured by our stringent quality and control procedures.
FEATURES
• Low distortion
• High linear gain
GL = 22.0 dB MIN. @f = 870 MHz
• Low return loss
ORDERING INFORMATION
Part Number
MC-7832-HA
Order Number
Package
MC-7832-HA-AZ
7-pin special with heatsink
Supplying Form
25 pcs MAX./Tray
(Pb-Free)
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: MC-7832-HA
ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
VDD
30
V
Vi
65.0
dBmV
Operating Case Temperature
TC
−30 to +100
°C
Storage Temperature
Tstg
−40 to +100
°C
Supply Voltage
Input Voltage
Note
Note In case of single tone
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. PG10685EJ01V0DS (1st edition)
Date Published October 2007 NS
Printed in Japan
2007
MC-7832-HA
RECOMMENDED OPERATING CONDITIONS (ZS = ZL = 75 Ω, unless otherwise specified)
Parameter
Supply Voltage
Symbol
Test Conditions
VDD
Input Voltage
Vi
Operating Case Temperature
TC
110 channel, Flat
MIN.
TYP.
MAX.
Unit
23.5
24.0
24.5
V
−
21.0
27.5
dBmV
−30
+25
+85
°C
ELECTRICAL CHARACTERISTICS (TC = 30 ± 5°C, VDD = 24 V, ZS = ZL = 75 Ω, unless otherwise
specified)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
f = 870 MHz
22.0
−
23.0
dB
Linear Gain
GL
Gain Slope
GSlope
f = 40 to 870 MHz
0.6
−
1.4
dB
Gain Flatness 1
GFlatness1
f = 40 to 870 MHz
−0.35
−
+0.35
dB
Gain Flatness 2
GFlatness2
f = 40 to 1 000 MHz
−0.35
−
+0.85
dB
Noise Figure 1
NF1
f = 50 MHz
−
−
6.0
dB
Noise Figure 2
NF2
f = 870 MHz
−
−
6.5
dB
180
−
240
mA
Operating Current
IDD
RF OFF (Pin = None)
Composite Triple Beat
CTB
110 channel,
−
−
−57
dBc
Cross Modulation
XM
VO = 44 dBmV, Flat
−
−
−50
dBc
−
−
−57
dBc
Composite 2nd Order Beat
CSO
Input Return Loss 1
RLi1
f = 40 to 160 MHz
20.0
−
−
dB
Input Return Loss 2
RLi2
f = 160 to 320 MHz
19.0
−
−
dB
Input Return Loss 3
RLi3
f = 320 to 640 MHz
17.5
−
−
dB
Input Return Loss 4
RLi4
f = 640 to 870 MHz
16.0
−
−
dB
Input Return Loss 5
RLi5
f = 870 to 1 000 MHz
10.5
−
−
dB
Output Return Loss 1
RLo1
f = 40 to 160 MHz
20.0
−
−
dB
Output Return Loss 2
RLo2
f = 160 to 320 MHz
19.0
−
−
dB
Output Return Loss 3
RLo3
f = 320 to 640 MHz
17.5
−
−
dB
Output Return Loss 4
RLo4
f = 640 to 870 MHz
16.0
−
−
dB
Output Return Loss 5
RLo5
f = 870 to 1 000 MHz
13.5
−
−
dB
2
Data Sheet PG10685EJ01V0DS
MC-7832-HA
PACKAGE DIMENSIONS
7-PIN SPECIAL WITH HEATSINK (UNIT: mm)
8.1 MAX.
38.1±0.25
+0.25
φ 4.25–0.35
27.5 MAX.
4.0±0.25
14.85 MAX.
3.2 MAX.
45.08 MAX.
19.05±0.38
25.4±0.25
6-32UNC2B
0.51±0.05
10.75±0.25
7 8 9
2.62±0.35
5
12.9 MAX.
1 2 3
21.5 MAX.
4.19±0.13
2.54±0.25
A
2.54±0.38
6.3
0.51±0.05
2.5
0.38.. A
±0.05
PIN CONNECTION
VDD
5
1
9
IN
OUT
2
3
7
8
GND
Data Sheet PG10685EJ01V0DS
3
MC-7832-HA
NOTES ON CORRECT USE
(1) The space between PC board and root of the lead should be kept more than 1 mm to prevent undesired stress
to the lead and also should be kept less than 4 mm to prevent undesired parasitic inductance.
Recommended that space is 2.0 to 3.0 mm typical.
(2) Recommended torque strength of the screw is 59 to 78 Ncm.
(3) Form the ground pattern as wide as possible to minimize ground impedance.
(to prevent undesired oscillation)
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Pin Part Heating
Soldering Conditions
Pin area temperature (pin temperature)
Soldering time (per pin of device)
: 350°C or below
Recommended Condition Symbol
Note
: 3 seconds or less
Note The point of pin part heating must be kept more than 1.2 mm distance from the root of lead.
4
Data Sheet PG10685EJ01V0DS
−
MC-7832-HA
• The information in this document is current as of October, 2007. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not
all products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
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written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
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property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
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The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
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defined above).
M8E 02. 11-1
Data Sheet PG10685EJ01V0DS
5
MC-7832-HA
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.