DATA SHEET GaAs INTEGRATED CIRCUIT μPG2408TB 0.05 to 3.0 GHz SPDT SWITCH DESCRIPTION The μPG2408TB is a GaAs MMIC for L, S-band SPDT (Single Pole Double Throw) switch for 2.4 GHz wireless LAN, mobile phone and other L, S-band applications. This device operates with dual control switching voltages of 2.5 to 5.3 V. This device can operate at frequencies from 0.05 to 3.0 GHz, with low insertion loss and high isolation. This device is housed in a 6-pin super minimold package (SC-88/SOT-363 type), and is suitable for high-density surface mounting. FEATURES • Switch control voltage : Vcont (H) = 3.0 V TYP. : Vcont (L) = 0 V TYP. • Low insertion loss : Lins = 0.40 dB TYP. @ f = 1.0 GHz : Lins = 0.50 dB TYP. @ f = 2.5 GHz • High isolation : ISL = 27 dB TYP. @ f = 1.0 GHz : ISL = 18 dB TYP. @ f = 2.5 GHz • Handling power : Pin (0.1 dB) = +29.0 dBm TYP. @ f = 0.5 to 3.0 GHz • High-density surface mounting : 6-pin super minimold package (SC-88/SOT-363 type) (2.0 × 1.25 × 0.9 mm) APPLICATIONS • L, S-band digital cellular or cordless telephone • W-LAN, WLL and BluetoothTM etc. ORDERING INFORMATION Part Number μPG2408TB-E4 Order Number μPG2408TB-E4-A Package 6-pin super minimold Marking G5P Supplying Form • Embossed tape 8 mm wide (SC-88/SOT-363 type) • Pin 4, 5, 6 face the perforation side of the tape (Pb-Free) • Qty 3 kpcs/reel Remark To order evaluation samples, please contact your nearby sales office. Part number for sample order: μPG2408TB Caution Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PG10770EJ01V0DS (1st edition) Date Published July 2009 NS Printed in Japan 2009 μPG2408TB PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) (Top View) RF1 2 3 G5P 1 6 1 5 2 Vcont1 6 6 1 5 2 Pin No. Pin Name 1 RF1 2 GND 3 RF2 4 Vcont2 5 RFC 6 Vcont1 RFC GND 5 Vcont2 RF2 4 (Bottom View) 3 4 4 3 SW TRUTH TABLE ON Path Vcont1 Vcont2 RFC-RF1 Low High RFC-RF2 High Low ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Parameter Symbol Switch Control Voltage Ratings Vcont +6.0 Unit Note V Input Power Pin +33.0 dBm Operating Ambient Temperature TA −45 to +85 °C Storage Temperature Tstg −55 to +150 °C Note ⎪Vcont1 − Vcont2⎪ ≤ 6.0 V RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified) Parameter Symbol MIN. TYP. MAX. Unit f 0.05 − 3.0 GHz Switch Control Voltage (H) Vcont (H) 2.5 3.0 5.3 V Switch Control Voltage (L) Vcont (L) −0.2 0 0.2 V Control Voltage Difference ΔVcont (H), ΔVcont (L)Note −0.1 0 0.1 V Operating Frequency Note ΔVcont (H) = Vcont1 (H) − Vcont2 (H) ΔVcont (L) = Vcont1 (L) − Vcont2 (L) 2 Data Sheet PG10770EJ01V0DS μPG2408TB ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, DC blocking capacitors = 56 pF, unless otherwise specified) Parameter Symbol Test Conditions Note 1 MIN. TYP. MAX. Unit − 0.40 0.55 dB Insertion Loss 1 Lins1 f = 0.05 to 0.5 GHz Insertion Loss 2 Lins2 f = 0.5 to 1.0 GHz − 0.40 0.55 dB Insertion Loss 3 Lins3 f = 1.0 to 2.0 GHz − 0.48 0.63 dB Insertion Loss 4 Lins4 f = 2.0 to 2.5 GHz − 0.50 0.65 dB Insertion Loss 5 Lins5 f = 2.5 to 3.0 GHz − 0.56 0.70 dB 24 27 − dB Note 1 Isolation 1 ISL1 f = 0.05 to 0.5 GHz Isolation 2 ISL2 f = 0.5 to 1.0 GHz 24 27 − dB Isolation 3 ISL3 f = 1.0 to 2.0 GHz 16 19 − dB Isolation 4 ISL4 f = 2.0 to 2.5 GHz 15 18 − dB Isolation 5 ISL5 f = 2.5 to 3.0 GHz 14 17 − dB 15 20 − dB 15 20 − dB 15 20 − dB 15 20 − dB +27.0 +29.0 − dBm f = 0.5 to 3.0 GHz − +29.0 − dBm f = 0.5 to 3.0 GHz, 2 tone, − +60 − dBm Input Return Loss 1 RLin1 f = 0.05 to 0.5 GHz Input Return Loss 2 RLin2 f = 0.5 to 3.0 GHz Output Return Loss 1 RLout1 f = 0.05 to 0.5 GHz Output Return Loss 2 RLout2 f = 0.5 to 3.0 GHz 0.1 dB Loss Compression Input Power Pin (0.1 dB) Note 2 Input 3rd Order Intercept Point IIP3 Note 1 Note 1 f = 2.0/2.5 GHz 5 MHz spicing Switch Control Current Icont No RF input − 0.3 20 μA Switch Control Speed tSW 50% CTL to 90/10% RF − 50 500 ns Notes 1. DC blocking capacitors = 1 000 pF at f = 0.05 to 0.5 GHz 2. Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of linear range. Caution It is necessary to use DC blocking capacitors with this device. The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. The range of recommended DC blocking capacitor value is less than 100 pF for frequencies above 0.5 GHz, and 1 000pF for frequencies above 0.5 GHz. Data Sheet PG10770EJ01V0DS 3 μPG2408TB EVALUATION CIRCUIT C2 C1 1 Vcont1 RF1 6 2 RFC 5 C1 Note 3 Vcont2 RF2 4 C1 C2 Note C1 : 0.05 to 0.5 GHz : 0.5 to 3.0 GHz 1 000 pF 56 pF C2 : 1 000 pF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. APPLICATION INFORMATION C1 Switch C1 LESD C1 • LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the antenna. • The value may be tailored to provide specific electrical responses. • The RF ground connections should be kept as short as possible and connected to directly to a good RF ground for best performance. 4 Data Sheet PG10770EJ01V0DS μPG2408TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD Vcont1 Vc1 RF1 OUT 1 C2 C 1 IN C1 C 2 C1 G5P RFC C1 C2 C 1 C1 C2 OUT 2 RF2 Vc2 6pin SMM SPDT SW Vcont2 USING THE NEC EVALUATION BOARD Symbol C1 C2 Test Conditions Values f = 0.05 to 0.5 GHz 1 000 pF f = 0.5 to 3.0 GHz 56 pF 1 000 pF Data Sheet PG10770EJ01V0DS 5 μPG2408TB TYPICAL CHARACTERISTICS (TA = +25°C, DC blocking capacitors = 56 pF, unless otherwise specified) RFC-RF1/RF2 ISOLATION vs. FREQUENCY RFC-RF1/RF2 INSERTION LOSS vs. FREQUENCY 0 –0.1 Vcont (H) = 3.0 V –5 –0.2 Isolation ISL (dB) Insertion Loss Lins (dB) Vcont (H) = 3.0 V –0.3 –0.4 –10 –15 –20 –25 –30 –0.5 –35 –0.6 0.0 0.5 1.0 1.5 2.0 2.5 –40 0.0 3.0 2.0 2.5 3.0 RFC-RF1/RF2 INPUT RETURN LOSS vs. FREQUENCY RFC-RF1/RF2 OUTPUT RETURN LOSS vs. FREQUENCY 0 Output Return Loss RLout (dB) –5 –10 –15 –20 –25 –30 0.0 0.5 1.0 1.5 2.0 2.5 Vcont (H) = 3.0 V –5 –10 –15 –20 –25 –30 0.0 3.0 0.5 1.0 1.5 2.0 2.5 Frequency f (GHz) Frequency f (GHz) RFC-RF1/RF2 INSERTION LOSS, Icont vs. SWITCH CONTROL VOLTAGE (H) RFC-RF1/RF2 ISOLATION vs. SWITCH CONTROL VOLTAGE (H) 6 f = 2.5 GHz Icont: No RF Input –0.3 f = 2.5 GHz 5 4 –0.4 Lins –0.5 3 –0.6 2 Icont 1 –0.7 –0.8 2.0 2.5 3.0 3.5 4.0 4.5 3.0 0 0 5.0 –5 Isolation ISL (dB) –0.2 Switch Control Current Icont (μA) Input Return Loss RLin (dB) 1.5 Frequency f (GHz) Vcont (H) = 3.0 V Insertion Loss Lins (dB) 1.0 Frequency f (GHz) 0 –10 –15 –20 –25 –30 –35 –40 2.0 2.5 3.0 3.5 4.0 4.5 Switch Control Voltage (H) Vcont (H) (V) Switch Control Voltage (H) Vcont (H) (V) Remark The graphs indicate nominal characteristics. 6 0.5 Data Sheet PG10770EJ01V0DS 5.0 μPG2408TB RFC-RF1/RF2 OUTPUT RETURN LOSS vs. SWITCH CONTROL VOLTAGE (H) RFC-RF1/RF2 INPUT RETURN LOSS vs. SWITCH CONTROL VOLTAGE (H) 0 f = 2.5 GHz Output Return Loss RLout (dB) Input Return Loss RLin (dB) –10 –15 –20 –25 –30 –35 –40 –45 0.1 dB Loss Compression Input Power Pin (0.1 dB) (dBm) 2.5 3.0 3.5 4.0 4.5 –10 –15 –20 –25 –30 –35 –40 –45 –50 2.0 5.0 2.5 3.0 3.5 4.0 4.5 Switch Control Voltage (H) Vcont (H) (V) Switch Control Voltage (H) Vcont (H) (V) RFC-RF1/RF2 Pin (0.1 dB) vs. SWITCH CONTROL VOLTAGE (H) RFC-RF1/RF2 INSERTION LOSS, Icont vs. INPUT POWER 5.0 6 0 36 f = 2.5 GHz –0.5 34 Insertion Loss Lins (dB) 0.1 dB Loss Compression Input Power Pin (0.1 dB) (dBm) –50 2.0 f = 2.5 GHz –5 32 30 28 f = 2.5 GHz Vcont (H) = 3.0 V Lins –1.0 4 –1.5 3 –2.0 2 1 –2.5 26 5 Switch Control Current Icont (μA) 0 –5 Icont 24 2.0 2.5 3.0 3.5 4.0 4.5 5.0 –3.0 15 20 25 30 0 35 Input Power Pin (dBm) Switch Control Voltage (H) Vcont (H) (V) RFC-RF1/RF2 Pin (0.1 dB) vs. FREQUENCY 38 DC blocking capacitors: f = 0.5 to 3.0 GHz 56 pF f < 0.5 GHz 1 000 pF 36 34 32 Vcont (H) = 3.0 V 30 28 26 24 22 20 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Frequency f (GHz) Remark The graphs indicate nominal characteristics. Data Sheet PG10770EJ01V0DS 7 μPG2408TB MOUNTING PAD LAYOUT DIMENSIONS 6-PIN SUPER MINIMOLD (SC-88/SOT-363 type) (UNIT: mm) 1.9 0.8 0.4 0.65 0.65 Remark The mounting pad layout in this document is for reference only. When designing PCB, please consider workability of mounting, solder joint reliability, prevention of solder bridge and so on, in order to optimize the design. 8 Data Sheet PG10770EJ01V0DS μPG2408TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (SC-88/SOT-363 type) (UNIT: mm) 2.1±0.1 0.2+0.1 –0.05 0.65 0.65 1.3 Data Sheet PG10770EJ01V0DS 0.15+0.1 –0.05 0 to 0.1 0.7 0.1 MIN. 0.9±0.1 2.0+0.15 –0.20 1.25±0.1 9 μPG2408TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Wave Soldering Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260°C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260°C or below Time at peak temperature : 10 seconds or less IR260 WS260 Preheating temperature (package surface temperature) : 120°C or below Partial Heating Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Caution Do not use different soldering methods together (except for partial heating). 10 Data Sheet PG10770EJ01V0DS HS350 μPG2408TB Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A. • The information in this document is current as of July, 2009. 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"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E0904E Data Sheet PG10770EJ01V0DS 11 μPG2408TB Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth.