DATA SHEET GaAs INTEGRATED CIRCUIT μPG2185T6R SPDT SWITCH FOR 2 GHz TO 6 GHz <R> DESCRIPTION The μPG2185T6R is a GaAs MMIC SPDT (Single Pole Double Throw) switch which was designed for 2 GHz to 6 GHz applications, including dual-band wireless LAN. This device can operate frequency from 2 GHz to 6 GHz, having the low insertion loss and high isolation. This device is housed in a 6-pin plastic TSSON (Thin Shrink Small Out-line Non-leaded) package. And this package is able to high-density surface mounting. <R> FEATURES • Operating frequency • Switch control voltage : f = 2.0 to 6.0 GHz : Vcont (H) = 2.8 to 3.3 V (3.0 V TYP.) : Vcont (L) = −0.2 to 0.2 V (0 V TYP.) • Low insertion loss : Lins1 = 0.40 dB TYP. @ f = 2.0 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Lins2 = 0.50 dB TYP. @ f = 2.5 to 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V • High isolation : ISL1 = 26 dB TYP. @ f = 2.0 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : ISL2 = 25 dB TYP. @ f = 2.5 to 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V • Handling power : Pin (1 dB) = +30.5 dBm TYP. @ f = 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Pin (1 dB) = +30.5 dBm TYP. @ f = 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V • High-density surface mounting : 6-pin plastic TSSON package (1.0 × 1.0 × 0.37 mm) APPLICATIONS • Wireless LAN (IEEE802.11a/b/g/n) <R> • UWB, near field communications ORDERING INFORMATION Part Number Order Number μPG2185T6R-E2 μPG2185T6R-E2-A Package Marking 6-pin plastic TSSON G8 (Pb-Free) Supplying Form • Embossed tape 8 mm wide • Pin 1, 6 face the perforation side of the tape • Qty 5 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: μPG2185T6R Caution Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PG10719EJ02V0DS (2nd edition) Date Published August 2008 NS Printed in Japan The mark <R> shows major revised points. The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field. 2008 μPG2185T6R PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) 1 G8 2 6 1 6 6 1 5 2 5 5 2 4 3 (Bottom View) (Top View) 4 3 4 3 Pin No. Pin Name 1 OUTPUT1 2 GND 3 OUTPUT2 4 Vcont2 5 INPUT 6 Vcont1 Remark Exposed pad : GND TRUTH TABLE Vcont1 Vcont2 INPUT−OUTPUT1 INPUT−OUTPUT2 High Low OFF ON Low High ON OFF ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Parameter Switch Control Voltage Symbol Ratings 6.0 Vcont Unit Note V Input Power Pin +31 dBm Power Dissipation PD 150 mW Operating Ambient Temperature TA −40 to +90 °C Storage Temperature Tstg −55 to +150 °C Note ⏐Vcont1 − Vcont2⏐ ≤ 6.0 V RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified) Parameter <R> Symbol MIN. TYP. MAX. Unit Switch Control Voltage (H) Vcont (H) 2.8 3.0 3.3 V Switch Control Voltage (L) Vcont (L) −0.2 0 +0.2 V f 2.0 − 6.0 GHz Operating Frequency 2 Data Sheet PG10719EJ02V0DS μPG2185T6R <R> ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 3.0 V, Vcont otherwise specified) Parameter (L) = 0 V, Z0 = 50 Ω, DC blocking capacitors = 6 pF, unless Symbol Test Conditions MIN. TYP. MAX. Unit Insertion Loss 1 Lins1 f = 2.0 to 2.5 GHz − 0.40 0.60 dB Insertion Loss 2 Lins2 f = 2.5 to 6.0 GHz − 0.50 0.80 dB Isolation 1 (INPUT−OFF Port) ISL1 f = 2.0 to 2.5 GHz 23 26 − dB Isolation 2 (INPUT−OFF Port) ISL2 f = 2.5 to 6.0 GHz 22 25 − dB Isolation 3 (OUTPUT1−OUTPUT2) ISL3 f = 2.0 to 2.5 GHz 24 27 − dB Isolation 4 (OUTPUT1−OUTPUT2) ISL4 f = 2.5 to 6.0 GHz 24 27 − dB Input Return Loss 1 RLin1 f = 2.0 to 2.5 GHz 15 20 − dB Input Return Loss 2 RLin2 f = 4.9 to 6.0 GHz 15 20 − dB Input Return Loss 3 RLin3 f = 2.5 to 4.9 GHz 12 17 − dB Output Return Loss 1 RLout1 f = 2.0 to 2.5 GHz 15 20 − dB Output Return Loss 2 RLout2 f = 4.9 to 6.0 GHz 15 20 − dB Output Return Loss 3 RLout3 f = 2.5 to 4.9 GHz 12 17 − dB f = 2.5 GHz +26 +29 − dBm f = 6.0 GHz +26 +29 − dBm f = 2.5 GHz − +30.5 − dBm f = 6.0 GHz − +30.5 − dBm 0.1 dB Loss Compression Note Input Power Pin (0.1 dB) 1 dB Loss Compression Note Input Power Pin (1 dB) Input 3rd Order Intercept Point IIP3 f = 2.5 GHz − +50 − dBm Switch Control Current Icont RF None − 0.1 1.0 μA Switch Control Speed tSW 50% CTL to 90/10% − 20 100 ns Note Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear range. Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear range. Caution This device is used it is necessary to use DC blocking capacitors. Data Sheet PG10719EJ02V0DS 3 μPG2185T6R EVALUATION CIRCUIT Vcont1 INPUT Vcont2 1 000 pF 1 000 pF 6 pF 6 5 4 1 2 3 6 pF 6 pF OUTPUT1 OUTPUT2 The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4 Data Sheet PG10719EJ02V0DS μPG2185T6R MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS 6-PIN PLASTIC TSSON (UNIT: mm) MOUNTING PAD 0.15 0.225 0.15 0.125 0.15 0.65 1.2 0.15 0.45 0.35 0.35 1.2 SOLDER MASK 0.13 0.15 0.225 0.75 1.15 0.13 0.6 0.13 0.45 0.35 0.35 0.75 1.15 Solder thickness : 0.08 mm Remark The mounting pad and solder mask layouts in this document are for reference only. Data Sheet PG10719EJ02V0DS 5 μPG2185T6R PACKAGE DIMENSIONS 6-PIN PLASTIC TSSON (T6R) (UNIT: mm) (Top View) 1.0±0.1 1.0±0.1 (Bottom View) 0.15+0.07 –0.05 A 0.08 MIN. A 0.15+0.07 –0.05 A A 0.45 ±0.1 0.35±0.06 0.35±0.06 1.0±0.1 0.08 MIN. 1.0±0.1 0.13±0.07 0.175±0.075 0.23±0.07 Remark A > 0 6 Data Sheet PG10719EJ02V0DS 0.37+0.03 –0.05 μPG2185T6R RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Wave Soldering Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260°C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260°C or below Time at peak temperature : 10 seconds or less IR260 WS260 Preheating temperature (package surface temperature) : 120°C or below Partial Heating Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10719EJ02V0DS 7 μPG2185T6R • The information in this document is current as of August, 2008. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. • NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1 8 Data Sheet PG10719EJ02V0DS μPG2185T6R Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth.