DATA SHEET GaAs INTEGRATED CIRCUIT μPG2151TK L, S-BAND SPDT SWITCH DESCRIPTION The μPG2151TK is a GaAs MMIC for L, S-band SPDT (Single Pole Double Throw) switch which was developed for mobile phone and another L, S-band application. This device can operate 2 control switching by control voltage 1.8 to 5.3 V. This device can operate frequency from 0.5 to 3.0 GHz, having the low insertion loss and high isolation. This device is housed in a 6-pin lead-less minimold (1511) package. And this package is able to high-density surface mounting. FEATURES • Switch control voltage • • • • : Vcont (H) = 1.8 to 5.3 V (2.6 V TYP.) : Vcont (L) = −0.2 to +0.2 V (0 V TYP.) Low insertion loss : LINS1 = 0.30 dB TYP. @ f = 0.5 to 1.0 GHz, Vcont (H) = 2.6 V, Vcont (L) = 0 V : LINS2 = 0.35 dB TYP. @ f = 1.0 to 2.0 GHz, Vcont (H) = 2.6 V, Vcont (L) = 0 V : LINS3 = 0.50 dB TYP. @ f = 2.0 to 3.0 GHz, Vcont (H) = 2.6 V, Vcont (L) = 0 V High isolation : ISL1 = 25 dB TYP. @ f = 0.5 to 1.0 GHz, Vcont (H) = 2.6 V, Vcont (L) = 0 V : ISL2 = 18 dB TYP. @ f = 1.0 to 2.0 GHz, Vcont (H) = 2.6 V, Vcont (L) = 0 V : ISL3 = 13 dB TYP. @ f = 2.0 to 3.0 GHz, Vcont (H) = 2.6 V, Vcont (L) = 0 V Handling power : Pin (0.1 dB) = +21.0 dBm TYP. @ f = 2.0 GHz, Vcont (H) = 2.6 V, Vcont (L) = 0 V High-density surface mounting : 6-pin lead-less minimold package (1.5 × 1.1 × 0.55 mm) APPLICATIONS • L, S-band digital cellular or cordless telephone TM • W-LAN, WLL and Bluetooth etc. ORDERING INFORMATION Part Number μPG2151TK-E2 Order Number μPG2151TK-E2-A Package Marking 6-pin lead-less G4N • Embossed tape 8 mm wide • Pin 1, 6 face the perforation side of the tape minimold (1511) (Pb-Free) Supplying Form Note • Qty 5 kpcs/reel Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office. Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: μPG2151TK Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PG10600EJ01V0DS (1st edition) Date Published May 2006 NS CP(K) Printed in Japan 2006 μPG2151TK PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) G4N 1 (Top View) 2 3 (Bottom View) 6 1 6 6 1 5 2 5 5 2 4 3 4 4 3 Pin No. Pin Name 1 OUTPUT1 2 GND 3 OUTPUT2 4 Vcont2 5 INPUT 6 Vcont1 TRUTH TABLE Vcont1 Vcont2 INPUT−OUTPUT1 INPUT−OUTPUT2 Low High OFF ON High Low ON OFF ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Parameter Switch Control Voltage Symbol Ratings Vcont +6.0 Unit Note V Input Power Pin +26 dBm Operating Ambient Temperature TA −45 to +85 °C Storage Temperature Tstg −55 to +150 °C Note ⎪Vcont1 − Vcont2⎪ ≤ 6.0 V RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified) Parameter Symbol MIN. TYP. MAX. Unit Switch Control Voltage (H) Vcont (H) 1.8 2.6 5.3 V Switch Control Voltage (L) Vcont (L) −0.2 0 +0.2 V 2 Data Sheet PG10600EJ01V0DS μPG2151TK ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 2.6 V, Vcont (L) = 0 V, DC cut capacitors = 56 pF, unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit dB Insertion Loss 1 LINS1 f = 0.5 to 1.0 GHz − 0.30 0.42 Insertion Loss 2 LINS2 f = 1.0 to 2.0 GHz − 0.35 0.47 Insertion Loss 3 LINS3 f = 2.0 to 3.0 GHz − 0.50 0.65 Isolation 1 ISL1 f = 0.5 to 1.0 GHz 22 25 − Isolation 2 ISL2 f = 1.0 to 2.0 GHz 15 18 − Isolation 3 ISL3 f = 2.0 to 3.0 GHz 10 13 − Input Return Loss RLin f = 0.5 to 3.0 GHz − 20 − dB Output Return Loss RLout f = 0.5 to 3.0 GHz − 20 − dB +18.0 +21.0 − dBm − 0.2 20 μA − 1.0 − μs 0.1 dB Loss Compression Input Power Pin (0.1 dB) f = 2.0 GHz dB Note Switch Control Current Icont Switch Control Speed tSW 50% CTL to 90/10% RF Note Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear range. Caution This device is used it is necessary to use DC cut capacitors. The value of DC cut capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. The range of recommended DC cut capacitor value is less than 100 pF. Data Sheet PG10600EJ01V0DS 3 μPG2151TK EVALUATION CIRCUIT Vcont1 INPUT Vcont2 1 000 pF 1 000 pF C0 6 5 4 1 2 3 C0 OUTPUT1 Remark GND C0 OUTPUT2 C0 : 56 pF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4 Data Sheet PG10600EJ01V0DS μPG2151TK ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD Vcont2 6pin L2MM SPDT SW Vc1 OUTPUT2 C2 C 2 C 4 OUT 1 INPUT G4N C1 C3 C1 C1 IN C 1 C 5 C2 OUT 2 OUTPUT1 Vc2 Vcont1 USING THE NEC EVALUATION BOARD Symbol C1, C2, C3 C4, C5 Values 56 pF 1 000 pF Data Sheet PG10600EJ01V0DS 5 μPG2151TK TYPICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 2.6 V, Vcont (L) = 0 V, DC cut capacitors = 56 pF, using test fixture, unless otherwise specified) INPUT-OUTPUT1 INSERTION LOSS vs. FREQUENCY 1: 4 2: 3 3: 2 4: 1 5: 0 1 –1 2 –2 3 4 –0.534 dB 1.0 GHz –0.678 dB 1.5 GHz –0.801 dB 2.0 GHz –0.938 dB 2.5 GHz –1.067 dB 3.0 GHz 5 –3 Insertion Loss LINS (dB) Insertion Loss LINS (dB) 5 INPUT-OUTPUT2 INSERTION LOSS vs. FREQUENCY 5 1: –0.556 dB 4 2: –0.688 dB 3 3: –0.806 dB 2 4: –0.947 dB 1 5: –1.081 dB 0 –4 2.5 3.0 3.5 2.5 GHz 1 3.0 GHz 2 3 4 5 1.5 2.0 2.5 3.0 –3 –5 0.5 2.0 2.0 GHz –2 –4 1.5 1.5 GHz –1 –5 0.5 1.0 1.0 GHz 1.0 Frequency f (GHz) Frequency f (GHz) Remark The graphs indicate nominal characteristics. Caution These characteristics values include the losses of NEC evaluation board. 6 Data Sheet PG10600EJ01V0DS 3.5 μPG2151TK INPUT-OUTPUT1 ISORATION vs. FREQUENCY 2: 30 3: 20 4: 10 5: 0 –25.11 dB 1.0 GHz –21.51 dB 1.5 GHz –19.13 dB 2.0 GHz –17.29 dB 2.5 GHz –15.55 dB 3.0 GHz –10 –20 1 2 3 1: –24.96 dB 40 2: –21.36 dB 30 3: –18.97 dB 20 4: –17.14 dB 10 5: –15.14 dB –20 –40 –50 0.5 1.5 2.0 1.5 GHz 2.0 GHz 2.5 GHz 3.0 GHz –10 –40 1.0 1.0 GHz 0 –50 0.5 3.0 2.5 1 3.5 1.0 3 4 5 2 1.5 2.0 2.5 3.0 3.5 Frequency f (GHz) Frequency f (GHz) INPUT-OUTPUT1 INPUT RETURN LOSS vs. FREQUENCY INPUT-OUTPUT2 INPUT RETURN LOSS vs. FREQUENCY 50 –35.68 dB 50 1: –33.53 dB 1.0 GHz –31.34 dB 1.5 GHz –28.09 dB 2.0 GHz –28.09 dB 2.5 GHz –31.87 dB 3.0 GHz 40 2: –34.10 dB 30 3: –31.36 dB 20 4: –30.21 dB 10 5: –30.48 dB 1: 40 2: 30 3: 20 4: 10 5: 0 –10 –20 –30 1 –40 –50 0.5 1.0 2 3 1.5 2.0 4 5 3.0 2.5 1.0 GHz 1.5 GHz 2.0 GHz 2.5 GHz 3.0 GHz 0 –10 –20 –30 1 –40 –50 0.5 3.5 1.0 2 3 4 5 1.5 2.0 2.5 3.0 3.5 Frequency f (GHz) Frequency f (GHz) INPUT-OUTPUT1 OUTPUT RETURN LOSS vs. FREQUENCY INPUT-OUTPUT2 OUTPUT RETURN LOSS vs. FREQUENCY 50 Output Return Loss RLout (dB) 50 –30 Input Return Loss RLin (dB) Input Return Loss RLin (dB) –30 5 4 Isolation LSL (dB) 1: 40 1: 40 2: 30 3: 20 4: 10 5: 0 –29.61 dB 50 1: –31.11 dB 1.0 GHz –28.18 dB 1.5 GHz –27.22 dB 2.0 GHz –29.01 dB 2.5 GHz –33.85 dB 3.0 GHz 40 2: –30.20 dB 30 3: –28.15 dB 20 4: –27.69 dB 10 5: –28.66 dB –10 –20 1 –30 2 –40 –50 0.5 3 4 5 1.0 1.5 2.0 2.5 3.0 3.5 Output Return Loss RLout (dB) Isolation LSL (dB) 50 INPUT-OUTPUT2 ISORATION vs. FREQUENCY 1.0 GHz 1.5 GHz 2.0 GHz 2.5 GHz 3.0 GHz 0 –10 –20 1 –30 –40 –50 0.5 Frequency f (GHz) 1.0 2 3 4 5 1.5 2.0 2.5 3.0 3.5 Frequency f (GHz) Remark The graphs indicate nominal characteristics. Data Sheet PG10600EJ01V0DS 7 μPG2151TK OUTPUT POWER vs. INPUT POWER +35 f = 2.0 GHz Output Power Pout (dBm) +30 +25 +20 +15 +10 +5 0 –5 –5 0 +5 +10 +15 +20 +25 +30 +35 Input Power Pin (dBm) Remark The graph indicates nominal characteristics. 8 Data Sheet PG10600EJ01V0DS μPG2151TK PACKAGE DIMENSIONS 6-PIN LEAD-LESS MINIMOLD (1511) (UNIT: mm) (Bottom View) 0.16±0.05 1.1±0.1 0.2±0.1 0.9±0.1 0.11+0.1 –0.05 1.3±0.05 0.55±0.03 1.5±0.1 0.48±0.05 0.48±0.05 (Top View) Data Sheet PG10600EJ01V0DS 9 μPG2151TK RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Wave Soldering Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260°C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260°C or below Time at peak temperature : 10 seconds or less IR260 WS260 Preheating temperature (package surface temperature) : 120°C or below Partial Heating Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Caution Do not use different soldering methods together (except for partial heating). 10 Data Sheet PG10600EJ01V0DS HS350 μPG2151TK Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A. • The information in this document is current as of May, 2006. 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(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1 Data Sheet PG10600EJ01V0DS 11 μPG2151TK Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth. For further information, please contact NEC Compound Semiconductor Devices Hong Kong Limited E-mail: [email protected] Hong Kong Head Office TEL: +852-3107-7303 FAX: +852-3107-7309 Taipei Branch Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Korea Branch Office TEL: +82-2-558-2120 FAX: +82-2-558-5209 NEC Electronics (Europe) GmbH http://www.eu.necel.com/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 Compound Semiconductor Devices Division NEC Electronics Corporation URL: http://www.ncsd.necel.com/ 0604