OPA336-EP SINGLE-SUPPLY MICRO-POWER CMOS OPERATIONAL AMPLIFIER MicroAmplifier™ SERIES www.ti.com SCES658 – JUNE 2006 FEATURES • • • • • • • • (1) • • • Controlled Baseline – One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of –55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree (1) Single-Supply Operation Rail-to-Rail Output (Within 3 mV) Micro Power: IQ = 23 µA/Amplifier Micro-Size Packages Low Offset Voltage: 500 µV Typical Specified From VS = 2.3 V to 5.5 V APPLICATIONS • • • • • • • Battery-Powered Instruments Portable Devices High-Impedance Applications Photodiode Preamplifiers Precision Integrators Medical Instruments Test Equipment Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. DBV PACKAGE (TOP VIEW) Out 1 5 V+ 4 –In V– 2 +In 3 DESCRIPTION/ORDERING INFORMATION The OPA336 micro-power CMOS operational amplifier (MicroAmplifier™ series) is designed for battery-powered applications. The device operates on a single supply, with operation as low as 2.1 V. The output is rail to rail and swings to within 3 mV of the supplies with a 100-kΩ load. The common-mode range extends to the negative supply — ideal for single-supply applications. In addition to small size and low quiescent current (23 µA/amplifier), the OPA336 features low offset voltage (500 µV typical), low input bias current (1 pA), and high open-loop gain (115 dB). The device is packaged in the tiny DBV (SOT23-5) surface-mount package. It operates from –55°C to 125°C. A macromodel is available for download (at www.ti.com) for design analysis. ORDERING INFORMATION TA –55°C to 125°C PACKAGE DBV – SOT23-5 ORDERABLE PART NUMBER OPA336MDBVREP TOP-SIDE MARKING OAYM ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. MicroAmplifier is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006, Texas Instruments Incorporated OPA336-EP SINGLE-SUPPLY MICRO-POWER CMOS OPERATIONAL AMPLIFIER MicroAmplifier™ SERIES www.ti.com SCES658 – JUNE 2006 Absolute Maximum Ratings (1) MIN MAX (V–) – 0.3 (V+) + 0.3 Supply voltage Signal input terminals 7.5 Voltage range (2) Current (2) 10 Output short circuit (3) V V mA Continuous TA Operating free-air temperature range –55 125 °C Tstg Storage temperature range –55 125 °C TJ Junction temperature 150 °C Lead temperature (soldering, 10 s) 300 °C Charged-Device Model (CDM) ESD rating θJA (1) (2) (3) 2 UNIT 1000 Human-Body Model (HBM) 500 Machine Model (MM) 100 Package thermal impedance 200 V °C/W Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Input terminals are diode clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails should be current limited to 10 mA or less. Short circuit to ground, one amplifier per package Submit Documentation Feedback OPA336-EP SINGLE-SUPPLY MICRO-POWER CMOS OPERATIONAL AMPLIFIER MicroAmplifier™ SERIES www.ti.com SCES658 – JUNE 2006 Electrical Characteristics over recommended operating temperature range, VS = 2.3 V to 5.5 V, TA = 25°C, VS = 5 V, RL = 25 kΩ connected to VS/2 (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Offset Voltage VOS Input offset voltage ±500 Input offset voltage overtemperature (1) ±950 Input offset voltage vs power supply PSRR Overtemperature (1) 25 VS = 2.3 V to 5.5 V 100 150 Channel separation, dc µV µV/V 0.1 Input Bias Current ±1 Input bias current IB IOS ±10 ±200 Overtemperature (1) ±1 Input offset current ±60 pA pA Noise Input voltage noise f = 0.1 Hz to 10 Hz 3 µVp-p en Input voltage noise density f = 1 kHz 40 nV/√Hz in Current noise density f = 1 kHz 30 fA/√Hz Input Voltage Range VCM Common-mode voltage range CMRR Common-mode rejection ratio Overtemperature (1) –0.2 –0.2 V < VCM < (V+) – 1 V 76 (V+) – 1 86 72 V dB Input Impedance Differential input impedance 1013 2 Ω pF Common mode input impedance 1013 4 Ω pF Open-Loop Gain Open-loop voltage gain AOL Overtemperature (1) RL = 25 kΩ, 100 mV < VO < (V+) – 100 mV 90 RL = 5 kΩ, 500 mV < VO < (V+) – 500 mV 90 RL = 25 kΩ, 100 mV < VO < (V+) – 100 mV 82 RL = 5 kΩ, 500 mV < VO < (V+) – 500 mV 89 dB Frequency Response GBW Gain-bandwidth product VS = 5 V, G = 1 100 kHz SR Slew rate VS = 5 V, G = 1 0.03 V/µs Overload recovery time VIN × G = VS 100 µs (1) Limits apply over the specified temperature range, TA = –55°C to 125°C. Submit Documentation Feedback 3 OPA336-EP SINGLE-SUPPLY MICRO-POWER CMOS OPERATIONAL AMPLIFIER MicroAmplifier™ SERIES www.ti.com SCES658 – JUNE 2006 Electrical Characteristics (continued) over recommended operating temperature range, VS = 2.3 V to 5.5 V, TA = 25°C, VS = 5 V, RL = 25 kΩ connected to VS/2 (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT mV Output Voltage output swing from rail (2) Overtemperature (3) ISC Short-circuit current CLOAD Capacitive load drive (4) RL = 100 kΩ, AOL ≥ 70 dB 3 RL = 25 kΩ, AOL ≥ 90 dB 20 100 RL = 5 kΩ, AOL ≥ 90 dB 70 500 RL = 25 kΩ, AOL ≥ 82 dB 100 RL = 5 kΩ, AOL ≥ 89 dB 500 ±5 mV mA Power Supply VS Specified voltage range 2.3 Minimum operating voltage IQ (2) (3) (4) 4 Quiescent current (per amplifier) Overtemperature (3) 5.5 2.1 IO = 0 Output voltage swings are measured between the output and positive and negative power-supply rails. Limits apply over the specified temperature range, TA = –55°C to 125°C. See Capacitive Load and Stability section Submit Documentation Feedback 23 V V 35 38 µA OPA336-EP SINGLE-SUPPLY MICRO-POWER CMOS OPERATIONAL AMPLIFIER MicroAmplifier™ SERIES www.ti.com SCES658 – JUNE 2006 TYPICAL CHARACTERISTICS TA = 25°C, VS = 5 V, RL = 25 kΩ connected to VS/2 (unless otherwise noted) POWER SUPPLY and COMMON MODE OPEN−LOOP GAIN/PHASE vs FREQUENCY 100 CMRR G 0 60 –45 40 –90 Φ 20 –135 0 –180 PSRR, CMRR (dB) 80 Phase (º) Voltage Gain (dB) 80 60 PSRR 40 20 –20 0 1 10 100 1k 10k 100k 1M 1 10 Frequency (Hz) 100 1k QUIESCENT CURRENT vs SUPPLY VOLTAGE 100k QUIESCENT CURRENT vs TEMPERATURE 30 30 Per Amplifier Per Amplifier VS = 5 V Quiescent Current (µA) 25 Quiescent Current (µA) 10k Frequency (Hz) 25 20 15 20 15 10 VS = 2.3 V 5 10 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 –75 –50 –25 25 50 75 100 125 SHORT−CIRCUIT CURRENT vs TEMPERATURE 8 ±5 7 Short−Circuit Current (mA) Short−Circuit Current (mA) SHORT−CIRCUIT CURRENT vs SUPPLY VOLTAGE ±6 ±4 0 Temperature (°C) Supply Voltage (V) I SC ±3 ±2 –ISC ±1 VS = 5 V 6 –ISC 5 4 ISC I SC 3 VS = 2.3 V 2 –ISC 1 0 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 –75 Supply Voltage (V) –50 –25 0 25 50 75 100 125 Temperature (°C) Submit Documentation Feedback 5 OPA336-EP SINGLE-SUPPLY MICRO-POWER CMOS OPERATIONAL AMPLIFIER MicroAmplifier™ SERIES www.ti.com SCES658 – JUNE 2006 TYPICAL CHARACTERISTICS (continued) TA = 25°C, VS = 5 V, RL = 25 kΩ connected to VS/2 (unless otherwise noted) INPUT VOLTAGE AND CURRENT NOISE SPECTRAL DENSITY vs FREQUENCY CHANNEL SEPARATION vs FREQUENCY 1k 1k 150 10 10 Channel Separation (dB) 100 100 Current Noise (fA/ Hz) Voltage Noise (nV/ Hz) Voltage noise 140 130 Dual and quad devices, G = 1, all channels. Quad measured channel A to D or B to C—other combinations yield improved rejection. 120 Current noise 1 110 1 10 100 1k 10k 100k 100 1k Frequency (Hz) 100k AOL, CMRR, PSRR vs TEMPERATURE MAXIMUM OUTPUT VOLTAGE vs FREQUENCY 120 6 AOL VS = 5.5 V AOL, CMRR, PSRR (dB) 5 Output Voltage (Vp−p) 10k Frequency (Hz) 4 3 VS = 2.3 V 2 1 110 100 PSRR 90 CMRR 80 70 0 100 1k –75 100k –50 –25 0 25 50 75 100 Temperature (ºC) OFFSET VOLTAGE-DRIFT MAGNITUDE PRODUCTION DISTRIBUTION 25 25 Typical production packaged units 20 Percent of Amplifiers (%) 15 10 5 0.1% 0.3% 0.2% 0.1% 0 20 15 10 5 Offset Voltage (µV) 6 Submit Documentation Feedback 4 3.5 3.75 3 Offset Voltage Drift (µV/_C) 3.25 2.5 2.75 2 2.25 1.5 1.75 1 1.25 0.5 0.75 500 400 300 200 100 0 –100 –200 –300 –400 –500 0 0.25 Percent of Amplifiers (%) Typical production packaged units 125 OPA336-EP SINGLE-SUPPLY MICRO-POWER CMOS OPERATIONAL AMPLIFIER MicroAmplifier™ SERIES www.ti.com SCES658 – JUNE 2006 TYPICAL CHARACTERISTICS (continued) TA = 25°C, VS = 5 V, RL = 25 kΩ connected to VS/2 (unless otherwise noted) INPUT BIAS CURRENT vs INPUT COMMON-MODE VOLTAGE 4 100 3 Input Bias Current (pA) 1k 10 1 VS = 5 V 2 1 0 0.1 –75 –50 –25 0 25 50 75 100 0123 45 125 Common-Mode Voltage (V) Temperature (°C) OUTPUT VOLTAGE SWING vs OUTPUT CURRENT OUTPUT VOLTAGE SWING vs OUTPUT CURRENT –2.5 5 VS = 2.5 V VS = 5 V –2.0 −55°C Sourcing Current 25°C 3 VS = +2.3 V 125°C 2 −55°C 125°C Output Voltage (V) 4 –1.5 125°C –1.0 −55°C –0.5 1 25°C 25°C 0 0 Output Current (mA) –0 –3 –4 –5 Output Current (mA) SMALL-SIGNAL STEP RESPONSE G = 1, C L = 200 pF, VS = +5 V LARGE-SIGNAL STEP RESPONSE G = 1, C L = 620 pF, V S = +5 V –1 –2 –6 –7 –8 500 mV/div 01 234 567 8 20 mV/div Output Voltage (V) Input Bias Current (pA) INPUT BIAS CURRENT vs TEMPERATURE 200 Ωs/div 50 Ωs/div Submit Documentation Feedback 7 OPA336-EP SINGLE-SUPPLY MICRO-POWER CMOS OPERATIONAL AMPLIFIER MicroAmplifier™ SERIES www.ti.com SCES658 – JUNE 2006 APPLICATION INFORMATION The OPA336 operational amplifier is fabricated with a state-of-the-art 0.6-micron CMOS process. The device is unity-gain stable and suitable for a wide range of general-purpose applications. Power-supply pins should be bypassed with 0.01-µF ceramic capacitors. The OPA336 is protected against reverse battery voltages. Operating Voltage The OPA336 can operate from a 2.1-V to 5.5-V single supply voltage, with excellent performance. Most behavior remains unchanged throughout the full operating voltage range. Parameters that vary significantly with operating voltage are shown in the typical characteristics. The OPA336 is fully specified for operation from 2.3 V to 5.5 V; a single limit applies over the supply range. In addition, many parameters are ensured over the specified temperature range, –55°C to 125°C. Input Voltage The input common-mode range of the OPA336 extends from (V–) – 0.2 V to (V+) – 1 V. For normal operation, inputs should be limited to this range. The absolute maximum input voltage is 300 mV beyond the supplies. Thus, inputs greater than the input common-mode range, but less than maximum input voltage, while not valid, will not cause any damage to the operational amplifier. Furthermore, the inputs may go beyond the power supplies without phase inversion (see Figure 1), unlike some other operational amplifiers. Normally, input bias current is approximately 1 pA. However, input voltages exceeding the power supplies can cause excessive current to flow in or out of the input pins. Momentary voltages greater than the power supply can be tolerated, as long as the current on the input pins is limited to 10 mA. This is easily accomplished with an input resistor (see Figure 2). 6V VOUT 0V Figure 1. No Phase Inversion With Inputs Greater Than Power-Supply Voltage +5 V IOVERLOAD 10 mA max VOUT VIN 5 kΩ Figure 2. Input Current Protection for Voltages Exceeding Power-Supply Voltage 8 Submit Documentation Feedback www.ti.com OPA336-EP SINGLE-SUPPLY MICRO-POWER CMOS OPERATIONAL AMPLIFIER MicroAmplifier™ SERIES SCES658 – JUNE 2006 APPLICATION INFORMATION (CONTINUED) Capacitive Load and Stability The OPA336 can drive a wide range of capacitive loads. However, all operational amplifiers, under certain conditions, may become unstable. Operational amplifier configuration, gain, and load value are just a few of the factors to consider when determining stability. When properly configured, the OPA336 drives approximately 10,000 pF. An operational amplifier in unity-gain configuration is the most vulnerable to capacitive load. The capacitive load reacts with the operational amplifier output resistance along with any additional load resistance to create a pole in the response, which degrades the phase margin. In unity gain, the OPA336 performs well with a pure capacitive load, up to about 300 pF. Increasing gain enhances the amplifier's ability to drive loads beyond this level. One method of improving capacitive load drive in the unity-gain configuration is to insert a 50-Ω to 100-Ω resistor inside the feedback loop (see Figure 3). This reduces ringing with large capacitive loads, while maintaining direct current (DC) accuracy. For example, with RL = 25 kΩ, OPA336 performs well with capacitive loads in excess of 1000 pF (see Figure 4). Without the OPA336 RS, capacitive load drive typically is 350 pF for these conditions (see Figure 5). RS 100 Ω VOUT VIN CL RL Figure 3. Series Resistor in Unity-Gain Configuration Improves Capacitive Load Drive 20 mV/div RS = 100 Ω, Load = 2 kΩ || 1000 pF, Vs +5 V 50 µs/div Figure 4. Small-Signal Step Response Using Series Resistor to Improve Capacitive Load Drive Submit Documentation Feedback 9 OPA336-EP SINGLE-SUPPLY MICRO-POWER CMOS OPERATIONAL AMPLIFIER MicroAmplifier™ SERIES www.ti.com SCES658 – JUNE 2006 APPLICATION INFORMATION (CONTINUED) 10k Capacitive Load (pF) Operation Above Selected Gain Curve Not Recommended G = +1 RL to Ground RL to Ground 1k RL to VS/2 VS = +5 V, VO = VS/2 100 5 10 100 Resistive Load (kΩ) Figure 5. Stability — Capacitive Load vs Resistive Load Alternatively, the resistor may be connected in series with the output outside of the feedback loop. However, if there is a resistive load parallel to the capacitive load, it and the series resistor create a voltage divider. This introduces a DC error at the output; however, this error may be insignificant. For instance, with RL = 100 kΩ and RS = 100 Ω, there is only about a 0.1% error at the output. Figure 5 shows the recommended operating regions for the OPA336. Decreasing the load resistance generally improves capacitive load drive. Figure 5 also shows how stability differs, depending on where the resistive load is connected. With G = 1 and RL = 10 kΩ connected to VS/2, the OPA336 typically can drive 500 pF. Connecting the same load to ground improves capacitive load drive to 1000 pF. 10 Submit Documentation Feedback PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty OPA336MDBVREP ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR V62/06641-01XE ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF OPA336-EP : • Catalog: OPA336 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 9-Aug-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device OPA336MDBVREP Package Package Pins Type Drawing SPQ SOT-23 3000 DBV 5 Reel Reel Diameter Width (mm) W1 (mm) 179.0 8.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 3.2 3.2 1.4 4.0 W Pin1 (mm) Quadrant 8.0 Q3 PACKAGE MATERIALS INFORMATION www.ti.com 9-Aug-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) OPA336MDBVREP SOT-23 DBV 5 3000 195.0 200.0 45.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DLP® Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com www.dlp.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2009, Texas Instruments Incorporated