SECOS SSP7150N

SSP7150N
3.6A, 150V, RDS(ON) 255 m
N-Channel Enhancement MOSFET
Elektronische Bauelemente
RoHS Compliant Product
A suffix of “-C” specifies halogen & lead-free
FEATURES



SOP-8PP
Low RDS(on) trench technology.
Low thermal impedance.
Fast switching speed.
B
D
C
APPLICATIONS



θ
White LED boost converters.
Automotive Systems.
Industrial DC/DC Conversion Circuits.
e
E
A
b
d
g
PACKAGE INFORMATION
Package
MPQ
Leader Size
SOP-8PP
3K
7’ inch
F
G
REF.
A
B
C
D
E
F
G
Millimeter
Min.
Max.
1.00
1.10
5.70
5.80
0.20
0.30
3.61
3.98
5.40
6.10
0.08
0.20
3.60
3.99
REF.
θ
b
d
e
g
Millimeter
Min.
Max.
0°
12°
0.33
0.51
1.27BSC
1.35
1.75
1.10
-
ABSOLUTE MAXIMUM RATINGS (TA=25°C unless otherwise specified)
Parameter
Symbol
Rating
Unit
Drain-Source Voltage
VDS
150
V
Gate-Source Voltage
VGS
±20
V
Continuous Drain Current 1
TA=25°C
TA=70°C
Pulsed Drain Current 2
Continuous Source Current (Diode Conduction)
Power Dissipation 1
1
TA=25°C
TA=70°C
Operating Junction and Storage Temperature Range
ID
3.6
2.9
A
IDM
20
A
IS
6.2
A
PD
TJ, TSTG
5
3.2
-55~150
W
°C
Thermal Resistance Data
Maximum Junction to Ambient 1
t≦10 sec
Steady State
RθJA
25
65
°C / W
Notes:
1. Surface Mounted on 1” x 1” FR4 Board.
2. Pulse width limited by maximum junction temperature.
http://www.SeCoSGmbH.com/
07-Apr-2011 Rev. A
Any changes of specification will not be informed individually.
Page 1 of 4
SSP7150N
3.6A, 150V, RDS(ON) 255 m
N-Channel Enhancement MOSFET
Elektronische Bauelemente
ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise specified)
Symbol
Parameter
Min
Typ
Max
Unit
Test condition
Static
VGS(th)
1
-
-
V
VDS=VGS, ID=250μA
Gate-Body Leakage
IGSS
-
-
±10
nA
VDS=0, VGS= ±20V
Zero Gate Voltage Drain Current
IDSS
-
-
1
-
-
10
10
-
-
-
-
255
-
-
290
gFS
-
10
-
S
VDS=15V,,ID=2.9A
VSD
-
0.76
-
V
IS=3.1A, VGS=0
Gate-Threshold Voltage
On-State Drain Current 1
ID(ON)
Drain-Source On-Resistance 1
Forward Transconductance
1
Diode Forward Voltage
RDS(ON)
Dynamic
Qg
-
10.8
-
Gate-Source Charge
Qgs
-
3.3
-
Gate-Drain Charge
Qgd
-
5.6
-
Turn-On Delay Time
Td(ON)
-
10.1
-
Tr
-
10
-
Td(OFF)
-
50
-
Tf
-
22
-
Input Capacitance
Ciss
-
848
-
Output Capacitance
Coss
-
69
-
Reverse Transfer Capacitance
Crss
-
29
-
Turn-Off Delay Time
Fall Time
A
mΩ
VDS=120V, VGS=0
VDS=120V, VGS=0,TJ=55°C
VDS=5V, VGS=10V
VGS=10V, ID=2.9A
VGS=4.5V, ID=2.7A
2
Total Gate Charge
Rise Time
μA
nC
ID=2.9A
VDS=75V
VGS=4.5V
nS
ID=2.9A, VDD=75V
VGEN=10V
RL=25.9Ω, RGEN=6Ω
pF
VDS=15V, VGS=0, f=1MHz
Notes:
1. Pulse test:PW≦300μs duty cycle≦2%.
2. Guaranteed by design, not subject to production testing.
http://www.SeCoSGmbH.com/
07-Apr-2011 Rev. A
Any changes of specification will not be informed individually.
Page 2 of 4
SSP7150N
Elektronische Bauelemente
3.6A, 150V, RDS(ON) 255 m
N-Channel Enhancement MOSFET
ELECTRICAL CHARACTERISTICS CURVE
http://www.SeCoSGmbH.com/
07-Apr-2011 Rev. A
Any changes of specification will not be informed individually.
Page 3 of 4
SSP7150N
Elektronische Bauelemente
3.6A, 150V, RDS(ON) 255 m
N-Channel Enhancement MOSFET
ELECTRICAL CHARACTERISTICS CURVE
http://www.SeCoSGmbH.com/
07-Apr-2011 Rev. A
Any changes of specification will not be informed individually.
Page 4 of 4