SEMIPOWER SWP3710

SAMWIN
SW3710
N-channel MOSFET
Features
TO-220
BVDSS : 100V
ID
■ High ruggedness
■ RDS(ON) (Max 0.023 Ω)@VGS=10V
■ Gate Charge (Typ 100nC)
■ Improved dv/dt Capability
■ 100% Avalanche Tested
: 57A
RDS(ON) : 0.023 ohm
1
2
2
3
1
1. Gate 2. Drain 3. Source
General Description
This N-channel enhancement mode field-effect power transistor using SAMWIN
semiconductor’s advanced planar stripe, DMOS technology intended for battery
Operated systems like a DC-DC converter motor control , ups ,audio amplifier.
Also, especially designed to minimize RDS(ON), low gate charge and high rugged
avalanche characteristics.
3
Order Codes
Item
1
Sales Type
SW P 3710
Marking
SW3710
Package
TO-220
Packaging
TUBE
Absolute maximum ratings
Symbol
VDSS
ID
Parameter
Value
Unit
Drain to Source Voltage
100
V
Continuous Drain Current (@TC=25oC)
57
A
Continuous Drain Current (@TC=100oC)
40
A
235
A
± 20
V
IDM
Drain current pulsed
VGS
Gate to Source Voltage
EAS
Single pulsed Avalanche Energy
(note 2)
482
mJ
EAR
Repetitive Avalanche Energy
(note 1)
7
mJ
dv/dt
Peak diode Recovery dv/dt
(note 3)
5
V/ns
160
W
1.05
W/oC
-55 ~ + 150
oC
300
oC
PD
TSTG, TJ
TL
(note 1)
Total power dissipation (@TC
Derating Factor above
=25oC)
25oC
Operating Junction Temperature & Storage Temperature
Maximum Lead Temperature for soldering
purpose, 1/8 from Case for 5 seconds.
Thermal characteristics
Symbol
Parameter
Value
Min.
Rthjc
Thermal resistance, Junction to case
Rthcs
Thermal resistance, Case to Sink
Rthja
Thermal resistance, Junction to ambient
Mar. 2011. Rev. 2.0
Typ.
Max.
0.92
Unit
oC/W
oC/W
0.5
62.5
Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved.
oC/W
1/7
SAMWIN
SW3710
Electrical characteristic ( TC = 25oC unless otherwise specified )
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
100
-
-
V
Off characteristics
BVDSS
Drain to source breakdown voltage
VGS=0V, ID=250uA
ΔBVDSS
/ ΔTJ
Breakdown voltage temperature
coefficient
ID=250uA, referenced to 25oC
-
0.066
-
V/oC
-
1
uA
Drain to source leakage current
VDS=100V, VGS=0V
-
IDSS
VDS=80V, TC=125oC
-
-
100
uA
Gate to source leakage current, forward
VGS=20V, VDS=0V
-
-
100
nA
Gate to source leakage current, reverse
VGS=-20V, VDS=0V
-
-
-100
nA
2.0
-
4.0
V
0.023
Ω
IGSS
On characteristics
VGS(TH)
Gate threshold voltage
VDS=VGS, ID=250uA
RDS(ON)
Drain to source on state resistance
VGS=10V, ID = 30A
Dynamic characteristics
Ciss
Input capacitance
3400
4250
Coss
Output capacitance
1320
1650
Crss
Reverse transfer capacitance
215
340
td(on)
Turn on delay time
60
120
70
160
195
310
Fall time
120
260
Qg
Total gate charge
96
140
Qgs
Gate-source charge
23
-
Qgd
Gate-drain charge
36
-
Min.
Typ.
Max.
Unit
-
-
57
A
-
-
235
A
tr
td(off)
tf
Rising time
Turn off delay time
VGS=0V, VDS=25V, f=1MHz
VDS=50V, ID=57A, RG=25Ω
VDS=80V, VGS=10V, ID=57A
pF
ns
nC
Source to drain diode ratings characteristics
Symbol
Parameter
Test conditions
IS
Continuous source current
ISM
Pulsed source current
Integral reverse p-n Junction
diode in the MOSFET
VSD
Diode forward voltage drop.
IS=57A, VGS=0V
-
-
1.5
V
Trr
Reverse recovery time
-
92
-
ns
Qrr
Breakdown voltage temperature
IS=57A, VGS=0V,
dIF/dt=100A/us
-
160
-
nC
※. Notes
1.
Repeatitive rating : pulse width limited by junction temperature.
2.
L = 270uH, IAS = 57A, VDD = 25V, RG=25Ω, Starting TJ = 25oC
3.
ISD ≤ 57A, di/dt = 300A/us, VDD ≤ BVDSS, Staring TJ =25oC
4.
Pulse Test : Pulse Width ≤ 300us, duty cycle ≤ 2%
5.
Essentially independent of operating temperature.
Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved.
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SAMWIN
SW3710
Fig. 1. On-state characteristics
Fig. 2. Transfer characteristics
VGS
Top :
15.0 V
10.0 V
8.0 V
7.0 V
6.0 V
5.5 V
5.0 V
Bottom : 4.5 V
ID, Drain Current [A]
2
10
ID, Drain Current [A]
2
10
1
10
o
175 C
1
10
o
25 C
o
-55 C
،‫ ط‬Notes :
1. 250¥‫ى‬s Pulse Test
2. TC = 25،‫ة‬
،‫ ط‬Notes :
1. VDS = 25V
2. 250¥‫ى‬s Pulse Test
0
0
10
-1
0
10
10
1
10
2
10
4
6
8
10
VGS, Gate-Source Voltage [V]
VDS, Drain-Source Voltage [V]
Fig. 3. On-resistance variation vs.
drain current and gate voltage
Fig. 4. On state current vs.
diode forward voltage
25
VGS = 20V
VGS = 10V
20
2
10
IDR, Reverse Drain Current [A]
RDS(ON),
Drain-Source On-Resistance [m¥‫]ط‬
30
15
10
5
،‫ ط‬Note : TJ = 25،‫ة‬
1
10
175،‫ة‬
25،‫ة‬
،‫ ط‬Notes :
1. VGS = 0V
2. 250¥‫ى‬s Pulse Test
0
0
0
50
100
150
200
250
10
300
0.2
0.4
0.6
ID, Drain Current [A]
Fig. 5. Capacitance characteristics
(Non-Repetitive)
1.0
1.2
1.4
1.6
1.8
Fig. 6. Gate charge characteristics
12
5500
Ciss=Cgs+Cgd(Cds=shorted)
5000
VDS = 50V
Coss=Cds+Cgd
10
VGS, Gate-Source Voltage [V]
Crss=Cgd
4500
4000
Capacitance [pF]
0.8
VSD, Source-Drain voltage [V]
،‫ ط‬Notes :
1. VGS = 0V
3500
3000
2. f=1MHz
Ciss
2500
2000
Coss
1500
1000
500
5
6
4
2
،‫ ط‬Note : ID = 57 A
Crss
0
0
0
VDS = 80V
8
10
15
20
25
VDS, Drain-Source Voltage [V]
30
35
0
10
20
30
40
50
60
70
80
90
100
QG, Total Gate Charge [nC]
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SAMWIN
SW3710
Fig 7. Breakdown Voltage Variation
vs. Junction Temperature
Fig. 8. On resistance variation
vs. junction temperature
RDS(ON), (Normalized)
1.0
،‫ ط‬Notes :
1. VGS = 0 V
0.9
2. ID = 250 ¥‫ى‬A
Drain-Source On-Resistance
3.0
1.1
2.5
2.0
1.5
1.0
،‫ ط‬Notes :
1. VGS = 10 V
0.5
2. ID = 30 A
0.8
-100
-50
0
50
100
150
0.0
-100
200
-50
0
50
100
150
200
o
o
TJ, Junction Temperature [ C]
TJ, Junction Temperature [ C]
Fig. 9. Maximum drain current vs.
case temperature.
Fig. 10. Maximum safe operating area
3
10
80
Operation in This Area
is Limited by R DS(on)
ID, Drain Current [A]
60
ID' Drain Current [A]
40
100 s
2
10
1 ms
10 ms
DC
1
10
،‫ ط‬Notes :
o
1. TC = 25 C
20
o
2. TJ = 175 C
3. Single Pulse
0
0
25
10
50
75
100
125
150
-1
0
10
175
1
10
10
2
10
VDS, Drain-Source Voltage [V]
o
TC' Case Temperature [ C]
Fig. 11. Transient thermal response curve
0
10
Z¥èJC(t), Thermal Response
BVDSS, (Normalized)
Drain-Source Breakdown Voltage
1.2
D=0.5
،‫ ط‬Notes :
1. Z¥èJC(t) = 0.92 ،‫ة‬/W Max.
0.2
2. Duty Factor, D=t1/t2
0.1
-1
10
3. TJM - TC = PDM * Z¥èJC(t)
0.05
0.02
0.01
single pulse
-2
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
t1, Square Wave Pulse Duration [sec]
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4/7
SAMWIN
SW3710
Fig. 12. Gate charge test circuit & waveform
VGS
Same type
as DUT
QG
VDS
QGD
QGS
DUT
VGS
1mA
Charge
Fig. 13. Switching time test circuit & waveform
VDS
RL
RG
90%
VDS
VDD
VIN
10VIN
DUT
10%
10%
td(on)
td(off)
tr
tON
tf
tOFF
Fig. 14. Unclamped Inductive switching test circuit & waveform
1
EAS =
L
BVDSS
IAS
BVDSS - VDD
IAS
VDS
RG
2
BVDSS
L X IAS2 X
VDD
ID(t)
10VIN
DUT
VDS(t)
tp
time
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SAMWIN
SW3710
Fig. 15. Peak diode recovery dv/dt test circuit & waveform
DUT
+ V
DS
10V
VGS (DRIVER)
L
IS
di/dt
IS (DUT)
IRM
VDS
RG
10VGS
Diode reverse current
VDD
Diode recovery dv/dt
Same type
as DUT
VDS (DUT)
*. dv/dt controlled by RG
*. Is controlled by pulse period
VF
VDD
Body diode forward voltage drop
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SAMWIN
SW3710
REVISION HISTORY
Revision No.
Changed Characteristics
Responsible
Date
Issuer
REV 1.0
Origination, First Release
Alice Nie
2007.12.05
XZQ
REV 2.0
Updated the format of datasheet and added
Order Codes.
Alice Nie
2011.03.24
XZQ
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