LM185QML www.ti.com SNVS386D – NOVEMBER 2005 – REVISED MARCH 2013 LM185QML Adjustable Micropower Voltage References Check for Samples: LM185QML FEATURES DESCRIPTION • • • • The LM185 are micropower 3-terminal adjustable band-gap voltage reference diodes. Operating from 1.24 to 5.3V and over a 10μA to 20mA current range, they feature exceptionally low dynamic impedance and good temperature stability. On-chip trimming is used to provide tight voltage tolerance. Since the LM185 band-gap reference uses only transistors and resistors, low noise and good long-term stability result. 1 2 Adjustable from 1.24V to 5.30V Operating Current of 10μA to 20mA 1Ω Dynamic Impedance Low Temperature Coefficient Careful design of the LM185 has made the device tolerant of capacitive loading, making it easy to use in almost any reference application. The wide dynamic operating range allows its use with widely varying supplies with excellent regulation. The extremely low power drain of the LM185 makes it useful for micropower circuitry. This voltage reference can be used to make portable meters, regulators or general purpose analog circuitry with battery life approaching shelf life. Further, the wide operating current allows it to replace older references with a tighter tolerance part. Connection Diagrams Figure 1. PFM Metal Can Package (Bottom View) See Package Number NDV0003H Figure 2. 20-Leadless Chip Carrier (Top View) See Package Number NAJ0020A N/C 1 10 N/C 2 9 N/C N/C 3 8 N/C N/C 4 7 ADJ V- 5 6 N/C +VREF Figure 3. 10-Lead CLGA (Top View) See Package Number NAC0010A 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2013, Texas Instruments Incorporated LM185QML SNVS386D – NOVEMBER 2005 – REVISED MARCH 2013 www.ti.com Block Diagram Schematic Diagram These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM185QML LM185QML www.ti.com SNVS386D – NOVEMBER 2005 – REVISED MARCH 2013 Absolute Maximum Ratings (1) Reverse Current 30mA Forward Current 10mA Operating Temperature Range −55°C ≤ TA ≤ 125°C Storage Temperature −55°C ≤ TA ≤ 150°C Maximum Junction Temperature TJmax 150°C Lead Temperature (soldering, 10 seconds) 300°C θJA Thermal Resistance θJC Package Weight (Typical) LCCC Package (Still Air) 100°C/W LCCC Package (500LF/Min Air flow) 73°C/W Metal Can Package (Still Air) 300°C/W Metal Can Package (500LF/Min Air flow) 139°C/W CLGA Package (Still Air) 194°C/W CLGA Package (500LF/Min Air flow) 128°C/W LCCC Package 25°C/W Metal Can Package 57°C/W CLGA Package 23°C/W LCCC Package TBD Metal Can Package TBD CLGA Package 210mg ESD Tolerance (2) (1) (2) 500V Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is intended to be functional. For guaranteed specifications and test conditions, see the Electrical Characteristics. Human body model, 1.5 kΩ in series with 100 pF. Table 1. Quality Conformance Inspection Mil-Std-883, Method 5005 - Group A Subgroup Description Temp °C 1 Static tests at 25 2 Static tests at 125 3 Static tests at -55 4 Dynamic tests at 25 5 Dynamic tests at 125 6 Dynamic tests at -55 7 Functional tests at 25 8A Functional tests at 125 8B Functional tests at -55 9 Switching tests at 25 10 Switching tests at 125 11 Switching tests at -55 12 Settling time at 25 13 Settling time at 125 14 Settling time at -55 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM185QML 3 LM185QML SNVS386D – NOVEMBER 2005 – REVISED MARCH 2013 www.ti.com LM185B Electrical Characteristics DC Parameters Symbol VRef Parameter Reference Voltage Conditions Notes Max Unit 1.228 1.252 V 1 1.215 1.255 V 2, 3 IR = 9µA 1.228 1.252 V 1 IR = 10µA 1.215 1.255 V 2, 3 IR = 1mA 1.228 1.252 V 1 1.215 1.255 V 2, 3 1.228 1.252 V 1 1.215 1.255 V 2, 3 1.228 1.252 V 1 1.215 1.255 V 2, 3 VR = 5.3V, IR = 45µA 1.288 1.252 V 1 VR = 5.3V, IR = 50µA 1.215 1.255 V 2, 3 VR = 5.3V, IR = 1.0mA 1.288 1.252 V 1 1.215 1.255 V 2, 3 1.288 1.252 V 1 1.215 2, 3 IR = 100µA IR = 20mA VR = 5.3V, IR = 100µA VR = 5.3V, IR = 20mA ΔVRef/ΔIR Reference Voltage Change with Current Subgroups Min 1.255 V 9µA ≤ IR ≤ 1mA 1.0 mV 1 10µA ≤ IR ≤ 1mA 1.5 mV 2, 3 1mA ≤ IR ≤ 20mA 10 mV 1 20 mV 2, 3 VR = 5.3V, 45µA ≤ IR ≤ 1mA 1.0 mV 1 VR = 5.3V, 50µA ≤ IR ≤ 1mA 1.5 mV 2, 3 VR = 5.3V, 1mA ≤ IR ≤ 20mA 10 mV 1 20 mV 2, 3 3.0 mV 1 6.0 mV 2, 3 ΔVRef / ΔVO Reference Voltage Change with Output Voltage VR = 5.3V, IR = 100µA IF Feedback Current IR = 9µA 20 nA 1 IR = 10µA 25 nA 2, 3 IR = 20mA 20 nA 1 25 nA 2, 3 VR = 5.3V, IR = 45µA 20 nA 1 VR = 5.3V, IR = 50µA 25 nA 2, 3 VR = 5.3V, IR = 20mA 20 nA 1 25 nA 2, 3 See (1) 9.0 µA 1 See (1) 10 µA 2, 3 See (1) 45 µA 1 See (1) 50 µA 2, 3 IC Minimum Operating Current VR = VRef VR = 5.3V (1) 4 Functional test. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM185QML LM185QML www.ti.com SNVS386D – NOVEMBER 2005 – REVISED MARCH 2013 LM185BY Electrical Characteristics DC Parameters Symbol VRef Parameter Reference Voltage Conditions Notes Max Unit 1.228 1.252 V 1 1.215 1.255 V 2, 3 IR = 9µA 1.228 1.252 V 1 IR = 10µA 1.215 1.255 V 2, 3 IR = 1mA 1.228 1.252 V 1 1.215 1.255 V 2, 3 1.228 1.252 V 1 1.215 1.255 V 2, 3 1.228 1.252 V 1 1.215 1.255 V 2, 3 VR = 5.3V, IR = 45µA 1.288 1.252 V 1 VR = 5.3V, IR = 50µA 1.215 1.255 V 2, 3 VR = 5.3V, IR = 1.0mA 1.288 1.252 V 1 1.215 1.255 V 2, 3 1.288 1.252 V 1 1.215 2, 3 IR = 100µA IR = 20mA VR = 5.3V, IR = 100µA VR = 5.3V, IR = 20mA ΔVRef/ΔIR Reference Voltage Change with Current Subgroups Min 1.255 V 9µA ≤ IR ≤ 1mA 1.0 mV 1 10µA ≤ IR ≤ 1mA 1.5 mV 2, 3 1mA ≤ IR ≤ 20mA 10 mV 1 20 mV 2, 3 VR = 5.3V, 45µA ≤ IR ≤ 1mA 1.0 mV 1 VR = 5.3V, 50µA ≤ IR ≤ 1mA 1.5 mV 2, 3 VR = 5.3V, 1mA ≤ IR ≤ 20mA 10 mV 1 20 mV 2, 3 3.0 mV 1 6.0 mV 2, 3 ΔVRef / ΔVO Reference Voltage Change with Output Voltage VR = 5.3V, IR = 100µA IF Feedback Current IR = 9µA 20 nA 1 IR = 10µA 25 nA 2, 3 IR = 20mA 20 nA 1 25 nA 2, 3 VR = 5.3V, IR = 45µA 20 nA 1 VR = 5.3V, IR = 50µA 25 nA 2, 3 VR = 5.3V, IR = 20mA 20 nA 1 25 nA 2, 3 See (1) 9.0 µA 1 See (1) 10 µA 2, 3 See (1) 45 µA 1 See (1) 50 µA 2, 3 See (2) 50 PPM/°C 1, 2, 3 IC Minimum Operating Current VR = VRef VR = 5.3V TC (1) (2) Temperature Coefficient Functional test. The average temperature coefficient is defined as the maximum deviation of reference voltage, at all measured temperatures between the operating TMin & TMax, divided by (TMax − TMin). The measured temperatures (TMeasured) are −55°C, 25°C, & 125°C or ΔVRef / (TMax − TMin) Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM185QML 5 LM185QML SNVS386D – NOVEMBER 2005 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics 6 Temperature Drift of 3 Representative Units Feedback Current Figure 4. Figure 5. Minimum Operating Current Reverse Characteristics Figure 6. Figure 7. Reverse Characteristics Forward Characteristics Figure 8. Figure 9. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM185QML LM185QML www.ti.com SNVS386D – NOVEMBER 2005 – REVISED MARCH 2013 Typical Performance Characteristics (continued) Output Noise Voltage Dynamic Output Impedance Figure 10. Figure 11. Response Time Figure 12. Temperature Coefficient Typical LM185 Figure 13. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM185QML 7 LM185QML SNVS386D – NOVEMBER 2005 – REVISED MARCH 2013 www.ti.com TYPICAL APPLICATIONS Precision 10V Reference Low AC Noise Reference Figure 14. Figure 15. 25V Low Current Shunt Regulator Figure 16. Figure 17. Series-Shunt 20 mA Regulator Figure 18. 8 200 mA Shunt Regulator High Efficiency Low Power Regulator Figure 19. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM185QML LM185QML www.ti.com SNVS386D – NOVEMBER 2005 – REVISED MARCH 2013 Voltage Level Detector Voltage Level Detector Figure 20. Figure 21. Fast Positive Clamp 2.4V + ΔVD1 Bidirectional Clamp ±2.4V Figure 22. Figure 23. Bidirectional Adjustable Clamp ±1.8V to ±2.4V Figure 24. Bidirectional Adjustable Clamp ±2.4V to ±6V Figure 25. *D1 can be any LED, VF=1.5V to 2.2V at 3 mA. D1 may act as an indicator. D1 will be on if ITHRESHOLD falls below the threshold current, except with I=O. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM185QML 9 LM185QML SNVS386D – NOVEMBER 2005 – REVISED MARCH 2013 www.ti.com Simple Floating Current Detector Figure 26. Figure 27. Current Source Centigrade Thermometer, 10mV/°C Figure 28. Figure 29. Freezer Alarm 1.2V Reference Figure 30. 10 Precision Floating Current Detector Figure 31. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM185QML LM185QML www.ti.com SNVS386D – NOVEMBER 2005 – REVISED MARCH 2013 5.0V Reference Figure 32. REVISION HISTORY SECTION Released Revision Section Originator Changes 11/08/05 A New Release, Corporate format L. Lytle 2 MDS data sheets converted into one Corp. data sheet format. MNLM185B-X Rev 0B0 and MNLM185BY-X Rev 0B0 will be archived. 04/06/06 B Ordering Information Table, WG Connection Diagram, Absolute Maximum Ratings Section, Physical Dimensions Section R. Malone Added NSID, Connection Diagram, Physical Dimension Dwg, Thermal Resistance and Package Weight for NAC package. Revision A will be Archived. 06/12/08 C LM185B and LM185BY Electrical Section Larry McGee Correct IC test, VR = VREF condition, subgroup 1, 2, 3 moved limits to the maximum column. Revision B will be Archived. 03/27/13 D All Changed layout of National Data Sheet to TI format. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM185QML 11 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) 5962-9091402QYA ACTIVE CFP NAC 10 54 TBD Call TI Call TI -55 to 125 LM185BWG /883 Q 5962-90914 02QYA ACO 02QYA >T LM185BWG/883 ACTIVE CFP NAC 10 54 TBD Call TI Call TI -55 to 125 LM185BWG /883 Q 5962-90914 02QYA ACO 02QYA >T (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. 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