Connector for Connection with PC Cards Supporting CardBus
SCAK/SCAJ Series
Highly reliable mounting achieved by unique terminal arrangement.
For
SD Memory
Card
For
microSD™
Card
For
SIM Card
8pins
For
W-SIM
For
Memory
Stick Micro™
For
Memory
Stick™
Features
Applications
●
Eject knob can be applied to the left or right side.
●
Pin header (SCAJ) is provided with an adsorption area
allowing automatic mounting.
●
For set top boxes, various PCs and AV equipment
Typical Specifications
Combine Type
Items
For
Compact
Flash™
For PC cards
supporting
CardBus
Specifications
Applicable media
PC cards which confirm to PC card standard
Mounting method
Surface mounting type
Structure
For
Express
Card™
Contact pitch
1.27mm
Number of contacts
68 pins
Operating
temperature range
–20℃ to ＋60℃
Voltage proof
For CMOS
Camera Module
Performance
250V AC 1minute
Insulation
resistance(Initial)
1,000MΩ min.
Contact
resistance(Initial)
40mΩ max.
Office environment：10,000cycles
Insertion and
removal cycle
Outside office environment：5,000cycles
Product Line
Ejection mechanism:2step
2 step ejector
Mounting system
Standard mount
Reverse mount
Stand-off（mm）
Cover
Shutter
Position of knob
Without
Left
Right
Left
Right
With
0
Without
Product No.
Standand
Reverse
SCAK5B7100
SCAK5B7200
SCAK5B7400
SCAK5B7500
Minimum packing
unit (pcs.)
SCAK5B7200
SCAK5B7100
SCAK5B7500
SCAK5B7400
180
Pin header
Mounting system
Stand-off（mm）
Product No.
Standard mount
0
SCAJ1A1600
Reverse mount
0
SCAJ1B1500
Minimum packing unit (pcs.)
300
Notes
1. ※Please place purchase orders in minimum order units.
2. Please contact us for export packing details.
3. The pin headers and the ejectors are supplied as separate parts. When using them, solder a pin header to a printed
circuit board, assemble an ejector to the pin header and screw it.
52
Connector for Connection with PC Cards Supporting CardBus SCAK/SCAJ Series
Unit:mm
Dimensions
Standard type
With cover
For
microSD™
Card
＃!
' For
W-SIM
For
Memory
Stick Micro™
For
Memory
Stick™
!
" #$ %"& '(")
*+") ,-
Combine Type
" & &
" & ")
0 &
&#
＃ "
For
SIM Card
8pins
$
＃#
＃%
#
!
!
%#
%#
"
!
＃３４
＃68
!#!
%#
$#%
（"! ）
!" "!
1
For
SD Memory
Card
（）
#
. # /. "
$#
#$
!!
PC board mounting hole dimensions
（Viewed from the mounting face side）
Style
No.
For
Compact
Flash™
For PC cards
supporting
CardBus
For
Express
Card™
Reverse type
With cover
＃34
Knob 5
＃68
＃35
＃1
52.6
3.4 min.
34.1 min.
30.2 min.
52.3
2.25 min.
61.46
51.5
28.6 min.
0.57
4.9 min.
6.7min.
2.25 min.
2-3.05
2.1min.
3.4
6.8
52.3
15.2
P.C board
mounting side
＃35
17.8
＃34
＃68
2 min.
4.2
1.7
0.35
＃1
For CMOS
Camera Module
6.7 min.
42.4
69.9
73.2 max.
78.2
23.5 min.
Pad width
5
¿1.2
5
4.13
67.43
1.4
33.9
Knob eject
position
3.6
Card entrance
¿2.4
Knob stroke 8
85.6
32.5
Engagement face
5.8 max.
Ejection travel
4.6
14
Knob lock
position
5
0.635
.4
2.4
5.9
2-2.6
Knob over
tra
4.5
2.1
Pitch
¿2
6
7.4
4.7
Card end position
（85.6）
74.1
63.3
54.56
61.46
From P.C board mounting
side to card center
2.7
2-
¿1.1
2
46.6
= 42.545
（0.635x67）
1.95
Link arm travel area
Card center
8
Pin header
23.3
53.95
33 max.
29.6 max.
53.95
4.2 min.
4-GND pad
34.9 min.
Recommend P.C board layout
(Mounting face side)
No part mounting
No pattern area
Land area
53
Connector for Connection with PC Cards Supporting CardBus
Soldering Conditions
Example of Reflow Soldering Condition（Reference）
For
SD Memory
Card
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA（K）or CC（T）.
3. Temperature profile.
For
microSD™
Card
For
W-SIM
For
Memory
Stick Micro™
For
Memory
Stick™
Temperature (˚C )
For
SIM Card
8pins
240℃(max.)
230℃(min.)
200
180℃
150℃
100
Room
temperature
Time (s)
Pre-heating
90±30 sec.
10 sec.(max.)
Combine Type
Heating time
sec.
For
Compact
Flash™
For PC cards
supporting
CardBus
For
Express
Card™
For CMOS
Camera Module
54
Cautions for using this product
1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or
electrical degradation to occur depending on the conditions. Caution is therefore required.
2. When soldering, do not use water soluble flux because this may corrode the product.
3. Regarding the setting of reflow conditions, please confirm them with the actual mass production conditions.
4. As PC board warping may alter characteristics, please take this into consideration when designing pattern and
layout.