Connector for microSD™ Card (Push-push Type) SCHA Series Compact low-profile type most suitable for mobile phones. For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type Features ● ● Applications Improved operability from a clear click feel. Good operational feel. ● Typical Specifications Items For Compact Flash™ For PC cards supporting CardBus For mobile phones, personal digital assistants, digital still cameras, compact audio equipment. Specifications Applicable media microSD™ Card Mounting type Surface mounting type Mounting style Standard mount/Reverse mount Media ejection structure Push-push type Operating temperature range −20℃ to ＋70℃ Voltage proof 500V AC 1minute Structure For Express Card™ For CMOS Camera Module Performance Insulation resistance （Initial） Contact resistance （Initial） 1,000MΩ min. Connector contacts 100mΩ max. Detection switch 500mΩ max. Insertion and removal cycle 5,000cycles Product Line Media ejection structure Mounting system Features Stand-off （mm） Packing system Without switch Product No. Drawing No. SCHA1A0101 1 SCHA1B0100 2 SCHA2B0300 3 Standard mount Push-push type 0 Taping With switch Reverse mount 16 Connector for microSD™ Card (Push-push Type) SCHA Series Dimensions Standard mount Unit:mm No. PC board mounting hole dimensions （Viewed from the mounting face side） Style Without switch 9.4 For microSD™ Card 1.4 0.3 1.8 6.85 6.1 5.7 1.8 1.15 For SIM Card 8pins 2.6 0.7 1 0.8 1.45 0.3 P=1.1 1.24 1.9 1.9 （） 7.7 12.9 1.4 For Compact Flash™ No parts area Land area For PC cards supporting CardBus No pattern area For Express Card™ With switch For CMOS Camera Module （） （） （ ） （） For Memory Stick™ Combine Type Card center 2 For W-SIM For Memory Stick Micro™ 0.3 1.5 13.6 2.9 0.3 12.6 9.85 7.4 7.2 （ ） （ ） For SD Memory Card 14 17 Connector for microSD™ Card (Push-push Type) SCHA Series Dimensions Reverse mount Unit:mm No. Style With switch For PC cards supporting CardBus For Express Card™ For CMOS Camera Module 18 （） $ $ （ ） 3 ! " "# "! " ! " " " " （） （） For Compact Flash™ For W-SIM Combine Type For SIM Card 8pins For Memory Stick™ For microSD™ Card ! For SD Memory Card For Memory Stick Micro™ PC board mounting hole dimensions （Viewed from the mounting face side） Small Memory Card Connectors Soldering Conditions Example of Reflow Soldering Condition（Reference） For SD Memory Card 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA（K）or CC（T）. 3. Temperature profile（Surface of products）. For microSD™ Card For W-SIM For Memory Stick Micro™ For Memory Stick™ Temperature (˚C ) For SIM Card 8pins 240℃(max.) 230℃(min.) 200 180℃ 150℃ 100 Room temperature Time (s) Pre-heating 90±30 sec. 10 sec.(max.) Combine Type Heating time sec. For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module 50 Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice.