Connector for ExpressCard™ SCBA/SCBB Series Compact low-profile and power-saving structure conforms to PCMCIA Unified Standard. For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Features ● ● ● ● Combine Type For Compact Flash™ Simple structure contributes to compact and light weight body. Eject knob can be applied to the left or right side. For set top boxes, printers, digital still cameras, car navigation systems, personal digital assistants, PCs and AV equipment Typical Specifications Items Structure For CMOS Camera Module ExpressCard™34/54 which confirm to ExpressCard™ standard Mounting method Surface mounting type Mounting system Standard mount / Reverse mount Contact pitch Operating temperature range Voltage proof Performance Specifications Applicable media Number of contacts Insulation resistance （Initial） Contact resistance （Initial） Insertion and removal cycle 56 ● Also available in stand-off. Pin header (SCBA) is provided with an adsorption area allowing automatic mounting. For PC cards supporting CardBus For Express Card™ Applications 1mm 26 pins –20℃ to ＋70℃ 500V AC 1minute 1,000MΩ min. 120mΩ max. 5,000cycles Connector for ExpressCard™ SCBA/SCBB Series Product Line Media ejection structure Stand-off （mm） Mounting system Position of knob Minimum packing unit Product No. Pin header SCBA7M0100 Standard mount Drawing （pcs.）F No. 550 1.6 2 step lever ejection type 1 0 Ejector SCBB7B0100 120 Pin header SCBA2M0100 550 Ejector SCBB2B0100 120 Pin header SCBA8M0100 550 Ejector SCBB8B0100 120 2 Right For SD Memory Card For microSD™ Card For SIM Card 8pins Reverse mount 1.75 3 Notes 1. F It is requested that the order placed be an integer multiple of the minimum order units. 2. The pin headers and the ejectors are supplied as separate parts. When using them, solder a pin header to a printed circuit board, assemble an ejector to the pin header and screw it. 3. For export packing, please consult us. For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type Dimensions Standard mount Unit:mm No. PC board mounting hole dimensions （Viewed from the mounting face side） Style Stand-off 1.6mm For PC cards supporting CardBus 40.7 min. 34.2 31.5 (1G25=25) Pitch1 0.7 53.5 62.5 max. 7.85 6 7.7 3 7 4.8 21 max. 27.5 min. 4 min. 74.8 ø3.1 2.4 6.3 ø3. 2 (1.5) (6) (1.3) 10 30.5 min. 33 min. 29.85 34.15 3.2 32.3 5.3 34.10 35 36.6 3 3.3 2-ø Push end position Initial position Pop up position 31.4 max. 20.5 min. 19.4 min. 35.5 max. 2.95 29.80 2-GND pad ExpressCard™ center PC board mounting side No part mounting 1.2mm max. 5.3mm max. 2.1 4.8 0.18 1.8 (4.6) ExpressCard™ end pos. 51 32 62.8 (75) 51 10 29.4 For CMOS Camera Module 9 0. ø 2- 3.25 5.2 (2.5) 11.5 min. 3.5 min. 2 max. 7.45 .5 PC board mounting side 37.2 For Express Card™ ø2 (39.1) 18.5 2- ExpressCard™ end pos. 1 For Compact Flash™ 57 Connector for ExpressCard™ SCBA/SCBB Series Dimensions Unit:mm Reverse mount No. Stand-off 0mm !" # # # # !#) ﾟ ﾟ # (## # φ For Memory Stick™ !" #$$# %$$& #$$# # ! #$$# 2 # %) * φ For W-SIM For SIM Card 8pins For microSD™ Card For SD Memory Card For Memory Stick Micro™ PC board mounting hole dimensions （Viewed from the mounting face side） Style # $ % & '( ! " Combine Type For PC cards supporting CardBus For Compact Flash™ '#!$ φ For Express Card™ Stand-off 1.75mm For CMOS Camera Module !" # $" %&"' "' '#!$ 58 # φ *" "' *" "' ) #( ) )## (# (# φ !" #$$# %$$& #$$# # ! #$$# φ 3 Connectors for ExpressCard™ Soldering Conditions Example of Reflow Soldering Condition（Reference） 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA（K）or CC（T）. 3. Temperature profile. For SD Memory Card Temperature (˚C ) For microSD™ Card 250˚C max. For SIM Card 8pins 220˚C 200 For W-SIM 190%10˚C For Memory Stick Micro™ 100 Room temperature Time (s) Pre-heating 90%30 sec. 55 sec. (max.) For Memory Stick™ Combine Type Heating time sec. For Compact Flash™ Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. When soldering, do not use water soluble flux because this may corrode the product. 3. Regarding the setting of reflow conditions, please confirm them with the actual mass production conditions. 4. As PC board warping may alter characteristics, please take this into consideration when designing pattern and layout. For PC cards supporting CardBus For Express Card™ For CMOS Camera Module 59