AP9T18GH/J Pb Free Plating Product Advanced Power Electronics Corp. ▼ Low Gate Charge N-CHANNEL ENHANCEMENT MODE POWER MOSFET D ▼ Capable of 2.5V gate drive 20V RDS(ON) 14mΩ ID ▼ Surface mount package G ▼ RoHS Compliant BVDSS 38A S Description The Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, ultra low on-resistance and cost-effectiveness. G D S TO-252(H) G D TO-251(J) S Absolute Maximum Ratings Symbol Parameter Rating Units VDS Drain-Source Voltage 20 V VGS Gate-Source Voltage ±16 V ID@TC=25℃ Continuous Drain Current, V GS @ 4.5V 38 A ID@TC=100℃ Continuous Drain Current, V GS @ 4.5V 24 A 140 A 1 IDM Pulsed Drain Current PD@TC=25℃ Total Power Dissipation 31.3 W Linear Derating Factor 0.25 W/℃ TSTG Storage Temperature Range -55 to 150 ℃ TJ Operating Junction Temperature Range -55 to 150 ℃ Thermal Data Symbol Parameter Value Units Rthj-c Thermal Resistance Junction-case Max. 4 ℃/W Rthj-a Thermal Resistance Junction-ambient Max. 110 ℃/W Data and specifications subject to change without notice 200908052-1/4 AP9T18GH/J o Electrical Characteristics@Tj=25 C(unless otherwise specified) Symbol Parameter Test Conditions Typ. Max. Units 20 - - V BVDSS Drain-Source Breakdown Voltage ΔBVDSS/ΔTj Breakdown Voltage Temperature Coefficient Reference to 25℃, ID=1mA - 0.1 - V/℃ RDS(ON) Static Drain-Source On-Resistance VGS=4.5V, ID=18A - - 14 mΩ VGS=2.5V, ID=9A - - 28 mΩ 0.5 - 1.5 V VDS=5V, ID=18A - 33 - S VDS=20V, VGS=0V - - 1 uA Drain-Source Leakage Current (Tj=150 C) VDS=16V ,VGS=0V - - 25 uA Gate-Source Leakage VGS=±16V - - ±100 nA ID=18A - 16 25 nC VGS(th) Gate Threshold Voltage gfs Forward Transconductance IDSS VDS=VGS, ID=250uA o Drain-Source Leakage Current (Tj=25 C) o IGSS VGS=0V, ID=250uA Min. 2 Qg Total Gate Charge Qgs Gate-Source Charge VDS=16V - 3 - nC Qgd Gate-Drain ("Miller") Charge VGS=4.5V - 9 - nC 2 td(on) Turn-on Delay Time VDS=10V - 12 - ns tr Rise Time ID=18A - 80 - ns td(off) Turn-off Delay Time RG=3.3Ω,VGS=5V - 22 - ns tf Fall Time RD=0.56Ω - 12 - ns Ciss Input Capacitance VGS=0V - 1115 1790 pF Coss Output Capacitance VDS=20V - 280 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 220 - pF Rg Gate Resistance f=1.0MHz - 1.54 - Ω Min. Typ. IS=18A, VGS=0V - - 1.3 V Source-Drain Diode Symbol VSD Parameter Forward On Voltage 2 2 Test Conditions Max. Units trr Reverse Recovery Time IS=18A, VGS=0V, - 19 - ns Qrr Reverse Recovery Charge dI/dt=100A/µs - 11 - nC Notes: 1.Pulse width limited by safe operating area. 2.Pulse width <300us , duty cycle <2%. 2/4 AP9T18GH/J 90 120 5.0V 4.5V o T C =25 C 100 5.0V 4.5V o T C =25 C 80 ID , Drain Current (A) ID , Drain Current (A) 70 80 3.5V 60 40 2.5V 60 3.5V 50 40 30 2.5V 20 20 V G =1.5V 10 V G =1.5V 0 0 0 1 2 3 0 4 2 3 V DS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 26 1.6 I D =9A I D =18A V G =4.5V 1.4 T C =25 o C Normalized RDS(ON) 22 RDS(ON) (mΩ ) 1 V DS , Drain-to-Source Voltage (V) 18 1.2 1.0 14 0.8 10 0.6 0 2 4 6 8 10 -50 0 50 100 150 T j , Junction Temperature ( o C) V GS , Gate-to-Source Voltage (V) Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature 2 10 8 Normalized VGS(th) (V) 1.5 IS(A) 6 T j =25 o C T j =150 o C 4 1 0.5 2 0 0 0 0.2 0.4 0.6 0.8 1 V SD , Source-to-Drain Voltage (V) Fig 5. Forward Characteristic of Reverse Diode 1.2 -50 0 50 100 150 T j , Junction Temperature ( o C) Fig 6. Gate Threshold Voltage v.s. Junction Temperature 3/4 AP9T18GH/J I D =18A 10 V DS =10V V DS =12V V DS =16V 8 C (pF) VGS , Gate to Source Voltage (V) f=1.0MHz 10000 12 6 C iss 1000 4 C oss C rss 2 0 100 0 5 10 15 20 25 30 35 1 5 9 13 17 21 25 29 V DS , Drain-to-Source Voltage (V) Q G , Total Gate Charge (nC) Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics 1000 Normalized Thermal Response (Rthjc) 1 100 ID (A) 100us 1ms 10 10ms 100ms DC Duty factor=0.5 0.2 0.1 0.1 0.05 PDM t 0.02 T 0.01 Duty factor = t/T Peak Tj = PDM x Rthjc + T C Single Pulse 0.01 1 0.1 1 10 100 0.00001 0.0001 Fig 9. Maximum Safe Operating Area 0.001 0.01 0.1 1 t , Pulse Width (s) V DS , Drain-to-Source Voltage (V) Fig 10. Effective Transient Thermal Impedance VG VDS 90% QG 4.5V QGS QGD 10% VGS td(on) tr td(off) tf Fig 11. Switching Time Waveform Charge Q Fig 12. Gate Charge Waveform 4/4