HD3SS0001 www.ti.com SLAS827 – FEBRUARY 2012 10.3Gbps Thunderbolt™ and DisplayPort™ Switch Check for Samples: HD3SS0001 FEATURES HOST APPLICATIONS DDC_SCL AUX(n) AUX(p) DDC_SDA 24 25 Top View of Package HPD GND TBC-2 } CA_DET HPD } TB Rx_1 or AUX/DDC } LSTx/LSRx or DP ML1 GND TBC-16 TB Rx_1(p) TB Rx_1(n) TBC-18 GND GND ML1(p) GND PAD ML1(n) TBC-9 TBC-11 15 DP_EN VDD 10G_EN 14 11 S0 VDD TBC-4 DESCRIPTION HD3SS0001 is a high-speed passive switch designed to support low speed and high speed signals required for Thunderbolt™(TBT) applications using the mDP connector. The HD3SS0001 switches between DDC, AUX, and the 10Gbps TBT signal in order to support DisplayPort, Dual Mode DisplayPort, and ThunderboltTM. The HD3SS0001 also switches between the ThunderboltTM Low Speed UART transmit/receive pair and DisplayPort Main Link 1 (ML1) pair. The device supports 5.4Gbps for DisplayPort and 10.3Gbps for Thunderbolt. Switch control is determined by three control pins and the mDP connector pin used for cable detect. The HD3SS0001 is offered in a 28-pin QFN package and specified to operate from a single supply voltage of 3.3V over the full industrial temperature range of –40°C to 85°C. ORDERING INFORMATION (1) (1) PART NUMBER PART MARKING PACKAGE HD3SS0001RLFR HD3SS0001 28-pin RLF Reel (Large) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Thunderbolt is a trademark of Intel Corporation in the U.S. and/or other countries. DisplayPort is a trademark of VESA Standards Association. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. Copyright © 2012, Texas Instruments Incorporated PRODUCT PREVIEW VDD CA_DET 10 • • • ThunderboltTM Applications 1 • • 28 • Compatible with DisplayPort 1.2 and ThunderboltTM – Supports DP and DP++ Configurations – Handles HPD (5V tolerant) and CA_DET – Supports AUX and DDC MUX Wide –3dB Differential BW of over 10GHz for 10G Link Excellent Dynamic Characteristics (at 5GHz) – Crosstalk = –30dB – Isolation = –20dB – Insertion Loss = –1.5dB – Return Loss = –16dB – Max Bit-Bit Skew = 4 ps VDD Operating Range 3.3 V ±10% Small 3.5 mm x 5.5 mm, 28-Pin TQFN Package Reduced Power Consumption in Detect and Sleep Power Modes LSTx • 23 TM LSRx 1 HD3SS0001 SLAS827 – FEBRUARY 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. FUNCTIONAL DIAGRAM spacer spacer VDD HD3SS0001 DDC_SCL 100kΩ DDC_SDA TBC-16 3:1 Mux AUX(p) AUX(n) TBC-18 TB Rx_1(p) PRODUCT PREVIEW TB Rx_1(n) 100kΩ 2:1 Mux ML1(p) ML1(n) TBC-9 TBC-11 LSTx LSRx S0 DP_EN PU/PD Enables VDD 1MΩ 1MΩ Control Logic 10G_EN 1MΩ CA_DETECT _ SNK TBC-4 CA_DET 1MΩ HPD 2 HPD_ SNK Submit Documentation Feedback TBC-2 Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s) :HD3SS0001 HD3SS0001 www.ti.com SLAS827 – FEBRUARY 2012 TRUTH TABLE Control Lines Device & PU/PD Configurations MUX Outputs Device Mode States S0 (System Power State) DP_EN 10G_EN TBC-4 (CA_Detect) Thunderbolt 10G Mode 1 (System Active) 0 (System Sleep) 1 1 1 1 DisplayPort Mode 1 (System Active) 0 (System Sleep) 0 0 TMDS Mode 1 (System Active) 0 (System Sleep) Detect Mode TBC-16/TBC-18 (AUX) Integrated PU/PD State 2:1 Mux (DP ML) 3:1 Mux (TB 10Gbps) X - Don't Care X - Don't Care LSTx & LSRx LSTx & LSRx TB Rx_1 3-stated Off Off 0 0 0 0 DP ML1 3-stated AUX 3-stated On On 0 0 0 0 1 1 DP ML1 3-stated DDC 3-stated Off Off 1 (System Active) 0 (System Sleep) 1 1 0 0 X - Don't Care X - Don't Care LSTx & LSRx LSTx & LSRx 3-stated 3-stated On On X - Don't Care 0 1 X - Don't Care 3-stated 3-stated Off Sleep Power Mode/ Invalid State Modes (1) CONNECTOR SIDE PIN CONTROLLER SIDE PIN TBC-16 DDC_SCL or AUX(p) or TB Rx_1(p) TBC-18 DDC_SDA or AUX(n) or TB Rx_1(n) TBC-9 ML1(p) or LSTx TBC-11 ML1(n) or LSRx TBC-4 CA_DET TBC-2 HPD The HD3SS0001 can tolerate polarity inversions for the differential signals denoted by the (p) and (n) terminology to ease potential board routing issues.The LSTx/LSRx cannot be swapped since they are buffered and therefore uni-directional. Also, note the integrated pullup on TBC-18 and the integrated pulldown on TBC-16 cannot be swapped. PIN FUNCTIONS PIN I/O DESCRIPTION NUMBER NAME 27 28 AUX(p) AUX(n) I/O Controller Side AUX Positive Signal Controller Side AUX Negative Signal 5 6 TB Rx_1(p) TB Rx_1(n) O Controller Side 10Gbps Positive Signal Controller Side 10Gbps Negative Signal 8 9 ML1(p) ML1(n) I Controller Side Channel 1, DisplayPort Main Link 1 Positive Signal Controller Side Channel 1, DisplayPort Main Link 1 Negative Signal 20 19 TBC-16 TBC-18 I/O Connector Side 10G or AUX Positive Signal or DDC CLK with integrated pulldown Connector Side 10G or AUX Negative Signal or DDC Data with integrated pullup 17 16 TBC-9 TBC-11 I/O Connector Side DP Main Link 1 Positive Signal or UART TX Connector Side DP Main Link 1 Negative Signal or UART RX 25 26 DDC_SCL DDC_SDA I/O Controller Side DDC ClockController Side DDC Data 2 CA_DET O Controller Side Cable Detect 23 TBC-4 I Connector Side Cable Detect with integrated pulldown 3 HPD O Controller Side Hot Plug Detect 22 TBC-2 I Connector Side Hot Plug Detect Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s) :HD3SS0001 3 PRODUCT PREVIEW MUX PIN CONNECTION TABLE (1) HD3SS0001 SLAS827 – FEBRUARY 2012 www.ti.com PIN FUNCTIONS (continued) PIN I/O DESCRIPTION NUMBER NAME 11 12 LSTx LSRx I/O 10 13 14 S0 DP_EN 10G_EN I 1, 15, 24 VDD Supply Positive power supply voltage 4, 7, 18, 21, Center Pad GND Supply Negative power supply voltage Controller Side UART TX SignalController Side UART RX Signal Control Lines for configuring device. S0 and 10G_EN incorporate integrated pulldowns and DP_EN incorporates a pullup. Therefore, the default device state will be “Detect Mode” per the Truth Table provided these lines are not driven. ABSOLUTE MAXIMUM RATINGS (1) (2) Over operating free-air temperature range (unless otherwise noted) VALUE Supply voltage range (2) PRODUCT PREVIEW Voltage range MIN MAX VDD –0.5 4 Differential I/O –0.5 4 Control pin/buffers –0.5 VDD+0.5 Human body model (3) Electrostatic discharge Charged-device model (2) (3) (4) V V ±1,500 (4) V ±500 Continuous power dissipation (1) UNIT See Thermal Table Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential voltages, are with respect to network ground terminal. Tested in accordance with JEDEC/ESDA JS-001-2011 Tested in accordance with JEDEC JESD22 C101-E THERMAL INFORMATION HD3SS0001 THERMAL METRIC (1) θJA Junction-to-ambient thermal resistance 37.9 θJCtop Junction-to-case (top) thermal resistance 34.4 θJCbot Junction-to-case (bottom) thermal resistance 1.4 θJB Junction-to-board thermal resistance 8.7 ψJT Junction-to-top characterization parameter 0.6 ψJB Junction-to-board characterization parameter 8.5 (1) UNITS 28-PIN TQFN (RLF) °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. THERMAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX (1) UNIT 4.6 7.6 mW PD Device power dissipation P(Detect) Device power dissipation in detect mode 5 mW PSleep Device power dissipation in sleep mode 15 µW (1) 4 The maximum rating is simulated under 3.6V VDD. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s) :HD3SS0001 PACKAGE OPTION ADDENDUM www.ti.com 18-Feb-2012 PACKAGING INFORMATION Orderable Device Status (1) HD3SS0001RLFR PREVIEW Package Type Package Drawing VQFN RLF Pins Package Qty 28 3000 Eco Plan TBD (2) Lead/ Ball Finish Call TI MSL Peak Temp (3) Samples (Requires Login) Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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