Spec. No. : C330SC Issued Date : 2003.10.17 Revised Date : Page No. : 1/3 CYStech Electronics Corp. 3.0Amp. Surface Mount Schottky Barrier Diodes CSMC582XSC Series Features • For surface mounted applications. • For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications • Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0 • Low leakage current • High surge capability • High temperature soldering: 250°C/10 seconds at terminals • Exceeds environmental standards of MIL-S-19500/228 Mechanical Data • Case: Molded plastic, SMC/JEDEC DO-214AB. • Terminals: Solder plated, solderable per MIL-STD-750 method 2026 • Polarity: Indicated by cathode band. • Mounting Position : Any. • Weight: 0.195 gram, 0.00585 ounce Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. ) Parameter Conditions Repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum instantaneous IF=3A (Note 1) forward voltage Maximum average forward rectified current 8.3ms single half sine wave superimposed Peak forward surge current on rated load(JEDEC method) VR=VRRM,TA=25℃(Note 1) Maximum DC reverse current VR=VRRM,TA=125℃(Note 1) Maximum thermal Junction to ambient(Note 2) resistance Diode junction capacitance f=1MHz and applied 4V reverse voltage Storage temperature Operating temperature Type Symbol CSMC CSMC CSMC Units 5820 5821 5822 VRRM 20 30 40 V VRMS 14 21 28 V VR 20 30 40 V VF 0.475 0.500 0.525 V IO 3 A IFSM 80 A IR 2 20 mA mA Rth,JA 55 (typ) ℃/w CJ Tstg TJ 300 (typ) -55~+150 -55~+125 pF ℃ ℃ Notes : 1.Pulse test, pulse width=300μsec, 2% duty cycle 2.Mounted on PCB with 14mm² (0.013mm thickness) copper pad area. CSMC582XSC CYStek Product Specification CYStech Electronics Corp. Spec. No. : C330SC Issued Date : 2003.10.17 Revised Date : Page No. : 2/3 Characteristic Curves Forward Current Derating Curve Maximum Non-Repetitive Forward Surge Current 90 Peak Forward Surge Current---IFSM(A) Average Forward Current---Io(A) 3.5 3 2.5 2 1.5 1 0.5 80 Tj=25℃, 8.3ms Single Half Sine Wave JEDEC method 70 60 50 40 30 20 10 0 0 0 50 100 Ambient Temperature---TA(℃) 1 150 100 Number of Cycles at 60Hz Junction Capacitance vs Reverse Voltage Forward Current vs Forward Voltage 700 Junction Capacitance---CJ(pF) 100 Forward Current---IF(A) 10 10 Tj=25℃, Pulse width=300μs 1% Duty cycle 1 0.1 600 500 400 300 200 100 0.01 0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 Forward Voltage---VF(V) 0 0.01 0.1 1 10 Reverse Voltage---VR(V) Reverse Leakage Current vs Reverse Voltage Reverse Leakage Current---IR(mA) 100 10 1 Tj=75℃ 0.1 Tj=25℃ 0.01 0 20 40 60 80 100 120 140 Percentage of Rated Peak Reverse Voltage---(%) CSMC582XSC CYStek Product Specification Spec. No. : C330SC Issued Date : 2003.10.17 Revised Date : Page No. : 3/3 CYStech Electronics Corp. SMC/DO-214AB Dimension Marking Code: Device CSMC 5820 CSMC 5821 CSMC 5822 Code SK32 SK33 SK34 SMC/DO-214AB Plastic Surface Mounted Package CYStek Package Code:SC *:Typical Inches Min. Max. 0.260 0.276 0.173 0.189 0.012(typ) 0.144 0.152 DIM A B C D Millimeters Min. Max. 6.6 7.0 4.4 4.8 0.3(typ) 3.6 3.8 DIM E F G H Inches Min. Max. 0.228 0.244 0.071 0.087 0.032(typ) 0.04(typ) Millimeters Min. Max. 5.8 6.2 1.8 2.2 0.8(typ) 1.0(typ) Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. CSMC582XSC CYStek Product Specification