CYStech Electronics Corp. Spec. No. : C901S6R Issued Date : 2004.04.19 Revised Date : Page No. : 1/6 General Purpose NPN / PNP Epitaxial Planar Transistors (dual transistors) HBNP45S6R Features • Includes a BTC2412 chip and a BTA1037 chip in a SOT-363 package. • Mounting possible with SOT-323 automatic mounting machines. • Transistor elements are independent, eliminating interference. • Mounting cost and area can be cut in half. Equivalent Circuit SOT-363R HBNP45S6R Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Power Dissipation Junction Temperature Storage Temperature Symbol VCBO VCEO VEBO IC Pd Tj Tstg Limits TR1 (NPN) 60 50 7 150 TR2 (PNP) -60 -50 -6 -150 200(total) *1 150 -55~+150 Unit V V V mA mW °C °C Note: *1 150mW per element must not be exceeded. HBNP45S6R CYStek Product Specification CYStech Electronics Corp. Spec. No. : C901S6R Issued Date : 2004.04.19 Revised Date : Page No. : 2/6 Characteristics (Ta=25°C) • TR1 (NPN) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *hFE fT Cob Min. 60 50 7 200 80 - Typ. 0.2 180 2 Max. 0.1 0.1 0.4 600 3.5 Unit V V V µA µA V MHz pF Test Conditions IC=100µA IC=1mA IE=50µA VCB=60V VEB=7V IC=50mA, IB=5mA VCE=6V, IC=1mA VCE=12V, IC=2mA, f=100MHz VCB=12V, f=1MHz *Pulse Test: Pulse Width ≤380µs, Duty Cycle≤2% • TR2 (PNP) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *hFE fT Cob Min. -60 -50 -6 200 60 - Typ. -0.25 140 4 Max. -0.1 -0.1 -0.5 600 5 Unit V V V µA µA V MHz pF Test Conditions IC=-50µA IC=-1mA IE=-50µA VCB=-60V VEB=-6V IC=-50mA, IB=-5mA VCE=-6V, IC=-1mA VCE=-12V, IC=-2mA, f=100MHz VCB=-12V, f=1MHz *Pulse Test: Pulse Width ≤380µs, Duty Cycle≤2% HBNP45S6R CYStek Product Specification Spec. No. : C901S6R Issued Date : 2004.04.19 CYStech Electronics Corp. Revised Date : Page No. : 3/6 Characteristic curves • TR1 (NPN) Current Gain vs Collector Current Saturation Voltage vs Collector Current 1000 1000 Current Gain---HFE Saturation Voltage-(mV) HFE@VCE=6V 100 VCE(SAT)@IC=10IB 100 10 0.1 1 10 100 0.1 1000 10 100 1000 Collector Current--- IC(mA) Collector Current--- IC(mA) Saturation Voltage vs Collector Current Cutoff Frequency vs Collector Current Cutoff Frequency---FT(GHZ) 1 Saturation Voltage---(mV) 1000 VBE(SAT)@IC=10IB 100 FT@VCE=12V 0.1 0.1 1 10 100 Collector Current ---IC(mA) HBNP45S6R 1 1000 1 10 100 Collector Current---IC(mA) CYStek Product Specification Spec. No. : C901S6R Issued Date : 2004.04.19 CYStech Electronics Corp. Revised Date : Page No. : 4/6 • TR2 (PNP) Current Gain vs Collector Current Saturation Voltage vs Collector Current 1000 1000 Saturation Voltage---(mV) Current Gain---HFE HFE@VCE=6V 100 10 VCE(SAT)@IC=10IB 100 10 0.1 1 10 100 1000 0.1 Collector Current---IC(mA) 1 10 100 1000 Collector Current---IC(mA) Saturation Voltage vs Collector Current Cutoff Frequency vs Collector Current Cutoff Frequency---FT(GHZ) 1 Saturation Voltage---(mV) 1000 VBE(SAT)@IC=10IB 100 FT@VCE=12V 0.1 0.1 1 10 100 1000 Collector Current---IC(mA) 1 10 100 Collector Current---IC(mA) Power Derating Curves Power Dissipation---PD(mW) 250 200 d ual 150 single 100 50 0 0 50 100 150 200 Ambient Temperature---TA(℃) HBNP45S6R CYStek Product Specification CYStech Electronics Corp. Spec. No. : C901S6R Issued Date : 2004.04.19 Revised Date : Page No. : 5/6 Reel Dimension Carrier Tape Dimension HBNP45S6R CYStek Product Specification CYStech Electronics Corp. Spec. No. : C901S6R Issued Date : 2004.04.19 Revised Date : Page No. : 6/6 SOT-363R Dimension Style: Pin 1. Emitter1 (E1) Pin 2. Base1 (B1) Pin 3. Collector2 (C2) Pin 4. Emitter2 (E2) Pin 5. Base2 (B2) Pin 6. Collector1 (C1) Marking: 46 6-Lead SOT-363R Plastic Surface Mounted Package CYStek Package Code: S6R *:Typical Inches Min. Max. 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026BSC 0.004 DIM A B C D G H Millimeters Min. Max. 1.8 2.2 1.15 1.35 0.8 1.1 0.1 0.3 0.65BSC 0.1 DIM J K N S Y Inches Min. Max. 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 0.012 0.016 Millimeters Min. Max. 0.1 0.25 0.1 0.30 0.20 REF 2.00 2.20 0.30 0.40 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. HBNP45S6R CYStek Product Specification