TI TPD6F003DQDR

TPD4F003, TPD6F003, TPD8F003
www.ti.com
SLLS907D – AUGUST 2008 – REVISED JANUARY 2010
FOUR-, SIX-, AND EIGHT-CHANNEL EMI FILTERS WITH INTEGRATED ESD PROTECTION
Check for Samples: TPD4F003, TPD6F003, TPD8F003
FEATURES
1
•
•
•
•
•
•
Four-, Six-, and Eight-Channel EMI Filtering for
Data Ports
–3 dB Bandwidth 200 MHz
Greater than 25dB attenuation at 1 GHz
Robust ESD Protection Exceeds IEC61000-4-2
(Level 4)
– ±15-kV Human-Body Model (HBM)
– ±12-kV IEC 61000-4-2 Contact Discharge
– ±20-kV IEC 61000-4-2 Air-Gap Discharge
Pi-Style (C-R-C) Filter Configuration
(R = 100 Ω, CTOTAL = 17 pF)
Low 10-nA Leakage Current
•
Space-Saving DQD Packages and
Flow-Through Pin Mapping Provide Optimum
Filter Performance
APPLICATIONS
•
•
•
•
LCD Display Interfaces
Cell Phones
SVGA Video Connections
Personal Digital Assistants (PDAs)
DQD PACKAGE
(TOP VIEW)
TPD4F003
TPD6F003
TPD8F003
Ch1_Out
Ch1_In
1
12
Ch1_Out
Ch1_In
1
16
Ch1_Out
Ch2_In
2
7
Ch2_Out
Ch2_In
2
11
Ch2_Out
Ch2_In
2
15
Ch2_Out
Ch3_In
3
6
Ch3_Out
Ch3_In
3
10
Ch3_Out
Ch3_In
3
14
Ch3_Out
Ch4_In
4
5
Ch4_Out
Ch4_In
4
9
Ch4_Out
Ch4_In
4
13
Ch4_Out
Ch5_In
5
8
Ch5_Out
Ch5_In
5
12
Ch5_Out
Ch6_In
6
7
Ch6_Out
Ch6_In
6
11
Ch6_Out
Ch7_In
7
10
Ch7_Out
Ch8_In
8
9
Ch8_Out
1.7 mm x 1.35 mm x 0.75 mm
(0.4-mm pitch)
2.5 mm x 1.35 mm x 0.75 mm
(0.4-mm pitch)
GND
8
GND
1
GND
Ch1_In
3.3 mm x 1.35 mm x 0.75 mm
(0.4-mm pitch)
DESCRIPTION/ORDERING INFORMATION
The TPD4F003, TPD6F003, and TPD8F003 are 4-, 6-, and 8-channel EMI filters in space-saving 0.4-mm pitch
DQD packages. The low-pass filter arrays reduce EMI emissions and provide system level ESD protection.
Because of its small package and easy-to-use pin assignments, the TPDxF003 filters ar suitable for a wide array
of applications such as mobile handsets, PDAs, video consoles, notebook computers, etc. In particular, these
filters are ideal for EMI filtering and protecting data lines from ESD at the LCD display, keypad, and memory
interfaces.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008–2010, Texas Instruments Incorporated
TPD4F003, TPD6F003, TPD8F003
SLLS907D – AUGUST 2008 – REVISED JANUARY 2010
www.ti.com
The TPDxF003 are highly integrated device designed to suppress EMI/RFI noise in all systems subjected to
electromagnetic interferences. These filter series include an ESD protection circuitry which prevents damage to
the application when subjected to ESD stress far exceeding IEC 61000-4-2 (Level 4).
The TPDxF003 is specified for –40°C to 85°C operation.
ORDERING INFORMATION
TA
–40°C to 85°C
(1)
(2)
PACKAGE
(1) (2)
PACKAGE DIMENSION
0.4-mm pitch SON
ORDERABLE
PART NUMBER
TOP-SIDE MARKING
Length = 1.7 mm, Width = 1.35 mm,
Pitch = 0.4 mm, Height = 0.75 mm
TPD4F003DQDR
5RS
Length = 2.5 mm, Width = 1.35 mm,
Pitch = 0.4 mm, Height = 0.75 mm
TPD6F003DQDR
47S
Length = 3.3 mm, Width = 1.35 mm,
Pitch = 0.4 mm, Height = 0.75 mm
TPD8F003DQDR
5US
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
EQUIVALENT SCHEMATIC REPRESENTATION
100 Ω
Ch_In
8.5 pF
Ch_Out
8.5 pF
GND
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
VIO
IO to GND
Tstg
Storage temperature range
TJ
Junction temperature
(1)
MAX
–65
UNIT
6
V
150
°C
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
100
115
Ω
VBR
DC breakdown voltage
R
Resistance
C
Capacitance (C1 or C2)
VIO = 2.5 V
8.5
pF
IIO
Channel leakage current
VIO = 3.3 V
10
nA
fC
Cut-off frequency
ZSOURCE = 50 Ω, ZLOAD = 50 Ω
200
MHz
(1)
2
IIO = 10 mA
TYP (1)
6
85
V
Typical values are at TA = 25°C.
Submit Documentation Feedback
Copyright © 2008–2010, Texas Instruments Incorporated
Product Folder Link(s): TPD4F003 TPD6F003 TPD8F003
TPD4F003, TPD6F003, TPD8F003
www.ti.com
SLLS907D – AUGUST 2008 – REVISED JANUARY 2010
ESD PROTECTION
TYP
UNIT
Human-Body Model (HBM)
±15
kV
IEC 61000-4-2 Contact Discharge
±12
kV
IEC 61000-4-2 Air-Gap Discharge
±20
kV
TYPICAL CHARACTERISTCS
IEC Clamping Waveforms
(clamp voltage measured both at Ch_Out and Ch_In)
140
140
120
120
100
100
80
80
Ch_In
Ch_Out
Amplitude (V)
Amplitude (V)
Ch_In
60
40
60
40
20
20
0
0
-20
-20
-40
-40
0
25
50
75
100
125
150
175
0
200
25
50
75
100
125
150
175
200
Time (ns)
Time (ns)
Figure 1. With 8 kV Contact ESD Stress at Ch_Out
Figure 2. With 12 kV Contact ESD Stress at Ch_Out
40
40
20
20
Ch_In
Ch_In
Ch_Out
0
0
-20
-20
Amplitude (V)
Amplitude (V)
Ch_Out
-40
-60
Ch_Out
-40
-60
-80
-80
-100
-100
-120
-120
-140
-140
0
25
50
75
100
125
150
175
200
0
25
50
75
100
125
150
175
200
Time (ns)
Time (ns)
Figure 3. With -8 kV Contact ESD Stress at Ch_Out
Copyright © 2008–2010, Texas Instruments Incorporated
Figure 4. With -12 kV Contact ESD Stress at Ch_Out
Submit Documentation Feedback
Product Folder Link(s): TPD4F003 TPD6F003 TPD8F003
3
TPD4F003, TPD6F003, TPD8F003
SLLS907D – AUGUST 2008 – REVISED JANUARY 2010
www.ti.com
0.001
0
-5
0.0008
TPD8F003
-10
-15
TPD4F003
0.0006
0.0004
TPD6F003
3dB drop/Bias of 0.0V
-3dB = 197MHz
Peak/Freq/Db = 2.30/47 GHz/dB
-20
0.0002
-25
Current (mA)
Insertion Loss (dB)
TPD6F003
TPD8F003
3dB drop/Bias of 0.0V
-3dB = 198MHz
Peak/Freq/Db = 2.57/45 GHz/dB
TPD4F003
3dB drop/Bias of 0.0V
-3dB = 197MHz
Peak/Freq/Db = 2.25/45 GHz/dB
-30
0
-35
-0.0002
-40
-0.0004
-45
-0.0006
-50
1.00E+06
1.00E+07
1.00E+08
1.00E+09
1.00E+10
-0.0008
Frequency (Hz)
-0.001
-4
-2
0
2
4
6
8
Voltage (V)
Figure 5. Frequency Response
Figure 6. DC Voltage-Current Sweep Across Input/Output Pins
Channel-to-Channel Crosstalk
0
0
-5
-10
-5
Adjacent Signal Pair
Farthest Signal Pair
-15
-20
-25
-30
-30
-35
-40
-40
-45
-50
Crosstalk (dB)
Crosstalk (dB)
Farthest Signal Pair
-25
-35
-55
-60
-65
-70
-75
-45
-50
-55
-60
-65
-70
-75
-80
-80
-85
-85
-90
-90
-95
-95
-100
-100
-105
-105
-110
-110
1.00E+05
Adjacent Signal Pair
-10
-15
-20
1.00E+06
1.00E+07
1.00E+08
1.00E+09
1.00E+10
1.00E+05
1.00E+06
1.00E+07
Frequency (Hz)
1.00E+08
1.00E+09
1.00E+10
Frequency (Hz)
Figure 7. TPD4F003
Figure 8. TPD6F003
0
-5
Adjacent Signal pair
-10
Farthest Signal Pair
-15
-20
-25
-30
-35
Crosstalk (dB)
-40
-45
-50
-55
-60
-65
-70
-75
-80
-85
-90
-95
-100
-105
-110
1.00E+05
1.00E+06
1.00E+07
1.00E+08
1.00E+09
1.00E+10
Frequency (Hz)
Figure 9. TPD8F003
4
Submit Documentation Feedback
Copyright © 2008–2010, Texas Instruments Incorporated
Product Folder Link(s): TPD4F003 TPD6F003 TPD8F003
PACKAGE OPTION ADDENDUM
www.ti.com
19-Feb-2010
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPD4F003DQDR
ACTIVE
WSON
DQD
8
3000
TBD
Call TI
Call TI
TPD6F003DQDR
ACTIVE
WSON
DQD
12
3000
TBD
Call TI
Call TI
TPD8F003DQDR
ACTIVE
WSON
DQD
16
3000 Green (RoHS &
no Sb/Br)
Lead/Ball Finish
CU NIPDAU
MSL Peak Temp (3)
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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