TPD4F003, TPD6F003, TPD8F003 www.ti.com SLLS907D – AUGUST 2008 – REVISED JANUARY 2010 FOUR-, SIX-, AND EIGHT-CHANNEL EMI FILTERS WITH INTEGRATED ESD PROTECTION Check for Samples: TPD4F003, TPD6F003, TPD8F003 FEATURES 1 • • • • • • Four-, Six-, and Eight-Channel EMI Filtering for Data Ports –3 dB Bandwidth 200 MHz Greater than 25dB attenuation at 1 GHz Robust ESD Protection Exceeds IEC61000-4-2 (Level 4) – ±15-kV Human-Body Model (HBM) – ±12-kV IEC 61000-4-2 Contact Discharge – ±20-kV IEC 61000-4-2 Air-Gap Discharge Pi-Style (C-R-C) Filter Configuration (R = 100 Ω, CTOTAL = 17 pF) Low 10-nA Leakage Current • Space-Saving DQD Packages and Flow-Through Pin Mapping Provide Optimum Filter Performance APPLICATIONS • • • • LCD Display Interfaces Cell Phones SVGA Video Connections Personal Digital Assistants (PDAs) DQD PACKAGE (TOP VIEW) TPD4F003 TPD6F003 TPD8F003 Ch1_Out Ch1_In 1 12 Ch1_Out Ch1_In 1 16 Ch1_Out Ch2_In 2 7 Ch2_Out Ch2_In 2 11 Ch2_Out Ch2_In 2 15 Ch2_Out Ch3_In 3 6 Ch3_Out Ch3_In 3 10 Ch3_Out Ch3_In 3 14 Ch3_Out Ch4_In 4 5 Ch4_Out Ch4_In 4 9 Ch4_Out Ch4_In 4 13 Ch4_Out Ch5_In 5 8 Ch5_Out Ch5_In 5 12 Ch5_Out Ch6_In 6 7 Ch6_Out Ch6_In 6 11 Ch6_Out Ch7_In 7 10 Ch7_Out Ch8_In 8 9 Ch8_Out 1.7 mm x 1.35 mm x 0.75 mm (0.4-mm pitch) 2.5 mm x 1.35 mm x 0.75 mm (0.4-mm pitch) GND 8 GND 1 GND Ch1_In 3.3 mm x 1.35 mm x 0.75 mm (0.4-mm pitch) DESCRIPTION/ORDERING INFORMATION The TPD4F003, TPD6F003, and TPD8F003 are 4-, 6-, and 8-channel EMI filters in space-saving 0.4-mm pitch DQD packages. The low-pass filter arrays reduce EMI emissions and provide system level ESD protection. Because of its small package and easy-to-use pin assignments, the TPDxF003 filters ar suitable for a wide array of applications such as mobile handsets, PDAs, video consoles, notebook computers, etc. In particular, these filters are ideal for EMI filtering and protecting data lines from ESD at the LCD display, keypad, and memory interfaces. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008–2010, Texas Instruments Incorporated TPD4F003, TPD6F003, TPD8F003 SLLS907D – AUGUST 2008 – REVISED JANUARY 2010 www.ti.com The TPDxF003 are highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. These filter series include an ESD protection circuitry which prevents damage to the application when subjected to ESD stress far exceeding IEC 61000-4-2 (Level 4). The TPDxF003 is specified for –40°C to 85°C operation. ORDERING INFORMATION TA –40°C to 85°C (1) (2) PACKAGE (1) (2) PACKAGE DIMENSION 0.4-mm pitch SON ORDERABLE PART NUMBER TOP-SIDE MARKING Length = 1.7 mm, Width = 1.35 mm, Pitch = 0.4 mm, Height = 0.75 mm TPD4F003DQDR 5RS Length = 2.5 mm, Width = 1.35 mm, Pitch = 0.4 mm, Height = 0.75 mm TPD6F003DQDR 47S Length = 3.3 mm, Width = 1.35 mm, Pitch = 0.4 mm, Height = 0.75 mm TPD8F003DQDR 5US For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. EQUIVALENT SCHEMATIC REPRESENTATION 100 Ω Ch_In 8.5 pF Ch_Out 8.5 pF GND ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN VIO IO to GND Tstg Storage temperature range TJ Junction temperature (1) MAX –65 UNIT 6 V 150 °C 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS TA = –40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN MAX UNIT 100 115 Ω VBR DC breakdown voltage R Resistance C Capacitance (C1 or C2) VIO = 2.5 V 8.5 pF IIO Channel leakage current VIO = 3.3 V 10 nA fC Cut-off frequency ZSOURCE = 50 Ω, ZLOAD = 50 Ω 200 MHz (1) 2 IIO = 10 mA TYP (1) 6 85 V Typical values are at TA = 25°C. Submit Documentation Feedback Copyright © 2008–2010, Texas Instruments Incorporated Product Folder Link(s): TPD4F003 TPD6F003 TPD8F003 TPD4F003, TPD6F003, TPD8F003 www.ti.com SLLS907D – AUGUST 2008 – REVISED JANUARY 2010 ESD PROTECTION TYP UNIT Human-Body Model (HBM) ±15 kV IEC 61000-4-2 Contact Discharge ±12 kV IEC 61000-4-2 Air-Gap Discharge ±20 kV TYPICAL CHARACTERISTCS IEC Clamping Waveforms (clamp voltage measured both at Ch_Out and Ch_In) 140 140 120 120 100 100 80 80 Ch_In Ch_Out Amplitude (V) Amplitude (V) Ch_In 60 40 60 40 20 20 0 0 -20 -20 -40 -40 0 25 50 75 100 125 150 175 0 200 25 50 75 100 125 150 175 200 Time (ns) Time (ns) Figure 1. With 8 kV Contact ESD Stress at Ch_Out Figure 2. With 12 kV Contact ESD Stress at Ch_Out 40 40 20 20 Ch_In Ch_In Ch_Out 0 0 -20 -20 Amplitude (V) Amplitude (V) Ch_Out -40 -60 Ch_Out -40 -60 -80 -80 -100 -100 -120 -120 -140 -140 0 25 50 75 100 125 150 175 200 0 25 50 75 100 125 150 175 200 Time (ns) Time (ns) Figure 3. With -8 kV Contact ESD Stress at Ch_Out Copyright © 2008–2010, Texas Instruments Incorporated Figure 4. With -12 kV Contact ESD Stress at Ch_Out Submit Documentation Feedback Product Folder Link(s): TPD4F003 TPD6F003 TPD8F003 3 TPD4F003, TPD6F003, TPD8F003 SLLS907D – AUGUST 2008 – REVISED JANUARY 2010 www.ti.com 0.001 0 -5 0.0008 TPD8F003 -10 -15 TPD4F003 0.0006 0.0004 TPD6F003 3dB drop/Bias of 0.0V -3dB = 197MHz Peak/Freq/Db = 2.30/47 GHz/dB -20 0.0002 -25 Current (mA) Insertion Loss (dB) TPD6F003 TPD8F003 3dB drop/Bias of 0.0V -3dB = 198MHz Peak/Freq/Db = 2.57/45 GHz/dB TPD4F003 3dB drop/Bias of 0.0V -3dB = 197MHz Peak/Freq/Db = 2.25/45 GHz/dB -30 0 -35 -0.0002 -40 -0.0004 -45 -0.0006 -50 1.00E+06 1.00E+07 1.00E+08 1.00E+09 1.00E+10 -0.0008 Frequency (Hz) -0.001 -4 -2 0 2 4 6 8 Voltage (V) Figure 5. Frequency Response Figure 6. DC Voltage-Current Sweep Across Input/Output Pins Channel-to-Channel Crosstalk 0 0 -5 -10 -5 Adjacent Signal Pair Farthest Signal Pair -15 -20 -25 -30 -30 -35 -40 -40 -45 -50 Crosstalk (dB) Crosstalk (dB) Farthest Signal Pair -25 -35 -55 -60 -65 -70 -75 -45 -50 -55 -60 -65 -70 -75 -80 -80 -85 -85 -90 -90 -95 -95 -100 -100 -105 -105 -110 -110 1.00E+05 Adjacent Signal Pair -10 -15 -20 1.00E+06 1.00E+07 1.00E+08 1.00E+09 1.00E+10 1.00E+05 1.00E+06 1.00E+07 Frequency (Hz) 1.00E+08 1.00E+09 1.00E+10 Frequency (Hz) Figure 7. TPD4F003 Figure 8. TPD6F003 0 -5 Adjacent Signal pair -10 Farthest Signal Pair -15 -20 -25 -30 -35 Crosstalk (dB) -40 -45 -50 -55 -60 -65 -70 -75 -80 -85 -90 -95 -100 -105 -110 1.00E+05 1.00E+06 1.00E+07 1.00E+08 1.00E+09 1.00E+10 Frequency (Hz) Figure 9. TPD8F003 4 Submit Documentation Feedback Copyright © 2008–2010, Texas Instruments Incorporated Product Folder Link(s): TPD4F003 TPD6F003 TPD8F003 PACKAGE OPTION ADDENDUM www.ti.com 12-Mar-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPD4F003DQDR ACTIVE WSON DQD 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPD6F003DQDR ACTIVE WSON DQD 12 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPD8F003DQDR ACTIVE WSON DQD 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) TPD4F003DQDR WSON DQD 8 3000 180.0 TPD6F003DQDR WSON DQD 12 3000 TPD8F003DQDR WSON DQD 16 3000 B0 (mm) K0 (mm) P1 (mm) 8.4 1.65 2.0 0.95 4.0 180.0 8.4 1.68 2.79 0.91 330.0 12.4 1.65 3.6 0.95 Pack Materials-Page 1 W Pin1 (mm) Quadrant 8.0 Q1 4.0 8.0 Q1 4.0 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPD4F003DQDR WSON TPD6F003DQDR WSON DQD 8 3000 202.0 201.0 28.0 DQD 12 3000 202.0 201.0 28.0 TPD8F003DQDR WSON DQD 16 3000 358.0 335.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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