TPS709xx www.ti.com SBVS186 – MARCH 2012 150-mA, 30-V, UltraLow IQ, Low-Dropout Regulators with Enable • • • • • • • • 23 • • UltraLow IQ: 1 μA Reverse Current Protection Low ISHUTDOWN: 150 nA Input Voltage Range: 2.5 V to 30 V Supports 200-mA Peak Output Low Dropout: 300 mV at 50 mA 2% Accuracy Over Temperature Available in Fixed-Output Voltages: 1.5 V to 6.5 V Thermal Shutdown and Overcurrent Protection Packages: SOT23-5 DESCRIPTION The TPS709xx series of low-dropout (LDO) linear regulators are ultralow quiescent current devices that are designed for power-sensitive applications. A precision band-gap and error amplifier provides 2% accuracy over temperature. Quiescent current of only 1 µA makes the devices ideal solutions for batterypowered, always ON systems that require very little idle state power dissipation. All devices have a thermal shutdown and current limit for safety. The LDO can be put into shutdown mode by pulling the EN pin low. The leakage current in this mode goes down to less than 150 nA. The TPS709xx series is available in an SOT23-5 package. APPLICATIONS • • • • • • • • Zigbee™ Networks Home Automation Metering Weighing Scales Portable Power Tools Remote Control Devices Wireless Handsets, Smart Phones, PDAs, WLAN and Other PC Add-On Cards White Goods DBV PACKAGE SOT23-5 (TOP VIEW) IN 1 GND 2 EN 3 5 OUT 4 NC 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Zigbee is a trademark of ZigBee Alliance. All other trademarks are the property of their respective owners. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. Copyright © 2012, Texas Instruments Incorporated PRODUCT PREVIEW FEATURES 1 TPS709xx SBVS186 – MARCH 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. AVAILABLE OPTIONS (1) PRODUCT VOUT XX is nominal output voltage (for example 28 = 2.8 V). E is TBD YYY is package designator Z is package quantity; R is for reel (3000 pieces), T is for tape (250 pieces) TPS709xxyyyz (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Specified at TJ = –40°C to +125°C, unless otherwise noted. All voltages are with respect to GND. VALUE PRODUCT PREVIEW Voltage Maximum output current MIN MAX UNIT VIN –0.3 +30 V VEN –0.3 +7 V VOUT –0.3 +7 V IOUT Internally limited PDISS See the Thermal Information table Output short-circuit duration Indefinite Continuous total power dissipation Temperature –55 +150 Storage, Tstg –55 +150 °C 2 kV 500 V Human body model (HBM) Electrostatic discharge (ESD) rating (1) Junction, TJ Charged device model (CDM) °C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability. THERMAL INFORMATION TPS709xx THERMAL METRIC (1) DBV (SOT23) UNITS 5 PINS θJA Junction-to-ambient thermal resistance 212.1 θJCtop Junction-to-case (top) thermal resistance 78.5 θJB Junction-to-board thermal resistance 39.5 ψJT Junction-to-top characterization parameter 2.86 ψJB Junction-to-board characterization parameter 38.7 θJCbot Junction-to-case (bottom) thermal resistance N/A (1) 2 °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated TPS709xx www.ti.com SBVS186 – MARCH 2012 ELECTRICAL CHARACTERISTICS At TA = –40°C to +85°C, VIN = VOUT (typ) + 1 V or 2.5 V (whichever is greater), IOUT = 1 mA, VEN = 2 V, and CIN = COUT = 2.2-μF ceramic, unless otherwise noted. Typical values are at TA = +25°C. TPS709xx TEST CONDITIONS MIN TYP MAX UNIT VIN Input voltage range 2.5 28 VOUT Output voltage range 1.5 6.5 V VO DC output accuracy –2 2 % ΔVO/ΔVIN Line regulation VOUT(NOM) + 1 V, 2.5 V ≤ VIN ≤ 24 V 15 mV ΔVO/ΔIOUT Load regulation 0 mA ≤ IOUT ≤ 150 mA VDO Dropout voltage (1) ICL Output current limit 10 20 50 mV IOUT = 150 mA 800 1650 mV IOUT = 50 mA 300 650 mV 300 400 mA 1 1.8 μA VOUT = 0.9 × VOUT(NOM) 260 IOUT = 0 mA IGND Ground pin current ISHUTDOWN Shutdown pin current IOUT = 100 mA 150 μA IOUT = 150 mA 300 μA VEN ≤ 0.4 V, VIN = 2.0 V 150 nA 85 dB 70 dB 52 dB 300 μVRMS f = 10 Hz PSRR V Power-supply rejection ratio f = 100 Hz f = 1 kHz BW = 100 Hz to 100 kHz, IOUT = 10 mA, VIN = 2.3 V, VOUT = 1.8 V VN Output noise voltage tSTR Startup time (2) VEN(HI) Enable pin high (enabled) 0.9 5.5 V VEN(HI) Enable pin high (disabled) 0 0.4 V IEN EN pin current EN = 5.5 V, IOUT = 10 µA 5 nA tSD Thermal shutdown temperature Shutdown, temperature increasing +160 °C Reset, temperature decreasing +140 °C TJ Operating junction temperature (1) (2) μs 150 –40 PRODUCT PREVIEW PARAMETER +125 °C VDO is measured for devices with VIN = 0.98 × VOUT(NOM). Startup time = time from EN assertion to 0.95 × VOUT(NOM). Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 3 TPS709xx SBVS186 – MARCH 2012 www.ti.com FUNCTIONAL BLOCK DIAGRAM OUT IN Current Limit Thermal Shutdown EN Bandgap LOGIC Device PRODUCT PREVIEW GND Figure 1. Fixed-Voltage Version 4 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated TPS709xx www.ti.com SBVS186 – MARCH 2012 TYPICAL CHARACTERISTICS PRODUCT PREVIEW Over operating temperature range (TJ = –40°C to +125°C), IOUT = 10 mA, VEN = 1.0 V, COUT = 2.2 μF, and VIN = VOUT(TYP) + 1 V or 2.5 V (whichever is greater), unless otherwise noted. Typical values are at TJ = +25°C. Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 5 TPS709xx SBVS186 – MARCH 2012 www.ti.com APPLICATION INFORMATION The TPS709xx are a series of devices that belong to a new family of next-generation, low-dropout (LDO) voltage regulators. They consume low quiescent current and deliver excellent line and load transient performance. This performance, combined with low noise, very good PSRR with little (VIN – VOUT) headroom, makes these devices ideal for RF portable applications, current limit, and thermal protection. The TPS709xx are specified from –40°C to +125°C. BOARD LAYOUT RECOMMENDATIONS TO IMPROVE PSRR AND NOISE PERFORMANCE Input and output capacitors should be placed as close to the device pins as possible. To improve ac performance (such as PSRR, output noise, and transient response), it is recommended that the board be designed with separate ground planes for VIN and VOUT, with the ground plane connected only at the GND pin of the device. In addition, the ground connection for the output capacitor should be connected directly to the device GND pin. INTERNAL CURRENT LIMIT PRODUCT PREVIEW The TPS709xx internal current limit helps to protect the regulator during fault conditions. During current limit, the output sources a fixed amount of current that is largely independent of output voltage. In such a case, the output voltage is not regulated, and can be measured as VOUT = ILIMIT × RLOAD. The PMOS pass transistor dissipates [(VIN – VOUT) × ILIMIT] until a thermal shutdown is triggered and the device turns off. As the device cools down, it is turned on by the internal thermal shutdown circuit. If the fault condition continues, the device cycles between current limit and thermal shutdown; see the Thermal Information section for more details. The TPS709xx is characterized over the recommended operating output current range up to 150 mA. The internal current limit begins to limit the output current at a minimum of 260 mA of output current. The TPS709xx continues to operate for output currents between 150 mA and 260 mA but some data sheet parameters may not be met, resulting in increased power dissipation. DROPOUT VOLTAGE The TPS709xx uses a PMOS pass transistor to achieve low dropout. When (VIN – VOUT) is less than the dropout voltage (VDO), the PMOS pass device is in the linear region of operation and the input-to-output resistance is the RDS(ON) of the PMOS pass element. VDO approximately scales with the output current because the PMOS device behaves as a resistor in dropout. As with any linear regulator, PSRR and transient response are degraded as (VIN – VOUT) approaches dropout. This effect is shown in in the Typical Characteristics. TRANSIENT RESPONSE As with any regulator, increasing the output capacitor size reduces over- and undershoot magnitude, but increases transient response duration. UNDERVOLTAGE LOCK-OUT (UVLO) The TPS709xx uses an undervoltage lockout (UVLO) circuit to keep the output shut off until the internal circuitry operates properly. REVERSE CURRENT PROTECTION The TPS709xx have integrated reverse current protection. Reverse current protection prevents current from flowing from the OUT pin to the IN pin when output voltage is higher than input voltage. The reverse current protection circuitry places the power path in high impedance when it detects that the output voltage is higher than the input voltage. This setting reduces leakage current from the output to the input to TBD nA, typical. The reverse current protection is always active regardless of the enable pin logic state or if the OUT pin voltage is greater than 2.0 V. Reverse current can flow if the output voltage is less than 2.0 V and if input voltage is less than the output voltage. 6 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated TPS709xx www.ti.com SBVS186 – MARCH 2012 THERMAL INFORMATION Thermal protection disables the output when the junction temperature rises to approximately +165°C, allowing the device to cool. When the junction temperature cools to approximately +145°C, the output circuitry is again enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may cycle on and off. This cycling limits the dissipation of the regulator, protecting it from damage as a result of overheating. Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heatsink. For reliable operation, junction temperature should be limited to +125°C, maximum. To estimate the margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal protection is triggered; use worst-case loads and signal conditions. For good reliability, thermal protection should trigger at least +35°C above the maximum expected ambient condition of the particular application. This configuration produces a worst-case junction temperature of +125°C at the highest expected ambient temperature and worst-case load. The TPS709xx internal protection circuitry is designed to protect against overload conditions. It is not intended to replace proper heatsinking. Continuously running the TPS709xx into thermal shutdown degrades device reliability. The ability to remove heat from the die is different for each package type, which presents different considerations in the printed circuit board (PCB) layout. The PCB area around the device that is free of other components moves the heat from the device to ambient air. Performance data for JEDEC low and high-K boards are given in the Thermal Information table. Using heavier copper increases the effectiveness in removing heat from the device. The addition of plated through-holes to heat-dissipating layers also improves the heatsink effectiveness. Power dissipation depends on input voltage and load conditions. Power dissipation (PD) is equal to the product of the output current and the voltage drop across the output pass element, as shown in Equation 1: PD = (VIN – VOUT) × IOUT Copyright © 2012, Texas Instruments Incorporated (1) Submit Documentation Feedback 7 PRODUCT PREVIEW POWER DISSIPATION PACKAGE OPTION ADDENDUM www.ti.com 5-Jun-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp PREVIEW SOT-23 DBV 5 3000 TBD Call TI Call TI TPS70912DBVT PREVIEW SOT-23 DBV 5 250 TBD Call TI Call TI TPS709135DBVR PREVIEW SOT-23 DBV 5 3000 TBD Call TI Call TI TPS709135DBVT PREVIEW SOT-23 DBV 5 250 TBD Call TI Call TI TPS70916DBVR PREVIEW SOT-23 DBV 5 3000 TBD Call TI Call TI TPS70916DBVT PREVIEW SOT-23 DBV 5 250 TBD Call TI Call TI TPS70918DBVR PREVIEW SOT-23 DBV 5 3000 TBD Call TI Call TI TPS70918DBVT PREVIEW SOT-23 DBV 5 250 TBD Call TI Call TI TPS70919DBVR PREVIEW SOT-23 DBV 5 3000 TBD Call TI Call TI TPS70919DBVT PREVIEW SOT-23 DBV 5 250 TBD Call TI Call TI TPS70925DBVR PREVIEW SOT-23 DBV 5 3000 TBD Call TI Call TI TPS70925DBVT PREVIEW SOT-23 DBV 5 250 TBD Call TI Call TI TPS70927DBVR PREVIEW SOT-23 DBV 5 3000 TBD Call TI Call TI TPS70927DBVT PREVIEW SOT-23 DBV 5 250 TBD Call TI Call TI TPS70928DBVR PREVIEW SOT-23 DBV 5 3000 TBD Call TI Call TI TPS70928DBVT PREVIEW SOT-23 DBV 5 250 TBD Call TI Call TI TPS70930DBVR PREVIEW SOT-23 DBV 5 3000 TBD Call TI Call TI TPS70930DBVT PREVIEW SOT-23 DBV 5 250 TBD Call TI Call TI TPS70933DBVR PREVIEW SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS70933DBVT PREVIEW SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS70950DBVR PREVIEW SOT-23 DBV 5 3000 TBD Call TI Call TI TPS70950DBVT PREVIEW SOT-23 DBV 5 250 TBD Call TI Call TI The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1 Samples (Requires Login) TPS70912DBVR (1) (3) PACKAGE OPTION ADDENDUM www.ti.com 5-Jun-2012 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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