EXAR XRP7604

XRP7604
1A 29V Non-Sync. Buck High Power LED Driver
March 2009
Rev. 1.0.0
GENERAL DESCRIPTION
APPLICATIONS
The XRP7604 is a non-synchronous voltage
mode PWM step down converter with
integrated high side FET optimized to drive
high power LEDs at up to 1A of continuous
current. A wide 4.5V to 29V input voltage
range allows for single supply operations from
industry standard 5V, 12V or 24V power rails.
A 1.2MHz constant operating frequency allows
for small external components selection while
an internal type II control loop compensation
reduces the overall component count and
solution footprint. A low 200mV feedback
reference voltage minimizes power dissipation
in the system while efficiency is mazimized via
a 100% duty cycle capability. Dimming and
shutdown mode is provided via an enable
function when required. An adjustable over
current and under voltage lock out protection
insures safe operations under abnormal
operating conditions.
The XRP7604 is pin compatible with Exar’s
XRP7603 and SP7600, non synchronous buck
high power led drivers respectively rated at
500mA and 2A.
The XRP7604 is offered in a compact thermally
enhanced RoHS compliant “green”/halogen
free 8-pin SO package.
• General Lighting and Displays
• Architectural and Accent Lighting
• Medical and Industrial Instrumentation
• Video Projectors
FEATURES
• 1A Continous Output Current Capable
• 4.5V to 29V Single Rail Input Voltage
• 1.2MHz Constant Switching Frequency
• Internal Control Loop Compensation
• 0.2V Feedback Reference Voltage
• 2.5% Output Voltage Accuracy
• Built-in Soft Start
• PWM & Analog Dimming Capability
• Adjustable Over-Current Protection
• Pin Compatible with 500mA rated
XRP7603 & 2A rated SP7600
• Thermally Enhanced Package
• RoHS Compliant “Green”/Halogen Free
8-pin SO Package
TYPICAL APPLICATION DIAGRAM
Fig. 1: XRP7604 Application Diagram
Exar Corporation
48720 Kato Road, Fremont CA 94538, USA
www.exar.com
Tel. +1 510 668-7000 – Fax. +1 510 668-7001
XRP7604
1A 29V Non-Sync. Buck High Power LED Driver
ABSOLUTE MAXIMUM RATINGS
OPERATING RATINGS
These are stress ratings only and functional operation of
the device at these ratings or any other above those
indicated in the operation sections of the specifications
below is not implied. Exposure to absolute maximum
rating conditions for extended periods of time may affect
reliability.
Input Voltage Range VIN ................................4.5V to 29V
Junction Temperature Range ....................-40°C to 125°C
Thermal Resistance θJA ...................................... 59°C/W
Input Voltage ............................................. -0.3V to 30V
Lx................................................................-2V to 30V
FB .....................................................-0.3V to VIN+0.3V
Storage Temperature .............................. -65°C to 150°C
Power Dissipation (Note 1) ................... Internally Limited
Lead Temperature (Soldering, 10 sec) ................... 300°C
ESD Rating (Lx, ISET) ....................................1KV - HBM
ESD Rating (All other pins) .............................2KV - HBM
ELECTRICAL SPECIFICATIONS
Specifications with standard type are for an Operating Junction Temperature of TJ = 25°C only; limits applying over the full
Operating Junction Temperature range are denoted by a “•”. Minimum and Maximum limits are guaranteed through test,
design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for
reference purposes only. Unless otherwise indicated, VIN = 4.5V to 29V, CIN = 1µF, TJ = –40°C to 125°C.
Parameter
Min.
Typ.
Max.
Units
Conditions
UVLO Turn-On Threshold
4.0
4.2
4.5
V
0°C ≤ TJ ≤ 125°C
UVLO Turn-Off Threshold
3.8
4.0
4.3
V
0°C ≤ TJ ≤ 125°C
UVLO Hysteresis
0.2
V
Operating Input Voltage Range
4.5
29
V
Operating Input Voltage Range
7
29
V
Operating VCC Current
0°C ≤ TJ ≤ 125°C
•
2
5
mA
VFB=0.1V, not switching
Standby VCC Current
0.6
1
mA
VFB=1.2V, not switching
Reference Voltage
200
mV
Reference Voltage
186
200
214
mV
Switching Frequency
960
1250
1550
kHz
40
100
ns
0
%
Minimum On-Pulse Duration
Minimum Duty Cycle
Maximum Duty Cycle
100
VDR Voltage
4.5
Over-Current Threshold
250
ISET Pin Input Current
25
OFF Interval During Hiccup
SHDN Threshold
SHDN Threshold Hysteresis
Switch On Resistance
Switch Leakage
•
%
5.5
V
300
350
mV
33
40
µA
100
0.8
•
1.0
Measure VIN-VDR
VIN > 7V
Measure VIN-Lx
•
VIN=VLx
•
Apply voltage to FB
ms
1.2
100
V
mV
95
3
•
mΩ
5
µA
Note 1: All parameters tested at TA=25°C. Specifications over temperature are guaranteed by design.
© 2009 Exar Corporation
2/13
Rev. 1.0.0
XRP7604
1A 29V Non-Sync. Buck High Power LED Driver
BLOCK DIAGRAM
Fig. 2: XRP7604 Block Diagram
PIN ASSIGNEMENT
Fig. 3: XRP7604 Pin Assignement
© 2009 Exar Corporation
3/13
Rev. 1.0.0
XRP7604
1A 29V Non-Sync. Buck High Power LED Driver
PIN DESCRIPTION
Name
Pin Number
Description
FB
1
Regulator feedback input. A current setting resistor is connected to LED’s cathode and
FB on one side and to ground on the other side. This pin can be also used for dimming
control. By connecting a diode between this pin and a >2V signal the LED can be pulsed
at up to 1kHz
GND
2
Ground pin
VDR
3
Power supply for the internal driver. This voltage is internally regulated to about 5V
below VIN. Place a 0.1uF decoupling capacitor between VDR and Vin as close as
possible to the IC.
PVIN
4,5
SVIN
6
Input power supply for the regulator. Place input decoupling capacitor as close as
possible to this pin. This is the Vin connection for the regulator and is not tied to the
high-side FET.
LX
7
Connect to the output inductor. This is the P-Channel FET Drain
ISET
8
This pin is used as a current limit input for the internal current limit comparator.
Connect to LX through an optional resistor. Internal threshold is pre-set to 350mV
nominal and can be decreased by changing the external resistor based on the following
formula: VTRSHLD = 350mV – 33uA * R
Power PAD
9
Can be connected to inductor LX node for a thermal PAD – see Layout suggestions
section.
Connection to the FET source
ORDERING INFORMATION
Temperature
Range
Marking
Package
Packing
Quantity
Note 1
XRP7604EDB-F
-40°C≤TJ≤+125°C
XRP7604E
YYWWF
LOT#
HSOICN-8
Exp. PAD
Bulk
RoHS Compliant
Green-Halogen Free
XRP7604EDBTR-F
-40°C≤TJ≤+125°C
XRP7604E
YYWWF
LOT#
HSOICN-8
Exp. PAD
2.5K/Tape & Reel
RoHS Compliant
Green/Halogen Free
Part Number
XRP7604EVB
Note 2
XRP7604 Evaluation Board
“YY” = Year – “WW” = Work Week – “F” = Green/Halogen Free designator – “LOT#” = Lot Number
© 2009 Exar Corporation
4/13
Rev. 1.0.0
XRP7604
1A 29V Non-Sync. Buck High Power LED Driver
TYPICAL PERFORMANCE CHARACTERISTICS
The typical performance characteristics follow and begin with an illustration of the efficiencies that
can be obtained with the XRP7604 driving 1 or 6 white LEDs in series for up to 500mA output
current. For the 6 LED applications with a 24V input, the duty cycle is high and an efficiency of
94% can be obtained. For 12V input and 1 LED at 1A output, the duty cycle is much lower, but the
efficiency is still over 80%. Note: to improve line regulation a small 22pF ceramic capacitor C6
should be placed from VFB to GND to filter out any noise obtained on the sensitive FB pin.
Scope photos of output ripple are shown for the typical application circuit for 6V input at 150mVpp
ripple and at 29V input with over 400mVpp output ripple, both shown with no output capacitor. For
comparison, an output ripple scope photo is shown with only 70mVpp when a 1uF capacitor is used
at the output. For applications sensitive to output ripple, adding this relatively small 1206 sized 1uF
50V ceramic capacitor to the output provides a very good reduction in output ripple but since the
value is only 1uF the circuit will still provide good PWM output response.
Vin startup scope photos are shown for 6V, 12V and 29V input with no problems in startup as
shown in the Vout, VFB and the outpt current Io.
The last scope photos are for the output short circuit which causes a hiccup mode. The output can
be shorted which causes a controlled automatic reset or hiccup mode of about 50 to 100msec
period.
All data taken at VIN = 12V, TA = 25°C, unless otherwise specified - Schematic and BOM from Application Information
section of this datasheet.
Efficiency versus Vin at Iout = 750mA
Iout versus Vin
0.800
100
1 LED
2 LED
3 LED
1 LED
6 LED
3 LED
15
20
6 LED
0.775
Iout (mA)
90
Efficiency (%)
2 LED
80
0.750
0.725
70
0.700
60
5
10
15
20
25
5
30
25
30
Fig. 5: Output Current vs Input Voltage
Fig. 4: Efficiency vs Input Voltage
© 2009 Exar Corporation
10
Vin (V)
Vin (V)
5/13
Rev. 1.0.0
XRP7604
1A 29V Non-Sync. Buck High Power LED Driver
VFB versus Vin at Iout = 750mA
0.210
1 LED
2 LED
VFB(V)
0.205
Ch1: Lx
Ch2: Vout(AC)
Ch4: Io 0.75A/div
0.200
0.195
0.190
5
10
15
20
25
30
Vin(V)
Fig. 7: No Cout, Output Ripple=104mVpp, Vin=6V
1 LED, Vf=3.3V @ 0.75A
Fig. 6: Feedback Voltage vs Input Voltage
Ch1: Lx
Ch2: Vout(AC)
Ch4: Io 0.75A/div
Ch1: Lx
Ch2: Vout(AC)
Ch4: Io 0.75A/div
Fig. 8: No Cout, Output Ripple=284mVpp, Vin=29V
1 LED, Vf=3.3V @ 0.75A
Ch1:
Ch2:
Ch3:
Ch4:
Fig. 9: Cout=1uF, Output Ripple=164mVpp, Vin=29V
1 LED, Vf=3.3V @ 0.75A
Vin
Vout
VFB
Io 0.5A/div
Fig. 11: 12V Vin Startup
1 LED, Vf=3.3V @ 0.75A
Fig. 10: 5V Vin Startup
1 LED, Vf=3.3V @ 0.75A
© 2009 Exar Corporation
Ch1:
Ch2:
Ch3:
Ch4:
Vin
Vout
VFB
Io 0.5A/div
6/13
Rev. 1.0.0
XRP7604
1A 29V Non-Sync. Buck High Power LED Driver
Ch1:
Ch2:
Ch3:
Ch4:
Lx
Vout
VFB
Io 0.5A/div
Fig. 13: Output Overcurrent
Hiccup mode with Vin=29V
Fig. 12: 29V Vin Startup
1 LED, Vf=3.3V @ 0.75A
© 2009 Exar Corporation
Ch1:
Ch2:
Ch3:
Ch4:
Vin
Vout
VFB
Io 2A/div
7/13
Rev. 1.0.0
XRP7604
1A 29V Non-Sync. Buck High Power LED Driver
DIM = L. The DIM signal needs to be greater
than 600mV minimum to turn-off the XRP7604
and less than 200mV to fully turn-on the
XRP7604. It is recommended to use a signal
with DIM = 1V or more for OFF and 0V for ON.
The user should note that the logic is reversed
relative to many other PWM controlled LED
drivers. In other words a logic level high at
20% duty cycle will result in approximately an
80% duty cycle for the LED. Recommended
modulation frequencies are from 100Hz to
200Hz with 10 – 90% duty cycle, 500Hz with
10 – 80% duty cycle, and 1000Hz with 10 70% duty cycle. Figures 15 & 16 show the
output response at the maximum PWM DIM
signal of 1000Hz. See figure 17 for 100Hz to
1000Hz duty cycle response for two Luxeon K2
LEDs in parallel at 0.75A total current.
THEORY OF OPERATION
The XRP7604 is a fixed frequency, Voltagemode, non-synchronous buck PWM regulator
optimized for driving LEDs. Constant LED
current is achieved using resistor RFB as
shown in the page 1 schematic. A low 0.2V
reference voltage minimizes power dissipation
in RFB. A tight reference voltage tolerance of
±3%, over full operating conditions, helps
accurately program the LED current. High
switching frequency of 1.2MHz (nominal)
reduces the size of passive components.
Dimming and power sequencing is achieved
using a logic-level PWM signal applied to FB
pin via a diode. Overcurrent protection (OCP)
is based on high-side MOSFET’s Rds(on) and is
programmable via a resistor placed at LX
node.
PROGRAMMING THE LED CURRENT
Use the following equation to program the LED
current:
Equ.1: RFB =
0.2V
I LED
The output voltage will adjust as needed to
ensure average ILED is supplied. For example if
the output current has to be set at 0.35A then
RFB=0.57 Ohm. If the output LED has a
corresponding Vf of 3.5V then XRP7604 will
step down the VIN to 3.5V. If two of these
LEDs are placed in series then XRP7604 will
step down the voltage to 7V. Superimposed on
ILED there is a current ripple that is equal in
magnitude to inductor current ripple. Current
ripple will be nominally set to 10% of ILED by
proper sizing of inductor. Note that throughout
this datasheet ILED and IO will be used
interchangeably.
Ch1: DIM Signal
Ch2: VFB – 0.75A IOUT/div
Fig. 14: 1.1KHz, 10% Duty Cycle Dimming Signal
Dimming Signal is ~70% LED Duty Cycle
Ch1: DIM Signal
Ch2: VFB – 0.75A IOUT/div
DIMMING SIGNAL
A logic-level PWM signal applied through a
small-signal diode to the feed-back (FB) pin
can be used for dimming control of the LED.
This external signal we call DIM turns the
MOSFET gate drive on/off, thereby modulating
the average current delivered to the LED. The
DIM signal connects to the VFB pin through a
1N4148 diode and will shutdown the XRP7604
when DIM = H and turn-on the XRP7604 when
© 2009 Exar Corporation
Fig. 15: 1KHz, 70% Duty Cycle
Dimming Signal is ~10% LED Duty Cycle
8/13
Rev. 1.0.0
XRP7604
1A 29V Non-Sync. Buck High Power LED Driver
after FB is set at the high state (>1.2V). The
regulator is now in standby and once Vin has
reached steady-state then FB is transitioned
from a high to a low state. The regulator then
starts operating at nominal frequency.
LED current versus PWM Dimming Duty
100
100Hz
200Hz
500Hz
1kHz
90
LED current (%)
80
Another benefit of using power sequencing for
power up is that it ensures all internal circuitry
is alive and fully operational before the device
is required to regulate the current through the
LEDs. Since the regulator was “Off” before
power was applied, it is unlikely the LED is
under any type of thermal stress. EXAR does
not recommend using the XRP7604 in
applications where dimming of the LED is
achieved by PWM’ing the actual input power as
is
common
in
automotive
dimming
applications.
70
60
50
40
30
20
10
0
0
10
20
30
40
50
60
70
80
90
100
(1-D) PWM Dimming Duty (%)
BUCK OPERATION WITHOUT OUTPUT
CAPACITOR
Fig. 16: Linearity, LED current vs (1-D) PWM Dimming
Duty Cycle, Vin=12V, Io=0.75A, 2 LED in series
In order to be able to apply the
aforementioned dimming signal to the LED,
the output filter capacitor that is normally
used with a buck converter has to be removed
from the circuit. Thus the LED current ripple
equals the inductor current ripple. As a rule of
thumb current ripple should be limited to 10%
of ILED. Allowing for a higher current ripple,
up to 30%, while staying within LED
manufacturer ripple guidelines, will reduce
inductance and possibly inductor size.
MODULATOR OPERATION AND POWER
SEQUENCING
The XRP7604 has a unique modulator design
which improves the device’s ability to operate
at very high duty cycle. While seamless in
operation as the duty cycle is increasing (input
voltage falling), when the duty cycle is
decreased (input voltage rising), the user will
observe the switching frequency increasing in
distinct fractions of the switching frequency. If
the device is operating at 100% duty cycle, a
unique advantage of using a p-channel pass
device, and then the input voltage is
increased, the frequency will start at 300kHz,
then 600kHz, and then finally 1.2MHz. The
frequency will tend to increase to the next
higher fraction once the duty cycle reaches 75
to 65 percent. This is the normal operation of
the device and should be expected. There is
no impact on the LED current accuracy. If
PWM dimming is being used as the input
voltage is increased, one will see the
frequency increasing when the duty cycle is <
90%. When power is initially applied the
device will begin operating as if the input
voltage is increasing and may start operation
at one of the fractional operating frequencies.
Many users will prefer to have the device start
operating at the nominal operating frequency,
thus it is recommended that Vin be applied
© 2009 Exar Corporation
OVERCURRENT PROGRAMMING
Resistor Rs can be used to program
Overcurrent Protection (OCP). Use the
following equation for calculating the Rs value.
Equ.2:
0.35V − (1.5 × 1.15 × I OCP × Rds(on))
Rs =
33μA
Where Iocp is the programmed overcurrent
and is generally set 50% above nominal
output current, and Rds(on) = 135mohms.
Maximum value of Rs that can be used for
programming OCP is 4k.
INDUCTOR SELECTION
Select the inductor L1 for inductance, Irms
and Isat. Calculate inductance from
9/13
Rev. 1.0.0
XRP7604
1A 29V Non-Sync. Buck High Power LED Driver
Equ.3: L =
Vo × (Vin − Vo)
Vin × f × ΔI L
Ceramic capacitors are recommended for input
filtering due to their low Equivalent Series
Resistance
(ESR),
Equivalent
Series
inductance (ESL) and small form factor.
Where Vin is converter input voltage and Vo is
converter output voltage. Since voltage across
Rset is small, Vo approximately equals Vf (for
a string of series connected LEDs Vo equals
total Vf)
SCHOTTKY RECTIFIER SELECTION
Select the Schottky D1 for Voltage rating VR
and current rating If. Recommended schottky
diode voltage rating for 12V and 24V
applications is 30V and 40V respectively.
Current rating can be calculated from:
ΔIL is inductor current ripple (nominally set to
30% of Io)
Inductor Isat and Irms must allow sufficient
safeguard over output current Io. As a rule of
thumb these parameters should be 50%
higher than Io. Where high efficiency is
required a low DCR inductor should be used.
Equ.5 : If ≥ 1 −
Note that in applications where duty cycle is
low, Schottky losses comprise a larger
percentage of converter losses. In order to
improve the efficiency in these applications
choose a Schottky that meets the calculated
current rating and has a lower Vf.
INPUT CAPACITOR SELECTION
Select the input capacitor for capacitanceand
ripple current rating. Use the capacitances
listed in the table 1 as a starting point and if
needed increase Cin.
IO(A)
Cin (µF)
<0.7
2.2
0.71 to 1.2
4.7
>1.2
2 x 4.7
FEEDBACK RESISTOR RFB
R2 is part of XRP7604 loop compensation
network. Use a 30k R2 for Vin of 20V and
larger. Use R2 of 60K for Vin less than 20V.
Table 1: Cin Selection
CAPACITOR C5
This is the decoupling capacitor for the power
supply for the internal driver. Use a 0.1uF and
place as closely to VDR and SVIN pins as
possible.
Calculate the ripple current requirement from:
Equ.4: Irip = Io ×
Where D =
Vo
× Io
Vin
D × (1 − D)
Vo
Vin
© 2009 Exar Corporation
10/13
Rev. 1.0.0
XRP7604
1A 29V Non-Sync. Buck High Power LED Driver
Schottky current rating IF
DESIGN EXAMPLE
Design a drive circuit for a string of 5 LED at
0.75A with a 24V input voltage. Nominal LED
voltage is 3.3V.
IF ≥ 1−
0.2V
= 0.27Ω
0.75 A
Rs calculation
A standard value of 0.27ohm 0805 is selected.
Rs =
Inductor L1 calculation
L1 =
24V
Voltage rating should be 30V. B340A rated at
30V/3A or equivalent can be used for its
ample current rating and low forward voltage.
Resistor RFB calculation
RFB =
(5 × 3.3) × 0.75 A = 0.42 A
(5 × 3.3V ) × (24V − (5 × 3.3V )) = 19.1μH
24V × 1.2 MHz × (0.3 × 0.75 A)
0.3V − (1.5 × 1.15 × 1.5 × 0.75 A × 0.095Ω)
= 3.5kΩ
33μA
Use standard resistor value for Rs of 3.4kΩ.
Use a 22uH standard inductor.
Input capacitor
A 4.7µF CIN (C1) is needed (refer to table 1).
From Equ.4, the ripple current rating of CIN is
a fraction of 0.75A. A 4.7uF/25V ceramic
capacitor easily meets this requirement and
offers low ESR and ESL.
Fig. 17: Circuit for design example
LAYOUT CONSIDERATION
copper regions to connect output capacitors to
load to minimize inductance and resistances.
i) Place the bypass capacitors C4 and C5 as
close as possible to the XRP7604 IC. See
figure 5 for details.
v) Keep other sensitive circuits and traces
away from the LX node in particular and away
from the power supply completely if possible.
ii) Create a pad under the IC that connects the
power pad (pin 9) to the inductor. Duplicate
this pad through the pcb layers if present, and
on the bottom side of the PCB. Use multiple
vias to connect these layers to aid in heat
dissipation. Do not oversize this pad - since
the LX node is subjected to very high dv/dt
voltages, the stray capacitance formed
between these islands and the surrounding
circuitry will tend to couple switching noise
For more detail on the XRP7604 layout see the
XRP7604EVB
Evaluation
Board
Manual
available on our web site. Each layer is shown
in detail as well as a complete bill of materials.
iii) Connect the Schottky diode cathode as
close as possible to the LX node and inductor
input side. Connect the anode to a large
diameter trace or a copper area that connects
the input ground to the output ground.
iv) The output capacitor, if used, should be
placed close to the load. Use short wide
© 2009 Exar Corporation
Fig. 18: XRP7604 Eval Board
Component Side Lay
11/13
Rev. 1.0.0
XRP7604
1A 29V Non-Sync. Buck High Power LED Driver
PACKAGE SPECIFICATION
8-PIN HSOICN
© 2009 Exar Corporation
12/13
Rev. 1.0.0
XRP7604
1A 29V Non-Sync. Buck High Power LED Driver
REVISION HISTORY
Revision
Date
1.0.0
03/17/2009
Description
First release of data sheet
FOR FURTHER ASSISTANCE
Email:
[email protected]
Exar Technical Documentation:
http://www.exar.com/TechDoc/default.aspx?
EXAR CORPORATION
HEADQUARTERS AND SALES OFFICES
48720 Kato Road
Fremont, CA 94538 – USA
Tel.: +1 (510) 668-7000
Fax: +1 (510) 668-7030
www.exar.com
NOTICE
EXAR Corporation reserves the right to make changes to the products contained in this publication in order to improve
design, performance or reliability. EXAR Corporation assumes no responsibility for the use of any circuits described herein,
conveys no license under any patent or other right, and makes no representation that the circuits are free of patent
infringement. Charts and schedules contained here in are only for illustration purposes and may vary depending upon a
user’s specific application. While the information in this publication has been carefully checked; no responsibility, however,
is assumed for inaccuracies.
EXAR Corporation does not recommend the use of any of its products in life support applications where the failure
malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect
safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation receives,
writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized; (b) the user assumes
such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances.
or
its
in
all
Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited.
© 2009 Exar Corporation
13/13
Rev. 1.0.0