EXCELICS EPA240D

Excelics
EPA240D
DATA SHEET
High Efficiency Heterojunction Power FET
•
•
•
•
•
•
410
+33dBm TYPICAL OUTPUT POWER
20.0 dB TYPICAL POWER GAIN AT 2GHz
0.4 X 2400 MICRON RECESSED “MUSHROOM” GATE
Si3N4 PASSIVATION
ADVANCED EPITAXIAL HETEROJUNCTION
PROFILE PROVIDES EXTRA HIGH POWER
EFFICIENCY, AND HIGH RELIABILITY
Idss SORTED IN 60mA PER BIN RANGE
104
D
72
620
155
75
S
100
ELECTRICAL CHARACTERISTICS (Ta = 25 OC)
SYMBOLS
G
S
94
Chip Thickness: 75 ± 13 microns
All Dimensions In Microns
MIN
TYP
Output Power at 1dB Compression
f= 2GHz
Vds=8V, Ids=50% Idss
f= 4GHz
Gain at 1dB Compression
f= 2GHz
Vds=8V, Ids=50% Idss
f= 4GHz
Power Added Efficiency at 1dB Compression
Vds=8V, Ids=50% Idss
f=2GHz
31.0
33.0
33.0
20.0
15.0
Idss
Saturated Drain Current
Vds=3V, Vgs=0V
440
720
Gm
Transconductance
Vds=3V, Vgs=0V
480
760
Vp
Pinch-off Voltage
Vds=3V, Ids=6mA
BVgd
Drain Breakdown Voltage Igd=2.4mA
-11
-15
V
BVgs
Source Breakdown Voltage Igs=2.4mA
-7
-14
V
Rth
Thermal Resistance (Au-Sn Eutectic Attach)
P1dB
G1dB
PAE
PARAMETERS/TEST CONDITIONS
18.5
MAX
dBm
dB
%
55
-1.0
940
PARAMETERS
ABSOLUTE1
mA
mS
-2.5
23
MAXIMUM RATINGS AT 25OC
SYMBOLS
UNIT
CONTINUOUS2
Drain-Source Voltage
12V
8V
Vds
Gate-Source Voltage
-8V
-3V
Vgs
Drain Current
Idss
620mA
Ids
Forward Gate Current
120mA
20mA
Igsf
Input Power
30dBm
@ 3dB Compression
Pin
o
Channel Temperature
175 C
150oC
Tch
Storage Temperature
-65/175oC
-65/150oC
Tstg
Total Power Dissipation
6.0 W
5.0W
Pt
Note: 1. Exceeding any of the above ratings may result in permanent damage.
2. Exceeding any of the above ratings may reduce MTTF below design goals.
Excelics Semiconductor, Inc., 2908 Scott Blvd., Santa Clara, CA 95054
Phone: (408) 970-8664 Fax: (408) 970-8998 Web Site: www.excelics.com
V
o
C/W
EPA240D
DATA SHEET
High Efficiency Heterojunction Power FET
S-PARAMETERS
FREQ
(GHz)
0.500
1.000
1.500
2.000
2.500
3.000
3.500
4.000
4.500
5.000
5.500
6.000
6.500
7.000
7.500
8.000
8.500
9.000
9.500
10.000
Note:
8V, 1/2 Idss
--- S11 ----- S21 --MAG
ANG MAG ANG
0.932
-84.1 15.622 132.6
0.885 -124.4 10.061 109.7
0.868 -144.6 7.154 97.1
0.861 -156.7 5.496 88.3
0.859 -165.1 4.443 81.3
0.858 -171.6 3.720 75.2
0.859 -176.9 3.194 69.7
0.860
178.6 2.794 64.5
0.862
174.6 2.478 59.5
0.864
171.0 2.223 54.7
0.867
167.6 2.012 50.0
0.870
164.4 1.833 45.4
0.873
161.4 1.680 40.9
0.877
158.5 1.546 36.5
0.880
155.8 1.428 32.2
0.884
153.1 1.323 27.9
0.888
150.5 1.229 23.8
0.892
147.9 1.143 19.7
0.896
145.4 1.064 15.7
0.900
143.0 0.993 11.8
--- S12 --MAG ANG
0.023
49.4
0.029
33.4
0.031
27.8
0.032
26.3
0.033
26.8
0.034
28.5
0.034
30.9
0.035
33.8
0.037
36.8
0.039
39.7
0.041
42.4
0.044
44.7
0.048
46.5
0.051
47.8
0.055
48.5
0.060
48.7
0.065
48.5
0.069
47.8
0.074
46.8
0.079
45.5
--- S22 --MAG
ANG
0.267
-50.6
0.194
-76.5
0.165
-92.0
0.156 -103.5
0.158 -113.0
0.166 -121.5
0.179 -129.2
0.194 -136.4
0.212 -143.3
0.232 -149.8
0.255 -156.0
0.279 -162.0
0.304 -167.8
0.331 -173.5
0.359 -178.9
0.388
175.8
0.417
170.6
0.447
165.6
0.477
160.7
0.506
155.9
The data included 0.7 mils diameter Au bonding wires:
1 gate wires, 20 mils each; 1 drain wires, 12 mils each; 4 source wires, 7 mils each.