DATE DRAWN APR.-07-‘04 CHECKED APR.-07-‘04 CHECKED APR.-07-‘04 NAME APPROVED DWG.NO. T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E l e ct r i c D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird p a rt y n or u s e d f or the manuf acturin g purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd. S P E C I F I C AT I O N Device Name ： SILICON DIODE Type Name ： PH975C6 Spec. No. ： MS5D2078 Fuji Electric Device Technology Co.,Ltd. MS5D2078 1/12 H04-004-07b Date APR.-07 -2004 Fuji Electric Device Technology Co.,Ltd. DWG.NO. T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o gy C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird p a rt y n o r u s e d for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd. Revised Records Classification Ind. Content Applied date Enactment ― ―――――― Issued date Drawn Checked MS5D2078 Approved 2/12 H04-004-06b 1. SCOPE This specification provides the ratings and the test requirement for FUJI SILICON DIODE PH975C6 2.APPLICATION PFC circuit(current discontinuous mode) This diode is a product which optimizes the diode characteristic for the PFC circuit.This product is a product by which th VF characteristic was valued more than trr though there is a relation of the trade-off up to VF and trr. 4.LEAD AND LABEL (1)Outer lead material:Cu+Pb-Sn Solder(Dipping) Outer lead material: Cu+Sn-Cu Solder(Dipping) (2)LABEL Pb-Sn Soldering mark Sn-Cu Pb Free mark （□□）□□□□□□□□ □□□□ （□□）□□□□□□□□ □□□□ （□□）□ □□□□□□□□ □□□□□□ （□□）□ □□□□□□□□ □□□□□□ PCS PCS DATE CODE DATE CODE EIAJ C-3 MADE IN JAPAN 01 A EIAJ C-3 MADE IN JAPAN 01 A 5. RATINGS 5.1 MAXIMUM RATINGS (at Tc=25℃ unless otherwise specified.) ITEM SYMBOL CONDITIONS Repetitive peak reverse voltage VRRM 50Hz Square wave duty 1/2 Average output current Io Tc=97℃ Non-repetitive surge current ** IFSM Sine wave, 10ms 1shot Operating junction temperature Tj Storage temperature Tstg Pb RATINGS 600 20 * UNITS V A 100 150 A ℃ -40～+150 ℃ * Out put current of center tap full wave connection. Rating per element 5.2 ELECTRICAL CHARACTERISTICS (at Tc=25℃ unless otherwise specified.) ITEM SYMBOL CONDITIONS MAXIMUM Forward voltage *** VF IF= 10A 1.55 Reverse current *** IR VR=VRRM 10.0 Reverse recovery time *** trr IF=0.1A,IR=0.2A,Irec=0.05A 50.0 Thermal resistance Rth(j-c) Junction to case 1.5 *** Rating per element 5.3 MECHANICAL CHARACTERISTICS Mounting torque Recommended torque 0.4～0.6 Approximate mass 4.9 ** Fuji Electric Device Technology Co.,Ltd. DWG.NO. T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o gy C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird p a rt y n o r u s e d for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd. 3. OUT VIEW, MARKING, MOLDING RESIN, CHARACTERISTICS (1)Out view is shown MS5D2078 9/12 (2)Marking is shown MS5D2078 9/12 It is marked to type name or abbreviated type name, polarity and Lot No. (3)Molding resin Epoxy resin UL : V-0 (4)Characteristics is shown MS5D2078 10/12～12/12 MS5D2078 UNITS V μA ns ℃/W N・m g 3/12 H04-004-03a 6. TEST AND INSPECTION 6.1 STANDARD TEST CONDITION Standard test condition is Ta=25℃、RH=65%. If judgment is no doubt, the test condition is possible to test in normal condition Ta=5～35℃、RH=48～85% 6.2 STRUCTURE INSPECTION It inspect with eye and measure,Item3 shall be satisfied. 6.3 FORWARD AND REVERSE CHARACTERISTICS It inspect on the standard condition,Item5.2 shall be satisfied. 6.4 TEST 5 Shock 6 Solder ability 1 Solder ability 2 7 Resistance to Soldering Heat Testing methods and Conditions Pull force : 25N Force maintaining duration :10±1s Load force : 10N Number of times : 2times(90deg./time) Screwing torque value:(M3) : 50±10N・cm Frequency : 100Hz to 2kHz Acceleration : 100m/s2 Sweeping time : 4min./1 cycle 4times for each X, Y&Z directions. Peak amplitude : 15km/s2 Duration time : 0.5ms 3times for each X, Y&Z directions. Solder : Sn-37Pb Solder temp. : 235±5℃ Immersion time : 5±0.5s Apply to flux Solder : Sn-3Ag-0.5Cu Solder temp. : 245±5℃ Immersion time : 5±0.5s Apply to flux Solder temp. : 260±5°C Immersion time : 10±1s Number of times : 1times Fuji Electric Device Technology Co.,Ltd. DWG.NO. Test Items 1 Terminal Strength (Tensile) 2 Terminal Strength (Bending) 3 Mounting Strength 4 Vibration Mechanical test T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o gy C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird p a rt y n o r u s e d for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd. Test No. Reference Standard EIAJ ED4701 Sampling number A-111A method 1 5 A-111A method 3 5 A-112 method 2 5 A-121 5 A-122 test code D 5 Acceptance number (0 : 1) 5 A-131A test code A 5 A-132 5 MS5D2078 4/12 H04-004-03a Test Items 1 High Temp. Storage 2 Low Temp. Storage 3 Temperature Humidity Storage 4 Temperature Humidity Bias Endurance test T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o gy C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird p a rt y n o r u s e d for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd. 5 Unsaturated Pressurized Vapor 6 Temperature Cycle 7 Thermal Shock 8 Steady state Operating life 9 Intermittent Operating life 10 High Temp. Reverse Bias Failure Criteria Testing methods and Conditions Temperature :Ｔstg max Test duration : 1000h Temperature :Ｔstg min Test duration : 1000h Temperature : 85±2°C Relative humidity : 85±5% Test duration : 1000h Temperature : 85±2°C Relative humidity : 85±5% Bias Voltage : VRRM× 0.8 Test duration : 1000h Temperature : 130±2°C Relative humidity : 85±5% Vapor pressure : 230kPa Test duration : 48h High temp. side : Tstg max Room temp. : 5～35℃ Low temp. side : Tstg min Duration time : HT 30min,RT 5min LT 30min Number of cycles : 100 cycles Fluid : pure water(running water) High temp. side : 100+0/-5°C Low temp. side : 0+5/-0°C Duration time : HT 5min,LT 5min Number of cycles : 100 cycles Ta=25±5°C Rated load Test duration : 1000h Tj=Tjmax ～50℃ 3min ON, 3min OFF Test duration : 10000cy Temperature : Ta=100 °C Bias Voltage : VR=VRRM duty=1/2 Test duration : 1000h IR ≦USL x 5 VF≦USL x 1.1 Sampling number B-111A 22 B-112A 22 B-121A test code C 22 B-122A test code C 22 B-123A test code B 22 B-131A 22 B-141A test code A 22 D-402 22 D-403 22 D-404 22 Acceptance number (0 : 1) USL : Upper specification Limit Fuji Electric Device Technology Co.,Ltd. DWG.NO. Test No. Reference Standard EIAJ ED4701 MS5D2078 5/12 H04-004-03a 7.Cautions ・Although Fuji Electric is continually improving product quality and reliability, a small percentage of semiconductor products may become faulty. When using Fuji Electric semiconductor products in your equipment, you are requested to take adequate safety measures to prevent the equipment from causing physical injury, fire, or other problem in case any of the products fail. It is recommended to make your design fail-safe, flame retardant, and free of malfunction. ・The products described in this specification are intended for use in the following electronic and electrical equipment which has normal reliability requirements. ・Computers ・OA equipment ・Communications equipment (Terminal devices) ・Measurement equipment ・Machine tools ・AV equipment ・Electrical home appliances ・Personal equipment ・Industrial robots etc. ・The products described in this Specification are not designed or manufactured to be used in equipment or systems used under life-threatening situations. If you are considering using these products in the equipment listed below, first check the system construction and required reliability, and take adequate ・Transportation equipment (automobiles, trains, ships, etc.) ・Backbone network equipment ・Traffic-signal control equipment ・Gas alarms, leakage gas auto breakers ・Submarine repeater equipment ・Burglar alarms, fire alarms, emergency equipment ・Medical equipment ・Nuclear control equipment etc. ・Do not use the products in this Specification for equipment requiring strict reliability such as (but not limited to): ・Aerospace equipment ・Aeronautical equipment 8.Warnings ・ The Diodes should be used in products within their absolute maximum rating (voltage, current, temperature, etc. ). The diodes may be destroyed if used beyond the rating. ・The equipment containing Diodes should have adequate fuses or circuit breakers to prevent the equipment from causing secondary destruction (ex. fire, explosion etc…). ・Use the Diodes within their reliability and lifetime under certain environments or conditions. The Diodes may fail before the target lifetime of your products if used under certain reliability conditions. ・You must design the Diodes to be operated within the specified maximum ratings (voltage, current, temperature, etc. ) to prevent possible failure or destruction of devices. ・Consider the possible temperature rise not only for the junction and case, but also for the outer leads. ・Do not directly touch the leads or package of the Diodes while power is supplied or during operation, to avoid electric shock and burns. ・The Diodes are made of incombustible material. However, if a Diode fails, it may emit smoke of flame. Also, operating the Diodes near any flammable place or material may cause the Diodes to emit smoke or flame in case the Diodes become even hotter during operation. Design the arrangement to prevent the spread of fire. ・The Diodes should not used in an environment in the presence of acid, organic matter, or corrosive gas. (hydrogen sulfide, sulfurous acid gas.) ・The Diodes should not used in an irradiated field since they are not radiation proof. Fuji Electric Device Technology Co.,Ltd. DWG.NO. T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o gy C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird p a rt y n o r u s e d for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd. safety measures such as a backup system to prevent the equipment from malfunctioning. MS5D2078 6/12 H04-004-03a Installation ・Soldering involves temperatures which exceed the device storage temperature rating. To avoid device damage and to ensure reliability, observe the following guidelines from the quality assurance standard. Table 1: Solder temperature and duration Solder Method Duration temperature Flow 260±5℃ 10±1second Soldering iron 350±10℃ 3.0±0.5second ・The immersion depth of the lead should basically be up to the lead stopper and the distance should be a maximum of 1.5mm from the device. ・When flow-soldering, be careful to avoid immersing the package in the solder bath. ・Refer to the following torque reference When mounting the device on a heat sink. Excess torque applied to the mounting screw causes damage to the device and weak torque will increase the Table 2:Recommended tightening torque Package style Screw Recommended tightening torque TO-247 M3 0.4～0.6N・m ・The heat sink should have a flatness within ±30μm and roughness within 10 μm. Also, keep the tightening torque within the limits of this specification. ・Improper handling may cause isolation breakdown leading to a critical accident. ・We recommend the use of thermal compound to optimize the efficiency of heat radiation. It is important to evenly apply the compound and to eliminate any air voids. Storage ・The Diodes must be stored at a standard temperature of 5 to 35℃ and relative humidity of 45 to 75%.If the storage area is very dry, a humidifier may be required. In such a case, use only deionized water or boiled water, since the chlorine in tap water may corrode the leads. ・The Diodes should not be subjected to rapid changes in temperature to avoid condensation on the surface of the Diodes. Therefore, store the Diodes in a place where the temperature is steady. ・The Diodes should not be stored on top of each other, since this may cause excessive external force on the case. ・The Diodes should not be stored with the lead terminals remaining unprocessed. Rust may cause presoldered connections to go fail during later processing. ・The Diodes should be stored in antistatic containers or shipping bags. Fuji Electric Device Technology Co.,Ltd. DWG.NO. T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o gy C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird p a rt y n o r u s e d for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd. thermal resistance, both of which conditions may destroy the device. MS5D2078 7/12 H04-004-03a 9.Appendix ・This products does not contain PBBs (Polybrominated Biphenyl) or PBDEs (Polybrominated Diphenyl Ether ) , substances. ・This products does not contain Class-I ODS and Class-II ODS substances set force by ‘Clean Air Act of US’ law. ・If you have any questions about any part of this Specification, please contact Fuji Electric or its sales agent before using the product ・Neither Fuji nor its agents shall be held liable for any injury caused by using the products not in accordance with the instructions. ・The application examples described in this specification are merely typical uses of Fuji Electric products. This specification does not confer any industrial property rights or other rights, nor constitute a Fuji Electric Device Technology Co.,Ltd. DWG.NO. T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o gy C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird p a rt y n o r u s e d for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd. license for such rights. MS5D2078 8/12 H04-004-03a Fuji Electric Device Technology Co.,Ltd. DWG.NO. See Note:1 Note:1.Country of origin mark. No mark is Made in JAPAN. 「P」is Made in PHILIPPINES. MS5D2078 9/12 H04-004-03a T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o gy C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird p a rt y n o r u s e d for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd. Forward Characteristic (typ.) Reverse Characteristic (typ.) 101 Tj=150°C Tj=125°C 100 Tj=100°C IR Reverse Current (µA) 10 Tj=125°C Tj=100°C Tj=25°C 10-2 Tj=25°C 10-3 1 10-4 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 0 1.8 100 200 300 400 500 600 700 VR Reverse Voltage (V) VF Forward Voltage (V) Reverse Power Dissipation (max.) Forward Power Dissipation (max.) 0.015 25 0.014 DC 0.013 0.012 Square wave λ=120° Sine wave λ=180° Square wave λ=180° 10 DC (W) Square wave λ=60° 15 0.010 Reverse Power Dissipation 0.011 0.009 0.008 0.007 α=180° 0.006 0.005 PR Forward Power Dissipation (W) 20 WF 0.004 5 0.003 0.002 0.001 Per 1element 0 0.000 0 2 4 Io 6 Average Output Current 8 10 0 (A) Fuji Electric Device Technology Co.,Ltd. 100 200 VR DWG.NO. T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o gy C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird p a rt y n o r u s e d for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd. IF Forward Current (A) Tj=150°C 10-1 300 400 Reverse Voltage MS5D2078 500 600 700 (V) 10/12 H04-004-03a 10 IFSM Peak Half - Wave Current Peak Half - Wave Current (A) 100 (A) Tc 110 100 Square wave λ=120° 0 1 2 4 6 8 Io 10 Average Output Current 12 14 16 18 10 20 22 24 26 Cj Case Temperature DC Sine wave λ=180° Square wave λ=180° 90 Junction Capacitance (pF) (°C) 120 50 28 1000 1 100 Fuji Electric Device Technology Co.,Ltd. DWG.NO. IFSM T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o gy C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird p a rt y n o r u s e d for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd. 160 Current Derating (Io-Tc) (max.) 1000 Junction Capacitance Characteristic (typ.) 150 140 130 100 10 80 70 60 Square wave λ=60° (A) 1 1 λ :Conduction angle of forward current for each rectifier element Surge Capability (max.) Number of Cycles at 50Hz 1 10 100 VR Reverse Voltage (V) t Time 10 (ms) 100 MS5D2078 1000 Io:Output current of center-tap full wave connection 1000 Surge Current Ratings (max.) 100 10 Sine wave 1000 11/12 H04-004-03a 10 -3 10 -2 10 -1 t Time Fuji Electric Device Technology Co.,Ltd. DWG.NO. T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o gy C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird p a rt y n o r u s e d for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd. Transient Thermal Impedance (°C/W) 10 1 Transient Thermal Impedance (max.) 10 0 Rth j-c:1.5℃/W 10 -1 10 -2 10 0 10 1 10 MS5D2078 2 (sec) 12/12 H04-004-03a