FUJI TS982C6R

Spec. No.
DAT E
DRAWN Oct.-19-‘07
CHECKED Oct.-19-‘07
CHECKED Oct.-19-‘07
NAME
APPROVED
DWG.NO.
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E l e c t r i c
D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t ,
o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y n or u s e d
for the manufacturing purposes without the express written consent of
Fuji Electric Device Technology Co.,Ltd.
S P E C I F I C AT I O N
Device Name :
SILICON DIODE
Type Name :
TS982C6R
:
MS5D3305
Fuji Electric Device Technology Co.,Ltd.
MS5D3305 1/12
H04-004-07b
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic
D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t ,
o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed
for the manufacturing purposes without the express written consent of
Fuji Electric Device Technology Co.,Ltd.
Revised
Records
Date
Classification
Ind.
Content
Applied
date
Oct.-19
-2007
Enactment
―
――――――
Issued
date
Drawn
Checked
MS5D3305
Approved
2/12
H04-004-06b
1. SCOPE
This specification provides the ratings and the test requirement for FUJI SILICON DIODE
TS982C6R
2. OUT VIEW, MOLDING RESIN, CHARACTERISTICS
Ordering code
Package type
TS982C6R
T-pack(S)
Out view
Page
Molding resin
9/12
Characteristics
Page
UL:V-0
10/12∼12/12
Bar code label is EIAJ C-3 specification. Indispensable description items are shown as below.
(1) Type name
(2) Production code
(3) Quantity
(4) Lot №(Date code)
(5) Company code
3.1 MAXIMUM RATINGS (at Ta=25℃ unless otherwise specified.)
Item
Repetitive peak reverse voltage
Average output current
Non-repetitive forward surge current**
Operating junction temperature
Storage temperature
Symbol
Conditions
Ratings
Units
600
V
16 *
A
40
A
150
℃
VRRM
50Hz Square wave duty =1/2
Io
Tc = 88℃
IFSM
Sine wave, 10ms 1shot
Tj
Tstg
-40∼+150
* Out put current of center tap full wave connection.
**Rating per element
℃
3.2 ELECTRICAL CHARACTERISTICS (at Ta=25℃ unless otherwise specified.)
Item
Symbol
Conditions
Maximum
Units
Forward voltage***
VF
IF = 8 A
3.0
V
Reverse current***
IR
VR = VRRM
25
μA
Reverse recovery time
trr
IF=0.1A,IR=0.2A,Irec=0.05A
0.026
μs
1.5
℃/W
1.6
g
Thermal resistance
Rth(j-c)
Junction to case
***Rating per element
3.3 MECHANICAL CHARACTERISTICS
Approximate mass
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic
D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t ,
o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed
for the manufacturing purposes without the express written consent of
Fuji Electric Device Technology Co.,Ltd.
3.RATINGS
MS5D3305
3/12
H04-004-03a
4.TEST AND INSPECTION
4.1 STANDARD TEST CONDITION
Standard test condition is Ta=25℃、65%R.H.
If judgment is no doubt, the test condition is possible to test in normal condition
Ta=5∼35℃、48∼85%R.H.
4.2 STRUCTURE INSPECTION
It inspect with eye and measure, Item 2 shall be satisfied.
4.3 FORWARD AND REVERSE CHARACTERISTICS
It inspect on the standard condition, Item 3.2 shall be satisfied.
4.4 TEST
2
Mechanical test
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic
D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t ,
o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed
for the manufacturing purposes without the express written consent of
Fuji Electric Device Technology Co.,Ltd.
1
Test
items
Vibration
Shock
Solder ability 1
3
Solder ability 2
4
Resistance to
soldering heat
Testing methods and conditions
Frequency : 100Hz to 2kHz
Acceleration : 100m/s2
Sweeping time : 4min./1 cycle
4times for each X, Y&Z directions.
2
Peak amplitude : 15km/s
Duration time : 0.5ms
3times for each X, Y&Z directions.
Solder : Sn-37Pb
Solder temp. : 235±5℃
Immersion time : 5±0.5s
Apply to flux
Solder : Sn-3Ag-0.5Cu
Solder temp. : 245±5℃
Immersion time : 5±0.5s
Apply to flux
Soldering temp. : 255±5°C
Peak temp.:260℃
Number of times : 2times
Infrared reflow
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
Test
No.
Reference
standard
EIAJ
ED4701
Sampling
Acceptance
number
number
EIAJ
ED4701/403
5
test code D
EIAJ
ED4701/404
5
test code D
EIAJ
ED4701/303
5
test code A
―
5
―
5
MS5D3305
(0 : 1)
4/12
H04-004-03a
Test
No.
High temp.
Storage
Low temp.
Storage
Temperature
humidity
storage
1
2
Endurance test
3
4
Temperature
humidity
bias
5
Unsaturated
pressurized
vapor
6
Temperature
cycle
7
Thermal
shock
8
9
10
Steady state
operating
life
Intermittent
operating
life
High temp.
Reverse
bias
Testing methods and conditions
Temperature :Tstg max
Test duration : 1000h
Temperature :Tstg min
Test duration : 1000h
Temperature : 85±2°C
Relative humidity : 85±5%
Test duration : 1000h
Temperature : 85±2°C
Relative humidity : 85±5%
Bias voltage : VRRM× 0.8
Test duration : 1000h
Temperature : 130±2°C
Relative humidity : 85±5%
Vapor pressure : 230kPa
Test duration : 48h
High temp. side : Tstg max
Room temp. : 5∼35℃
Low temp. side : Tstg min
Duration time : HT 30min,RT 5min LT 30min
Number of cycles : 100 cycles
Fluid : pure water(running water)
High temp. side : 100+0/-5°C
Low temp. side : 0+5/-0°C
Duration time : HT 5min,LT 5min
Number of cycles : 100 cycles
Ta=25±5°C
Rated load
Test duration : 1000h
Tj=Tjmax ∼50℃
3min ON, 3min OFF
Test duration : 10000cycles
Temperature : Ta=100 °C
Bias voltage : VR=VRRM duty=1/2
Test duration : 1000h
Reference
standard
EIAJ ED4701
Sampling
number
EIAJ
ED4701/201
22
EIAJ
ED4701/202
22
EIAJ
ED4701/103
test code C
22
EIAJ
ED4701/103
test code C
22
EIAJ
ED4701/103
test code F
22
EIAJ
ED4701/105
22
EIAJ
ED4701/307
test code A
22
−
22
EIAJ
ED4701/106
22
EIAJ
ED4701/101
22
Acceptance
number
(0 : 1)
Preparation : Test items required without fail : Test Method B-121,B-122,B-123,B-131,B-141
Baking treatment : 125±5°C, 24hr
Humidification treatment : 85±2°C,65±5%RH,168±24hr
Soldering heat for surface mounting : Reflow soldering
Failure criteria
IR ≦USL x 5
VF≦USL x 1.1
Fuji Electric Device Technology Co.,Ltd.
230±5℃ (235℃max.), 10±1sec, 2times.
USL : Upper specification limit
DWG.NO.
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic
D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t ,
o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed
for the manufacturing purposes without the express written consent of
Fuji Electric Device Technology Co.,Ltd.
Test
items
MS5D3305
5/12
H04-004-03a
5.CAUTIONS
・Although Fuji Electric is continually improving product quality and reliability, a small percentage of
semiconductor products may become faulty. When using Fuji Electric semiconductor products in your
equipment, you are requested to take adequate safety measures to prevent the equipment from
causing physical injury, fire, or other problem in case any of the products fail. It is recommended to
make your design fail-safe, flame retardant, and free of malfunction.
・The products described in this specification are intended for use in the following electronic and
electrical equipment which has normal reliability requirements.
・Computers
・OA equipment ・Communications equipment (Terminal devices)
・Measurement equipment
・Machine tools
・AV equipment
・Electrical home appliances
・Personal equipment
・Industrial robots etc.
・The products described in this specification are not designed or manufactured to be used in equipment
or systems used under life-threatening situations. If you are considering using these products in the
equipment listed below, first check the system construction and required reliability, and take adequate
・Transportation equipment (automobiles, trains, ships, etc.)
・Backbone network equipment
・Traffic-signal control equipment
・Gas alarms, leakage gas auto breakers
・Submarine repeater equipment
・Burglar alarms, fire alarms, emergency equipment
・Medical equipment
・Nuclear control equipment etc.
・Do not use the products in this specification for equipment requiring strict reliability such as (but not
limited to):
・Aerospace equipment
・Aeronautical equipment
6.WARNINGS
・The Diodes should be used in products within their absolute maximum rating (voltage, current,
temperature, etc. ). The diodes may be destroyed if used beyond the rating.
・The equipment containing Diodes should have adequate fuses or circuit breakers to prevent the
equipment from causing secondary destruction (ex. fire, explosion etc…).
・Use the Diodes within their reliability and lifetime under certain environments or conditions.
The Diodes may fail before the target lifetime of your products if used under certain reliability
conditions.
・You must design the Diodes to be operated within the specified maximum ratings (voltage, current,
temperature, etc. ) to prevent possible failure or destruction of devices.
・Consider the possible temperature rise not only for the junction and case, but also for the outer leads.
・Do not directly touch the leads or package of the Diodes while power is supplied or during operation, to
avoid electric shock and burns.
・The Diodes are made of incombustible material. However, if a Diode fails, it may emit smoke of flame.
Also, operating the Diodes near any flammable place or material may cause the Diodes to emit smoke
or flame in case the Diodes become even hotter during operation.
Design the arrangement to prevent the spread of fire.
・The Diodes should not used in an environment in the presence of acid, organic matter, or corrosive gas.
(hydrogen sulfide, sulfurous acid gas.)
・The Diodes should not used in an irradiated field since they are not radiation proof.
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic
D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t ,
o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed
for the manufacturing purposes without the express written consent of
Fuji Electric Device Technology Co.,Ltd.
safety measures such as a backup system to prevent the equipment from malfunctioning.
MS5D3305
6/12
H04-004-03a
INSTALLATION
・Soldering involves temperatures which exceed the device storage temperature rating. To avoid
device damage and to ensure reliability, observe the following guidelines from the quality
assurance standard.
Table 1: Solder temperature and duration
Solder
Method
temperature
260℃max.
Reflow
Duration
Number of times
≦10sec
2times
・Recommendation temperature profile(Reflow)
300
275
260℃(peak)
≦10sec
225
4.5℃/sec(max.)
230℃
≧50sec
200
Temperature [℃]
Post Cooling
-5℃/sec(max.)
175
150
Pre-heat
150∼180℃
60∼120sec
125
100
75
6℃/sec(max.)
50
25
0
time [sec]
・Recommendation soldering pads
Dimensions unit:mm
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic
D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t ,
o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed
for the manufacturing purposes without the express written consent of
Fuji Electric Device Technology Co.,Ltd.
250
MS5D3305
7/12
H04-004-03a
STORAGE
・The Diodes must be stored at a standard temperature of 5 to 35℃ and relative humidity of 45
to 75%.If the storage area is very dry, a humidifier may be required. In such a case, use only
deionized water or boiled water, since the chlorine in tap water may corrode the leads.
・The Diodes should not be subjected to rapid changes in temperature to avoid condensation on
the surface of the Diodes. Therefore, store the Diodes in a place where the temperature is
steady.
・The Diodes should not be stored on top of each other, since this may cause excessive external
force on the case.
・The Diodes should not be stored with the lead terminals remaining unprocessed. Rust may
cause presoldered connections to go fail during later processing.
・The Diodes should be stored in antistatic containers or shipping bags.
7.APPENDIX
Diphenyl Ether ) , substances.
・This products does not contain Class-I ODS and Class-II ODS substances set force by ‘Clean Air
Act of US’ law.
・If you have any questions about any part of this specification, please contact Fuji Electric Device
Technology or its sales agent before using the product
・Neither Fuji nor its agents shall be held liable for any injury caused by using the products not in
accordance with the instructions.
・This specification does not confer any industrial property rights or other rights, nor constitute a
license for such rights.
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic
D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t ,
o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed
for the manufacturing purposes without the express written consent of
Fuji Electric Device Technology Co.,Ltd.
・This products does not contain PBBs (Polybrominated Biphenyl) or PBDEs (Polybrominated
MS5D3305
8/12
H04-004-03a
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic
D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t ,
o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed
for the manufacturing purposes without the express written consent of
Fuji Electric Device Technology Co.,Ltd.
(TS982C6R)
Sn-Ag plating (Pb<1000ppm)
MS5D3305
9/12
H04-004-03a
Forward Characteristic (typ.)
Reverse Characteristic (typ.)
102
Tj=150°C
101
Tj=125°C
10
IR Reverse Current (µA)
Tj=100°C
IF Forward Current (A)
Tj=150°C
Tj=125°C
Tj=100°C
Tj=25°C
1
10
0
10-1
10-3
0.1
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
0
2.8
100
200
300
400
500
600
700
VR Reverse Voltage (V)
VF Forward Voltage (V)
Forward Power Dissipation (max.)
Reverse Power Dissipation (max.)
30
0.035
DC
360°
360°
0.030
25
VR
(W)
I0
λ
α
(W)
20
Square wave λ=60°
Reverse Power Dissipation
Forward Power Dissipation
0.025
Square wave λ=120°
Sine wave λ=180°
15
Square wave λ=180°
DC
10
PR
WF
0.020
α=180°
0.015
0.010
5
0.005
Per 1element
0
0
2
4
6
IF(AV) Average Forward Current
8
0.000
0
(A)
Fuji Electric Device Technology Co.,Ltd.
100
200
VR
DWG.NO.
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic
D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t ,
o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed
for the manufacturing purposes without the express written consent of
Fuji Electric Device Technology Co.,Ltd.
Tj=25°C
10-2
300
400
Reverse Voltage
MS5D3305
500
600
700
(V)
10/12
H04-004-03a
Peak Half - Wave Current
(A)
Tc
Case Temperature
100
90
70
Square wave λ=60°
0
2
1
4
6
IF(AV) Average Forward Current
8
10
12
14
16
10
18
20
Cj
(°C)
110
DC
80
Junction Capacitance (pF)
Square wave λ=180°
Sine wave λ=180°
Square wave λ=120°
(A)
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
IFSM
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f F u ji E le c t r ic
D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t ,
o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed
for the manufacturing purposes without the express written consent of
Fuji Electric Device Technology Co.,Ltd.
160
Current Derating (IF(AV)-Tc) (max.)
1000
Junction Capacitance Characteristic (typ.)
150
140
130
120
100
10
60
50
40
30
22
1
λ :Conduction angle of forward current for each rectifier element
IF(AV):Forward current of center-tap full wave connection
1
10
100
VR
Reverse Voltage (V)
MS5D3305
1000
1000
Surge Capability (max.)
100
10
1
Number of Cycles at 50Hz
100
11/12
H04-004-03a
10
-3
10
-2
10
-1
t
Time
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f F u ji E le c t r ic
D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t ,
o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird pa rt y nor u s ed
for the manufacturing purposes without the express written consent of
Fuji Electric Device Technology Co.,Ltd.
Transient Thermal Impedance
(°C/W)
10
2
Transient Thermal Impedance (max.)
10
1
Rth j-c:1.5℃/W
10
0
10
-1
(sec)
10
0
10
1
10
2
MS5D3305
12/12
H04-004-03a