TI REF3233

REF3212, REF3220
REF3225, REF3230
REF3233, REF3240
SBVS058C – JUNE 2005 – REVISED AUGUST 2011
www.ti.com
4ppm/°C, 100μA, SOT23-6
SERIES VOLTAGE REFERENCE
Check for Samples: REF3212, REF3220, REF3225, REF3230, REF3233, REF3240
FEATURES
DESCRIPTION
•
The REF32xx is a very low drift, micropower,
low-dropout, precision voltage reference family
available in the tiny SOT23-6 package.
1
2
•
•
•
•
•
Excellent Specified Drift Performance:
– 7ppm/°C (max) at 0°C to +125°C
– 20ppm/°C (max) at –40°C to +125°C
Microsize Package: SOT23-6
High Output Current: ±10mA
High Accuracy: 0.01%
Low Quiescent Current: 100μA
Low Dropout: 5mV
APPLICATIONS
•
•
•
•
Portable Equipment
Data Acquisition Systems
Medical Equipment
Test Equipment
GND_F
1
GND_S
2
ENABLE
3
REF3212
REF3220
REF3225
REF3230
REF3233
REF3240
The small size and low power consumption (120μA
max) of the REF32xx make it ideal for portable and
battery-powered applications. This reference is stable
with any capacitive load.
The REF32xx can be operated from a supply as low
as 5mV above the output voltage, under no load
conditions. All models are specified for the wide
temperature range of –40°C to +125°C.
AVAILABLE OUTPUT VOLTAGES
PRODUCT
6
OUT_F
5
OUT_S
4
IN
VOLTAGE
REF3212
1.25V
REF3220
2.048V
REF3225
2.5V
REF3230
3.0V
REF3233
3.3V
REF3240
4.096
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2011, Texas Instruments Incorporated
REF3212, REF3220
REF3225, REF3230
REF3233, REF3240
SBVS058C – JUNE 2005 – REVISED AUGUST 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE INFORMATION (1)
(1)
PRODUCT
OUTPUT VOLTAGE
PACKAGE-LEAD
PACKAGE
DESIGNATOR
PACKAGE MARKING
REF3212
1.25V
SOT23-6
DBV
R32A
REF3220
2.048V
SOT23-6
DBV
R32B
REF3225
2.5V
SOT23-6
DBV
R32C
REF3230
3.0V
SOT23-6
DBV
R32D
REF3233
3.3V
SOT23-6
DBV
R32E
REF3240
4.096
SOT23-6
DBV
R32F
For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS (1)
Over operating free-air temperature range (unless otherwise noted).
REF32xx
UNIT
+7.5
V
Input voltage
Output short-circuit
Continuous
Operating temperature
–55 to +135
°C
Storage temperature
–65 to +150
°C
Junction temperature
+150
°C
Human body model (HBM)
4
kV
Charged device model (CDM)
1
kV
400
V
ESD ratings
Machine model (MM)
(1)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
PIN DESCRIPTIONS
PIN CONFIGURATION
PIN
NAME
DBV PACKAGE
SOT23-6
(TOP VIEW)
1
GND_S
2
ENABLE
3
R32x
GND_F
6
OUT_F
5
OUT_S
4
IN
NOTE:: The location of pin 1 on the REF32xx is
determined by orienting the package
marking as shown in the diagram above.
2
NO.
FUNCTION
DESCRIPTION
This pin enables and
disables the device
ENABLE
3
Digital input
GND_F
1
Analog output
Ground connection of the
device
GND_S
2
Analog input
Ground sense at the load
IN
4
Analog input
Positive supply voltage
OUT_F
6
Analog output
Output of Reference
Voltage
OUT_S
5
Analog input
Sense connection at the
load
Copyright © 2005–2011, Texas Instruments Incorporated
REF3212, REF3220
REF3225, REF3230
REF3233, REF3240
SBVS058C – JUNE 2005 – REVISED AUGUST 2011
www.ti.com
ELECTRICAL CHARACTERISTICS
Boldface limits apply over the listed temperature range.
At TA = +25°C, ILOAD = 0mA, and VIN = 5V, unless otherwise noted.
REF32xx
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
1.2475
1.25
1.2525
V
–0.2
0.01
0.2
%
REF3212 (1.25V)
OUTPUT VOLTAGE, VOUT
Initial accuracy
NOISE
Output voltage noise
f = 0.1Hz to 10Hz
17
µVPP
Voltage noise
f = 10Hz to 10kHz
24
µVRMS
REF3220 (2.048V)
OUTPUT VOLTAGE, VOUT
Initial accuracy
2.044
2.048
2.052
V
–0.2
0.01
0.2
%
NOISE
Output voltage noise
f = 0.1Hz to 10Hz
27
µVPP
Voltage noise
f = 10Hz to 10kHz
39
µVRMS
REF3225 (2.5V)
OUTPUT VOLTAGE, VOUT
Initial accuracy
2.495
2.50
2.505
V
–0.2
0.01
0.2
%
NOISE
Output voltage noise
f = 0.1Hz to 10Hz
33
µVPP
Voltage noise
f = 10Hz to 10kHz
48
µVRMS
REF3230 (3V)
OUTPUT VOLTAGE, VOUT
Initial accuracy
2.994
3
3.006
V
–0.2
0.01
0.2
%
NOISE
Output voltage noise
f = 0.1Hz to 10Hz
39
µVPP
Voltage noise
f = 10Hz to 10kHz
57
µVRMS
REF3233 (3.3V)
OUTPUT VOLTAGE, VOUT
Initial accuracy
3.293
3.3
3.307
V
–0.2
0.01
0.2
%
NOISE
Output voltage noise
f = 0.1Hz to 10Hz
43
µVPP
Voltage noise
f = 10Hz to 10kHz
63
µVRMS
REF3240 (4.096V)
OUTPUT VOLTAGE, VOUT
Initial accuracy
4.088
4.096
4.104
V
–0.2
0.01
0.2
%
NOISE
Output voltage noise
f = 0.1Hz to 10Hz
53
µVPP
Voltage noise
f = 10Hz to 10kHz
78
µVRMS
Copyright © 2005–2011, Texas Instruments Incorporated
3
REF3212, REF3220
REF3225, REF3230
REF3233, REF3240
SBVS058C – JUNE 2005 – REVISED AUGUST 2011
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
Boldface limits apply over the listed temperature range.
At TA = +25°C, ILOAD = 0mA, and VIN = 5V, unless otherwise noted.
REF32xx
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
REF3212 / REF3220 / REF3225 / REF3230 / REF3233 / REF3240
OUTPUT VOLTAGE TEMP
DRIFT
dVOUT/dT
0°C ≤ TA ≤ +125°C
–40°C ≤ TA ≤ +125°C
LONG-TERM STABILITY
0 to 1000h
4
7
ppm/°C
10.5
20
ppm/°C
15
+65
ppm/V
55
ppm
VOUT + 0.05 (1) ≤ VIN ≤ 5.5V
–65
Sourcing
0mA < ILOAD < 10mA, VIN = VOUT + 250mV (1)
–40
3
40
µV/mA
Sinking
–10mA < ILOAD < 0mA, VIN = VOUT + 100mV (1)
–60
20
60
µV/mA
LINE REGULATION
LOAD REGULATION (2)
THERMAL HYSTERESIS (3)
dVOUT/dILOAD
dT
First cycle
100
Additional cycles
DROPOUT VOLTAGE (1)
OUTPUT CURRENT
SHORT-CIRCUIT CURRENT
ppm
25
VIN – VOUT
ILOAD
0°C ≤ TA ≤ +125°C
VIN = VOUT + 250mV (1)
5
–10
ppm
50
mV
10
mA
ISC
Sourcing
50
mA
Sinking
40
mA
60
µs
TURN-ON SETTLING TIME
To 0.1% at VIN = 5V with CL = 0
ENABLE/SHUTDOWN (4)
VL
Reference in Shutdown mode
VH
Reference is active
POWER SUPPLY
0.7
V
VIN
V
IL = 0
Voltage
VIN
Current
IQ
.. Over temperature
Shutdown
0
1.5
IS
VOUT + 0.05 (1)
5.5
V
ENABLE > 1.5V
100
120
µA
0°C ≤ TA ≤ +125°C
115
135
µA
ENABLE < 0.7V
0.1
1
µA
TEMPERATURE RANGE
Specified
–40
+125
°C
Operating
–55
+135
°C
Storage
–65
+150
Thermal resistance, SOT23-6
(1)
(2)
(3)
(4)
4
θJA
200
°C
°C/W
The minimum supply voltage for the REF3212 is 1.8V.
Load regulation is using force and sense lines; see the Load Regulation section for more information.
Thermal hysteresis procedure is explained in more detail in the Applications Information TBD section.
If the rise time of the input voltage is less than or equal to 2ms, the ENABLE and IN pins can be tied together. For rise times greater
than 2ms, see the Supply Voltage section.
Copyright © 2005–2011, Texas Instruments Incorporated
REF3212, REF3220
REF3225, REF3230
REF3233, REF3240
SBVS058C – JUNE 2005 – REVISED AUGUST 2011
www.ti.com
TYPICAL CHARACTERISTICS
At TA = +25°C, ILOAD = 0mA, VIN = +5V power supply, and REF3225 used for typical characteristics, unless otherwise noted.
TEMPERATURE DRIFT
(–40°C to +125°C)
Population
Population
TEMPERATURE DRIFT
(0°C to +125°C)
0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
Drift (ppm/°C)
Drift (ppm/°C)
Figure 1.
Figure 2.
OUTPUT VOLTAGE ACCURACY vs TEMPERATURE
DROPOUT VOLTAGE vs LOAD CURRENT
0.12
160
0.08
Dropout Voltage (mV)
Output Voltage Accuracy (%)
+125°C
140
0.04
0
-0.04
-0.08
+25°C
120
100
-40°C
80
60
40
20
0
-0.12
-50
-25
0
+25
+50
+75
+100
+125
-15
-10
Temperature (°C)
5
10
15
Load Current (mA)
Figure 3.
Figure 4.
QUIESCENT CURRENT vs TEMPERATURE
POWER-SUPPLY REJECTION RATIO vs FREQUENCY
130
100
90
120
80
110
70
PSRR (dB)
Quiescent Current (mA)
0
-5
100
90
60
50
40
30
80
20
70
10
-50
-25
0
+25
+50
+75
+100
+125
1
10
100
1k
Temperature (°C)
Frequency (Hz)
Figure 5.
Figure 6.
Copyright © 2005–2011, Texas Instruments Incorporated
10k
100k
5
REF3212, REF3220
REF3225, REF3230
REF3233, REF3240
SBVS058C – JUNE 2005 – REVISED AUGUST 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, ILOAD = 0mA, VIN = +5V power supply, and REF3225 used for typical characteristics, unless otherwise noted.
OUTPUT VOLTAGE vs LOAD CURRENT
1.2525
2.505
1.2520
2.504
1.2515
2.503
1.2510
1.2505
Output Voltage (V)
+125°C
1.2500
+25°C
1.2495
1.2490
-40°C
1.2485
2.502
2.501
+125°C
2.500
+25°C
2.499
2.498
-40°C
2.497
1.2480
2.496
1.2475
2.495
2.5
3
3.5
4
4.5
5
-15
-10
0
-5
Input Voltage (V)
5
10
15
Load Current (mA)
Figure 8.
0.1Hz TO 10Hz NOISE
OUTPUT VOLTAGE INITIAL ACCURACY
0.20
0.16
0.12
0.08
-0.08
-0.12
400ms/div
-0.16
-0.20
10mV/div
Population
Figure 7.
0.04
2
0
1.5
-0.04
Output Voltage (V)
OUTPUT VOLTAGE vs INPUT VOLTAGE
(REF3212)
Output Accuracy (%)
Figure 9.
Figure 10.
STEP RESPONSE
CL = 0pF, 5V STARTUP
STEP RESPONSE
CL = 1µF
VIN
VIN
1V/div
1V/div
VOUT
VOUT
10ms/div
Figure 11.
6
100ms/div
Figure 12.
Copyright © 2005–2011, Texas Instruments Incorporated
REF3212, REF3220
REF3225, REF3230
REF3233, REF3240
SBVS058C – JUNE 2005 – REVISED AUGUST 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, ILOAD = 0mA, VIN = +5V power supply, and REF3225 used for typical characteristics, unless otherwise noted.
500mV/div
LINE TRANSIENT
CL = 10µF
VIN
VIN
VOUT
20mV/div
20mV/div
500mV/div
LINE TRANSIENT
CL = 0pF
ILOAD
VOUT
20ms/div
100ms/div
Figure 13.
Figure 14.
LOAD TRANSIENT
CL = 0pF, ±10mA OUTPUT PULSE
LOAD TRANSIENT
CL = 1µF, ±10mA OUTPUT PULSE
ILOAD
+10mA
+10mA
+10mA
+10mA
-10mA
-10mA
50mV/div
200mV/div
VOUT
ILOAD
VOUT
40ms/div
40ms/div
Figure 15.
Figure 16.
LOAD TRANSIENT
CL = 0pF, ±1mA OUTPUT PULSE
LOAD TRANSIENT
CL = 1µF, ±1mA OUTPUT PULSE
ILOAD
+1mA
+1mA
-1mA
+1mA
+1mA
-1mA
20mV/div
100mV/div
VOUT
VOUT
40ms/div
40ms/div
Figure 17.
Figure 18.
Copyright © 2005–2011, Texas Instruments Incorporated
7
REF3212, REF3220
REF3225, REF3230
REF3233, REF3240
SBVS058C – JUNE 2005 – REVISED AUGUST 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, ILOAD = 0mA, VIN = +5V power supply, and REF3225 used for typical characteristics, unless otherwise noted.
LONG-TERM STABILITY
(32 Units)
Output Voltage Stability (ppm)
200
150
100
50
0
-50
-100
-150
-200
0
200
400
600
800
1000
1200
Time (Hours)
Figure 19.
THEORY OF OPERATION
GENERAL DESCRIPTION
APPLICATION INFORMATION
The REF32xx does not require a load capacitor and
is stable with any capacitive load. Figure 21 shows
typical connections required for operation of the
REF32xx. A supply bypass capacitor of 0.47μF is
recommended.
1
0.47mF
+5V
VBANDGAP
2
3
R32C
The REF32xx is a family of CMOS, precision
bandgap voltage references. Figure 20 shows the
basic bandgap topology. Transistors Q1 and Q2 are
biased so that the current density of Q1 is greater
than that of Q2. The difference of the two
base-emitter voltages (Vbe1 – Vbe2) has a positive
temperature coefficient and is forced across resistor
R1. This voltage is amplified and added to the
base-emitter voltage of Q2, which has a negative
temperature coefficient. The resulting output voltage
is virtually independent of temperature.
6
+2.5V
5
4
Figure 21. Typical Operating Connections for the
REF3225
R1
Q1 I
+
Vbe1
-
+
Vbe2
-
SUPPLY VOLTAGE
N Q2
Figure 20. Simplified Schematic of Bandgap
Reference
8
The REF32xx family of references features an
extremely low dropout voltage. With the exception of
the REF3212, which has a minimum supply
requirement of 1.8V, these references can be
operated with a supply of only 5mV above the output
voltage in an unloaded condition. For loaded
conditions, a typical dropout voltage versus load is
shown in the Typical Characteristic curves.
Copyright © 2005–2011, Texas Instruments Incorporated
REF3212, REF3220
REF3225, REF3230
REF3233, REF3240
SBVS058C – JUNE 2005 – REVISED AUGUST 2011
www.ti.com
The REF32xx also features a low quiescent current of
100μA, with a maximum quiescent current over
temperature of just 135μA. The quiescent current
typically changes less than 2μA over the entire supply
range, as shown in Figure 22.
110
The RC filter in Figure 23 can be used as a starting
point for the REF3240. The values for R1 and C1
have been calculated so that the voltage at the
ENABLE pin reaches 0.7V after the input voltage has
reached 4.15V; Table 1 lists these values. For output
voltage options other than 4.096V, the RC filter can
be made faster.
Quiescent Current (mA)
108
Table 1. Recommended R1 and C1 Values for the
REF3240
106
104
RISE TIME
R1 VALUE
C1 VALUE
2ms
150kΩ
100nF
100
5ms
150kΩ
220nF
98
10ms
330kΩ
220nF
20ms
390kΩ
330nF
50ms
680kΩ
470nF
100ms
680kΩ
1000nF
102
96
94
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Power Supply (V)
Figure 22. Supply Current vs Supply Voltage
In this document, rise time is defined as the time until
an exponential input signal reaches 90% of its final
voltage. For example, the 2ms value shown in
Table 1 is valid for an end value of 5V.
Supply voltages below the specified levels can cause
the REF32xx to momentarily draw currents greater
than the typical quiescent current. This momentary
current draw can be prevented by using a power
supply with a fast rising edge and low output
impedance.
If the input voltage has a different shape or the end
value is not 5V, then the time until the minimum
dropout voltage has been reached should be used to
decide if the IN and ENABLE pins can be tied
together. Table 2 lists these times.
For optimal startup when the IN pin and ENABLE pin
are tied together, keep the input voltage rise time less
than or equal to 2ms. For rise times greater than
2ms, the ENABLE pin must be kept below 0.7V until
the voltage at the IN pin has reached the minimum
operating voltage. One way to control the voltage at
the ENABLE pin is with an additional RC filter, such
as that shown in Figure 23. The RC filter must hold
the voltage at the ENABLE pin below the threshold
voltage until the voltage at the input pin has reached
the minimum operating voltage.
1
6
2
5
VREF
Table 2. Minimum Dropout Voltage Times
DEVICE
TIME
REF3212
0.4ms
REF3220
0.5ms
REF3225
0.7ms
REF3230
0.9ms
REF3233
1.0ms
REF3240
1.6ms
Note that because the leakage current of the EN pin
is in the range of a few nA, it can be disregarded in
most applications.
SHUTDOWN
3
4
VIN
R1
C1
The REF32xx can be placed in a low-power mode by
pulling the ENABLE/SHUTDOWN pin low. When in
Shutdown mode, the output of the REF32xx becomes
a resistive load to ground. The value of the load
depends on the model, and ranges from
approximately 100kΩ to 400kΩ.
Figure 23. Application Circuit to Control the
REF32xx ENABLE Pin
Copyright © 2005–2011, Texas Instruments Incorporated
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REF3212, REF3220
REF3225, REF3230
REF3233, REF3240
SBVS058C – JUNE 2005 – REVISED AUGUST 2011
www.ti.com
THERMAL HYSTERESIS
LONG-TERM STABILITY
Thermal hysteresis for the REF32xx is defined as the
change in output voltage after operating the device at
+25°C, cycling the device through the specified
temperature range, and returning to +25°C. It can be
expressed as:
Long-term stability refers to the change of the output
voltage of a reference over a period of months or
years. This effect lessens as time progresses, as is
shown by the long-term stability Typical Characteristic
curves. The typical drift value for the REF32xx is
55ppm from 0 to 1000 hours. This parameter is
characterized by measuring 30 units at regular
intervals for a period of 1000 hours.
(
VPRE - VPOST
VNOM
(
VHYST =
6
´ 10 (ppm)
Where:
VHYST = thermal hysteresis (in units of ppm).
VNOM = the specified output voltage.
VPRE = output voltage measured at +25°C
pretemperature cycling.
VPOST = output voltage measured after the device
has been cycled through the specified
temperature range of –40°C to +125°C and
returned to +25°C.
(1)
LOAD REGULATION
Load regulation is defined as the change in output
voltage as a result of changes in load current. The
load regulation of the REF32xx is measured using
force and sense contacts, as shown in Figure 24.
Contact and Trace Resistance
TEMPERATURE DRIFT
The REF32xx is designed to exhibit minimal drift
error, which is defined as the change in output
voltage over varying temperature. The drift is
calculated using the box method, as described by
Equation 2:
(
VOUTMAX - VOUTMIN
VOUT ´ Temp Range
(
Drift =
OUT_F
1
6
GND_S
OUT_S
2
REF32xx
5
ENABLE
IN
3
6
´ 10 (ppm)
(2)
The REF32xx features a typical drift coefficient of
4ppm/°C from 0°C to +125°C—the primary
temperature range for many applications. For the
extended industrial temperature range of –40°C to
+125°C, the REF32xx family drift increases to a
typical value of 10.5ppm/°C.
NOISE PERFORMANCE
Typical 0.1Hz to 10Hz voltage noise can be seen in
the Typical Characteristic curve, 0.1Hz to 10Hz
Voltage Noise. The noise voltage of the REF32xx
increases with output voltage and operating
temperature. Additional filtering can be used to
improve output noise levels, although care should be
taken to ensure the output impedance does not
degrade AC performance.
10
GND_F
RLOAD
4
0.47mF
+5V
Figure 24. Accurate Load Regulation of REF32xx
The force and sense lines can be used to effectively
eliminate the impact of contact and trace resistance,
resulting in accurate voltage at the load. By
connecting the force and sense lines at the load, the
REF32xx compensates for the contact and trace
resistances because it measures and adjusts the
voltage actually delivered at the load.
The GND_S pin is connected to the internal ground of
the device through ESD protection diodes. Because
of that connection, the maximum differential voltage
between the GND_S and GND_F pins must be kept
below 200mV to prevent these dioes from
unintentionally turning on.
Copyright © 2005–2011, Texas Instruments Incorporated
REF3212, REF3220
REF3225, REF3230
REF3233, REF3240
SBVS058C – JUNE 2005 – REVISED AUGUST 2011
www.ti.com
APPLICATION CIRCUITS
+5V
NEGATIVE REFERENCE VOLTAGE
3
For applications requiring a negative and positive
reference voltage, the REF32xx and OPA735 can be
used to provide a dual-supply reference from a ±5V
supply. Figure 25 shows the REF3225 used to
provide a ±2.5V supply reference voltage. The low
drift performance of the REF32xx complements the
low offset voltage and zero drift of the OPA735 to
provide an accurate solution for split-supply
applications. Care must be taken to match the
temperature coefficients of R1 and R2.
4
5
REF3225
2
6
+2.5V
1
R1
10kW
R2
10kW
+5V
Data acquisition systems often require stable voltage
references to maintain accuracy. The REF32xx family
features stability and a wide range of voltages
suitable for most microcontrollers and data
converters. Figure 26, Figure 27, and Figure 28 show
basic data acquisition systems.
-5V
NOTE:: Bypass capacitor is not shown.
Figure 25. REF3225 Combined with OPA735 to
Create Positive and Negative Reference Voltages
5
3.3V
3
REF3233
6
5W
VREF
2
VCC
+
+
4
1
V+
0.47mF
GND
VS
ADS7822
1mF to 10mF
1mF to 10mF
0.1mF
VIN
-2.5V
OPA735
DATA ACQUISITION
Microcontroller
+In
CS
-In
DOUT
GND
DCLOCK
Figure 26. Basic Data Acquisition System 1
Copyright © 2005–2011, Texas Instruments Incorporated
11
REF3212, REF3220
REF3225, REF3230
REF3233, REF3240
SBVS058C – JUNE 2005 – REVISED AUGUST 2011
www.ti.com
2.5V Supply
2.5V
3
5W
VIN
4
+
5
REF3212
2
6
VOUT = 1.25V
VREF
1
VS
ADS8324
VCC
+
0.1mF
1mF to 10mF
GND
+In
0V to 1.25V
1mF to 10mF
Microcontroller
CS
DOUT
-In
GND
DCLOCK
Figure 27. Basic Data Acquisition System 2
+5V
2
1
REF3240
5
3
4
6
VOUT = 4.096V
1kW
0.1mF
10W
22mF
+5V
1kW
VIN
1mF
VREF
10W
ADS8381
THS4031
6800pF
0.22mF
500W
-5V
Figure 28. REF3240 Provides an Accurate Reference for Driving the ADS8381
12
Copyright © 2005–2011, Texas Instruments Incorporated
REF3212, REF3220
REF3225, REF3230
REF3233, REF3240
SBVS058C – JUNE 2005 – REVISED AUGUST 2011
www.ti.com
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (February 2006) to Revision C
Page
•
Added Pin Descriptions table ................................................................................................................................................ 2
•
Added note to Enable/Shutdown parameter ......................................................................................................................... 4
•
Changed the minimum voltage for Enable/Shutdown with reference active from (0.75 × VIN) to 1.5 .................................. 4
•
Changed Current test condition from from (0.75 × VIN) to (1.5V) ......................................................................................... 4
•
Added text, two tables, and one figure to Supply Voltage section ....................................................................................... 8
•
Changed pin 3 in Figure 24 from SHDN to ENABLE (typo) ............................................................................................... 10
•
Added paragraph to Load Regulation section .................................................................................................................... 10
Copyright © 2005–2011, Texas Instruments Incorporated
13
PACKAGE OPTION ADDENDUM
www.ti.com
25-Nov-2008
PACKAGING INFORMATION
(1)
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
REF3212AIDBVR
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
REF3212AIDBVRG4
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
REF3212AIDBVT
ACTIVE
SOT-23
DBV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
REF3212AIDBVTG4
ACTIVE
SOT-23
DBV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
REF3220AIDBVR
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
REF3220AIDBVRG4
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
REF3220AIDBVT
ACTIVE
SOT-23
DBV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
REF3220AIDBVTG4
ACTIVE
SOT-23
DBV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
REF3225AIDBVR
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
REF3225AIDBVRG4
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
REF3225AIDBVT
ACTIVE
SOT-23
DBV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
REF3225AIDBVTG4
ACTIVE
SOT-23
DBV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
REF3230AIDBVR
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
REF3230AIDBVRG4
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
REF3230AIDBVT
ACTIVE
SOT-23
DBV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
REF3230AIDBVTG4
ACTIVE
SOT-23
DBV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
REF3233AIDBVR
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
REF3233AIDBVRG4
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
REF3233AIDBVT
ACTIVE
SOT-23
DBV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
REF3233AIDBVTG4
ACTIVE
SOT-23
DBV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
REF3240AIDBVR
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
REF3240AIDBVRG4
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
REF3240AIDBVT
ACTIVE
SOT-23
DBV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
REF3240AIDBVTG4
ACTIVE
SOT-23
DBV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
The marketing status values are defined as follows:
Addendum-Page 1
Lead/Ball Finish
MSL Peak Temp (3)
PACKAGE OPTION ADDENDUM
www.ti.com
25-Nov-2008
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF REF3212, REF3220, REF3225, REF3230, REF3233, REF3240 :
• Enhanced Product: REF3212-EP, REF3220-EP, REF3225-EP, REF3230-EP, REF3233-EP, REF3240-EP
NOTE: Qualified Version Definitions:
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Oct-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
REF3212AIDBVR
SOT-23
DBV
6
3000
180.0
8.4
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.2
3.1
1.39
4.0
8.0
Q3
REF3212AIDBVT
SOT-23
DBV
6
250
180.0
8.4
3.2
3.1
1.39
4.0
8.0
Q3
REF3220AIDBVR
SOT-23
DBV
6
3000
180.0
8.4
3.2
3.1
1.39
4.0
8.0
Q3
REF3220AIDBVT
SOT-23
DBV
6
250
180.0
8.4
3.2
3.1
1.39
4.0
8.0
Q3
REF3225AIDBVR
SOT-23
DBV
6
3000
180.0
8.4
3.2
3.1
1.39
4.0
8.0
Q3
REF3225AIDBVT
SOT-23
DBV
6
250
180.0
8.4
3.2
3.1
1.39
4.0
8.0
Q3
REF3230AIDBVR
SOT-23
DBV
6
3000
180.0
8.4
3.2
3.1
1.39
4.0
8.0
Q3
REF3230AIDBVT
SOT-23
DBV
6
250
180.0
8.4
3.2
3.1
1.39
4.0
8.0
Q3
REF3233AIDBVR
SOT-23
DBV
6
3000
180.0
8.4
3.2
3.1
1.39
4.0
8.0
Q3
REF3233AIDBVT
SOT-23
DBV
6
250
180.0
8.4
3.2
3.1
1.39
4.0
8.0
Q3
REF3240AIDBVR
SOT-23
DBV
6
3000
180.0
8.4
3.2
3.1
1.39
4.0
8.0
Q3
REF3240AIDBVT
SOT-23
DBV
6
250
180.0
8.4
3.2
3.1
1.39
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Oct-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
REF3212AIDBVR
SOT-23
DBV
6
3000
210.0
185.0
35.0
REF3212AIDBVT
SOT-23
DBV
6
250
210.0
185.0
35.0
REF3220AIDBVR
SOT-23
DBV
6
3000
210.0
185.0
35.0
REF3220AIDBVT
SOT-23
DBV
6
250
210.0
185.0
35.0
REF3225AIDBVR
SOT-23
DBV
6
3000
210.0
185.0
35.0
REF3225AIDBVT
SOT-23
DBV
6
250
210.0
185.0
35.0
REF3230AIDBVR
SOT-23
DBV
6
3000
210.0
185.0
35.0
REF3230AIDBVT
SOT-23
DBV
6
250
210.0
185.0
35.0
REF3233AIDBVR
SOT-23
DBV
6
3000
210.0
185.0
35.0
REF3233AIDBVT
SOT-23
DBV
6
250
210.0
185.0
35.0
REF3240AIDBVR
SOT-23
DBV
6
3000
210.0
185.0
35.0
REF3240AIDBVT
SOT-23
DBV
6
250
210.0
185.0
35.0
Pack Materials-Page 2
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