REF3212, REF3220 REF3225, REF3230 REF3233, REF3240 SBVS058C – JUNE 2005 – REVISED AUGUST 2011 www.ti.com 4ppm/°C, 100μA, SOT23-6 SERIES VOLTAGE REFERENCE Check for Samples: REF3212, REF3220, REF3225, REF3230, REF3233, REF3240 FEATURES DESCRIPTION • The REF32xx is a very low drift, micropower, low-dropout, precision voltage reference family available in the tiny SOT23-6 package. 1 2 • • • • • Excellent Specified Drift Performance: – 7ppm/°C (max) at 0°C to +125°C – 20ppm/°C (max) at –40°C to +125°C Microsize Package: SOT23-6 High Output Current: ±10mA High Accuracy: 0.01% Low Quiescent Current: 100μA Low Dropout: 5mV APPLICATIONS • • • • Portable Equipment Data Acquisition Systems Medical Equipment Test Equipment GND_F 1 GND_S 2 ENABLE 3 REF3212 REF3220 REF3225 REF3230 REF3233 REF3240 The small size and low power consumption (120μA max) of the REF32xx make it ideal for portable and battery-powered applications. This reference is stable with any capacitive load. The REF32xx can be operated from a supply as low as 5mV above the output voltage, under no load conditions. All models are specified for the wide temperature range of –40°C to +125°C. AVAILABLE OUTPUT VOLTAGES PRODUCT 6 OUT_F 5 OUT_S 4 IN VOLTAGE REF3212 1.25V REF3220 2.048V REF3225 2.5V REF3230 3.0V REF3233 3.3V REF3240 4.096 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2011, Texas Instruments Incorporated REF3212, REF3220 REF3225, REF3230 REF3233, REF3240 SBVS058C – JUNE 2005 – REVISED AUGUST 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE INFORMATION (1) (1) PRODUCT OUTPUT VOLTAGE PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING REF3212 1.25V SOT23-6 DBV R32A REF3220 2.048V SOT23-6 DBV R32B REF3225 2.5V SOT23-6 DBV R32C REF3230 3.0V SOT23-6 DBV R32D REF3233 3.3V SOT23-6 DBV R32E REF3240 4.096 SOT23-6 DBV R32F For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted). REF32xx UNIT +7.5 V Input voltage Output short-circuit Continuous Operating temperature –55 to +135 °C Storage temperature –65 to +150 °C Junction temperature +150 °C Human body model (HBM) 4 kV Charged device model (CDM) 1 kV 400 V ESD ratings Machine model (MM) (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. PIN DESCRIPTIONS PIN CONFIGURATION PIN NAME DBV PACKAGE SOT23-6 (TOP VIEW) 1 GND_S 2 ENABLE 3 R32x GND_F 6 OUT_F 5 OUT_S 4 IN NOTE:: The location of pin 1 on the REF32xx is determined by orienting the package marking as shown in the diagram above. 2 NO. FUNCTION DESCRIPTION This pin enables and disables the device ENABLE 3 Digital input GND_F 1 Analog output Ground connection of the device GND_S 2 Analog input Ground sense at the load IN 4 Analog input Positive supply voltage OUT_F 6 Analog output Output of Reference Voltage OUT_S 5 Analog input Sense connection at the load Copyright © 2005–2011, Texas Instruments Incorporated REF3212, REF3220 REF3225, REF3230 REF3233, REF3240 SBVS058C – JUNE 2005 – REVISED AUGUST 2011 www.ti.com ELECTRICAL CHARACTERISTICS Boldface limits apply over the listed temperature range. At TA = +25°C, ILOAD = 0mA, and VIN = 5V, unless otherwise noted. REF32xx PARAMETER CONDITIONS MIN TYP MAX UNIT 1.2475 1.25 1.2525 V –0.2 0.01 0.2 % REF3212 (1.25V) OUTPUT VOLTAGE, VOUT Initial accuracy NOISE Output voltage noise f = 0.1Hz to 10Hz 17 µVPP Voltage noise f = 10Hz to 10kHz 24 µVRMS REF3220 (2.048V) OUTPUT VOLTAGE, VOUT Initial accuracy 2.044 2.048 2.052 V –0.2 0.01 0.2 % NOISE Output voltage noise f = 0.1Hz to 10Hz 27 µVPP Voltage noise f = 10Hz to 10kHz 39 µVRMS REF3225 (2.5V) OUTPUT VOLTAGE, VOUT Initial accuracy 2.495 2.50 2.505 V –0.2 0.01 0.2 % NOISE Output voltage noise f = 0.1Hz to 10Hz 33 µVPP Voltage noise f = 10Hz to 10kHz 48 µVRMS REF3230 (3V) OUTPUT VOLTAGE, VOUT Initial accuracy 2.994 3 3.006 V –0.2 0.01 0.2 % NOISE Output voltage noise f = 0.1Hz to 10Hz 39 µVPP Voltage noise f = 10Hz to 10kHz 57 µVRMS REF3233 (3.3V) OUTPUT VOLTAGE, VOUT Initial accuracy 3.293 3.3 3.307 V –0.2 0.01 0.2 % NOISE Output voltage noise f = 0.1Hz to 10Hz 43 µVPP Voltage noise f = 10Hz to 10kHz 63 µVRMS REF3240 (4.096V) OUTPUT VOLTAGE, VOUT Initial accuracy 4.088 4.096 4.104 V –0.2 0.01 0.2 % NOISE Output voltage noise f = 0.1Hz to 10Hz 53 µVPP Voltage noise f = 10Hz to 10kHz 78 µVRMS Copyright © 2005–2011, Texas Instruments Incorporated 3 REF3212, REF3220 REF3225, REF3230 REF3233, REF3240 SBVS058C – JUNE 2005 – REVISED AUGUST 2011 www.ti.com ELECTRICAL CHARACTERISTICS (continued) Boldface limits apply over the listed temperature range. At TA = +25°C, ILOAD = 0mA, and VIN = 5V, unless otherwise noted. REF32xx PARAMETER CONDITIONS MIN TYP MAX UNIT REF3212 / REF3220 / REF3225 / REF3230 / REF3233 / REF3240 OUTPUT VOLTAGE TEMP DRIFT dVOUT/dT 0°C ≤ TA ≤ +125°C –40°C ≤ TA ≤ +125°C LONG-TERM STABILITY 0 to 1000h 4 7 ppm/°C 10.5 20 ppm/°C 15 +65 ppm/V 55 ppm VOUT + 0.05 (1) ≤ VIN ≤ 5.5V –65 Sourcing 0mA < ILOAD < 10mA, VIN = VOUT + 250mV (1) –40 3 40 µV/mA Sinking –10mA < ILOAD < 0mA, VIN = VOUT + 100mV (1) –60 20 60 µV/mA LINE REGULATION LOAD REGULATION (2) THERMAL HYSTERESIS (3) dVOUT/dILOAD dT First cycle 100 Additional cycles DROPOUT VOLTAGE (1) OUTPUT CURRENT SHORT-CIRCUIT CURRENT ppm 25 VIN – VOUT ILOAD 0°C ≤ TA ≤ +125°C VIN = VOUT + 250mV (1) 5 –10 ppm 50 mV 10 mA ISC Sourcing 50 mA Sinking 40 mA 60 µs TURN-ON SETTLING TIME To 0.1% at VIN = 5V with CL = 0 ENABLE/SHUTDOWN (4) VL Reference in Shutdown mode VH Reference is active POWER SUPPLY 0.7 V VIN V IL = 0 Voltage VIN Current IQ .. Over temperature Shutdown 0 1.5 IS VOUT + 0.05 (1) 5.5 V ENABLE > 1.5V 100 120 µA 0°C ≤ TA ≤ +125°C 115 135 µA ENABLE < 0.7V 0.1 1 µA TEMPERATURE RANGE Specified –40 +125 °C Operating –55 +135 °C Storage –65 +150 Thermal resistance, SOT23-6 (1) (2) (3) (4) 4 θJA 200 °C °C/W The minimum supply voltage for the REF3212 is 1.8V. Load regulation is using force and sense lines; see the Load Regulation section for more information. Thermal hysteresis procedure is explained in more detail in the Applications Information TBD section. If the rise time of the input voltage is less than or equal to 2ms, the ENABLE and IN pins can be tied together. For rise times greater than 2ms, see the Supply Voltage section. Copyright © 2005–2011, Texas Instruments Incorporated REF3212, REF3220 REF3225, REF3230 REF3233, REF3240 SBVS058C – JUNE 2005 – REVISED AUGUST 2011 www.ti.com TYPICAL CHARACTERISTICS At TA = +25°C, ILOAD = 0mA, VIN = +5V power supply, and REF3225 used for typical characteristics, unless otherwise noted. TEMPERATURE DRIFT (–40°C to +125°C) Population Population TEMPERATURE DRIFT (0°C to +125°C) 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Drift (ppm/°C) Drift (ppm/°C) Figure 1. Figure 2. OUTPUT VOLTAGE ACCURACY vs TEMPERATURE DROPOUT VOLTAGE vs LOAD CURRENT 0.12 160 0.08 Dropout Voltage (mV) Output Voltage Accuracy (%) +125°C 140 0.04 0 -0.04 -0.08 +25°C 120 100 -40°C 80 60 40 20 0 -0.12 -50 -25 0 +25 +50 +75 +100 +125 -15 -10 Temperature (°C) 5 10 15 Load Current (mA) Figure 3. Figure 4. QUIESCENT CURRENT vs TEMPERATURE POWER-SUPPLY REJECTION RATIO vs FREQUENCY 130 100 90 120 80 110 70 PSRR (dB) Quiescent Current (mA) 0 -5 100 90 60 50 40 30 80 20 70 10 -50 -25 0 +25 +50 +75 +100 +125 1 10 100 1k Temperature (°C) Frequency (Hz) Figure 5. Figure 6. Copyright © 2005–2011, Texas Instruments Incorporated 10k 100k 5 REF3212, REF3220 REF3225, REF3230 REF3233, REF3240 SBVS058C – JUNE 2005 – REVISED AUGUST 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C, ILOAD = 0mA, VIN = +5V power supply, and REF3225 used for typical characteristics, unless otherwise noted. OUTPUT VOLTAGE vs LOAD CURRENT 1.2525 2.505 1.2520 2.504 1.2515 2.503 1.2510 1.2505 Output Voltage (V) +125°C 1.2500 +25°C 1.2495 1.2490 -40°C 1.2485 2.502 2.501 +125°C 2.500 +25°C 2.499 2.498 -40°C 2.497 1.2480 2.496 1.2475 2.495 2.5 3 3.5 4 4.5 5 -15 -10 0 -5 Input Voltage (V) 5 10 15 Load Current (mA) Figure 8. 0.1Hz TO 10Hz NOISE OUTPUT VOLTAGE INITIAL ACCURACY 0.20 0.16 0.12 0.08 -0.08 -0.12 400ms/div -0.16 -0.20 10mV/div Population Figure 7. 0.04 2 0 1.5 -0.04 Output Voltage (V) OUTPUT VOLTAGE vs INPUT VOLTAGE (REF3212) Output Accuracy (%) Figure 9. Figure 10. STEP RESPONSE CL = 0pF, 5V STARTUP STEP RESPONSE CL = 1µF VIN VIN 1V/div 1V/div VOUT VOUT 10ms/div Figure 11. 6 100ms/div Figure 12. Copyright © 2005–2011, Texas Instruments Incorporated REF3212, REF3220 REF3225, REF3230 REF3233, REF3240 SBVS058C – JUNE 2005 – REVISED AUGUST 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C, ILOAD = 0mA, VIN = +5V power supply, and REF3225 used for typical characteristics, unless otherwise noted. 500mV/div LINE TRANSIENT CL = 10µF VIN VIN VOUT 20mV/div 20mV/div 500mV/div LINE TRANSIENT CL = 0pF ILOAD VOUT 20ms/div 100ms/div Figure 13. Figure 14. LOAD TRANSIENT CL = 0pF, ±10mA OUTPUT PULSE LOAD TRANSIENT CL = 1µF, ±10mA OUTPUT PULSE ILOAD +10mA +10mA +10mA +10mA -10mA -10mA 50mV/div 200mV/div VOUT ILOAD VOUT 40ms/div 40ms/div Figure 15. Figure 16. LOAD TRANSIENT CL = 0pF, ±1mA OUTPUT PULSE LOAD TRANSIENT CL = 1µF, ±1mA OUTPUT PULSE ILOAD +1mA +1mA -1mA +1mA +1mA -1mA 20mV/div 100mV/div VOUT VOUT 40ms/div 40ms/div Figure 17. Figure 18. Copyright © 2005–2011, Texas Instruments Incorporated 7 REF3212, REF3220 REF3225, REF3230 REF3233, REF3240 SBVS058C – JUNE 2005 – REVISED AUGUST 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C, ILOAD = 0mA, VIN = +5V power supply, and REF3225 used for typical characteristics, unless otherwise noted. LONG-TERM STABILITY (32 Units) Output Voltage Stability (ppm) 200 150 100 50 0 -50 -100 -150 -200 0 200 400 600 800 1000 1200 Time (Hours) Figure 19. THEORY OF OPERATION GENERAL DESCRIPTION APPLICATION INFORMATION The REF32xx does not require a load capacitor and is stable with any capacitive load. Figure 21 shows typical connections required for operation of the REF32xx. A supply bypass capacitor of 0.47μF is recommended. 1 0.47mF +5V VBANDGAP 2 3 R32C The REF32xx is a family of CMOS, precision bandgap voltage references. Figure 20 shows the basic bandgap topology. Transistors Q1 and Q2 are biased so that the current density of Q1 is greater than that of Q2. The difference of the two base-emitter voltages (Vbe1 – Vbe2) has a positive temperature coefficient and is forced across resistor R1. This voltage is amplified and added to the base-emitter voltage of Q2, which has a negative temperature coefficient. The resulting output voltage is virtually independent of temperature. 6 +2.5V 5 4 Figure 21. Typical Operating Connections for the REF3225 R1 Q1 I + Vbe1 - + Vbe2 - SUPPLY VOLTAGE N Q2 Figure 20. Simplified Schematic of Bandgap Reference 8 The REF32xx family of references features an extremely low dropout voltage. With the exception of the REF3212, which has a minimum supply requirement of 1.8V, these references can be operated with a supply of only 5mV above the output voltage in an unloaded condition. For loaded conditions, a typical dropout voltage versus load is shown in the Typical Characteristic curves. Copyright © 2005–2011, Texas Instruments Incorporated REF3212, REF3220 REF3225, REF3230 REF3233, REF3240 SBVS058C – JUNE 2005 – REVISED AUGUST 2011 www.ti.com The REF32xx also features a low quiescent current of 100μA, with a maximum quiescent current over temperature of just 135μA. The quiescent current typically changes less than 2μA over the entire supply range, as shown in Figure 22. 110 The RC filter in Figure 23 can be used as a starting point for the REF3240. The values for R1 and C1 have been calculated so that the voltage at the ENABLE pin reaches 0.7V after the input voltage has reached 4.15V; Table 1 lists these values. For output voltage options other than 4.096V, the RC filter can be made faster. Quiescent Current (mA) 108 Table 1. Recommended R1 and C1 Values for the REF3240 106 104 RISE TIME R1 VALUE C1 VALUE 2ms 150kΩ 100nF 100 5ms 150kΩ 220nF 98 10ms 330kΩ 220nF 20ms 390kΩ 330nF 50ms 680kΩ 470nF 100ms 680kΩ 1000nF 102 96 94 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Power Supply (V) Figure 22. Supply Current vs Supply Voltage In this document, rise time is defined as the time until an exponential input signal reaches 90% of its final voltage. For example, the 2ms value shown in Table 1 is valid for an end value of 5V. Supply voltages below the specified levels can cause the REF32xx to momentarily draw currents greater than the typical quiescent current. This momentary current draw can be prevented by using a power supply with a fast rising edge and low output impedance. If the input voltage has a different shape or the end value is not 5V, then the time until the minimum dropout voltage has been reached should be used to decide if the IN and ENABLE pins can be tied together. Table 2 lists these times. For optimal startup when the IN pin and ENABLE pin are tied together, keep the input voltage rise time less than or equal to 2ms. For rise times greater than 2ms, the ENABLE pin must be kept below 0.7V until the voltage at the IN pin has reached the minimum operating voltage. One way to control the voltage at the ENABLE pin is with an additional RC filter, such as that shown in Figure 23. The RC filter must hold the voltage at the ENABLE pin below the threshold voltage until the voltage at the input pin has reached the minimum operating voltage. 1 6 2 5 VREF Table 2. Minimum Dropout Voltage Times DEVICE TIME REF3212 0.4ms REF3220 0.5ms REF3225 0.7ms REF3230 0.9ms REF3233 1.0ms REF3240 1.6ms Note that because the leakage current of the EN pin is in the range of a few nA, it can be disregarded in most applications. SHUTDOWN 3 4 VIN R1 C1 The REF32xx can be placed in a low-power mode by pulling the ENABLE/SHUTDOWN pin low. When in Shutdown mode, the output of the REF32xx becomes a resistive load to ground. The value of the load depends on the model, and ranges from approximately 100kΩ to 400kΩ. Figure 23. Application Circuit to Control the REF32xx ENABLE Pin Copyright © 2005–2011, Texas Instruments Incorporated 9 REF3212, REF3220 REF3225, REF3230 REF3233, REF3240 SBVS058C – JUNE 2005 – REVISED AUGUST 2011 www.ti.com THERMAL HYSTERESIS LONG-TERM STABILITY Thermal hysteresis for the REF32xx is defined as the change in output voltage after operating the device at +25°C, cycling the device through the specified temperature range, and returning to +25°C. It can be expressed as: Long-term stability refers to the change of the output voltage of a reference over a period of months or years. This effect lessens as time progresses, as is shown by the long-term stability Typical Characteristic curves. The typical drift value for the REF32xx is 55ppm from 0 to 1000 hours. This parameter is characterized by measuring 30 units at regular intervals for a period of 1000 hours. ( VPRE - VPOST VNOM ( VHYST = 6 ´ 10 (ppm) Where: VHYST = thermal hysteresis (in units of ppm). VNOM = the specified output voltage. VPRE = output voltage measured at +25°C pretemperature cycling. VPOST = output voltage measured after the device has been cycled through the specified temperature range of –40°C to +125°C and returned to +25°C. (1) LOAD REGULATION Load regulation is defined as the change in output voltage as a result of changes in load current. The load regulation of the REF32xx is measured using force and sense contacts, as shown in Figure 24. Contact and Trace Resistance TEMPERATURE DRIFT The REF32xx is designed to exhibit minimal drift error, which is defined as the change in output voltage over varying temperature. The drift is calculated using the box method, as described by Equation 2: ( VOUTMAX - VOUTMIN VOUT ´ Temp Range ( Drift = OUT_F 1 6 GND_S OUT_S 2 REF32xx 5 ENABLE IN 3 6 ´ 10 (ppm) (2) The REF32xx features a typical drift coefficient of 4ppm/°C from 0°C to +125°C—the primary temperature range for many applications. For the extended industrial temperature range of –40°C to +125°C, the REF32xx family drift increases to a typical value of 10.5ppm/°C. NOISE PERFORMANCE Typical 0.1Hz to 10Hz voltage noise can be seen in the Typical Characteristic curve, 0.1Hz to 10Hz Voltage Noise. The noise voltage of the REF32xx increases with output voltage and operating temperature. Additional filtering can be used to improve output noise levels, although care should be taken to ensure the output impedance does not degrade AC performance. 10 GND_F RLOAD 4 0.47mF +5V Figure 24. Accurate Load Regulation of REF32xx The force and sense lines can be used to effectively eliminate the impact of contact and trace resistance, resulting in accurate voltage at the load. By connecting the force and sense lines at the load, the REF32xx compensates for the contact and trace resistances because it measures and adjusts the voltage actually delivered at the load. The GND_S pin is connected to the internal ground of the device through ESD protection diodes. Because of that connection, the maximum differential voltage between the GND_S and GND_F pins must be kept below 200mV to prevent these dioes from unintentionally turning on. Copyright © 2005–2011, Texas Instruments Incorporated REF3212, REF3220 REF3225, REF3230 REF3233, REF3240 SBVS058C – JUNE 2005 – REVISED AUGUST 2011 www.ti.com APPLICATION CIRCUITS +5V NEGATIVE REFERENCE VOLTAGE 3 For applications requiring a negative and positive reference voltage, the REF32xx and OPA735 can be used to provide a dual-supply reference from a ±5V supply. Figure 25 shows the REF3225 used to provide a ±2.5V supply reference voltage. The low drift performance of the REF32xx complements the low offset voltage and zero drift of the OPA735 to provide an accurate solution for split-supply applications. Care must be taken to match the temperature coefficients of R1 and R2. 4 5 REF3225 2 6 +2.5V 1 R1 10kW R2 10kW +5V Data acquisition systems often require stable voltage references to maintain accuracy. The REF32xx family features stability and a wide range of voltages suitable for most microcontrollers and data converters. Figure 26, Figure 27, and Figure 28 show basic data acquisition systems. -5V NOTE:: Bypass capacitor is not shown. Figure 25. REF3225 Combined with OPA735 to Create Positive and Negative Reference Voltages 5 3.3V 3 REF3233 6 5W VREF 2 VCC + + 4 1 V+ 0.47mF GND VS ADS7822 1mF to 10mF 1mF to 10mF 0.1mF VIN -2.5V OPA735 DATA ACQUISITION Microcontroller +In CS -In DOUT GND DCLOCK Figure 26. Basic Data Acquisition System 1 Copyright © 2005–2011, Texas Instruments Incorporated 11 REF3212, REF3220 REF3225, REF3230 REF3233, REF3240 SBVS058C – JUNE 2005 – REVISED AUGUST 2011 www.ti.com 2.5V Supply 2.5V 3 5W VIN 4 + 5 REF3212 2 6 VOUT = 1.25V VREF 1 VS ADS8324 VCC + 0.1mF 1mF to 10mF GND +In 0V to 1.25V 1mF to 10mF Microcontroller CS DOUT -In GND DCLOCK Figure 27. Basic Data Acquisition System 2 +5V 2 1 REF3240 5 3 4 6 VOUT = 4.096V 1kW 0.1mF 10W 22mF +5V 1kW VIN 1mF VREF 10W ADS8381 THS4031 6800pF 0.22mF 500W -5V Figure 28. REF3240 Provides an Accurate Reference for Driving the ADS8381 12 Copyright © 2005–2011, Texas Instruments Incorporated REF3212, REF3220 REF3225, REF3230 REF3233, REF3240 SBVS058C – JUNE 2005 – REVISED AUGUST 2011 www.ti.com REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (February 2006) to Revision C Page • Added Pin Descriptions table ................................................................................................................................................ 2 • Added note to Enable/Shutdown parameter ......................................................................................................................... 4 • Changed the minimum voltage for Enable/Shutdown with reference active from (0.75 × VIN) to 1.5 .................................. 4 • Changed Current test condition from from (0.75 × VIN) to (1.5V) ......................................................................................... 4 • Added text, two tables, and one figure to Supply Voltage section ....................................................................................... 8 • Changed pin 3 in Figure 24 from SHDN to ENABLE (typo) ............................................................................................... 10 • Added paragraph to Load Regulation section .................................................................................................................... 10 Copyright © 2005–2011, Texas Instruments Incorporated 13 PACKAGE OPTION ADDENDUM www.ti.com 25-Nov-2008 PACKAGING INFORMATION (1) Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty REF3212AIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REF3212AIDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REF3212AIDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REF3212AIDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REF3220AIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REF3220AIDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REF3220AIDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REF3220AIDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REF3225AIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REF3225AIDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REF3225AIDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REF3225AIDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REF3230AIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REF3230AIDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REF3230AIDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REF3230AIDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REF3233AIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REF3233AIDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REF3233AIDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REF3233AIDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REF3240AIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REF3240AIDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REF3240AIDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REF3240AIDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR The marketing status values are defined as follows: Addendum-Page 1 Lead/Ball Finish MSL Peak Temp (3) PACKAGE OPTION ADDENDUM www.ti.com 25-Nov-2008 ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF REF3212, REF3220, REF3225, REF3230, REF3233, REF3240 : • Enhanced Product: REF3212-EP, REF3220-EP, REF3225-EP, REF3230-EP, REF3233-EP, REF3240-EP NOTE: Qualified Version Definitions: • Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 12-Oct-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) REF3212AIDBVR SOT-23 DBV 6 3000 180.0 8.4 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.2 3.1 1.39 4.0 8.0 Q3 REF3212AIDBVT SOT-23 DBV 6 250 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3 REF3220AIDBVR SOT-23 DBV 6 3000 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3 REF3220AIDBVT SOT-23 DBV 6 250 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3 REF3225AIDBVR SOT-23 DBV 6 3000 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3 REF3225AIDBVT SOT-23 DBV 6 250 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3 REF3230AIDBVR SOT-23 DBV 6 3000 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3 REF3230AIDBVT SOT-23 DBV 6 250 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3 REF3233AIDBVR SOT-23 DBV 6 3000 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3 REF3233AIDBVT SOT-23 DBV 6 250 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3 REF3240AIDBVR SOT-23 DBV 6 3000 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3 REF3240AIDBVT SOT-23 DBV 6 250 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 12-Oct-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) REF3212AIDBVR SOT-23 DBV 6 3000 210.0 185.0 35.0 REF3212AIDBVT SOT-23 DBV 6 250 210.0 185.0 35.0 REF3220AIDBVR SOT-23 DBV 6 3000 210.0 185.0 35.0 REF3220AIDBVT SOT-23 DBV 6 250 210.0 185.0 35.0 REF3225AIDBVR SOT-23 DBV 6 3000 210.0 185.0 35.0 REF3225AIDBVT SOT-23 DBV 6 250 210.0 185.0 35.0 REF3230AIDBVR SOT-23 DBV 6 3000 210.0 185.0 35.0 REF3230AIDBVT SOT-23 DBV 6 250 210.0 185.0 35.0 REF3233AIDBVR SOT-23 DBV 6 3000 210.0 185.0 35.0 REF3233AIDBVT SOT-23 DBV 6 250 210.0 185.0 35.0 REF3240AIDBVR SOT-23 DBV 6 3000 210.0 185.0 35.0 REF3240AIDBVT SOT-23 DBV 6 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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