BB OPA4376AIPWRG4

 OP
A3
76
OPA
2376
OPA376
OPA2376
OPA4376
OPA
4376
SBOS406B – JUNE 2007 – REVISED SEPTEMBER 2007
Precision, Low Noise, Low Quiescent Current,
Operational Amplifier
FEATURES
DESCRIPTION
•
•
•
•
•
•
•
The OPA376 family represent a new generation of
low-noise operational amplifiers. Rail-to-rail input, low
offset (5μV typ), low noise (7.5nV/√Hz), quiescent
current less than 1mA max, and a 5.5MHz bandwidth
make this part very attractive for a variety of precision
and portable applications. In addition, this device has
a reasonably wide supply range with excellent PSRR,
making it attractive for applications that run directly
from batteries without regulation.
1
2
LOW NOISE: 7.5nV/√Hz at 1kHz
0.1Hz to 10Hz NOISE: 0.8μVPP
QUIESCENT CURRENT: 950μA (max)
LOW OFFSET VOLTAGE: 25μV (max)
SINGLE-SUPPLY OPERATION
SUPPLY VOLTAGE: 2.2V to 5.5V
SPACE-SAVING PACKAGES:
– SC-70, SOT23, MSOP, TSSOP
APPLICATIONS
ADC BUFFER
AUDIO EQUIPMENT
MEDICAL INSTRUMENTATION
HANDHELD TEST EQUIPMENT
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
-25.0
-22.5
-20.0
-17.5
-15.0
-12.5
-10.0
-7.5
-5.0
-2.5
0
2.5
5.0
7.5
10.0
12.5
15.0
17.5
20.0
22.5
25.0
Population
•
•
•
•
The OPA376 (single version) is available in
MicroSIZE SC70-5, SOT23-5, and SO-8 packages.
The OPA2376 (dual) is offered in the MSOP-8 and
SO-8 packages. The OPA4376 (quad) is offered in a
TSSOP-14 package. All versions are specified for
operation from –40°C to +125°C.
Offset Voltage (mV)
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
OPA376
OPA2376
OPA4376
www.ti.com
SBOS406B – JUNE 2007 – REVISED SEPTEMBER 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS (1)
OPA376, OPA2376, OPA4376
UNIT
+7
V
Supply Voltage
Signal Input Terminals
Voltage
(2)
–0.5 to (V+) + 0.5
V
±10
mA
Current (2)
Output Short-Circuit (3)
Continuous
Operating Temperature
–40 to +150
°C
Storage Temperature
–65 to +150
°C
Junction Temperature
+150
°C
Human Body Model
4000
V
Charged Device Model
1000
V
Machine Model
200
V
ESD Rating
(1)
(2)
(3)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should
be current limited to 10mA or less.
Short-circuit to ground one amplifier per package.
PACKAGE INFORMATION (1)
PRODUCT
PACKAGE-LEAD
PACKAGE DESIGNATOR
SC70-5
DCK
BUR
OPA376
SOT23-5
DBV
BUQ
SO-8
D
OPA376
SO-8
D
OPA2376
OPA2376
MSOP-8
DGK
OBBI
OPA4376
TSSOP-14
PW
OPA4376
OPA2376
(1)
2
PACKAGE MARKING
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
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SBOS406B – JUNE 2007 – REVISED SEPTEMBER 2007
ELECTRICAL CHARACTERISTICS: VS = +2.2V to +5.5V
Boldface limits apply over the specified temperature range: TA = –40°C to +125°C.
At TA = +25°C, RL = 10kΩ connected to VS/2, VCM = VS/2, and VOUT = VS/2, unless otherwise noted.
OPA376, OPA2376, OPA4376
PARAMETERS
CONDITIONS
MIN
TYP
MAX
UNIT
5
25
μV
OFFSET VOLTAGE
Input Offset Voltage
vs Temperature
vs Power Supply
VOS
dVOS/dT
PSRR
Over Temperature
–40°C to +85°C
0.26
1
μV/°C
–40°C to +125°C
0.32
2
μV/°C
VS = +2.2V to +5.5V, VCM < (V+) – 1.3V
5
20
VS = +2.2V to +5.5V, VCM < (V+) – 1.3V
5
μV/V
0.5
mV/V
Channel Separation, dc (dual, quad)
μV/V
INPUT BIAS CURRENT
Input Bias Current
IB
0.2
Over Temperature
Input Offset Current
10
pA
See Typical Characteristics
pA
0.2
pA
IOS
10
NOISE
0.8
μVPP
en
7.5
nV/√Hz
in
2
fA/√Hz
Input Voltage Noise, f = 0.1Hz to 10Hz
Input Voltage Noise Density, f = 1kHz
Input Current Noise, f = 1kHz
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
VCM
Common-Mode Rejection Ratio
CMRR
(V–) – 0.1
(V–) < VCM < (V+) – 1.3 V
76
(V+) + 0.1
V
90
dB
Differential
6.5
pF
Common-Mode
13
pF
INPUT CAPACITANCE
OPEN-LOOP GAIN
Open-Loop Voltage Gain
AOL
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
50mV < VO < (V+) – 50mV, RL = 10kΩ
120
134
dB
100mV < VO < (V+) – 100mV, RL = 2kΩ
120
126
dB
CL = 100pF, VS = 5.5V
GBW
SR
5.5
MHz
G = +1
2
V/μs
Settling Time 0.1%
tS
2V Step , G = +1
1.6
μs
Settling Time 0.01%
tS
2V Step , G = +1
2
μs
VIN × Gain > VS
0.33
μs
VO = 1VRMS, G = +1, f = 1kHz, RL = 10kΩ
0.00027
%
Overload Recovery Time
THD + Noise
THD+N
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OPA2376
OPA4376
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SBOS406B – JUNE 2007 – REVISED SEPTEMBER 2007
ELECTRICAL CHARACTERISTICS: VS = +2.2V to +5.5V (continued)
Boldface limits apply over the specified temperature range: TA = –40°C to +125°C.
At TA = +25°C, RL = 10kΩ connected to VS/2, VCM = VS/2, and VOUT = VS/2, unless otherwise noted.
OPA376, OPA2376, OPA4376
PARAMETERS
CONDITIONS
MIN
TYP
MAX
UNIT
10
20
mV
40
mV
OUTPUT
Voltage Output Swing from Rail
RL = 10kΩ
Over Temperature
RL = 10kΩ
Voltage Output Swing from Rail
RL = 2kΩ
Over Temperature
Short-Circuit Current
Capacitive Load Drive
40
RL = 2kΩ
ISC
mV
80
mV
±40
CLOAD
Open-Loop Output Impedance
50
mA
See Typical Characteristics
RO
Ω
150
POWER SUPPLY
Specified Voltage Range
VS
2.2
Operating Voltage Range
Quiescent Current per amplifier
5.5
V
950
μA
1
mA
°C
2 to 5.5
IQ
IO = 0, VS = +5.5V, VCM < (V+) – 1.3V
760
Over Temperature
V
TEMPERATURE RANGE
Specified Range
–40
+125
Operating Range
–40
+150
Thermal Resistance
4
°C
°C/W
θJA
SC70
250
°C/W
SOT23
200
°C/W
SO-8, TSSOP-14, MSOP-8
150
°C/W
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OPA2376
OPA4376
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SBOS406B – JUNE 2007 – REVISED SEPTEMBER 2007
PIN CONFIGURATIONS
OPA376
SOT23-5
Top View
OUT
1
V-
2
+IN
3
OPA376
SO-8
Top View
5
V+
4
-IN
NC
1
8
NC
-IN
2
7
V+
+IN
3
6
OUT
V-
4
5
NC
OPA376
SC70-5
Top View
+IN
1
V-
2
-IN
3
OPA2376
SO-8, MSOP-8
Top View
V+
5
OUT
4
OUT A
1
8
V+
-IN A
2
7
OUT B
+IN A
3
6
-IN B
V-
4
5
+IN B
OPA4376
TSSOP-14
Top View
Out A
1
14
OUT D
-IN A
2
13
-IN D
+IN A
3
12
+IN D
V+
4
11
V-
+IN B
5
10
+IN C
-IN B
6
9
-IN C
OUT B
7
8
OUT C
NOTE: NC denotes no internal connection.
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OPA2376
OPA4376
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SBOS406B – JUNE 2007 – REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS
At TA = +25°C, RL = 10kΩ connected to VS/2, VCM = VS/2, and VOUT = VS/2, unless otherwise noted.
POWER-SUPPLY AND COMMON-MODE
REJECTION RATIO vs FREQUENCY
0
140
-20
120
-40
Gain
100
-60
Phase
80
-80
60
-100
40
-120
20
-140
0
-160
-20
0.1
1
10
100
120
1k
10k
100k
1M
Power-Supply Rejection Ratio (dB)
160
Phase Margin (°)
Open-Loop Gain (dB)
OPEN-LOOP GAIN/PHASE vs FREQUENCY
V(+) Power-Supply Rejection Ratio
100
80
Common-Mode
Rejection Ratio
60
40
V(-) Power-Supply Rejection Ratio
20
0
-180
10M
10
100
1k
10k
100k
1M
10M
Frequency (Hz)
Frequency (Hz)
Figure 1.
Figure 2.
OPEN-LOOP GAIN AND POWER-SUPPLY
REJECTION RATIO vs TEMPERATURE
0.1Hz to 10Hz
INPUT VOLTAGE NOISE
Open-Loop Gain (RL = 2kW)
140
120
500nV/div
Open-Loop Gain and PSRR (dB)
160
Power-Supply Rejection Ratio
(VS = 2.1V to 5.5V)
100
80
-50
0
-25
50
25
75
100
1s/div
150
125
Temperature (°C)
Figure 3.
Figure 4.
INPUT VOLTAGE NOISE SPECTRAL DENSITY
TOTAL HARMONIC DISTORTION + NOISE
vs FREQUENCY
1
Total Harmonic Distortion + Noise (%)
Voltage Noise (nV/ÖHz)
100
10
1
VS = 5V, VCM = 2V, VOUT = 1VRMS
0.1
0.01
Gain = 10V/V
0.001
Gain = 1V/V
0.0001
1
10
100
1k
10k
100k
10
100
Frequency (Hz)
Figure 5.
6
1k
10k
100k
Frequency (Hz)
Figure 6.
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OPA2376
OPA4376
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SBOS406B – JUNE 2007 – REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, RL = 10kΩ connected to VS/2, VCM = VS/2, and VOUT = VS/2, unless otherwise noted.
COMMON-MODE REJECTION RATIO
vs TEMPERATURE
QUIESCENT CURRENT
vs TEMPERATURE
1000
100
900
Quiescent Current (mA)
Common-Mode Rejection Ratio (dB)
110
90
80
70
800
700
600
60
50
500
-50
-25
0
25
50
75
100
125
150
-50
-25
0
25
50
75
100
Temperature (°C)
Temperature (°C)
Figure 7.
Figure 8.
QUIESCENT AND SHORT-CIRCUIT CURRENT
vs SUPPLY VOLTAGE
SHORT-CIRCUIT CURRENT
vs TEMPERATURE
150
125
150
75
50
1000
125
VS = ±2.75V
Quiescent Current (mA)
ISC
30
800
20
700
IQ
10
600
Short-Circuit Current (mA)
40
900
Short-Circuit Current (mA)
50
ISC+
25
0
-25
ISC-
-50
-75
0
500
2.0
2.5
3.0
3.5
4.0
4.5
-100
5.5
5.0
-50
-25
0
25
Figure 9.
75
100
Figure 10.
INPUT BIAS CURRENT vs TEMPERATURE
OUTPUT VOLTAGE vs OUTPUT CURRENT
150
3
125
2
Output Voltage (V)
Input Bias Current (pA)
50
Temperature (°C)
Supply Voltage (V)
100
75
50
25
1
+150°C
+125°C
+25°C
-40°C
0
-1
-2
0
-3
-50
-25
0
25
50
75
100
125
150
0
10
20
Temperature (°C)
Figure 11.
30
40
50
60
70
80
Output Current (mA)
Figure 12.
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OPA2376
OPA4376
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SBOS406B – JUNE 2007 – REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, RL = 10kΩ connected to VS/2, VCM = VS/2, and VOUT = VS/2, unless otherwise noted.
OFFSET VOLTAGE DRIFT
PRODUCTION DISTRIBUTION (–40°C to +125°C)
-25.0
-22.5
-20.0
-17.5
-15.0
-12.5
-10.0
-7.5
-5.0
-2.5
0
2.5
5.0
7.5
10.0
12.5
15.0
17.5
20.0
22.5
25.0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
Population
Population
OFFSET VOLTAGE
PRODUCTION DISTRIBUTION
½Offset Voltage Drift½ (mV/°C)
Offset Voltage (mV)
Figure 13.
Figure 14.
MAXIMUM OUTPUT VOLTAGE vs FREQUENCY
6
VS = 5.5V
VS = 5V
G = +1V/V
Small-Signal Overshoot (%)
Output Voltage (VPP)
5
4
3
SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE
50
VS = 2.5V
2
1
40
30
20
10
0
0
1k
10k
100k
1M
10M
100
10
Frequency (Hz)
Figure 15.
Figure 16.
SMALL-SIGNAL PULSE RESPONSE
LARGE-SIGNAL PULSE RESPONSE
G = +1
RL = 2kW
CL = 50pF
1V/div
50mV/div
G = +1
RL = 10kW
CL = 50pF
Time (2ms/div)
Time (400ns/div)
Figure 17.
8
1k
Load Capacitance (pF)
Figure 18.
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SBOS406B – JUNE 2007 – REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, RL = 10kΩ connected to VS/2, VCM = VS/2, and VOUT = VS/2, unless otherwise noted.
SETTLING TIME vs CLOSED-LOOP GAIN
CHANNEL SEPARATION vs FREQUENCY
140
100
Channel Separation (dB)
Settling Time (ms)
120
10
0.01%
1
0.1%
100
80
60
40
20
0
0.1
1
10
10
100
100
1k
10k
100k
Closed-Loop Gain (V/V)
Frequency (Hz)
Figure 19.
Figure 20.
1M
10M
100M
OPEN-LOOP OUTPUT RESISTANCE vs FREQUENCY
Open-Loop Output Resistance (W)
1k
100
10
400mA Load
2mA Load
1
0.1
10
100
1k
10k
100k
1M
10M
Frequency (Hz)
Figure 21.
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OPA2376
OPA4376
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SBOS406B – JUNE 2007 – REVISED SEPTEMBER 2007
APPLICATION INFORMATION
OPERATING CHARACTERISTICS
COMMON-MODE VOLTAGE RANGE
The OPA376 family of amplifiers has parameters that
are fully specified from +2.2V to +5.5V. Many of the
specifications apply from –40°C to +125°C.
Parameters that can exhibit significant variance with
regard to operating voltage or temperature are
presented in the Typical Characteristics.
The input common-mode voltage range of the
OPA376 series extends 100mV beyond the supply
rails. The offset voltage of the amplifier is very low,
from approximately (V–) to (V+) – 1V, as shown in
Figure 23. The offset voltage increases as
common-mode
voltage
exceeds
(V+)
–1V.
Common-mode rejection is specified from (V–) to
(V+) – 1.3V.
For best operational performance of the device, good
printed circuit board (PCB) layout practices are
required. Low-loss, 0.1μF bypass capacitors must be
connected between each supply pin and ground as
close to the device as possible. A single bypass
capacitor from V+ to ground is applicable to
single-supply applications.
BASIC AMPLIFIER CONFIGURATIONS
The OPA376 family is unity-gain stable. It does not
exhibit output phase inversion when the input is
overdriven. A typical single-supply connection is
shown in Figure 22. The OPA376 is configured as a
basic inverting amplifier with a gain of –10V/V. This
single-supply connection has an output centered on
the common-mode voltage, VCM. For the circuit
shown, this voltage is 2.5V, but may be any value
within the common-mode input voltage range.
3
2
Output Voltage (mV)
GENERAL LAYOUT GUIDELINES
1
0
-1
-2
-V
+V
-3
-0.5 0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Common-Mode (V)
Figure 23. Offset and Common-Mode Voltage
INPUT AND ESD PROTECTION
R2
10kW
+5V
C1
100nF
R1
1kW
OPA376
VOUT
VIN
The OPA376 family incorporate internal electrostatic
discharge (ESD) protection circuits on all pins. In the
case of input and output pins, this protection primarily
consists of current steering diodes connected
between the input and power-supply pins. These ESD
protection diodes also provide in-circuit, input
overdrive protection, provided that the current is
limited to 10mA as stated in the Absolute Maximum
Ratings. Figure 24 shows how a series input resistor
may be added to the driven input to limit the input
current. The added resistor contributes thermal noise
at the amplifier input and its value should be kept to a
minimum in noise-sensitive applications.
VCM = 2.5V
V+
IOVERLOAD
10mA max
Figure 22. Basic Single-Supply Connection
OPA376
VOUT
VIN
5kW
Figure 24. Input Current Protection
10
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SBOS406B – JUNE 2007 – REVISED SEPTEMBER 2007
CAPACITIVE LOAD AND STABILITY
ACTIVE FILTERING
The OPA376 series of amplifiers may be used in
applications where driving a capacitive load is
required. As with all op amps, there may be specific
instances where the OPAx376 can become unstable,
leading to oscillation. The particular op amp circuit
configuration, layout, gain and output loading are
some of the factors to consider when establishing
whether an amplifier will be stable in operation. An op
amp in the unity-gain (+1V/V) buffer configuration and
driving a capacitive load exhibits a greater tendency
to be unstable than an amplifier operated at a higher
noise gain. The capacitive load, in conjunction with
the op amp output resistance, creates a pole within
the feedback loop that degrades the phase margin.
The degradation of the phase margin increases as
the capacitive loading increases.
The OPA376 series is well-suited for filter
applications requiring a wide bandwidth, fast slew
rate, low-noise, single-supply operational amplifier.
Figure 26 shows a 50kHz, 2nd-order, low-pass filter.
The components have been selected to provide a
maximally-flat Butterworth response. Beyond the
cutoff frequency, roll-off is –40dB/dec. The
Butterworth response is ideal for applications
requiring predictable gain characteristics such as the
anti-aliasing filter used ahead of an analog-to-digital
converter (ADC).
The OPAx376 in a unity-gain configuration can
directly drive up to 250pF pure capacitive load.
Increasing the gain enhances the ability of the
amplifier to drive greater capacitive loads (see the
typical characteristic plot, Small-Signal Overshoot vs
Capacitive Load. In unity-gain configurations,
capacitive load drive can be improved by inserting a
small (10Ω to 20Ω) resistor, RS, in series with the
output, as shown in Figure 25. This resistor
significantly reduces ringing while maintaining dc
performance for purely capacitive loads. However, if
there is a resistive load in parallel with the capacitive
load, a voltage divider is created, introducing a gain
error at the output and slightly reducing the output
swing. The error introduced is proportional to the ratio
RS/RL, and is generally negligible at low output
current levels.
C2
150pF
V+
R1
5.49kW
R2
12.4kW
OPA376
VIN
C1
1nF
VOUT
(V+)/2
Figure 26. Second-Order Butterworth 50kHz
Low-Pass Filter
DRIVING AN ANALOG-TO-DIGITAL
CONVERTER
V+
RS
VOUT
OPA376
VIN
R3
5.49kW
10W to
20W
RL
CL
The low noise and wide gain bandwidth of the
OPA376 family make it an ideal driver for ADCs.
Figure 27 illustrates the OPA376 driving an
ADS8327, 16-bit, 250kSPS converter. The amplifier is
connected as a unity-gain, noninverting buffer.
Figure 25. Improving Capacitive Load Drive
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SBOS406B – JUNE 2007 – REVISED SEPTEMBER 2007
+5V
C1
0.1mF
+5V
(1)
R1
100W
+IN
OPA376
(1)
C3
1.2nF
VIN
-IN
ADS8327
Low Power
16-Bit
500kSPS
REF IN
+5V
REF5040
4.096V
C4
100nF
NOTE: (1) Suggested value; may require adjustment based on specific application.
Figure 27. Driving an ADS8327
reduced to 5.1V by the series 6.8kΩ resistors on the
output side of the cable, and the 4.7kΩ and zener
diode on the input side of the cable. AC coupling is
used to block the different dc voltage levels from
each other on each end of the cable.
PHANTOM-POWERED MICROPHONE
The circuit provided in Figure 28 depicts how a
remote microphone amplifier can be powered by a
phantom source on the output side of the signal
cable. The cable serves double duty, carrying both
the differential output signal from, and dc power to
the microphone amplifier stage.
An INA163 instrumentation amplifier provides
differential inputs and receives the balanced audio
signals from the cable. The INA163 gain may be set
from 0dB to 80dB by selecting the RG value. The
INA163 circuit is typical of the input circuitry used in
mixing consoles.
An OPA2376 serves as a single-ended input, to
differential output amplifier with a 6dB gain.
Common-mode bias for the two op amps is provided
by the dc voltage developed across the electret
microphone element. A 48V phantom supply is
Phantom Power
(Provides power source for microphone)
48V
Microphone
100W
+
1mF
D1
5.1V
+
33mF
R1
2.7kW
C2
33mF
R6
100W
R8
4.7kW
R9
4.7kW
R10
6.8kW
+
1/2
OPA2376
R11
6.8kW
+15V
10mF
+
2
2
3
3
1kW
RG
INA163
10mF
+
Panasonic
WM-034CY
1kW
1
10kW
+
+
1/2
OPA2376
C3
33mF
1
R7
100W
3.3kW
Low-level differential audio signal
is transmitted differentially on the
same cable as power to the microphone.
3.3kW
-15V
10mF
Typical microphone input circuit used in mixing consoles.
Figure 28. Phantom-Powered Electret Microphone
12
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): OPA376 OPA2376 OPA4376
OPA376
OPA2376
OPA4376
www.ti.com
SBOS406B – JUNE 2007 – REVISED SEPTEMBER 2007
V+ = +2.7V to 5V
Passband 300Hz to 3kHz
R9
510kW
R1
1.5kW
R2
1MW
R4
20kW
C3
33pF
C1
1000pF
R7
51kW
1/2
OPA2376
Electret
(1)
Microphone
R3
1MW
R8
150kW
VREF 1
8 V+
7
1/2
OPA2376
R6
100kW
C2
1000pF
+IN
ADS7822 6
12-Bit A/D
5
2
-IN
DCLOCK
DOUT
CS/SHDN
Serial
Interface
3
4
R5
20kW
G = 100
GND
NOTE: (1) Electret microphone powered by R1.
Figure 29. OPA2376 as a Speech Bandpass Filtered Data Acquisition System
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): OPA376 OPA2376 OPA4376
Submit Documentation Feedback
13
PACKAGE OPTION ADDENDUM
www.ti.com
5-Oct-2007
PACKAGING INFORMATION
(1)
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
OPA2376AID
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA2376AIDG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA2376AIDGKR
ACTIVE
MSOP
DGK
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA2376AIDGKRG4
ACTIVE
MSOP
DGK
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA2376AIDGKT
ACTIVE
MSOP
DGK
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA2376AIDGKTG4
ACTIVE
MSOP
DGK
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA2376AIDR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA2376AIDRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA376AID
ACTIVE
SOIC
D
8
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA376AIDBVR
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA376AIDBVRG4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA376AIDBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA376AIDBVTG4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA376AIDCKR
ACTIVE
SC70
DCK
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA376AIDCKRG4
ACTIVE
SC70
DCK
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA376AIDCKT
ACTIVE
SC70
DCK
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA376AIDCKTG4
ACTIVE
SC70
DCK
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA376AIDG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA376AIDR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA376AIDRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA4376AIPW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA4376AIPWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA4376AIPWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA4376AIPWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
75
The marketing status values are defined as follows:
Addendum-Page 1
Lead/Ball Finish
MSL Peak Temp (3)
PACKAGE OPTION ADDENDUM
www.ti.com
5-Oct-2007
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
OPA2376AIDGKR
DGK
8
SITE 41
330
12
5.3
3.4
1.4
8
12
Q1
OPA2376AIDGKT
DGK
8
SITE 41
180
12
5.3
3.4
1.4
8
12
Q1
OPA2376AIDR
D
8
SITE 41
330
12
6.4
5.2
2.1
8
12
Q1
OPA376AIDBVR
DBV
5
SITE 48
179
8
3.2
3.2
1.4
4
8
Q3
OPA376AIDBVT
DBV
5
SITE 48
179
8
3.2
3.2
1.4
4
8
Q3
OPA376AIDCKR
DCK
5
SITE 48
179
8
2.25
2.4
1.22
4
8
Q3
OPA376AIDCKT
DCK
5
SITE 48
179
8
2.25
2.4
1.22
4
8
Q3
OPA376AIDR
D
8
SITE 41
330
12
6.4
5.2
2.1
8
12
Q1
OPA4376AIPWR
PW
14
SITE 41
330
12
7.0
5.6
1.6
8
12
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
OPA2376AIDGKR
DGK
8
SITE 41
346.0
346.0
29.0
OPA2376AIDGKT
DGK
8
SITE 41
190.0
212.7
31.75
OPA2376AIDR
D
8
SITE 41
346.0
346.0
29.0
OPA376AIDBVR
DBV
5
SITE 48
195.0
200.0
45.0
OPA376AIDBVT
DBV
5
SITE 48
195.0
200.0
45.0
OPA376AIDCKR
DCK
5
SITE 48
195.0
200.0
45.0
OPA376AIDCKT
DCK
5
SITE 48
195.0
200.0
45.0
OPA376AIDR
D
8
SITE 41
346.0
346.0
29.0
OPA4376AIPWR
PW
14
SITE 41
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
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• DALLAS, TEXAS 75265
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