TI TCA8424

TCA8424
www.ti.com
SCDS341 – MARCH 2013
Low-Voltage 8x16 Keyboard Scanner with HID over I2C Compliant Interface
Check for Samples: TCA8424
FEATURES
1
•
•
•
•
ESD Protection Exceeds JESD 22
– 1000-V Human-Body Model (A114-A)
RHB 5mmx5mm
RSM 4mmx4mm
PREVIEW
0.50
32X 0.30
1
32
EW
•
•
•
•
•
Thermal Pad
EV
I
•
•
•
•
•
•
Operating Power-Supply Voltage Range of
1.65V to 3.6V
Supports FM+ I2C Operation up to 1MHz
Can Support up to 128 (8x16) Key Scan
Internal Power-On-Reset
Open Drain Open Drain Active Low INT Output
Noise Filter on SCL/SDA and Inputs
Open Drain Outputs Can Sink up to 12mA
Current for LED
Hardware Coded HID and REPORT Descriptors
Available With Preprogrammed Keyboard Map
Software Reset per HID Over I2C Standard
Internal Pull-up Resistors Make
Implementation Easy With no Need for
External Components
HID Over I2C Commands Supported
– RESET
– GET REPORT
– SET REPORT
– SET POWER
Fixed Length 8-byte INPUT Report can Detect
up to 6 Simultaneous Key Presses Excluding
Modifiers (CTRL, ALT, SHIFT)
INPUT Report Generated on Key Press and
Release
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
SIZE AND SHAPE
SHOWN ON SEPARATE SHEET
4X 3.50
PR
•
0.50
0.30
32X 0.18
0.10 M C A B
RHA 6mm x 6mm
DESCRIPTION
This 128 key scan device is specifically targeted towards end equipment that runs on Windows 8 operating
system. The device is fully compliant with the HID over I2C specification defined (ver 1.0) defined by Microsoft.
The HID and report descriptors are hard coded into the device so that they don’t need to be programmed at
production. The device also comes with a preprogrammed keyboard map that is compatible with most standard
laptop/notebook keyboards. However, the device also available without a pre-programmed keyboard, so that any
keyboard map may be written into it at production.
The device generates INPUT reports of standard 8-byte length with the 1st byte being the modifier byte. After the
keyboard map is programmed into the device it automatically recognizes the row/column location of the modifier
keys based on their usage code. It is capable of detecting and reporting up to six simultaneous key presses plus
eight modifiers. It generates an input report on each key press and each key release.
The device also supports LED indicators that are standard on a keyboard. Different variations support 2,4 or 8
LED outputs. Each output has open drain architecture and is capable of sinking up to 12mA of current. The LEDs
are controlled by a standard OUTPUT report as described in the HID over I2C standard.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
TCA8424
SCDS341 – MARCH 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
COL5
COL4
COL3
COL2
COL1
1
COL6
VCC
COL7
TEST
TOP THROUGH VIEW
31
30
29
28
27
26
25
COL0
ROW15
W
GND
2
3
EV
IE
ROW14
4
23
ROW13
22
ROW12
21
ROW11
20
ROW10
19
ROW9
18
ROW8
17
ROW7
5
LED1
6
SDA
7
2
10
11
12
13
14
ROW0
ROW1
ROW2
ROW3
ROW4
Submit Documentation Feedback
15
ROW5
9
INT
SCL
ROW6
LED0
PR
RSM/RHB
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: TCA8424
TCA8424
www.ti.com
SCDS341 – MARCH 2013
DVCC
TEST
COL7
COL6
COL5
COL4
COL3
39
38
37
36
35
34
33
32
COL2
DVCC
ROW14
TOP THROUGH VIEW
GND
1
30
COL1
(NC)
2
29
COL0
ROW15
3
28
ROW13
GND
4
27
ROW12
(NC)
5
26
ROW11
RHA
23
ROW8
LED3
9
22
ROW7
SDA
10
21
ROW6
12
13
14
15
16
17
18
19
ROW5
8
ROW4
LED2
ROW3
ROW9
ROW2
24
ROW1
7
ROW0
LED1
(NC)
ROW10
(NC)
25
INT
6
SCL
LED0
PIN FUNCTIONS
NAME
TYPE
FUNCTION
VCC
Power
Supply voltage for the device. The I2C bus should be pulled up to this rail. The key matrix IO voltages are
also referenced to this supply voltage.
Input
COLs of the key matrix
COL0–COL7
ROW0–ROW15
Output
ROW of key matrix
LED0–LED7
Output
Open drain output for driving LEDs
TEST
Input
High voltage input used to program the internal memory. To be grounded in application. (1)
GND
Power
Ground
INT
output
Active-low interrupt output. Connect to VCC through a pull-up resistor.
SCL
Input
Serial clock bus. Connect to VCC through a pull-up resistor.
SDA
I/O
Serial data bus. Connect to VCC through a pull-up resistor.
(1)
TEST pin must be grounded in application to ensure proper operation of device.
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: TCA8424
3
TCA8424
SCDS341 – MARCH 2013
www.ti.com
Columns 0 - 7
SIMPLIFIED BLOCK DIAGRAM
Non-Volatile
Memory
HID Descriptor
(30 bytes)
Registers
(volatile)
Key scan
Logic
Rows 0 - 15
Input Register
(8 bytes)
LEDs
Report Descriptor
(194 bytes)
Output Register
(1 bytes)
Core Logic
and
internal
registers
Interrupt
Keyboard map
(256 bytes)
Command Register
(2 bytes)
SDA
Report Ids
Usage Codes
Function Key Location
(32 bytes)
2
I C buffers
and Logic
Data Register
(2 bytes)
SCL
I2C INTERFACE
The bidirectional I2C bus consists of the serial clock (SCL) and serial data (SDA) lines. Both lines must be
connected to VCC through a pull-up resistor. Data transfer may be initiated only when the bus is not busy.
I2C communication with this device is initiated by a master sending a Start condition, a high-to-low transition on
the SDA input/output, while the SCL input is high. After the Start condition, the device address byte is sent, most
significant bit (MSB) first, including the data direction bit (R/W).
After receiving the valid address byte, this device responds with an acknowledge (ACK), a low on the SDA
input/output during the high of the ACK-related clock pulse.
On the I2C bus, only one data bit is transferred during each clock pulse. The data on the SDA line must remain
stable during the high pulse of the clock period, as changes in the data line at this time are interpreted as control
commands (Start or Stop). A Stop condition, a low-to-high transition on the SDA input/output while the SCL input
is high, is sent by the master.
Any number of data bytes can be transferred from the transmitter to receiver between the Start and the Stop
conditions. Each byte of eight bits is followed by one ACK bit. The transmitter must release the SDA line before
the receiver can send an ACK bit. The device that acknowledges must pull down the SDA line during the ACK
clock pulse, so that the SDA line is stable low during the high pulse of the ACK-related clock period. When a
slave receiver is addressed, it must generate an ACK after each byte is received. Similarly, the master must
generate an ACK after each byte that it receives from the slave transmitter. Setup and hold times must be met to
ensure proper operation.
4
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: TCA8424
TCA8424
www.ti.com
SCDS341 – MARCH 2013
A master receiver signals an end of data to the slave transmitter by not generating an acknowledge (NACK) after
the last byte has been clocked out of the slave. This is done by the master receiver by holding the SDA line high.
In this event, the transmitter must release the data line to enable the master to generate a Stop condition.
NOTE
Any communication to another device on the same I2C BUS must be terminated by a stop
condition before communicating to the TCA8424. Any glitches below 0.7 × VCC on the
SCL or SDA line should be less than 50 ns as per the I2C specification.
SDA
SCL
S
P
Start Condition
Stop Condition
Figure 1. Definition of Start and Stop Conditions
SDA
SCL
Data Line Change
Figure 2. Bit Transfer
Data Output
by Transmitter
NACK
Data Output
by Receiver
ACK
SCL From
Master
1
8
2
9
S
Clock Pulse for
Acknowledgment
Start
Condition
Figure 3. Acknowledgment on I2C Bus
DEVICE I2C ADDRESS
The address of the device is shown below:
Table 1. Address Reference
B7
0
0
B6
1
1
B5
1
1
SLAVE ADDRESS
B4
B3
1
0
1
0
I2C BUS SLAVE ADDRESS
B2
1
1
B1
1
1
B0
0 (W)
1 (R)
134 (decimal), 76(h)
135 (decimal), 77(h)
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: TCA8424
5
TCA8424
SCDS341 – MARCH 2013
www.ti.com
The last bit of the slave address defines the operation (read or write) to be performed. A high (1) selects a read
operation. While a low (0) selects a write operation.
Other I2C address options are available. Please contact your local TI sales person for devices with alternate I2C
address.
REGISTER ADDRESS BYTE
Following the successful acknowledgment of the I2C address byte, the bus master sends two register address
bytes indicating the address of the register on which the read or write operation needs to be performed. This
register address is stored in an internal register and used by the device for subsequent read/write to the device.
This is explained more in detail in subsequent sections of the DS.
Other I2C address options are available. Contact your local TI sales person for devices with alternate I2C
address.
Table 2. Register Map
REGISTER ADDRESS
(Hex)
HID descriptor
DESCRIPTION
0000h-001Dh
HID descriptor
Report Descriptor
0030h-00F1h
Report descriptor
Keyboard Map
0100h-01FFh
keyboard Map
POWER UP DEFAULT
See section on HID descriptor
See section on Report descriptor
see section on Keyboard map
Function Key location (1)
0201h
Function Key location on Keyboard Map (2)
0
Default Report ID
0202h
Default Report ID
1
Report ID1
0203h
Report ID1
2
Report ID2
0204h
Report ID2
3
Report ID3
0205h
Report ID3
4
0206h
Report ID4
Report ID4
5
Report ID1 usage IDs
0207h-020Eh
Usage IDs associated with ReportID1
A7 – AE
Report ID2 usage IDs
020Fh-0216h
Usage IDs associated with ReportID2
AF – B6
Report ID3 usage IDs
0217h-021Eh
Usage IDs associated with ReportID3
B7 – BA
Report ID4 usage IDs
021Fh-0226h
Usage IDs associated with ReportID4
BB – BE
Input report
Output report
Command register
Data register
(1)
(2)
6
0400h
input report length (LSB)
00h
0401h
input report length (MSB)
00h
0402h
Report ID
A2
0403h
modifier byte
00h
0404h
reserved
0405h
usage code 1
00h
0406h
usage code 2
00h
0407h
usage code 3
00h
0408h
usage code 4
00h
0409h
usage code 5
00h
040Ah
usage code 6
00h
0500h
LED status
00h
0600h
HID over I2C Command low byte
00h
0601h
HID over I2C Command high byte
00h
Data for HID over I2C command
00h
0700-070Ah
reserved
Function Key Usage ID in keyboard map must be non-zero
Column/Row intersection of function key. i.e. col3 row4 intersection would read 34h
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: TCA8424
TCA8424
www.ti.com
SCDS341 – MARCH 2013
Table 2. Register Map (continued)
REGISTER ADDRESS
(Hex)
0000h (3)
DESCRIPTION
HID Descriptor length
0001h
0002h
BCD version
000Bh
000Ch
47h
48h
max input report length (including 2 bytes
length field)
4Ah
Output register address
4Ch
49h
000Dh
HID Descriptor (3)
(0000h-001Dh)
000Eh
000Fh
0010h
4Dh
4Eh
Command register address
50h
Product ID
56h
57h
Version ID
58h
Reserved per HID over I2C spec v0.91
5Ah
0019h
001Ah
54h
55h
0017h
0018h
52h
53h
Vendor ID
0015h
0016h
4Fh
51h
data register address
0013h
0014h
4Bh
max output report length (including 2 bytes
length field)
0011h
0012h
46h
Input register address
0009h
000Ah
44h
45h
Report Descriptor Register address
0007h
0008h
42h
43h
Report descriptor length
0005h
0006h
40h
41h
0003h
0004h
POWER UP DEFAULT
59h
001Bh
5Bh
001Ch
5Ch
001Dh
5Dh
5Eh
(3)
The Hid descriptor start address must be 0000h
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: TCA8424
7
TCA8424
SCDS341 – MARCH 2013
www.ti.com
HID DESCRIPTOR RETRIEVAL
S
Address
W
Ack
Data
(HID Desc Addr - LSB)
Ack
Address
R
Ack
Data
HID Desc - LSB
Ack
SDA driven by HOST
(Direction: HOST to DEVICE)
SDA driven by DEVICE
(Direction: DEVICE to HOST)
Data
(HID Desc Addr - MSB)
Ack
Data
HID Desc - MSB
Sr
Nak
P
LEGEND
S – Start; P – Stop; Sr – Repeated Start
R – Read(1); W – Write(0)
Ack – Acknowledgment
Nak – Negative Acknowledgment
Figure 4. Typical Retrieval of the HID Descriptor
Figure 4 shows the typical retrieval of the HID descriptor. This is the most common way the HID descriptor is
retrieved. However, the TCA8424 allows partial retrieval of the descriptor as described in the HID over I2C spec
rev 1.0.
Table 3. Report Descriptor
Report (1) descriptor
(0030h-00F1h)
(1)
8
Register Address
Power up Default
30
5F
31
60
32
61
33
62
34
63
35
64
36
65
37
66
38
67
39
68
3A
69
3B
6A
3C
6B
3D
6C
3E
6D
3F
6E
40
6F
41
70
42
71
43
72
44
73
45
74
46
75
47
76
48
77
Report descriptor contents may vary depending on version of device. Please contact TI for device for
different Report Descriptor contents
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: TCA8424
TCA8424
www.ti.com
SCDS341 – MARCH 2013
Table 3. Report Descriptor (continued)
Report descriptor
(0030h-00F1h)
Register Address
Power up Default
49
78
4A
79
4B
7A
4C
7B
4D
7C
4E
7D
4F
7E
50
7F
51
80
52
81
53
82
54
83
55
84
56
85
57
86
58
87
59
88
5A
89
5B
8A
5C
8B
5D
8C
5E
8D
5F
8E
60
8F
61
90
62
91
63
92
64
93
65
94
66
95
67
96
68
97
69
98
6A
99
6B
9A
6C
9B
6D
9C
6E
9D
6F
9E
70
9F
71
A0
72
A1
73
A2
74
A3
75
A4
76
A5
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: TCA8424
9
TCA8424
SCDS341 – MARCH 2013
www.ti.com
Table 3. Report Descriptor (continued)
Report descriptor
(0030h-00F1h)
10
Register Address
Power up Default
77
A6
78
A7
79
A8
7A
A9
7B
AA
7C
AB
7D
AC
7E
AD
7F
AE
80
AF
81
B0
82
B1
83
B2
84
B3
85
B4
86
B5
87
B6
88
B7
89
B8
8A
B9
8B
BA
8C
BB
8D
BC
8E
BD
8F
BE
90
BF
91
C0
92
C1
93
C2
94
C3
95
C4
96
C5
97
C6
98
C7
99
C8
9A
C9
9B
CA
9C
CB
9D
CC
9E
CD
9F
CE
A0
CF
A1
D0
A2
D1
A3
D2
A4
D3
A5
D4
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: TCA8424
TCA8424
www.ti.com
SCDS341 – MARCH 2013
Table 3. Report Descriptor (continued)
Report descriptor
(0030h-00F1h)
Register Address
Power up Default
A6
D5
A7
D6
A8
D7
A9
D8
AA
D9
AB
DA
AC
DB
AD
DC
AE
DD
AF
DE
B0
DF
B1
E0
B2
E1
B3
E2
B4
E3
B5
E4
B6
E5
B7
E6
B8
E7
B9
E8
BA
E9
BB
EA
BC
EB
BD
EC
BE
ED
BF
EE
C0
EF
C1
F0
C2
F1
C3
F2
C4
F3
C5
F4
C6
F5
C7
F6
C8
F7
C9
F8
CA
F9
CB
FA
CC
FB
CD
FC
CE
FD
CF
FE
D0
FF
D1
0
D2
1
D3
2
D4
3
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: TCA8424
11
TCA8424
SCDS341 – MARCH 2013
www.ti.com
Table 3. Report Descriptor (continued)
Report descriptor
(0030h-00F1h)
Register Address
Power up Default
D5
4
D6
5
D7
6
D8
7
D9
8
DA
9
DB
0A
DC
0B
DD
0C
DE
0D
DF
0E
E0
0F
E1
10
E2
11
E3
12
E4
13
E5
14
E6
15
E7
16
E8
17
E9
18
EA
19
EB
1A
EC
1B
ED
1C
EE
1D
EF
1E
F0
1F
REPORT DESCRIPTOR RETREIVAL
S
Address
W
Ack
Data
(Report Desc Reg - LSB)
Ack
Address
R
Ack
Data
(Report Desc - LSB)
Ack
SDA driven by HOST
(Direction: HOST to DEVICE)
SDA driven by DEVICE
(Direction: DEVICE to HOST)
12
Data
(Report Desc Addr - MSB)
Ack
Data
(Report Desc - MSB)
Sr
Nak
P
LEGEND
S – Start; P – Stop; Sr – Repeated Start
R – Read(1); W – Write(0)
Ack – Acknowledgment
Nak – Negative Acknowledgment
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: TCA8424
TCA8424
www.ti.com
SCDS341 – MARCH 2013
INPUT REPORT
Input reports are used to communicate key presses and releases to the host controller. The TCA8424 is capable
of communicating up to six simultaneous key presses and up to eight modifier keys. The standard modifier keys
recognized by the TCA8424 are (Usage ID based on HID usage tables ver 1.11). The usage ID for each key is
stored in the keyboard map section of NV memory.
• Left Ctrl (Usage ID – E0)
• Left shift (Usage ID – E1)
• Left Alt (Usage ID – E2)
• Left GUI (Usage ID – E3)
• Right Ctrl (Usage ID – E4)
• Right shift ( Usage ID – E5)
• Right Alt (Usage ID – E6)
• Right GUI (Usage ID – E7)
Below is that format of a standard input report. The first two bytes are data length field indicating the length of
input report.
Byte
0
1
2
3
4
5
6
7
8
9
10
Bit 7
0
0
Bit 6
0
0
Bit 5
0
0
RightGUI
RightAlt
RightShift
Bit 4
0
0
Bit 3
1
0
Report ID
RightCtrl
LeftGUI
Reserved
Key1 Usage ID
Key2 Usage ID
Key3 Usage ID
Key4 Usage ID
Key5 Usage ID
Key6 Usage ID
Bit 2
0
0
Bit 1
1
0
Bit 0
1
0
LeftAlt
LeftShift
LeftCtrl
An input report is generated for every key press and also on every key release. If no keys are pressed after a
key release then the report contains all zeroes except for the Data length field (first two bytes) and the Report ID.
Input reports are also generated if only modifier keys are pressed (not accompanied by any other key). The data
length field (first two bytes) for a standard key press is always 11.
SPECIAL MODIFIER (Fn key) AND ALTERNATE REPORT IDs
Other than the standard modifiers, the TCA8424 also supports one special modifier such as the function (FN)
key. This operates different from the other modifier keys in that, it is not represented in the modifier byte of the
input report. The TCA8424 only supports a single key press in combination with the FN key.
When the FN key is pressed the TCA8424 generates a default input report indicating that all keys have been
released. A FN key release will generate an input report with the current Report ID and cleared usage codes.
The TCA8424 only supports a single key press in combination with the FN key. Any key pressed after the FN
key that does not have a non-zero Usage ID will be ignored. Once the FN key is pressed and a key that has an
Usage ID in the alternate keyboard map has been pressed, additional key presses will be ignored until either the
FN key is released or the second key that had an Usage ID in the alternate keyboard map is released.
In addition to standard function keys, many keyboards support special functions such as volume up, volume
down, skip track, previous track etc. Report IDs are used as a way for the host processor to identify whether the
usage ID corresponds to a standard function key or a special function key. The TCA8424 supports Five different
report IDs. Report IDs must be non-zero.
1. Default Report ID – located at address 0202h. This ID is populated in the input report when there is a normal
key press or a regular function key.
2. Report ID 1 – located at address 0203h. This ID is populated in the report when the Usage ID of the key
press detected by the TCA8424 corresponds to a usage ID located in the memory range (0207h-020Eh)
3. Report ID 2 – located at address 0204h. This ID is populated in the report when the Usage ID of the key
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: TCA8424
13
TCA8424
SCDS341 – MARCH 2013
www.ti.com
press detected by the TCA8424 corresponds to a usage ID located in the memory range (020Fh-0216h)
4. Report ID 3 – located at address 0204h. This ID is populated in the report when the Usage ID of the key
press detected by the TCA8424 corresponds to a usage ID located in the memory range (0217h-021Eh)
5. Report ID 4 – located at address 0204h. This ID is populated in the report when the Usage ID of the key
press detected by the TCA8424 corresponds to a usage ID located in the memory range (021Fh-0226h)
As can be inferred from the above description, whenever a key press is detected, the TCA8424 looks up the
usage ID from the alternate keyboard map and then compares this usage ID with the usage IDs corresponding to
Report ID 1, Report ID 2, Report ID 3, and Report ID 4. If there is a match, then corresponding report ID is
populated in the special input report. If not the default input report is used with the default Report ID. (1)
Below is the format of the special input report. The format is similar to the bit field representation used to
represent the modifier byte in the standard input report. Usage ID byte location 0 will correspond to the first
Usage ID in memory for the respective Report ID (2) and descend with Usage ID byte location 7 corresponding to
the last Usage ID in memory.(2)
Table 4. Special Input Report
Byte
0
Bit 7
0
Bit 6
0
Bit 5
0
Bit 4
0
1
2
0
0
0
0
Usage ID
byte location
7
Usage ID
byte location
6
Usage ID
byte location
5
3
(1)
(2)
Bit 3
0
0
Report ID
Usage ID
Usage ID
byte location byte location
4
3
Bit 2
1
Bit 1
0
Bit 0
0
0
0
0
Usage ID
Usage ID
byte location2 byte location1
Usage ID
byte location
0
The last 5 key Usage IDs in the input report and the modifier byte will always read 00h when the function key is pressed in addition to
another key.
For Report ID1: Usage ID byte location 0 corresponds to memory location 0207h. Usage ID byte location 7 corresponds to memory
location 020Eh.
S
Address
R
Data
(Report Field - LSB)
SDA driven by HOST
(Direction: HOST to DEVICE)
SDA driven by DEVICE
(Direction: DEVICE to HOST)
Ack
Ack
Data
(Length Field - LSB)
Ack
Data
(Report Field - MSB)
Data
(Length Field - MSB)
Nak
Ack
P
LEGEND
S – Start; P – Stop; Sr – Repeated Start
R – Read(1); W – Write(0)
Ack – Acknowledgment
Nak – Negative Acknowledgment
Figure 5. Input Report Retrieval
It is important to note that, unlike retrieval of other reports, where the first I2C transaction is a write, in the case of
input report the first transaction itself is a read operation as indicated by Bit 8 of the I2C address.
14
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: TCA8424
TCA8424
www.ti.com
SCDS341 – MARCH 2013
OUTPUT REPORT
Output reports are used by the host to turn ON/OFF any indicator LEDs ( caps lock, num lock etc.) on the
keyboard. The TCA8424 can support from 2 to 4 LED indicators depending on the version of the device chosen.
The output reports are single byte reports (8-bit) where each bit indicates the status of the corresponding LED. A
‘1’ indicates that the LED is turned on where as a ‘0’ turns off the LED. Below is the format of the output report
received from the host. Just as in the case of the input report the first two bytes indicate the length of the output
report.
Byte
0
1
2
S
Bit 7
0
0
Reserved
Bit 6
0
0
Reserved
Bit 5
0
0
Reserved
W
Ack
Data
(Output Register - LSB)
Data
(Length Field - LSB)
Ack
Data
(Length Field - MSB)
Address
SDA driven by HOST
(Direction: HOST to DEVICE)
SDA driven by DEVICE
(Direction: DEVICE to HOST)
Bit 4
0
0
Reserved
Bit 3
0
0
LED3
Data
Ack (Output Register - MSB)
Ack
Data
(Report Field - LSB)
Bit 2
0
0
LED2
Bit 1
1
0
LED1
Bit 0
1
0
LED0
Ack
Ack
Data
(Report Field - MSB)
Ack
P
LEGEND
S – Start; P – Stop; Sr – Repeated Start
R – Read(1); W – Write(0)
Ack – Acknowledgment
Nak – Negative Acknowledgment
Figure 6. Output Report Retrieval
COMMAND and DATA REGISTER
The HID over I2C spec requires that all devices respond to certain commands. The commands are issued to the
command register. The command is an opcode as defined by the HID over I2C spec. The operand for the
command goes to the data register. Below is a list of commands supported by the TCA8424.
Op Code
Command Name
Effect on Device
0001b
RESET
Device is reset and all registers are returned to default value. This command has the same effect on the
device as a power on reset.
0010b
GET_REPORT
Most recent input report is transferred to Data Register
0011b
SET_REPORT
Data register contents are used to turn on/off LED.
1000b
SET_POWER
All LEDs are turned off and device is in lowest current mode (will still detect key presses)
The I2C transactions used to issue these commands are exactly as described in the HID over I2C standard.
RESET
After receiving the RESET command, the device will go through a full power on reset and all registers are loaded
with their default values. The TCA8424 takes ~600µs to reset and during this time all I2C traffic will be ignored by
the device. After coming out of reset, the data length field in the input report is populated with 0000h and the INT
signal is asserted.
GET_REPORT
The GET_REPORT command will retrieve the current input report from the device but will not clear the interrupt
asserted from a key press or release.
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: TCA8424
15
TCA8424
SCDS341 – MARCH 2013
www.ti.com
SET_REPORT
The SET_REPORT command is used to set the contents of the output report. The Data shall be packaged with
the length field as 0x0003, and the third byte shall describe the LED outputs as defined in the report descriptor.
SET_POWER
The SET_POWER=SLEEP command will turn off all the LED outputs and clear the input report including report
ID and length field. If a key is pressed when SET_POWER=SLEEP command is received, keyscan will stop
when the command is received. TCA8424 will wait for all keys to be released before any subsequent key press
will assert an interrupt. If a key is pressed and not released while device is asleep and the SET_POWER=WAKE
command is received, the key scanner will start and assert an interrupt that a key has been pressed. The
SET_POWER=WAKE command is received the LED outputs will be returned to the state they were before the
SET_POWER=SLEEP was received. If a command to change the output report is received during sleep, the
LED status will indicate that of the last output report received upon SET_POWER=WAKE.
If keys are pressed while the device is entering sleep mode, a read of the input report or use of the
GET_REPORT command before all keys are released, may not reflect the current state of the keyboard. Any key
presses that happen after all keys are released will populate the input report and assert INT.
KEYBOARD MAP
The Non volatile memory contains a section that contains the keyboard map. Each byte location in the keyboard
map, is mapped to a specific row column intersection on the key matrix, and contains the usage ID of the key
located in that row column intersection. The keyboard map consists of two sections. Each row column
intersection is mapped to one location in each section. The primary section contains the usage ID of the key and
the alternate section contains the alternate usage ID of the key that will be reported when the special modifier
(FN) is used. Only keys with non-zero usage codes will be recognized, including the function key.
The device is available with some pre defined keyboard maps. It is also available with the keyboard map not
programmed so that the end user may program the keyboard map based on the keyboard being used.
Alternately you may contact TI for custom variations of the part with different keyboard maps programmed by
special request.
The table below illustrates the column-row intersections and the memory locations they are mapped to.
KEYBOARD MAP (PRIMARY)
KEYBOARD MAP (SECONDARY)
C0
C1
C2
C3
C4
C5
C6
C7
C0
C1
C2
C3
C4
C5
C6
C7
R0
A1
B1
C1
D1
E1
F1
81
91
R1
A2
B2
C2
D2
E2
F2
82
92
R0
A1
B1
C1
D1
E1
F1
81
91
R1
A2
B2
C2
D2
E2
F2
82
R2
A3
B3
C3
D3
E3
F3
83
92
93
R2
A3
B3
C3
D3
E3
F3
83
93
R3
A4
B4
C4
D4
E4
F4
R4
A5
B5
C5
D5
E5
F5
84
94
R3
A4
B4
C4
D4
E4
F4
84
94
85
95
R4
A5
B5
C5
D5
E5
F5
85
R5
A6
B6
C6
D6
E6
95
F6
86
96
R5
A6
B6
C6
D6
E6
F6
86
96
R6
A7
B7
C7
D7
R7
A8
B8
C8
D8
E7
F7
87
97
R6
A7
B7
C7
D7
E7
F7
87
97
E8
F8
88
98
R7
A8
B8
C8
D8
E8
F8
88
R8
A9
B9
C9
98
D9
E9
F9
89
99
R8
A9
B9
C9
D9
E9
F9
89
R9
AA
BA
CA
99
DA
EA
FA
8A
9A
R9
AA
BA
CA
DA
EA
FA
8A
9A
R10
AB
BB
CB
DB
EB
FB
8B
9B
R10
AB
BB
CB
DB
EB
FB
8B
9B
R11
AC
BC
CC
DC
EC
FC
8C
9C
R11
AC
BC
CC
DC
EC
FC
8C
9C
R12
AD
BD
CD
DD
ED
FD
8D
9D
R12
AD
BD
CD
DD
ED
FD
8D
9D
R13
AE
BE
CE
DE
EE
FE
8E
9E
R13
AE
BE
CE
DE
EE
FE
8E
9E
R14
AF
BF
CF
DF
EF
FF
8F
9F
R14
AF
BF
CF
DF
EF
FF
8F
9F
R15
B0
C0
D0
E0
F0
80
90
A0
R15
B0
C0
D0
E0
F0
80
90
A0
16
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: TCA8424
TCA8424
www.ti.com
SCDS341 – MARCH 2013
KEYSCAN LOGIC
Functional Overview
Upon power up or when coming out of RESET, the devices initializes itself with all the registers having the power
up default value. All the COLx pins are pulled up to VCC by internal pull up resistors. All the ROWx pins are
pulled low. The device is now in idle/standby mode ( lowest power state). When any key is pressed, one of the
COL pins gets connected to one of the ROW pins, thereby pulling down the corresponding COL pin. This initiates
the keyscan.
When this occurs the internal oscillator turns on, and each ROWx pin goes low, one after the other, for
approximately 800uS while the COLx inputs are sampled at each step. Then, for every key that is pressed, the
corresponding usage ID from the keyboard map is registered. After approximately 25mS, the scan will repeat. If
any previously pressed key is still pressed, then the corresponding code is written to the Input register. The scan
continues to repeat as long as there are keys pressed. Now, when a previously pressed key is released another
input report is generated with the keys that are still pressed, or if no keys are pressed, then an input report with
all zero Usage codes is reported.
Once the input report has been populated into the input register, the INT is asserted to indicate to the host that
an input report is now available.
Interrupt (INT) Output
An interrupt is generated when the device has an input report ready for the HOST to read. Resetting the interrupt
is achieved by reading the INPUT Register. Using the GET_REPORT command will not clear the interrupt. The
interrupt will clear after the 2nd read byte of the empty input report on reset. After reset, a default input report
read will clear the input report after the last byte is read. If a special input report is read, the interrupt clears after
the 4th byte is read.
The interrupt status is updated in the read mode at the acknowledge (ACK) or not acknowledge (NACK) bit
following the rising edge of the SCL signal after the last byte of the input report has been read. The INPUT
register will keep getting updated with the most recent key press reports even while the INT signal stays
asserted. In order avoid missing of key presses it is recommended that host processor respond to interrupt
service request in <50ms (debounce time)
The INT output has an open-drain structure and requires a pull-up resistor to VCC. When the device comes out of
power on reset, the /INT signal is asserted to indicate to the host that the device has come out of reset (as
required by the HID over I2C). The value in the data length field of the input report is set to 0000h when the
device comes out of POR (as required by the HID over I2C).
Power-On Reset
When power (from 0V) is applied to VCCP, an internal power-on reset holds the TCA8424 in a reset condition until
VCCP has reached VPOR. At that time, the reset condition is released, and the TCA8424 registers and I2C state
machine initialize to their default states. After that, VCCP must be lowered to below VPORF and back up to the
operating voltage for a power-reset cycle.
• During power up, if VCCI ramps before VCCP, a power on reset event occurs and the I2C registers are reset.
• If VCCP ramps up before VCCI, then the device with reset as if RESET = 0
• The device is reset regardless of which VCCx ramps first.
Power-On Reset Requirements
In the event of a glitch or data corruption, TCA8424 can be reset to its default conditions by using the power-on
reset feature. Power-on reset requires that the device go through a power cycle to be completely reset. This
reset also happens when the device is powered on for the first time in an application.
The two types of power-on reset are shown in Figure 7 and Figure 8.
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: TCA8424
17
TCA8424
SCDS341 – MARCH 2013
www.ti.com
VCC
Ramp-Up
Ramp-Down
Re-Ramp-Up
tTRR_GND
Time
tRT
tFT
tRT
Figure 7. VCC is Lowered Below 0.2 V or 0 V and Then Ramped Up to VCC
VCC
Ramp-Down
Ramp-Up
tTRR_VPOR50
VIN drops below POR levels
tFT
Time to Re-Ramp
Time
tRT
Figure 8. VCC is Lowered Below the POR Threshold, Then Ramped Back Up to VCC
Glitches in the power supply can also affect the power-on reset performance of this device. The glitch width (tGW)
and height (tGH) are dependent on each other. The bypass capacitance, source impedance, and device
impedance are factors that affect power-on reset performance. Figure 9 provides more information on how to
measure these specifications.
VCC
tGH
Time
tGW
Figure 9. Glitch Width and Glitch Height
VPOR is critical to the power-on reset. VPOR is the voltage level at which the reset condition is released and all the
registers and the I2C/SMBus state machine are initialized to their default states. The value of VPOR differs based
on the VCC being lowered to or from 0. Figure 10 provides more details on this specification.
VCC
VPOR
VPORF
Time
POR
Time
Figure 10. VPOR
18
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: TCA8424
TCA8424
www.ti.com
SCDS341 – MARCH 2013
The table below specifies the performance of the power-on reset feature for TCA8424 for both types of power-on
reset.
RECOMMENDED SUPPLY SEQUENCING AND RAMP RATES AT TA = 25°C (1)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
MAX
UNIT
1
100
ms
Rise rate
0.1
100
ms
tRR_GND
Time to re-ramp (when VCC drops to GND)
40
μs
tRR_POR50
Time to re-ramp (when VCC drops to VPOR_MIN – 50 mV)
40
μs
VCC_GH
Level that VCCP can glitch down to, but not cause a functional disruption when
VCCX_GW = 1 μs
tGW
Glitch width that will not cause a functional disruption when VCCX_GH = 0.5 × VCCx
VPORF
Voltage trip point of POR on falling VCC
0.86
VPORR
Voltage trip point of POR on rising VCC
1.1
1.34
V
tFT
Fall rate
tRT
(1)
MIN
TYP
1.2
V
10
μs
1.22
V
Not tested. Specified by design
ABSOLUTE MAXIMUM RATINGS (1) (2)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCCI
Supply voltage range
–0.3
4
V
VI
Input voltage range
–0.3
4
V
VILED
Input voltage range LED outputs
–0.3
5.5
V
VITEST
Input voltage range test pin
7.7
V
IIK
Input clamp current
SCL
VI < 0
±10
mA
IOK
Output clamp current
INT
VO < 0
±10
mA
IIOK
Input/output clamp current
SDA
VO < 0 or VO > VCC
±10
mA
SDA
VO = 0
±30
mA
IOL
Continuous output low
current
INT
VO = 0
±10
mA
LEDx
VO = 0
±20
mA
150
°C
Tstg
(1)
(2)
Storage temperature range
–65
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: TCA8424
19
TCA8424
SCDS341 – MARCH 2013
www.ti.com
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
VCCI
Supply voltage
Vtest
Voltage on test pin
VILED
Voltage on LED output
VIH
High-level input voltage
SCL, SDA
VIL
Low-level input voltage
SCL, SDA
MAX
UNIT
1.65
3.6
V
GND
GND
V
5
V
0.7 × VCCI
3.6
V
–0.3
0.3 × VCCI
During normal operation ( in application)
V
SDA
20
mA
INT
3
mA
12
mA
85
°C
IOL
Low-level output
current
TA
Operating free-air temperature
LEDx
–40
ELECTRICAL CHARACTERISTICS
All values are specified at 25°C operating temperature (unless otherwise noted)
PARAMETER
VIK
TEST CONDITIONS
Input diode clamp voltage
II = –18 mA
ROWx, INT
IOL = 3 mA
VOL
SDA
IOL = 20 mA
VCC
MIN
1.65 V to 3.6 V
–1.2
TYP
0.4
1.8 V
0.4
2.5 V
0.4
3.3 V
0.4
3.6 V
0.4
1.65 V
0.4
1.8 V
0.4
2.5 V
0.4
3.3 V
0.4
3.6 V
0.4
1.8 V
0.4
0.4
LEDx
IOL = 12 mA
3.3 V
IOL
LEDx
VOL = 0.4 V
1.65 V – 5.5 V
R int
Internal pull up resistance
5V
Icc4khz1
Icc1Mhz1
Fscl = 0 kHz, oscillator off
Current consumption
Fscl = 400 kHz, oscillator on
Current consumption
Fscl = 1 MHz, oscillator on
ΔIcc
Incremental current for duration of key press
Cin
SCL, SDA
20
One key pressed
Submit Documentation Feedback
V
V
V
0.4
12
80
Current consumption
UNIT
V
1.65 V
VOL
Iccsh0
MAX
mA
100
120
kΩ
1.65 V
0.25
8
1.8 V
0.27
8
2.5 V
0.4
12
3.3 V
0.54
16
3.6 V
0.6
20
1.65 V
17
18
1.8 V
18
20
2.5 V
25
30
3.3 V
33
40
3.6 V
39
50
1.65 V
36
40
1.8 V
39
50
2.5 V
48
60
3.3 V
65
70
3.6 V
60
80
1.65 V – 3.6 V
39
45
µA
5
10
pF
µA
µA
µA
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: TCA8424
TCA8424
www.ti.com
SCDS341 – MARCH 2013
I2C INTERFACE TIMING REQUIREMENTS
over operating free-air temperature range (unless otherwise noted)
STANDARD
MODE
I2C BUS
PARAMETER
2
MIN
MAX
100
FAST MODE
PLUS (FM+)
I2C BUS
FAST MODE
I2C BUS
MIN
MAX
0
400
UNIT
MIN
MAX
0
1000
fscl
I C clock frequency
0
tsch
I2C clock high time
4
0.6
0.26
μs
tscl
I2C clock low time
4.7
1.3
0.5
μs
2
tsp
I C spike time
tsds
I2C serial data setup time
50
tsdh
I2C serial data hold time
ticr
I2C input rise time
1000
20
300
ticf
I2C input fall time
300
20 x (VDD/
5.5 V)
300
tocf
I2C output fall time; 10 pF to 400 pF bus
300
20 x (VDD/
5.5 V)
300
tbuf
I2C bus free time between Stop and Start
2
50
kHz
50
250
100
50
0
0
0
ns
ns
ns
120
ns
20 x (VDD/
5.5 V)
120
ns
20 x (VDD/
5.5 V)
120
μs
4.7
1.3
0.5
μs
tsts
I C Start or repeater Start condition setup time
4.7
0.6
0.26
μs
tsth
I2C Start or repeater Start condition hold time
4
0.6
0.26
μs
tsps
I2C Stop condition setup time
4
0.6
0.26
μs
tvd(data) Valid data time; SCL low to SDA output valid
tvd(ack)
Valid data time of ACK condition; ACK signal from SCL
low to SDA (out) low
3.45
0.3
0.9
0.45
μs
3.45
0.3
0.9
0.45
μs
SWITCHING CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
FROM (INPUT)
TO (OUTPUT)
MAX
UNIT
tir
Interrupt reset delay time
PARAMETER
SCL
INT
MIN
600
ns
tpv
Output data valid
SCL
LEDx
155
ns
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: TCA8424
21
TCA8424
SCDS341 – MARCH 2013
www.ti.com
PARAMETER MEASUREMENT INFORMATION
VCCI
RL = 1kΩ
DUT
SDA
CL = 50 pF
(see note A)
SDA LOAD CONFIGURATION
Two Bytes for READ Input Report
(see Figure 5)
Stop
Start
Condition Condition
(P)
(S)
Address
Bit 7
(MSB)
tscl
R/W
Bit 0
(LSB)
Address
Bit 1
Data
Bit 7
(MSB)
ACK
(A)
Data
Bit 0
(LSB)
Stop
Condition
(p)
tsch
0.7 x VCCI
SCL
ticr
tbuf
ticf
0.3 x VCCI
tvd
tvd
tsp
tsts
tsps
tocf
SDA
ticf
ticr
tsth
tsds
tsdh
0.7 x VCCI
tvd(ack)
Repeat Start
Condition
VOLTAGE WAVEFORMS
A.
0.3 x VCCI
Stop
Condition
CL includes probe and jig capacitance. tocf is measured with CL of 10 pF or 400 pF. All inputs are supplied by
generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr/tf ≤ 30 ns. All parameters and
waveforms are not applicable to all devices.
Figure 11. I2C Interface Load Circuit and Voltage Waveforms
VCCI
RL = 2.2kΩ
DUT
INT
CL = 25 pF
(see note A)
INTERRUPT LOAD CONFIGURATION
A.
CL includes probe and jig capacitance. All inputs are supplied by generators having the following characteristics: PRR
≤ 10 MHz, ZO = 50 Ω, tr/tf ≤ 30 ns. All parameters and waveforms are not applicable to all devices.
Figure 12. Interrupt Load Circuit and Voltage Waveforms
22
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: TCA8424
TCA8424
www.ti.com
SCDS341 – MARCH 2013
PARAMETER MEASUREMENT INFORMATION (continued)
0.5 Vcci
Colx
tIV
0.5 Vcci
INT
tIR
SCL
0.5 Vcci
tPV
0.5 Vcci
Ledx
VCC
RL = 420Ω
DUT
LED
Figure 13. LED Load Configuration
Row15
DUT
Col7
Figure 14. Row Pull-down Load Configuration
CL includes probe and jig capacitance. tpv is measured from 0.7 × VCC on SCL to 50% I/O (Pn) output. All inputs
are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr/tf ≤ 30 ns. The
outputs are measured one at a time, with one transition per measurement. All parameters and waveforms are not
applicable to all devices.
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: TCA8424
23
PACKAGE OPTION ADDENDUM
www.ti.com
20-May-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
TCA8424RHAR
ACTIVE
Package Type Package Pins Package
Drawing
Qty
VQFN
RHA
40
2500
Eco Plan
Lead/Ball Finish
(2)
Green (RoHS
& no Sb/Br)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
CU NIPDAU
Level-3-260C-168 HR
(4/5)
-40 to 85
PZ
424
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
31-May-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TCA8424RHAR
Package Package Pins
Type Drawing
VQFN
RHA
40
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
16.4
Pack Materials-Page 1
6.3
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
6.3
1.5
12.0
16.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
31-May-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TCA8424RHAR
VQFN
RHA
40
2500
367.0
367.0
38.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated