TI TPS76201-Q1

TPS76201-Q1
www.ti.com
SLVSAO7 – DECEMBER 2010
Low Output, Adjustable, Ultralow-Power, 100-mA Low-Dropout
Linear Regulator
Check for Samples: TPS76201-Q1
FEATURES
DESCRIPTION
•
•
•
•
•
•
•
The TPS76201-Q1 low-dropout (LDO) voltage
regulator features an adjustable output voltage as low
as 0.7 V. It is an ideal regulator for sub 1.2-V DSP
core voltage supplies and is equally suited for similar
applications with other low-voltage processors and
controllers. SOT-23 packaging and the high-efficiency
that results from the ultralow power regulator
operation make the TPS76201-Q1 especially useful
in handheld and portable battery applications. This
regulator features low dropout voltages and ultralow
quiescent current compared to conventional LDO
regulators. Offered in a five-terminal, small outline
integrated
circuit
(SOT-23)
package,
the
TPS76201-Q1 is ideal for micropower operations and
where board space is at a premium.
1
2
•
Qualified for Automotive Applications
100-mA Low-Dropout Regulator
Adjustable Output Voltage: 0.7 V to 5.5 V
Only 27-mA Quiescent Current at 100 mA
1-mA Quiescent Current in Standby Mode
Overcurrent Limitation
–40°C to +125°C Operating Ambient
Temperature Range
Available in 5-Pin SOT-23 (DBV) Package
DBV PACKAGE (TOP VIEW)
IN
1
GND
2
EN
3
5
OUT
4
A combination of new circuit design and process
innovation has enabled the usual PNP pass transistor
to be replaced by a PMOS pass element. Because
the PMOS pass element is a voltage-driven device,
the quiescent current is ultralow (30 mA maximum)
and is stable over the entire range of output load
current (10 mA to 100 mA). Intended for use in
portable systems such as laptops and cellular
phones, the ultralow-power operation results in a
significant increase in the system battery operating
life.
FB
GROUND CURRENT vs
JUNCTION TEMPERATURE
27
VIN = 2.7 V
VOUT = 0.7 V
25
Ground Current (mA)
IO = 100 mA
The TPS76201-Q1 also features a logic-enabled
sleep mode to shut down the regulator, reducing
quiescent current to 1 mA typical at TJ = +25°C. The
TPS76201-Q1 is offered in an adjustable version
(programmable over the range of 0.7 V to 5.5 V).
23
IO = 10 mA
21
19
17
15
-40 -25 -10
5
20
35
50
65
80
95
110 125
Junction Temperature (°C)
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010, Texas Instruments Incorporated
TPS76201-Q1
SLVSAO7 – DECEMBER 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION (1)
(1)
(2)
VOLTAGE (2)
TA
PACKAGE
PART NUMBER
PACKAGE
MARKING
Variable
0.7 V to 5.5 V
−40°C to +125°C
SOT-23 (DBV)
TPS76201QDBVRQ1
PUEQ
TRANSPORT
MEDIA,
QUANTITY
Tape and reel, 3000
For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
Contact the factory for availability of fixed output options.
ABSOLUTE MAXIMUM RATINGS (1)
Over operating free-air temperature range (unless otherwise noted).
PARAMETER
TPS76201-Q1
UNIT
Input voltage range, VIN (2)
–0.3 to +13.5
V
Voltage range at EN
–0.3 to VIN +0.3
V
Voltage on OUT, FB
7
V
Peak output current, IOUT
Internally limited
Operating ambient temperature range, TA
–40 to +150
°C
Storage temperature range, TSTG
–65 to +150
°C
(1)
(2)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied..
All voltage values are with respect to network ground terminal.
THERMAL INFORMATION
TPS76201-Q1
THERMAL METRIC (1)
DBV
UNITS
5 PINS
qJA
Junction-to-ambient thermal resistance
183.6
qJC(top)
Junction-to-case(top) thermal resistance
69.9
qJB
Junction-to-board thermal resistance
41.6
yJT
Junction-to-top characterization parameter
2.4
yJB
Junction-to-board characterization parameter
40.9
qJC(bottom)
Junction-to-case(bottom) thermal resistance
—
(1)
2
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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SLVSAO7 – DECEMBER 2010
RECOMMENDED OPERATING CONDITIONS
Over operating free-air temperature range (unless otherwise noted).
MIN
Input voltage range, VIN (1)
Output voltage range, VOUT
NOM
MAX
2.7
(2)
UNIT
10
V
0.7
5.5
V
Continuous output current, IOUT (2)
0.01
100
mA
Operating ambient temperature range, TA (2)
–40
+125
°C
(1)
(2)
To calculate the minimum input voltage for the desired maximum output current, use the following formula: VINmin = VOUTmax + VDO (max
load)
Continuous output current and operating junction temperature are limited by internal protection circuitry, but it is not recommended that
the device operate under conditions beyond those specified in this table for extended periods of time.
ELECTRICAL CHARACTERISTICS
Over recommended operating free-air temperature range; VIN = VOUT(Typ) + 1 V; IOUT = 100 mA, EN = 0 V, and COUT = 4.7 mF,
unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
0.7 V ≤ VOUT ≤ 5.5 V, TJ = +25°C
VOUT
IQ
10-mA to 100-mA load (1)
GND current
(1) (2)
Load regulation
BW = 300 Hz to 50 kHz, COUT = 10 mF,
VOUT = 0.7 V, TJ = +25°C
ICL
Output current limit
VOUT = 0 V, see (1)
2.7 V < VIN ≤ 10 V
Power-supply rejection ratio
f = 1 kHz, COUT = 10 mF,
TJ = +25°C, see (1)
IEN
Enable pin current
mA
12
mV
0.04
%/V
60
350
%/V
mVRMS
750
1
TJ = −40°C to +125°C
Low-level enable input voltage
mA
0.1
EN = VIN, 2.7 V < VIN ≤ 10 V
VEN(LO)
PSRR
(2)
(1)
2.7 V < VIN ≤ 10 V, TJ = −40°C to +125°C,
see (1)
2.7 V < VIN ≤ 10 V
V
35
EN = 0 V, 10 mA < IOUT < 100 mA,
TJ = +25°C
High-level enable input voltage
V
1.03 ×
VOUT
EN = 0 V, 10 mA < IOUT < 100 mA,
TJ = −40°C to +125°C
VEN(HI)
UNIT
27
Output noise voltage
Standby current
0.97 ×
VOUT
EN = 0 V, 10 mA < IOUT < 100 mA,
TJ = +25°C
VN
ISTBY
(1)
Line regulation, output voltage (2)
MAX
VOUT
0.7 V ≤ VOUT ≤ 5.5 V, TJ = −40°C to +125°C
2.7 V < VIN ≤ 10 V, TJ = +25°C, see
ΔVO/VOUT
TYP
mA
2
1.7
60
–1
EN = VIN
–1
mA
V
0.8
EN = 0 V
mA
0
V
dB
1
mA
1
mA
Minimum IN operating voltage is 2.7 V or VOUT(typ) + 1 V, whichever is greater. Maximum IN voltage = 10 V, minimum output current =
10 mA, and maximum output current = 100 mA.
x
VOUT(VImax - 2.7 V)
× 1000
100
VOUT[VImax - (VOUT + 1 V)]
Line Reg. (mV) = (%/V) ×
× 1000
100
If VOUT ≥ 2.5 V, then VINmin = VOUT + 1 V, VINmax = 10 V:
x (mV) = (%/V) ×
If VOUT ≤ 1.8 V, then VINmin = 2.7 V, VINmax = 10 V: Line Reg.
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SLVSAO7 – DECEMBER 2010
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FUNCTIONAL BLOCK DIAGRAM
IN
OUT
EN
Current Limit/
Thermal
Protection
VREF
FB
GND
Figure 1. TPS76201-Q1
PIN CONFIGURATION
DBV PACKAGE
SOT-23
(TOP VIEW)
IN
1
GND
2
EN
3
5
OUT
4
FB
PIN DESCRIPTIONS
4
NAME
SOT-23
DBV
I/O
IN
1
I
GND
2
—
DESCRIPTION
Input supply voltage
Ground pin
EN
3
I
Enable input
OUT
4
I
Regulated output voltage
FB
5
O
Feedback voltage
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SLVSAO7 – DECEMBER 2010
TYPICAL CHARACTERISTICS
At TJ = –40°C to +125°C, VIN = VOUT(TYP) + 0.5 V or 2.0 V, whichever is greater; IOUT = 10 mA, VEN = VIN, COUT = 1.0 mF,
unless otherwise noted. Typical values are at TJ = +25°C.
OUTPUT VOLTAGE vs
OUTPUT CURRENT
OUTPUT VOLTAGE vs
OUTPUT CURRENT
0.720
2.520
VIN = 3.5 V
VOUT = 2.5 V
COUT = 4.7 mF
TJ = +25°C
2.515
VIN = 2.7 V
VOUT = 0.7 V
COUT = 4.7 mF
TJ = +25°C
0.715
2.510
Output Voltage (V)
Output Voltage (V)
0.710
2.505
2.500
2.495
0.705
0.700
0.695
2.490
0.690
2.485
2.480
0.685
0
20
40
60
80
100
0
20
40
Output Current (mA)
80
Figure 2.
Figure 3.
OUTPUT VOLTAGE vs
JUNCTION TEMPERATURE
GROUND CURRENT vs
JUNCTION TEMPERATURE
100
27
0.6680
0.6675
60
Output Current (mA)
VIN = 2.7 V
VOUT = 0.7 V
COUT = 4.7 mF
VIN = 2.7 V
VOUT = 0.7 V
IO = 1 mA
25
IO = 100 mA
0.6665
Ground Current (mA)
Output Voltage (V)
0.6670
IO = 100 mA
0.6860
23
IO = 10 mA
21
19
0.6855
17
0.6850
15
0.6845
-40 -25 -10
5
20
35
50
65
80
95
110 125
-40 -25 -10
5
20
35
50
65
80
95
110 125
Junction Temperature (°C)
Junction Temperature (°C)
Figure 4.
Figure 5.
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TYPICAL CHARACTERISTICS (continued)
At TJ = –40°C to +125°C, VIN = VOUT(TYP) + 0.5 V or 2.0 V, whichever is greater; IOUT = 10 mA, VEN = VIN, COUT = 1.0 mF,
unless otherwise noted. Typical values are at TJ = +25°C.
OUTPUT SPECTRAL NOISE DENSITY vs FREQUENCY
OUTPUT IMPEDANCE vs FREQUENCY
3.5
27
VIN = 2.7 V
VOUT = 0.7 V
VIN = 2.7 V
VOUT = 0.7 V
COUT = 4.7 mF
RESR ≈ 0.3 W
3.0
25
2.5
IO = 100 mA
Output Impedance (W)
Ground Current (mA)
2.0
23
IO = 10 mA
21
19
1.5
1.0
0.5
IO = 1 mA
0
IO = 100 mA
-0.5
17
-1.0
-1.5
15
-40 -25 -10
5
20
35
50
65
80
95
10
110 125
100
1k
10 k
100 k
Figure 6.
Figure 7.
DROPOUT VOLTAGE vs
INPUT VOLTAGE
DROPOUT VOLTAGE vs
JUNCTION TEMPERATURE
180
180
IO = 100 mA
IO = 100 mA
160
160
TJ = +125°C
TJ = +125°C
140
Dropout Voltage (mV)
Dropout Voltage (mV)
140
120
TJ = +25°C
100
80
60
120
TJ = +25°C
100
80
60
TJ = -40°C
TJ = -40°C
40
40
20
20
2
4
6
8
10
2
Output Voltage (V)
4
6
8
10
Output Voltage (V)
Figure 8.
6
1M
Frequency (Hz)
Junction Temperature (°C)
Figure 9.
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SLVSAO7 – DECEMBER 2010
TYPICAL CHARACTERISTICS (continued)
At TJ = –40°C to +125°C, VIN = VOUT(TYP) + 0.5 V or 2.0 V, whichever is greater; IOUT = 10 mA, VEN = VIN, COUT = 1.0 mF,
unless otherwise noted. Typical values are at TJ = +25°C.
OUTPUT VOLTAGE AND ENABLE VOLTAGE
vs TIME (START-UP)
POWER-SUPPLY RIPPLE REJECTION vs FREQUENCY
90
Enable Voltage (V)
VIN = 2.7 V
VOUT = 0.7 V
COUT = 4.7 mF
80
60
50
IO = 1 mA
40
Output Voltage (V)
Power-Supply Rejection Ratio (dB)
70
30
20
IO = 100 mA
10
VIN = 2.7 V
VOUT = 0.7 V
COUT = 4.7 mF
IOUT = 100 mA
TJ = +25°C
5
0
1
0.5
0
0
-10
100
1k
10 k
100 k
1M
0
10 M
20
40
60
80
100
120
140
160
Frequency (Hz)
Startup Time (ms)
Figure 10.
Figure 11.
LINE TRANSIENT RESPONSE
LOAD TRANSIENT RESPONSE
Current Load (mA)
Input Voltage (V)
10
3.7
2.7
180
200
100
0
Change in
Output Voltage, DVOUT (mV)
Output Voltage (mV)
10
0
-10
IOUT = 10 mA
VOUT = 0.7 V
COUT = 4.7 mF
0
50
100
150
200
250
300
350
400
450
500
0
-100
VIN = 2.7 V
VOUT = 0.7 V
COUT = 10 mF
-200
0
Time (ms)
50
100
150
200
250
300
350
400
450
500
Time (ms)
Figure 12.
Figure 13.
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TYPICAL CHARACTERISTICS (continued)
At TJ = –40°C to +125°C, VIN = VOUT(TYP) + 0.5 V or 2.0 V, whichever is greater; IOUT = 10 mA, VEN = VIN, COUT = 1.0 mF,
unless otherwise noted. Typical values are at TJ = +25°C.
Current Load (mA)
LOAD TRANSIENT RESPONSE
100
0
Change in
Output Voltage, DVOUT (mV)
Change in
Output Voltage, DVOUT (mV)
Current Load (mA)
LINE TRANSIENT RESPONSE
0
-100
VIN = 2.7 V
VOUT = 0.7 V
COUT = 10 mF
-200
0
50
100
150
200
250
300
350
400
450
100
0
100
0
-100
VIN = 3.5 V
VOUT = 2.5 V
COUT = 10 mF
500
0
20
40
60
80
Time (ms)
100
120
180
Figure 15.
TYPICAL REGIONS OF STABILITY
EQUIVALENT SERIES RESISTANCE (ESR)
vs OUTPUT CURRENT
TYPICAL REGIONS OF STABILITY
EQUIVALENT SERIES RESISTANCE (ESR)
vs OUTPUT CURRENT
200
100
COUT = 10 mF
Equivalent Series Resistance (W)
COUT = 4.7 mF
Equivalent Series Resistance (W)
160
Figure 14.
100
10
Region of Instability
1
10
Region of Instability
1
Region of Instability
Region of Instability
0.1
0.1
0
0.02
0.04
0.06
0.08
0.1
0
Output Current (A)
0.02
0.04
0.06
0.08
0.1
Output Current (A)
Figure 16.
8
140
Time (ms)
Figure 17.
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SLVSAO7 – DECEMBER 2010
APPLICATION INFORMATION
The TPS76201-Q1 low-dropout (LDO) regulator has been optimized for use in battery-operated equipment
including, but not limited to, the sub 1.2-V DSP core voltage supplies. It features low quiescent current (23 mA
nominally) and enable inputs to reduce supply currents to 1 mA when the regulators are turned off. A typical
application circuit is shown in Figure 18.
TPS76201-Q1
1
VIN
IN
5
VOUT
OUT
C1
1 mF
3
EN
4
+
FB
4.7 mF
GND
ESR = 0.5 W
2
Figure 18. Typical Application Circuit
External Capacitor Requirements
Although not required, a 0.047-mF or larger ceramic input bypass capacitor, connected between IN and GND and
located close to the TPS76201-Q1, is recommended to improve transient response and noise rejection. A
higher-value electrolytic input capacitor may be necessary if large, fast-rise-time load transients are anticipated
and the device is located several inches from the power source.
Like all low dropout regulators, the TPS76201-Q1 requires an output capacitor connected between OUT and
GND to stabilize the internal control loop. The minimum recommended capacitance is 4.7 mF. The equivalent
series resistance (ESR) of the capacitor should be between 0.3 Ω and 1.5 Ω. to ensure stability. Capacitor values
larger than 4.7 mF are acceptable, and allow the use of smaller ESR values. Capacitors less than 4.7 mF are not
recommended because they require careful selection of ESR to ensure stability. Solid tantalum electrolytic,
aluminum electrolytic, and multilayer ceramic capacitors are all suitable, provided they meet the requirements
described above. Most of the commercially available 4.7-mF surface-mount solid tantalum capacitors, including
devices from Sprague, Kemet, and Nichico, meet these ESR requirements. Multilayer ceramic capacitors may
have very small equivalent series resistances and therefore may require the addition of a low-value series
resistor to ensure stability. Table 1 summarizes the capacitor selection recommendations.
Table 1. Capacitor Selection
PART NO.
MFR
VALUE
MAX ESR (1)
SIZE
(H × L × W) (2)
T494B475K016AS
KEMET
4.7 mF
1.5 Ω
1.9 × 3.5 × 2.8
195D106x0016x2T
SPRAGUE
10 mF
1.5 Ω
1.3 × 7.0 × 2.7
695D106x003562T
SPRAGUE
10 mF
1.3 Ω
2.5 × 7.6 × 2.5
TPSC475K035R0600
AVX
4.7 mF
0.6 Ω
2.6 × 6.0 × 3.2
(1)
(2)
ESR is maximum resistance in Ohms at 100 kHz and TA = +25°C. Contact manufacturer for minimum
ESR values.
Size is shown in mm.
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Output Voltage Programming
The output voltage of the TPS76201-Q1 adjustable regulator is programmed using an external resistor divider as
shown in Figure 19. The output voltage is calculated using:
R1
VOUT = VREF × (1 +
)
R2
(1)
Where:
VREF = 0.6663 V, typ (the internal reference voltage)
Resistors R1 and R2 should be chosen for approximately 10-mA divider current. Lower value resistors can be
used but offer no inherent advantage and waste more power. Higher values should be avoided because leakage
currents at FB increase the output voltage error. The recommended design procedure is to choose R2 = 66.5 kΩ
to set the divider current at 10 mA and then calculate R1 using Equation 2:
V
R1 = ( OUT - 1 ) × R2
VREF
(2)
OUTPUT VOLTAGE
PROGRAMMING GUIDE
OUTPUT
VOLTAGE
(V)
0.7
DIVIDER RESISTANCE
TPS76201-Q1
(1)
(kW)
R1
R2
3.36
66.5
0.9
23.2
66.5
1.2
53.6
66.5
1.5
83.5
66.5
1.8
113
66.5
2.5
182
66.5
3.3
246
66.5
3.6
294
66.5
4
332
66.5
5
432
66.5
1
VIN
IN
1 mF
5
VOUT
OUT
≥ 1.7 V
3
R1
EN
4
≤ 0.9 V
+
FB
4.7 mF
GND
2
R2
ESR = 0.5 W
(1) 1% values shown.
Figure 19. TPS76201-Q1 Adjustable LDO Regulator Programming
Power Dissipation and Junction Temperature
Specified regulator operation is assured to a junction temperature of +125°C; the maximum junction temperature
should be restricted to +150°C under normal operating conditions. This restriction limits the power dissipation the
regulator can handle in any given application. To ensure the junction temperature is within acceptable limits,
calculate the maximum allowable dissipation, PD(max), and the actual dissipation, PD, which must be less than or
equal to PD(max).
The maximum power dissipation limit is determined using Equation 3:
TJ(max) - TA
PD(max) =
RqJA
(3)
Where:
TJmax is the maximum allowable junction temperature.
RqJA is the thermal resistance junction-to-ambient for the package; see the Thermal Information table.
TA is the ambient temperature.
10
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The regulator dissipation is calculated using Equation 4:
PD = (VIN - VOUT) × IOUT
(4)
Power dissipation resulting from quiescent current is negligible. Excessive power dissipation triggers the thermal
protection circuit.
Regulator Protection
The TPS76201-Q1 PMOS-pass transistor has a built-in back diode that conducts reverse current when the input
voltage drops below the output voltage (for example, during power down). Current is conducted from the output
to the input and is not internally limited. If extended reverse voltage operation is anticipated, external limiting
might be appropriate.
The TPS76201-Q1 features internal current limiting and thermal protection. During normal operation, the
TPS76201-Q1 limits output current to approximately 350 mA. When current limiting engages, the output voltage
scales back linearly until the overcurrent condition ends. While current limiting is designed to prevent gross
device failure, care should be taken not to exceed the power dissipation ratings of the package. If the
temperature of the device exceeds approximately +165°C, thermal protection circuitry shuts it down. Once the
device has cooled to below approximately +140°C, regulator operation resumes.
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PACKAGE OPTION ADDENDUM
www.ti.com
19-Jan-2011
PACKAGING INFORMATION
Orderable Device
TPS76201QDBVRQ1
Status
(1)
Package Type Package
Drawing
ACTIVE
SOT-23
DBV
Pins
Package Qty
5
3000
Eco Plan
(2)
Green (RoHS
& no Sb/Br)
Lead/
Ball Finish
MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
(3)
Samples
(Requires Login)
Request Free Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS76201-Q1 :
• Catalog: TPS76201
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Dec-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TPS76201QDBVRQ1
Package Package Pins
Type Drawing
SPQ
SOT-23
3000
DBV
5
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
179.0
8.4
Pack Materials-Page 1
3.2
B0
(mm)
K0
(mm)
P1
(mm)
3.2
1.4
4.0
W
Pin1
(mm) Quadrant
8.0
Q3
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Dec-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS76201QDBVRQ1
SOT-23
DBV
5
3000
203.0
203.0
35.0
Pack Materials-Page 2
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