Transistors IC SMD Type HEXFET Power MOSFET KRFR9310 TO-252 Features Unit: mm +0.1 2.30-0.1 +0.15 1.50-0.15 +0.15 6.50-0.15 +0.2 5.30-0.2 +0.8 0.50-0.7 P-Channel 0.127 max 2.3 Fully Avalanche Rated +0.28 1.50-0.1 Avanced Process Technology +0.1 0.60-0.1 +0.15 4.60-0.15 3.80 +0.15 5.55-0.15 +0.1 0.80-0.1 +0.25 2.65-0.1 +0.2 9.70-0.2 Fast Switching +0.15 0.50-0.15 Surface Mount 1. Gate 2. Drain 3. Source Absolute Maximum Ratings Ta = 25 Parameter Symbol Rating Continuous Drain Current, VGS @ -10V,Tc = 25 ID -1.8 Continuous Drain Current, VGS @ -10V,Tc = 100 ID -1.1 Pulsed Drain Current*1 IDM -7.2 Power Dissipation Tc = 25 PD 50 Linear Derating Factor 0.4 Unit A W W/ V Gate-to-Source Voltage VGS Single Pulse Avalanche Energy*3 EAS 92 mJ Avalanche Current *1 IAR -1.8 A 20 Repetitive Avalanche Energy *1 EAR 5 mJ Peak Diode Recovery dv/dt *2 dv/dt -24 V/ns TJ,TSTG -55 to + 150 Operating Junction and Storage Temperature Range Junction-to-Case R JC 2.5 /W Junction-to-Ambient R JA 50 /W Junction-to-Ambient R JA 110 /W *1 Repetitive rating; pulse width limited by max. junction temperature. *2 ISD -1.1A, di/dt 450A/ s, VDD V(BR)DSS,TJ 150 *3 Starting TJ = 25 , L = 57 mH,RG = 25 , IAS = -1.8A. www.kexin.com.cn 1 Transistors IC SMD Type KRFR9310 Electrical Characteristics Ta = 25 Parameter Symbol Drain-to-Source Breakdown Voltage V(BR)DSS Testconditons VGS = 0V, ID =- 250 A Min Static Drain-to-Source On-Resistance RDS(on) Gate Threshold Voltage VGS(th) VDS = VGS, ID = -250 A -2.0 gfs VDS = -50V, ID = -1.1A*1 0.91 IDSS Gate-to-Source Forward Leakage IGSS Gate-to-Source Reverse Leakage TJ ID = -1mA,Reference to 25 VGS = -10V, ID = -1.1A*1 V/ 7.0 -4.0 VDS = -400V, VGS = 0V -100 VDS = -320V, VGS = 0V, TJ = 125 -500 VGS = 20V -100 VGS = -20V 100 Total Gate Charge Qg ID = -1.1A 13 Qgs VDS = -320V 3.2 Gate-to-Drain ("Miller") Charge Qgd VGS = -10V,*1 5.0 Turn-On Delay Time td(on) VDD = -200V 11 ID = -1.1A 10 RG =21 25 RD =180 *1 24 tr Turn-Off Delay Time td(off) V S Gate-to-Source Charge Rise Time Unit V -0.41 V(BR)DSS/ Drain-to-Source Leakage Current Max -400 Breakdown Voltage Temp. Coefficient Forward Transconductance Typ A nA nC ns Fall Time tf Internal Drain Inductance LD 4.5 nH Internal Source Inductance LS 7.5 nH Input Capacitance Ciss VGS = 0V 270 Output Capacitance Coss VDS = -25V 50 Reverse Transfer Capacitance Crss f = 1.0MHz 8.0 Continuous Source Current Body Diode) pF IS -1.8 ISM -7.2 A Pulsed Source Current Body Diode) *2 Diode Forward Voltage VSD -4.0 V Reverse Recovery Time trr TJ = 25 , IF = -1.1A 170 260 ns Reverse RecoveryCharge Qrr di/dt = 100A/ 640 960 Forward Turn-On Time ton Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD) *1 Pulse width 300 s; duty cycle 2%. *2 Repetitive rating; pulse width limited bymax 2 www.kexin.com.cn TJ = 25 , IS = -1.1A, VGS = 0V*1 s*1 C