3.8x2.0mm DOME LENS SMD CHIP LED LAMP APED3820MGC MEGA GREEN Features Description lLOW DH InGaAlP on GaAs substrate Light Emitting Diode. l3.8mmx2.0mm SMT LED,3.2mm THICKNESS. POWER CONSUMPTION. lIDEAL FOR BACKLIGHT AND INDICATOR. l VARIOUS lPACKAGE The Mega Green source color devices are made with COLORS AND LENS TYPES AVAILABLE. : 500PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.008") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAB0343 APPROVED: J. Lu REV NO: V.6 CHECKED: Allen Liu DATE: APR/03/2003 DRAWN: Z.Y.YANG PAGE: 1 OF 4 Selection Guide P ar t N o . Dic e APED 3820MGC Iv (m c d ) @ 20 m A L en s Ty p e MEGA GREEN(InGaAIP) WATER C LEAR Mi n . Ty p . 70 250 Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. V i ew i n g An g le 2θ1/2 60° (H) 35° (V) Electrical / Optical Characteristics at TA=25°°C Sy m b o l P ar am et er D ev i c e λp e a k Peak Wavelength Mega Green λD D omi nate Wavelength ∆λ 1/2 Ty p . Max . Un its Tes t C o n d i t i o n s 574 nm IF = 2 0 m A Mega Green 568 nm IF = 2 0 m A Spectral Li ne Half-wi dth Mega Green 26 nm IF = 2 0 m A C C apaci tance Mega Green 20 pF V F = 0 V;f= 1 M Hz VF Forward Voltage Mega Green 2.1 2.5 V IF = 2 0 m A IR Reverse C urrent Mega Green 10 uA VR = 5V Absolute Maximum Ratings at TA=25°°C P ar am et er Meg a Gr een Un its Power di ssi pati on 105 mW Peak Forward C urrent [1] 150 mA D C Forward C urrent 30 Reverse Voltage 5 Operati ng/Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAB0343 APPROVED: J. Lu mA REV NO: V.6 CHECKED: Allen Liu -40°C To +85°C DATE: APR/03/2003 DRAWN: Z.Y.YANG V PAGE: 2 OF 4 Mega Green SPEC NO: DSAB0343 APPROVED: J. Lu APED3820MGC REV NO: V.6 CHECKED: Allen Liu DATE: APR/03/2003 DRAWN: Z.Y.YANG PAGE: 3 OF 4 APED3820MGC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAB0343 APPROVED: J. Lu REV NO: V.6 CHECKED: Allen Liu DATE: APR/03/2003 DRAWN: Z.Y.YANG PAGE: 4 OF 4