KINGBRIGHT APKF3030SEXXC/E

3.0mmx3.0mm SURFACE MOUNT LED LAMP
APKF3030SEXXC/E
HYPER ORANGE
Features
Description
l 3.0mmx3.0mm SMT LED, 2.0mm(MAX.) THICKNESS.
with DH InGaAlP on GaAs substrate Light Emitting
lLOW POWER CONSUMPTION.
l ONE
ORANGE CHIP IN ONE PACKAGE.
l CAN PRODUCE ANY COLOR IN VISIBLE
The Hyper Orange source color devices are made
Diode.
SPECTRUM, INCLUDING WHITE LIGHT.
lPACKAGE
: 1000PCS / REEL.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.2(0.008") unless otherwise noted.
3. Specifications are subject to change without notice.
SPEC NO: DSAD1207
APPROVED : J. Lu
REV NO: V.1
CHECKED : Allen Liu
DATE: APR/25/2003
DRAWN: D.H.FANG
PAGE: 1 OF 4
Selection Guide
P ar t N o .
Dic e
APKF3030SEXXC /E
L en s Ty p e
HYPER ORANGE (InGaAlP)
WATER C LEAR
Iv (m c d )
@ 20m A
Mi n .
180
V i ew i n g
An g le
Ty p .
2θ1/2
400
100°
Note:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at TA=25°°C
Sy m b o l
P ar am et er
D ev i c e
λp e a k
Peak Wavelength
Hyper Orange
λD
D omi nate Wavelength
∆λ1/2
Un its
Tes t C o n d i t i o n s
630
nm
I F =20mA
Hyper Orange
621
nm
I F =20mA
Spectral Li ne Half-wi dth
Hyper Orange
20
nm
I F =20mA
C
C apaci tance
Hyper Orange
25
pF
VF=0V;f=1MHz
VF
Forward Voltage
Hyper Orange
2.0
2.5
V
I F =20mA
IR
Reverse C urrent
Hyper Orange
10
uA
V R = 5V
Absolute Maximum Ratings at TA=25°°C
P ar am et er
Power di ssi pati on
Max .
H y p er Or an g e
Un its
30
mA
150
D C Forward C urrent
Peak Forward C urrent [1]
195
Reverse Voltage
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
REV NO: V.1
CHECKED : Allen Liu
mW
mA
5
Operati ng/Storage Temperature
SPEC NO: DSAD1207
APPROVED : J. Lu
Ty p .
-40°C To +85°C
DATE: APR/25/2003
DRAWN: D.H.FANG
V
PAGE: 2 OF 4
Hyper Orange
SPEC NO: DSAD1207
APPROVED : J. Lu
APKF3030SEXXC/E
REV NO: V.1
CHECKED : Allen Liu
DATE: APR/25/2003
DRAWN: D.H.FANG
PAGE: 3 OF 4
APKF3030SEXXC/E
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
SPEC NO: DSAD1207
APPROVED : J. Lu
REV NO: V.1
CHECKED : Allen Liu
DATE: APR/25/2003
DRAWN: D.H.FANG
PAGE: 4 OF 4