3.0mmx3.0mm SURFACE MOUNT LED LAMP APKF3030SEXXC/E HYPER ORANGE Features Description l 3.0mmx3.0mm SMT LED, 2.0mm(MAX.) THICKNESS. with DH InGaAlP on GaAs substrate Light Emitting lLOW POWER CONSUMPTION. l ONE ORANGE CHIP IN ONE PACKAGE. l CAN PRODUCE ANY COLOR IN VISIBLE The Hyper Orange source color devices are made Diode. SPECTRUM, INCLUDING WHITE LIGHT. lPACKAGE : 1000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.008") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAD1207 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE: APR/25/2003 DRAWN: D.H.FANG PAGE: 1 OF 4 Selection Guide P ar t N o . Dic e APKF3030SEXXC /E L en s Ty p e HYPER ORANGE (InGaAlP) WATER C LEAR Iv (m c d ) @ 20m A Mi n . 180 V i ew i n g An g le Ty p . 2θ1/2 400 100° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25°°C Sy m b o l P ar am et er D ev i c e λp e a k Peak Wavelength Hyper Orange λD D omi nate Wavelength ∆λ1/2 Un its Tes t C o n d i t i o n s 630 nm I F =20mA Hyper Orange 621 nm I F =20mA Spectral Li ne Half-wi dth Hyper Orange 20 nm I F =20mA C C apaci tance Hyper Orange 25 pF VF=0V;f=1MHz VF Forward Voltage Hyper Orange 2.0 2.5 V I F =20mA IR Reverse C urrent Hyper Orange 10 uA V R = 5V Absolute Maximum Ratings at TA=25°°C P ar am et er Power di ssi pati on Max . H y p er Or an g e Un its 30 mA 150 D C Forward C urrent Peak Forward C urrent [1] 195 Reverse Voltage Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. REV NO: V.1 CHECKED : Allen Liu mW mA 5 Operati ng/Storage Temperature SPEC NO: DSAD1207 APPROVED : J. Lu Ty p . -40°C To +85°C DATE: APR/25/2003 DRAWN: D.H.FANG V PAGE: 2 OF 4 Hyper Orange SPEC NO: DSAD1207 APPROVED : J. Lu APKF3030SEXXC/E REV NO: V.1 CHECKED : Allen Liu DATE: APR/25/2003 DRAWN: D.H.FANG PAGE: 3 OF 4 APKF3030SEXXC/E SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAD1207 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE: APR/25/2003 DRAWN: D.H.FANG PAGE: 4 OF 4