3.2X1.6mm SMD CHIP LED LAMP APK3216SEC Features SUPER BRIGHT ORANGE Description !3.2mmX1.6mm SMT LED, 1.1mm THICKNESS. !LOW POWER CONSUMPTION. !WIDE VIEWING ANGLE. !IDEAL FOR BACKLIGHT AND INDICATOR. ! VARIOUS COLORS AND LENS TYPES AVAILABLE. !PACKAGE :2000PCS / REEL. The Super Bright Orange source color devices are made with DH InGaAlP on GaAs substrate Light Emitting Diode. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.0079") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAD1147 APPROVED:J.Lu REV NO: V.1 CHECKED:Allen Liu D DATE:MAR/24/2003 DRAWN: L.ZHANG PAGE: 1 OF 4 Selection Guide Par t No . Dic e A P K 3 2 16 S E C Iv (m c d ) @ 20 m A L en s Ty p e SUPER BRIGHT ORANGE (InGaAlP) WATER CLEAR V i ew i n g An g l e Min . Ty p . 2θ1/2 110 30 0 90 ° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°°C Sy m b o l Par am et er D ev i c e Ty p . λp e a k Peak Wavelength Super Bright Orange λD Dominate Wavelength ∆λ1/2 Max . Un it s Tes t Co n d it io n s 6 10 nm I F =20mA Super Bright Orange 601 nm I F =20mA Spectral Line Half-width Super Bright Orange 29 nm I F =20mA C Capacitance Super Bright Orange 30 pF VF=0V;f=1MHz VF Forward Voltage Super Bright Orange 2.0 2.5 V I F =20mA IR Reverse Current Super Bright Orange 10 uA V R = 5V Absolute Maximum Ratings at T)=25°°C Par am et er Su p er B r ig h t Or an g e Un it s Power dissipation 75 mW DC Forward Current 30 mA Peak Forward Current [1] 195 mA Reverse Voltage 5 V Operating/Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAD1147 APPROVED:J.Lu REV NO: V.1 CHECKED:Allen Liu DATE:MAR/24/2003 DRAWN: L.ZHANG PAGE: 2 OF 4 Super Bright Orange SPEC NO: DSAD1147 APPROVED:J.Lu APK3216SEC REV NO: V.1 CHECKED:Allen Liu DATE:MAR/24/2003 DRAWN: L.ZHANG PAGE: 3 OF 4 APK3216SEC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAD1147 APPROVED:J.Lu REV NO: V.1 CHECKED:Allen Liu DATE:MAR/24/2003 DRAWN: L.ZHANG PAGE: 4 OF 4