3.2x1.6mm SMD CHIP LED LAMP KPC-3216SEC SUPER BRIGHT ORANGE Features Description !3.2mmx1.6mm SMT LED, 1.1mm THICKNESS. The Super Bright Orange source color devices are !LOW POWER CONSUMPTION. made with DH InGaAlP on GaAs substrate Light !WIDE VIEWING ANGLE. Emitting Diode. !IDEAL FOR BACKLIGHT AND INDICATOR. ! VARIOUS COLORS AND LENS TYPES AVAILABLE. !PACKAGE : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.0079") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAD0224 APPROVED: J. Lu REV NO: V.1 CHECKED: Allen Liu DATE: JAN/25/2003 DRAWN: X.T.HU PAGE: 1 OF 4 Selection Guide Dic e KPC-3216SEC Iv (m c d ) @ 20 m A L en s Ty p e SUPER BRIGHT ORANGE ( InGaAlP) WATER CLEAR V i ew i n g An g l e Min . Ty p . 2θ1/2 70 200 120° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25°°C Sy m b o l P ar am et er D ev i c e Ty p . λpeak Peak Wavelength Super Bright Orange λD Dominate Wavelength ∆λ1/2 Max . Un its Tes t Co n d it io n s 610 nm IF = 2 0 m A Super Bright Orange 601 nm IF = 2 0 m A Spectral Line Half-width Super Bright Orange 29 nm IF = 2 0 m A C Capacitance Super Bright Orange 30 pF V F = 0 V;f= 1 M Hz VF Forward Voltage Super Bright Orange 2.0 2.5 V IF = 2 0 m A IR Reverse Current Super Bright Orange 10 uA VR = 5V Absolute Maximum Ratings at TA=25°°C P ar am et er Su p er B r ig h t Or an g e Un its Power dissipation 75 mW DC Forward Current 30 mA Peak Forward Current [1] 195 mA Reverse Voltage 5 V Operating/Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAD0224 APPROVED: J. Lu REV NO: V.1 CHECKED: Allen Liu DATE: JAN/25/2003 DRAWN: X.T.HU PAGE: 2 OF 4 Super Bright Orange SPEC NO: DSAD0224 APPROVED: J. Lu KPC-3216SEC REV NO: V.1 CHECKED: Allen Liu DATE: JAN/25/2003 DRAWN: X.T.HU PAGE: 3 OF 4 KPC-3216SEC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAD0224 APPROVED: J. Lu REV NO: V.1 CHECKED: Allen Liu DATE: JAN/25/2003 DRAWN: X.T.HU PAGE: 4 OF 4