SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array RoHS Pb GREEN SP3004 Lead-Free/Green Series Description The SP3004 has ultra low capacitance rail-to rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level (Level 4) specified in the IEC 61000-4-2 international standard without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394. Pinout Features I/O 1 I/O 4 GND VCC I/O 2 I/O 3 t-PXDBQBDJUBODFPG 0.85pF (TYP) per I/O t-PXMFBLBHFDVSSFOUPG 0.5μA (MAX) at 5V t&4%QSPUFDUJPOPGL7 contact discharge, L7BJSEJTDIBSHF (IEC61000-4-2) t4NBMM405QBDLBHF saves board space t&'5QSPUFDUJPO IEC61000-4-4, 40A (5/50 ns) t-JHIUOJOH1SPUFDUJPO IEC61000-4-5, 4A (8/20μs) Functional Block Diagram Applications I/O4 VCC t$PNQVUFS1FSJQIFSBMT t/FUXPSL)BSEXBSF1PSUT t.PCJMF1IPOFT t5FTU&RVJQNFOU t1%"T t.FEJDBM&RVJQNFOU t%JHJUBM$BNFSBT I/O1 GND I/O3 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 57 SP3004 Lead-Free/Green Series Lead-Free/Green SP3004 I/O2 SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Absolute Maximum Ratings Symbol Parameter Value Units 4 A Operating Temperature -40 to 85 °C Storage Temperature -50 to 150 °C IPP Peak Current (tp TOP TSTOR CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Storage Temperature Range Units -65 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 10s) 260 °C Electrical Characteristics (TOP=25ºC) Symbol Test Conditions Max Units Reverse Standoff Voltage Parameter VRWM IR ≤ 1μA 6 V Reverse Leakage Current ILEAK VR=5V 0.5 μA Clamp Voltage1 ESD Withstand Voltage1 VC VESD Diode Capacitance1 CI/O-GND Diode Capacitance1 CI/O-I/O Min Typ IPP=1A, tp=8/20μs, Fwd 10.0 12.0 V IPP=2A, tp=8/20μs, Fwd 11.8 15.0 V IEC61000-4-2 (Contact) ±12 kV IEC61000-4-2 (Air) ±15 kV Reverse Bias=0V 0.95 1.1 1.25 pF Reverse Bias=1.65V 0.7 0.85 1 pF Reverse Bias=0V 0.5 pF Note : 1 Parameter is guaranteed by design and/or device characterization. SP3004 Lead-Free/Green Series 58 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Insertion Loss (S21) I/O to GND Capacitance vs. Bias Voltage 1.50 0 1.40 I/O Capacitance (pF) Insertion Loss [dB] 1.30 -5 -10 -15 1.20 VCC = Float 1.10 1.00 VCC = 3.3V 0.90 0.80 VCC = 5V 0.70 0.60 0.50 -20 1.E+06 1.E+07 1.E+08 1.E+09 0.0 1.E+10 Frequency [Hz] 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 I/O DC Bias (V) Capacitance vs. Frequency 2E-12 1.8E-12 1.6E-12 Capacitance [F] 1.4E-12 1.2E-12 1E-12 8E-13 6E-13 4E-13 2E-13 0 1.E+07 1.E+08 1.E+09 Lead-Free/Green SP3004 1.E+06 Frequency [Hz] ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 59 SP3004 Lead-Free/Green Series SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Application Example +5V D2+ D2+ Gnd D2- D26 5 4 SP300x-04 1 2 3 D1+ D1+ Gnd D1HDMI or DVI Connector D1HDMI or DVI Interface IC D0+ D0+ Gnd D0- D06 5 4 SP300x-04 1 2 3 Clk+ Clk+ Gnd Clk- ClkGnd voltage ASIC HDMI/DVI drivers can also be protected with the SP300x-04, the +VCC pins on the SP300x-04 can be substituted with a suitable bypass capacitor or in some backdrive applications the +VCC of the SP300x-04 can be nPBUFEPS/$ HDMI or DVI application example for the Littelfuse SP300x-04 protection devices. A single 4 channel SP300x-04 device can be used to protect four of the data lines in a HDMI/DVI interface. Two (2) SP300x-04 devices provide protection for the main data lines. Low Soldering Parameters Reflow Condition Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C SP3004 Lead-Free/Green Series 60 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Package Dimensions - SOT563 A Package L SOT 563 Pins 6 5 4 Solder Pad Layout E 2 6 Millimeters HE 3 Max Min Max 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 D 1.50 1.70 0.059 0.067 E 1.10 1.30 0.043 0.051 A e c B e Part Numbering System Silicon Protection Array 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 Matte Tin G= Green Lead Material Copper Alloy T= Tape & Reel Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 X = SOT563, 5000 quantity -04 = 4 channel 0.020 BSC 0.10 Lead Plating Package Number of Channels 0.50 BSC L Product Characteristics SP3004-04X T G Series Inches Min Part Marking System /PUFT 1. All dimensions are in millimeters GX 4 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. GX4 Product Series Number of Channels 4. All specifications comply to JEDEC SPEC MO-223 Issue A G = SP3004 series 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. Assembly Site 6. Package surface matte finish VDI 11-13. (varies) Ordering Information Part Number Package Marking Min. Order Qty. SP3004-04XTG SOT563 GX4 5000 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 61 SP3004 Lead-Free/Green Series Lead-Free/Green SP3004 D SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array Embossed Carrier Tape & Reel Specification - SOT563 Millimetres Min Max 1.65 1.85 0.065 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P0 3.90 4.10 0.154 0.161 40.0+/- 0.20 W 7.70 8.10 1.574+/-0.008 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 1.73 1.83 0.068 0.072 B0 1.73 1.83 0.068 0.072 K0 0.64 0.74 0.025 0.029 t 62 Min E 10P0 SP3004 Lead-Free/Green Series Inches Max 0.22 max 0.009 max ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.