DATA SHEET CMOS INTEGRATED CIRCUIT μPD5713TK WIDE BAND SPDT SWITCH DESCRIPTION The μPD5713TK is a CMOS MMIC for wide band SPDT (Single Pole Double Throw) switch which were developed for mobile communications, wireless communications and another general-purpose RF switching application. This device can operate frequency from 0.05 to 2.5 GHz, having the low insertion loss and high isolation. This device is housed in a 6-pin lead-less minimold (1511) package. And this package is able to high-density surface mounting. FEATURES • Supply voltage : VDD = 1.8 to 3.6 V (2.8 V TYP.) • Switch control voltage : Vcont (H) = 1.8 to 3.6 V (2.8 V TYP.) : Vcont (L) = −0.2 to +0.4 V (0 V TYP.) • Low insertion loss : Lins1 = 0.6 dB TYP. @ f = 0.05 to 1.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V : Lins2 = 0.8 dB TYP. @ f = 1.0 to 2.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V : Lins3 = 0.95 dB TYP. @ f = 2.0 to 2.5 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V • High isolation : ISL1 = 32.5 dB TYP. @ f = 0.05 to 1.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V : ISL2 = 25 dB TYP. @ f = 1.0 to 2.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V : ISL3 = 22.5 dB TYP. @ f = 2.0 to 2.5 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V • Handling power : Pin (1 dB) = +21.0 dBm TYP. @ f = 1.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V : Pin (0.1 dB) = +17.0 dBm TYP. @ f = 1.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V • High-density surface mounting : 6-pin lead-less minimold package (1.5 × 1.1 × 0.55 mm) APPLICATIONS • Mobile communications • Wireless communications • Another general-purpose RF switching applications ORDERING INFORMATION Part Number μPD5713TK-E2 Order Number μPD5713TK-E2-A Package 6-pin lead-less minimold (1511) (Pb-Free) Marking C3Q Supplying Form • Embossed tape 8 mm wide • Pin 1, 6 face the perforation side of the tape • Qty 5 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: μPD5713TK Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PU10627EJ01V0DS (1st edition) Date Published September 2006 NS CP(K) Printed in Japan 2006 μPD5713TK PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) 2 3 C3Q 1 (Top View) (Bottom View) 6 1 6 6 1 5 2 5 5 2 4 3 4 4 3 Pin No. Pin Name 1 OUTPUT1 2 GND 3 OUTPUT2 4 Vcont 5 INPUT 6 VDD TRUTH TABLE Vcont INPUT−OUTPUT1 INPUT−OUTPUT2 Low OFF ON High ON OFF ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Parameter Symbol Ratings Unit Supply Voltage VDD −0.5 to +4.6 V Switch Control Voltage Vcont −0.5 to +4.6 V Vcont (H) +0.5 V Voltage Difference − VDD Input Power Pin +23 dBm Operating Ambient Temperature TA −45 to +85 °C Storage Temperature Tstg −55 to +150 °C RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified) Parameter Symbol MIN. TYP. MAX. Unit VDD +1.8 +2.8 +3.6 V Switch Control Voltage (H) Vcont (H) +1.8 +2.8 +3.6 V Switch Control Voltage (L) Vcont (L) −0.2 0 +0.4 V Supply Voltage Remark VDD − 0.4 V ≤ Vcont (H) ≤ VDD + 0.2 V 2 Data Sheet PU10627EJ01V0DS μPD5713TK ELECTRICAL CHARACTERISTICS (TA = +25°C, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V, DC cut capacitors = 1 000 pF, unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Insertion Loss 1 Lins1 f = 0.05 to 1.0 GHz − 0.6 0.8 dB Insertion Loss 2 Lins2 f = 1.0 to 2.0 GHz − 0.8 1.0 dB Insertion Loss 3 Lins3 f = 2.0 to 2.5 GHz − 0.95 1.2 dB Isolation 1 ISL1 f = 0.05 to 1.0 GHz 30 32.5 − dB Isolation 2 ISL2 f = 1.0 to 2.0 GHz 22 25 − dB Isolation 3 ISL3 f = 2.0 to 2.5 GHz 20 22.5 − dB Input Return Loss RLin f = 0.05 to 2.5 GHz 13 17 − dB Output Return Loss RLout f = 0.05 to 2.5 GHz 13 17 − dB +13.0 +17.0 − dBm f = 1.0 GHz − +21.0 − dBm 0.1 dB Loss Compression Input Power 1 dB Loss Compression Input Power Pin (0.1 dB) f = 1.0 GHz Note 1 Pin (1 dB) Note 2 Supply Current IDD VDD = Vcont = 2.8 V, RF off − 0.01 1.0 μA Switch Control Current Icont VDD = Vcont = 2.8 V, RF off − 0.01 1.0 μA Switch Control Speed tSW f = 1.0 GHz − 30 100 ns Notes 1. Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear range. 2. Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear range. Caution This device is used it is necessary to use DC cut capacitors. The value of DC cut capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. Data Sheet PU10627EJ01V0DS 3 μPD5713TK EVALUATION CIRCUIT VDD Vcont INPUT C0 1 000 pF 1 000 pF 6 1 5 2 4 3 C0 OUTPUT1 C0 OUTPUT2 Remark C0 = 1 000 pF Caution This IC has pull down resistance between RF line and GND, witch fixes electric potential of RF line to 0 V, then the IC cannot be used for DC switching. The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4 Data Sheet PU10627EJ01V0DS μPD5713TK ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD Vcont 6pinL2MM SPDT SW Vc2 OUTPUT2 C2 C 2 C 4 OUT 2 INPUT C3Q C1 C3 C1 C1 IN C 1 C 5 C2 OUT 1 OUTPUT1 Vc1 VDD USING THE NEC EVALUATION BOARD Symbol Values C1, C2, C3 1 000 pF C4, C5 1 000 pF Data Sheet PU10627EJ01V0DS 5 μPD5713TK TYPICAL CHARACTERISTICS (TA = +25°C, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V, Pin = 0 dBm, DC cut capacitors = 1 000 pF, unless otherwise specified) INPUT–OUTPUT2 INSERSION LOSS vs. FREQUENCY INPUT–OUTPUT1 INSERSION LOSS vs. FREQUENCY 1: –0.584 dB 0.5 GHz 2: –0.659 dB 1.0 GHz 3: –0.730 dB 1.5 GHz 4: –0.811 dB 2.0 GHz 5: –0.924 dB 2.5 GHz Insersion Loss Lins (dB) 2.0 1.5 1.0 0.5 0 1 –0.5 2 –1.0 3 4 –1.5 5 2.5 –2.0 0 40 1.0 0.5 0 1 –0.5 2 –1.0 1.0 1.5 2.0 3.0 2.5 10 0 –10 –20 –30 0 1.5 2.0 5 0.5 1.0 2.5 Frequency f (GHz) INPUT–OUTPUT1 ISOLATION vs. FREQUENCY INPUT–OUTPUT2 ISOLATION vs. FREQUENCY 40 20 1 2 –40 3 4 5 3.0 1: –39.0 dB 0.5 GHz 2: –31.8 dB 1.0 GHz 3: –27.9 dB 1.5 GHz 4: –24.4 dB 2.0 GHz 5: –21.6 dB 2.5 GHz 30 10 0 –10 –20 –30 1 2 –40 –50 3 4 5 2.0 2.5 –50 –60 0 0.5 1.0 1.5 2.0 2.5 3.0 0 0.5 Frequency f (MHz) 40 10 0 –10 1 –20 2 –30 3 4 3.0 1: –26.4 dB 0.5 GHz 2: –21.8 dB 1.0 GHz 3: –19.6 dB 1.5 GHz 4: –18.5 dB 2.0 GHz 5: –18.3 dB 2.5 GHz 30 Input Return Loss RLin (dB) 20 1.5 INPUT–OUTPUT2 INPUT RETURN LOSS vs. FREQUENCY 40 1: –26.0 dB 0.5 GHz 2: –21.5 dB 1.0 GHz 3: –19.5 dB 1.5 GHz 4: –18.3 dB 2.0 GHz 5: –18.9 dB 2.5 GHz 30 1.0 Frequency f (MHz) INPUT–OUTPUT1 INPUT RETURN LOSS vs. FREQUENCY Input Return Loss RLin (dB) 4 Frequency f (GHz) Isolation ISL (dB) 20 5 –40 20 10 0 –10 1 –20 –30 2 3 4 5 1.0 1.5 2.0 2.5 –40 –50 –50 –60 –60 0 0.5 1.0 1.5 2.0 2.5 3.0 0 0.5 Frequency f (MHz) Frequency f (MHz) Remark The graphs indicate nominal characteristics. 6 3 –1.5 –2.5 0.5 1: –38.2 dB 0.5 GHz 2: –31.7 dB 1.0 GHz 3: –27.4 dB 1.5 GHz 4: –23.9 dB 2.0 GHz 5: –22.4 dB 2.5 GHz 30 Isolation ISL (dB) 1.5 –2.0 –2.5 –60 1: –0.584 dB 0.5 GHz 2: –0.653 dB 1.0 GHz 3: –0.731 dB 1.5 GHz 4: –0.826 dB 2.0 GHz 5: –0.968 dB 2.5 GHz 2.0 Insersion Loss Lins (dB) 2.5 Data Sheet PU10627EJ01V0DS 3.0 μPD5713TK INPUT–OUTPUT2 OUTPUT RETURN LOSS vs. FREQUENCY INPUT–OUTPUT1 OUTPUT RETURN LOSS vs. FREQUENCY 40 1: –23.6 dB 0.5 GHz 2: –22.4 dB 1.0 GHz 3: –19.0 dB 1.5 GHz 4: –19.4 dB 2.0 GHz 5: –18.5 dB 2.5 GHz 30 20 10 0 –10 Output Return Loss RLout (dB) Output Return Loss RLout (dB) 40 1 –20 2 –30 3 4 5 –40 –50 1: –24.4 dB 0.5 GHz 2: –22.9 dB 1.0 GHz 3: –20.0 dB 1.5 GHz 4: –20.6 dB 2.0 GHz 5: –19.4 dB 2.5 GHz 30 20 10 0 –10 1 –20 –30 2 3 4 5 1.5 2.0 2.5 –40 –50 –60 –60 0 0.5 1.0 1.5 2.0 2.5 3.0 0 0.5 1.0 3.0 Frequency f (MHz) Frequency f (MHz) OUTPUT POWER vs. INPUT POWER +35 Output Power Pout (dBm) f = 1 GHz +30 +25 +20 +15 +10 +5 +5 +10 +15 +20 +25 +30 +35 Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. Data Sheet PU10627EJ01V0DS 7 μPD5713TK MOUNTING PAD DIMENSIONS 6-PIN LEAD-LESS MINIMOLD (1511) (UNIT: mm) 1.10 0.45 0.26 0.48 0.48 Remark The mounting pad layouts in this document are for reference only. 8 Data Sheet PU10627EJ01V0DS μPD5713TK PACKAGE DIMENSIONS 6-PIN LEAD-LESS MINIMOLD (1511) (UNIT: mm) (Bottom View) 0.16±0.05 0.48±0.05 0.48±0.05 1.1±0.1 0.2±0.1 0.9±0.1 0.11+0.1 –0.05 1.3±0.05 0.55±0.03 1.5±0.1 (Top View) Data Sheet PU10627EJ01V0DS 9 μPD5713TK RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Wave Soldering Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260°C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260°C or below Time at peak temperature : 10 seconds or less IR260 WS260 Preheating temperature (package surface temperature) : 120°C or below Partial Heating Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Caution Do not use different soldering methods together (except for partial heating). 10 Data Sheet PU10627EJ01V0DS HS350 μPD5713TK • The information in this document is current as of September, 2006. 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(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1 Data Sheet PU10627EJ01V0DS 11 μPD5713TK For further information, please contact NEC Compound Semiconductor Devices Hong Kong Limited E-mail: [email protected] Hong Kong Head Office TEL: +852-3107-7303 FAX: +852-3107-7309 Taipei Branch Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Korea Branch Office TEL: +82-2-558-2120 FAX: +82-2-558-5209 NEC Electronics (Europe) GmbH http://www.eu.necel.com/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 Compound Semiconductor Devices Division NEC Electronics Corporation URL: http://www.ncsd.necel.com/ 0604