DATA SHEET CMOS INTEGRATED CIRCUIT μPD5738T6N WIDE BAND DPDT SWITCH DESCRIPTION The μPD5738T6N is a CMOS MMIC DPDT (Double Pole Double Throw) switch which is developed for mobile communications, wireless communications and another RF switching applications. This device can operate within frequency from 0.01 to 2.5 GHz, having low insertion loss and high isolation performances. This device is housed in a 6-pin plastic TSON (Thin Small Out-line Non-leaded) (T6N) package, which allows high-density surface mounting. FEATURES • Supply voltage • Switch control voltage • • • • • : VDD = 1.5 to 3.6 V (2.8 V TYP.) : Vcont (H) = 1.5 to 3.6 V (2.8 V TYP.) : Vcont (L) = −0.2 to +0.4 V (0 V TYP.) Low insertion loss Note : Lins1 = 0.5 dB TYP. @ f = 0.01 to 0.05 GHz : Lins2 = 0.8 dB TYP. @ f = 0.05 to 1.0 GHz : Lins3 = 1.4 dB TYP. @ f = 1.0 to 2.0 GHz : Lins4 = 1.6 dB TYP. @ f = 2.0 to 2.5 GHz High isolation Note : ISL1 = 45 dB TYP. @ f = 0.01 to 0.05 GHz : ISL2 = 22 dB TYP. @ f = 0.05 to 1.0 GHz : ISL3 = 16 dB TYP. @ f = 1.0 to 2.0 GHz : ISL4 = 15 dB TYP. @ f = 2.0 to 2.5 GHz Handling power Note : Pin (1 dB) = +20 dBm TYP. @ f = 1.0 GHz : Pin (0.1 dB) = +15 dBm TYP. @ f = 1.0 GHz High-density surface mounting : 6-pin plastic TSON (T6N) package (1.5 × 1.5 × 0.37 mm) High ESD voltage : machine-model 200 V (TYP.), human-body-model 3 kV (TYP.) Note TA = 25°C, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V APPLICATIONS • Mobile communications • Wireless communications • Another RF switching applications ORDERING INFORMATION Part Number μPD5738T6N-E2 Order Number μPD5738T6N-E2-A Package 6-pin plastic TSON (T6N) (Pb-Free) Marking C3X Supplying Form • Embossed tape 8 mm wide • Pin 1, 6 face the perforation side of the tape • Qty 3 kpcs/reel Remark To order evaluation samples, please contact your nearby sales office. Part number for sample order: μPD5738T6N Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PU10750EJ01V0DS (1st edition) Date Published February 2009 NS Printed in Japan 2009 μPD5738T6N PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) 2 C3X 1 3 (Bottom View) (Top View) 6 1 6 6 1 5 2 5 5 2 4 3 4 3 4 Pin No. Pin Name 1 INPUT1 2 Vcont 3 OUTPUT1 4 INPUT2 5 VDD 6 OUTPUT2 Remark Exposed pad : GND TRUTH TABLE Vcont INPUT1−OUTPUT1, INPUT2−OUTPUT2 INPUT1−OUTPUT2, INPUT2−OUTPUT1 Low ON OFF High OFF ON Remark High: +2.8 V, Low: 0 V ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Parameter Symbol Ratings Unit Supply Voltage VDD −0.5 to +4.6 V Switch Control Voltage Vcont −0.5 to +4.6 V Vcont (H) +0.5 V Voltage Difference − VDD Input Power Pin +23 dBm Operating Ambient Temperature TA −45 to +85 °C Storage Temperature Tstg −55 to +150 °C RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified) Parameter Symbol MIN. TYP. MAX. Unit VDD +1.5 +2.8 +3.6 V Switch Control Voltage (H) Vcont (H) +1.5 +2.8 +3.6 V Switch Control Voltage (L) Vcont (L) −0.2 0 +0.4 V Supply Voltage Remark VDD − 0.4 V ≤ Vcont (H) ≤ VDD + 0.2 V 2 Data Sheet PU10750EJ01V0DS μPD5738T6N ELECTRICAL CHARACTERISTICS (TA = +25°C, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V, Pin = 0 dBm, Z0 = 50 Ω, DC blocking capacitors = 10 000 pF, unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Insertion Loss 1 Lins1 f = 0.01 to 0.05 GHz − 0.5 0.9 dB Insertion Loss 2 Lins2 f = 0.05 to 1.0 GHz − 0.8 1.2 dB Insertion Loss 3 Lins3 f = 1.0 to 2.0 GHz − 1.4 1.8 dB Insertion Loss 4 Lins4 f = 2.0 to 2.5 GHz − 1.6 2.0 dB Isolation 1 ISL1 f = 0.01 to 0.05 GHz 35 45 − dB Isolation 2 ISL2 f = 0.05 to 1.0 GHz 18 22 − dB Isolation 3 ISL3 f = 1.0 to 2.0 GHz 13 16 − dB Isolation 4 ISL4 f = 2.0 to 2.5 GHz 12 15 − dB Return Loss 1 RL1 f = 0.01 to 1.0 GHz 13 18 − dB Return Loss 2 RL2 f = 1.0 to 2.5 GHz 8 12 − dB +10 +15 − dBm f = 1.0 GHz − +20 − dBm 0.1 dB Loss Compression Input Power 1 dB Loss Compression Input Power Pin (0.1 dB) f = 1.0 GHz Note 1 Pin (1 dB) Note 2 Supply Current IDD VDD = Vcont = 2.8 V, RF off − 0.01 1 μA Switch Control Current Icont VDD = Vcont = 2.8 V, RF off − 0.01 1 μA Switch Control Speed tSW f = 1.0 GHz − 0.4 1 μs Notes 1. Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear range. 2. Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear range. Caution DC blocking capacitors are necessary. Please do not supply any DC bias to the terminals (INPUT1, INPUT2, OUTPUT1, OUTPUT2). The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. Data Sheet PU10750EJ01V0DS 3 μPD5738T6N EVALUATION CIRCUIT DC block 10 000 pF DC block 10 000 pF INPUT1 Vcont 1 6 2 5 RF bypass 1 000 pF VDD RF bypass 1 000 pF 4 3 OUTPUT1 OUTPUT2 DC block 10 000 pF INPUT2 DC block 10 000 pF Exposed pad Caution This IC has pull down resistances inside between each RF line and GND line, which bias each RF pin internally to GND, then the IC cannot be used for DC switching. The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4 Data Sheet PU10750EJ01V0DS μPD5738T6N ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD OUTPUT2 INPUT1 N E C WIDE BAND DPDT SWITCH INPUT1 EB Ver 1 C1 OUTPUT2 C1 VDD Vcont C2 C2 Vcont VDD C1 C1 OUTPUT1 INPUT2 OUTPUT1 INPUT2 USING THE NEC EVALUATION BOARD Symbol Values C1 1 0000 pF C2 1 000 pF Data Sheet PU10750EJ01V0DS 5 μPD5738T6N TYPICAL CHARACTERISTICS (TA = +25°C, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V, Pin = 0 dBm, Z0 = 50 Ω, DC blocking capacitors = 10 000 pF, unless otherwise specified) INPUT1, 2–OUTPUT1, 2 ISOLATION vs. FREQUENCY 0 0 –0.5 –10 Isolation ISL (dB) Insertion Loss Lins (dB) INPUT1, 2–OUTPUT1, 2 INSERTION LOSS vs. FREQUENCY –1.0 –1.5 –2.0 –2.5 0 0.5 1.0 –20 –30 –40 VDD = Vcont (H) = 1.5 V VDD = Vcont (H) = 2.8 V VDD = Vcont (H) = 3.6 V 1.5 2.0 2.5 –50 0 0.5 1.0 VDD = Vcont (H) = 1.5 V VDD = Vcont (H) = 2.8 V VDD = Vcont (H) = 3.6 V 1.5 2.0 2.5 Frequency f (GHz) Frequency f (GHz) INPUT1, 2–OUTPUT1, 2 RETURN LOSS vs. FREQUENCY 0 Return Loss RL (dB) –10 –20 –30 –40 –50 0 0.5 1.0 VDD = Vcont (H) = 1.5 V VDD = Vcont (H) = 2.8 V VDD = Vcont (H) = 3.6 V 1.5 2.0 2.5 INSERTION LOSS vs. INPUT POWER 0 f = 1.0 GHz Insertion Loss Lins (dB) –0.5 –1.0 –1.5 –2.0 VDD = Vcont (H) = 1.5 V VDD = Vcont (H) = 2.8 V VDD = Vcont (H) = 3.6 V –3.0 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 –2.5 Input Power Pin (dBm) 0.1 dB Loss Compression Input Power Pin (0.1 dB) (dBm) Frequency f (GHz) Pin (0.1 dB) vs. FREQUENCY (for reference) 20 18 17 16 15 14 13 12 11 10 10 M Remark The graphs indicate nominal characteristics. 6 VDD = Vcont (H) = 2.8 V 19 Data Sheet PU10750EJ01V0DS 100 M 1G Frequency f (Hz) 10 G μPD5738T6N INPUT1, 2–OUTPUT1, 2 ISOLATION vs. FREQUENCY 0 0 –0.5 –10 Isolation ISL (dB) Insertion Loss Lins (dB) INPUT1, 2–OUTPUT1, 2 INSERTION LOSS vs. FREQUENCY –1.0 –1.5 –2.0 –2.5 0 0.5 1.0 1.5 TA = –45°C TA = +25°C TA = +85°C 2.0 2.5 –20 –30 –40 –50 0 0.5 1.0 1.5 TA = –45°C TA = +25°C TA = +85°C 2.0 2.5 Frequency f (GHz) Frequency f (GHz) INPUT1, 2–OUTPUT1, 2 RETURN LOSS vs. FREQUENCY 0 Return Loss RL (dB) –10 –20 –30 –40 –50 0 0.5 1.0 1.5 TA = –45°C TA = +25°C TA = +85°C 2.0 2.5 Frequency f (GHz) INSERTION LOSS vs. INPUT POWER 0 f = 1.0 GHz Insertion Loss Lins (dB) –0.5 –1.0 –1.5 –2.0 –2.5 –3.0 TA = –45°C TA = +25°C TA = +85°C 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. Data Sheet PU10750EJ01V0DS 7 μPD5738T6N MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS 6-PIN PLASTIC TSON (UNIT: mm) MOUNTING PAD 0.3 0.2 0.5 1.0 0.5 0.3 0.5 0.3 0.3 SOLDER MASK 0.475 0.15 0.5 0.55 0.5 0.25 0.35 0.475 0.25 Solder thickness : 0.08 mm Remark The mounting pad and solder mask layouts in this document are for reference only. When designing PCB, please consider workability of mounting, solder joint reliability, prevention of solder bridge and so on, in order to optimize the design. 8 Data Sheet PU10750EJ01V0DS μPD5738T6N PACKAGE DIMENSIONS 6-PIN PLASTIC TSON (T6N) (UNIT: mm) (Top View) (Bottom View) (Side View) 0.3±0.07 1.5±0.1 0.37+0.03 –0.05 1.2±0.1 A 0.08 MIN. 0.2+0.07 –0.05 A 1.5±0.1 0.5±0.06 (0.24) 0.2±0.1 0.7±0.1 Remark A>0 ( ) : Reference value Data Sheet PU10750EJ01V0DS 9 μPD5738T6N RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Partial Heating Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260°C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Caution Do not use different soldering methods together (except for partial heating). 10 Data Sheet PU10750EJ01V0DS IR260 HS350 μPD5738T6N • The information in this document is current as of February, 2009. The information is subject to change without notice. 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