NEC UPG2409T6X

DATA SHEET
GaAs INTEGRATED CIRCUIT
μPG2409T6X
HIGH POWER SPDT SWITCH FOR WiMAX
TM
DESCRIPTION
The μPG2409T6X is a GaAs MMIC high power SPDT (Single Pole Double Throw) switch which were designed for
WiMAX.
This device can operate frequency from 0.05 to 6.0 GHz, having the low insertion loss and high isolation.
This device is housed in a 6-pin plastic TSON (Thin Small Out-line Non-leaded) (T6X) package. And this package
is suitable for high-density surface mounting.
FEATURES
• Switch control voltage
: Vcont (H) = 3.0 V TYP.
: Vcont (L) = 0 V TYP.
• Low insertion loss
: Lins = 0.45 dB TYP. @ f = 2.5 GHz
: Lins = 0.55 dB TYP. @ f = 3.8 GHz
: Lins = 0.65 dB TYP. @ f = 6.0 GHz
• High isolation
: ISL = 30 dB TYP. @ f = 2.5 GHz
: ISL = 30 dB TYP. @ f = 3.8 GHz
: ISL = 27 dB TYP. @ f = 6.0 GHz
• Handling power
: Pin (1 dB) = +36.0 dBm TYP. @ f = 0.05 to 6.0 GHz
• High-density surface mounting : 6-pin plastic TSON (T6X) package (1.5 × 1.5 × 0.37 mm)
APPLICATIONS
• WiMAX and wireless LAN (IEEE802.11a/b/g/n)
ORDERING INFORMATION
Part Number
μPG2409T6X-E2
Order Number
μPG2409T6X-E2-A
Package
6-pin plastic TSON
(T6X) (Pb-Free)
Marking
G5R
Supplying Form
• Embossed tape 8 mm wide
• Pin 1, 6 face the perforation side of the tape
• Qty 3 kpcs/reel
Remark To order evaluation samples, please contact your nearby sales office.
Part number for sample order: μPG2409T6X
Caution Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can
damage this device. This device must be protected at all times from ESD. Static charges may
easily produce potentials of several kilovolts on the human body or equipment, which can
discharge without detection. Industry-standard ESD precautions must be employed at all times.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. PG10773EJ01V0DS (1st edition)
Date Published July 2009 NS
Printed in Japan
2009
μPG2409T6X
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
(Top View)
2
3
G5R
1
(Bottom View)
(Top View)
6
RF1
1
Vcont1
6
6
1
5
GND
2
RFC
5
5
2
RF2
4
3
Vcont2
4
4
3
Pin No.
Pin Name
1
RF1
2
GND
3
RF2
4
Vcont2
5
RFC
6
Vcont1
Remark Exposed pad : GND
SW TRUTH TABLE
Vcont1
Vcont2
RFC-RF1
RFC-RF2
High
Low
ON
OFF
Low
High
OFF
ON
ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified)
Parameter
Symbol
Switch Control Voltage
Ratings
Vcont
+6.0
Unit
Note
V
Input Power
Pin
+36
dBm
Operating Ambient Temperature
TA
−45 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
Note ⎪Vcont1 − Vcont2⎪ ≤ 6.0 V
RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
f
0.05
−
6.0
GHz
Switch Control Voltage (H)
Vcont (H)
2.7
3.0
3.3
V
Switch Control Voltage (L)
Vcont (L)
−0.2
0
0.2
V
Control Voltage Difference
ΔVcont (H),
ΔVcont (L)Note
−0.1
0
0.1
V
Operating Frequency
Note ΔVcont (H) = Vcont1 (H) − Vcont2 (H)
ΔVcont (L) = Vcont1 (L) − Vcont2 (L)
2
Data Sheet PG10773EJ01V0DS
μPG2409T6X
ELECTRICAL CHARACTERISTICS
(TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, ZO = 50 Ω, DC blocking capacitors = 8 pF, unless otherwise
specified)
Parameter
Insertion Loss 1
Symbol
Lins1
Test Conditions
f = 0.05 to 0.5 GHz
Note 1
Note 2
MIN.
TYP.
MAX.
Unit
−
0.35
−
dB
−
0.40
0.65
dB
Insertion Loss 2
Lins2
f = 0.5 to 2.0 GHz
Insertion Loss 3
Lins3
f = 2.0 to 2.5 GHz
−
0.45
0.70
dB
Insertion Loss 4
Lins4
f = 2.5 to 3.8 GHz
−
0.55
0.80
dB
Insertion Loss 5
Lins5
f = 3.8 to 6.0 GHz
−
0.65
0.90
dB
−
30
−
dB
25
30
−
dB
Isolation 1
ISL1
f = 0.05 to 0.5 GHz
Note 1
Note 2
Isolation 2
ISL2
f = 0.5 to 2.0 GHz
Isolation 3
ISL3
f = 2.0 to 2.5 GHz
25
30
−
dB
Isolation 4
ISL4
f = 2.5 to 3.8 GHz
25
30
−
dB
Isolation 5
ISL5
f = 3.8 to 6.0 GHz
22
27
−
dB
−
20
−
dB
15
20
−
dB
15
20
−
dB
10
15
−
dB
−
+34.0
−
dBm
−
+36.0
−
dBm
+34.0
+36.0
−
dBm
Return Loss 1
RL1
f = 0.05 to 0.5 GHz
Return Loss 2
RL2
f = 0.5 to 2.0 GHz
Return Loss 3
RL3
f = 2.0 to 2.5 GHz
Return Loss 4
RL4
f = 2.5 to 6.0 GHz
0.1 dB Loss Compression
Input Power
Note 2
Note 2
Pin (0.1 dB)
f = 0.5 to 6.0 GHz
Pin (1 dB)
f = 0.05 to 0.5 GHz
Note 3
1 dB Loss Compression
Input Power
Note 1
Note 4
f = 0.5 to 6.0 GHz
Note 1
Note 2
2nd Harmonics
2f0
f = 2.5 GHz, Pin = +30 dBm
−
70
−
dBc
3rd Harmonics
3f0
f = 2.5 GHz, Pin = +30 dBm
−
70
−
dBc
Input 3rd Order Intercept Point
IIP3
f = 2.5 GHz
−
+60
−
dBm
Switch Control Current
Icont
No RF input
−
0.1
10
μA
Switch Control Speed
tSW
50% CTL to 90/10% RF
−
100
250
ns
Notes 1. DC blocking capacitors = 1 000 pF at f = 0.05 to 0.5 GHz
2. DC blocking capacitors = 56 pF at f = 0.5 to 2.0 GHz
3. Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of the
linear range.
4. Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of the
linear range.
Caution It is necessary to use DC blocking capacitors with this device.
Data Sheet PG10773EJ01V0DS
3
μPG2409T6X
EVALUATION CIRCUIT
1 000 pF
C1
1
Vcont1
RF1
6
2
RFC
5
C1 Note
3
Vcont2
RF2
4
C1
1 000 pF
Note C1 : 0.05 to 0.5 GHz 1 000 pF
: 0.5 to 2.0 GHz
56 pF
: 2.0 to 6.0 GHz
8 pF
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
APPLICATION INFORMATION
C1
Switch
C1
LESD
C1
• C1 are DC blocking capacitors external to the device.
The value may be tailored to provide specific electrical responses.
• The RF ground connections should be kept as short as possible and connected to directly to a good RF ground
for best performance.
• LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the
antenna.
4
Data Sheet PG10773EJ01V0DS
μPG2409T6X
TYPICAL CHARACTERISTICS (TA = +25°C, DC blocking capacitors = 8 pF, unless otherwise specified)
RFC-RF1/RF2
INSERTION LOSS vs. FREQUENCY
RFC-RF1/RF2
ISOLATION vs. FREQUENCY
0
0.0
Vcont (H) = 3.0 V
Vcont (H) = 3.0 V
–10
–0.2
Isolation ISL (dB)
Insertion Loss Lins (dB)
–0.1
–0.3
–0.4
–0.5
–0.6
–0.7
–0.8
–20
–30
–40
–50
–0.9
–1.0
0.0
1.0
2.0
3.0
4.0
5.0
–60
0.0
6.0
1.0
2.0
3.0
6.0
Frequency f (GHz)
RFC RETURN LOSS vs. FREQUENCY
RF1/RF2 RETURN LOSS vs. FREQUENCY
0
Vcont (H) = 3.0 V
Vcont (H) = 3.0 V
–5
–5
–10
–10
Return Loss RL (dB)
Return Loss RL (dB)
5.0
Frequency f (GHz)
0
–15
–20
–25
–30
–35
–40
0.0
–15
–20
–25
–30
–35
1.0
2.0
3.0
4.0
5.0
–40
0.0
6.0
1.0
2.0
3.0
4.0
5.0
Frequency f (GHz)
Frequency f (GHz)
RFC-RF1/RF2 INSERTION LOSS,
Icont vs. SWITCH CONTROL VOLTAGE (H)
RFC-RF1/RF2 ISOLATION vs.
SWITCH CONTROL VOLTAGE (H)
1.0
Lins
0.6
–0.6
6.0 GHz
0.4
–0.8
0.2
–1.0
–1.2
2.0
Icont (No RF input)
2.5
–10
0.8
f = 2.5 GHz
3.0
0.0
3.5
6.0
0
Isolation ISL (dB)
–0.4
Switch Control Current Icont (μA)
–0.2
Insertion Loss Lins (dB)
4.0
–20
f = 6.0 GHz
–30
2.5 GHz
–40
–50
–60
2.0
2.5
3.0
3.5
Switch Control Voltage (H) Vcont (H) (V)
Switch Control Voltage (H) Vcont (H) (V)
Remark The graphs indicate nominal characteristics.
Data Sheet PG10773EJ01V0DS
5
μPG2409T6X
RF1/RF2 RETURN LOSS vs.
SWITCH CONTROL VOLTAGE (H)
0
0
–5
–5
–10
–10
–15
Return Loss RL (dB)
Return Loss RL (dB)
RFC RETURN LOSS vs.
SWITCH CONTROL VOLTAGE (H)
f = 6.0 GHz
–20
–25
2.5 GHz
–30
–40
2.0
2.5
3.0
2.5 GHz
–30
3.0
2.5
3.5
RFC-RF1/RF2 INSERTION LOSS,
Icont vs. INPUT POWER
RFC-RF1/RF2 Pin (0.1 dB) vs.
SWITCH CONTROL VOLTAGE (H)
Lins
–0.4
4
3.3 V
–0.6
3.0 V
Vcont (H) = 2.7 V
2
–0.8
3.3 V
3.0 V
2.7 V
–1.0
Icont
20
25
30
3
1
0
40
35
Input Power Pin (dBm)
RFC-RF1/RF2
2f0, 3f0 vs. INPUT POWER
–30
Vcont (H) = 3.0 V
–40 Vcont (L) = 0 V
f = 2.5 GHz
–50
3f0
–60
–70
2f0
–80
–90
–100
20 21 22 23 24 25 26 27 28 29 30 31 32 33 34
Output Power Pout (dBm)
3rd Order Intermoduration Distortion IM3 (dBm)
5
0.1 dB Loss Compression Input Power Pin (0.1 dB) (dBm)
Switch Control Voltage (H) Vcont (H) (V)
Switch Control Current Icont (μA)
Insertion Loss Lins (dB)
–25
Switch Control Voltage (H) Vcont (H) (V)
f = 2.5 GHz
2nd Harmonics 2f0 (dBc)
3rd Harmonics 3f0 (dBc)
–20
–40
2.0
3.5
–0.2
38
f = 2.5 GHz
36
34
32
30
28
26
2.0
3.0
2.5
3.5
Switch Control Voltage (H) Vcont (H) (V)
RFC-RF1/RF2
OUTPUT POWER, IM3 vs. INPUT POWER
80
60
40
Pout
20
0
–20
–40
–80
0
Vcont (H) = 3.0 V
Vcont (L) = 0 V
f = 2.5 GHz
IM3
–60
Input Power Pin (dBm)
10
20
30
40
50
60
Input Power Pin (1 Tone) (dBm)
Remark The graphs indicate nominal characteristics.
6
f = 6.0 GHz
–35
–35
–1.2
15
–15
Data Sheet PG10773EJ01V0DS
70
80
μPG2409T6X
MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS
6-PIN PLASTIC TSON (UNIT: mm)
MOUNTING PAD
0.3
0.2
0.5
1.0
0.5
0.3
0.5
0.3
0.3
SOLDER MASK
0.475
0.15
0.5
0.55
0.5
0.25
0.35
0.475
0.25
Solder thickness : 0.08 mm
Remark The mounting pad and solder mask layouts in this document is for reference only.
When designing PCB, please consider workability of mounting, solder joint reliability, prevention of solder
bridge and so on, in order to optimize the design.
Data Sheet PG10773EJ01V0DS
7
μPG2409T6X
PACKAGE DIMENSIONS
6-PIN PLASTIC TSON (T6X) (UNIT: mm)
(Top View)
(Bottom View)
(Side View)
0.3±0.07
1.5±0.1
0.37+0.03
–0.05
1.2±0.1
A
0.08 MIN.
0.2+0.07
–0.05
A
1.5±0.1
0.5±0.06
(0.24)
0.2±0.1
0.7±0.1
Remark A>0
( ) : Reference value
8
Data Sheet PG10773EJ01V0DS
μPG2409T6X
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Partial Heating
Soldering Conditions
Condition Symbol
Peak temperature (package surface temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220°C or higher
: 60 seconds or less
Preheating time at 120 to 180°C
: 120±30 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
: 350°C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
IR260
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10773EJ01V0DS
9
μPG2409T6X
WiMAX is a trademark or a registered trademark of the WiMAX Forum.
• The information in this document is current as of July, 2009. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets,
etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or
types are available in every country. Please check with an NEC Electronics sales representative for
availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
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property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
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responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
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agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. In addition, NEC
Electronics products are not taken measures to prevent radioactive rays in the product design. When customers
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persons, as the result of defects of NEC Electronics products.
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The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC
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The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
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(Note)
(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E0904E
10
Data Sheet PG10773EJ01V0DS
μPG2409T6X
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.