NEC UPG2406T6R-E2-A

DATA SHEET
GaAs INTEGRATED CIRCUIT
μPG2406T6R
0.01 to 3.0 GHz SPDT SWITCH
DESCRIPTION
The μPG2406T6R is a GaAs MMIC for L, S-band SPDT (Single Pole Double Throw) switch which were designed
for mobile phone and another L, S-band application.
This device can operate 2 control switching by control voltage 1.8 to 3.3 V. This device can operate frequency from
0.01 to 3.0 GHz, having the low insertion loss and high isolation.
This device is housed in a 6-pin plastic TSSON (Thin Shrink Small Out-line Non-leaded) (T6R) package. And this
package is able to high-density surface mounting.
FEATURES
• Switch control voltage
: Vcont (H) = 1.8 to 3.3 V (2.7 V TYP.)
: Vcont (L) = −0.2 to +0.2 V (0 V TYP.)
• Low insertion loss
: Lins = 0.40 dB TYP. @ f = 1.0 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V
: Lins = 0.47 dB TYP. @ f = 2.5 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V
• High isolation
: ISL = 27 dB TYP. @ f = 1.0 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V
: ISL = 17 dB TYP. @ f = 2.5 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V
• Handling power
: Pin (0.1 dB) = +29.0 dBm TYP. @ f = 2.0/2.5 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V
: Pin (1 dB) = +30.5 dBm TYP. @ f = 0.5 to 3.0 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V
• High-density surface mounting : 6-pin plastic TSSON (T6R) package (1.0 × 1.0 × 0.37 mm)
APPLICATIONS
• L, S-band digital cellular or cordless telephone
• W-LAN, WLL and BluetoothTM etc.
ORDERING INFORMATION
Part Number
μPG2406T6R-E2
Order Number
μPG2406T6R-E2-A
Package
6-pin plastic TSSON
(T6R) (Pb-Free)
Marking
G9
Supplying Form
• Embossed tape 8 mm wide
• Pin 1, 6 face the perforation side of the tape
• Qty 5 kpcs/reel
Remark To order evaluation samples, please contact your nearby sales office.
Part number for sample order: μPG2406T6R
Caution Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can
damage this device. This device must be protected at all times from ESD. Static charges may
easily produce potentials of several kilovolts on the human body or equipment, which can
discharge without detection. Industry-standard ESD precautions must be employed at all times.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. PG10759EJ01V0DS (1st edition)
Date Published April 2009 NS
Printed in Japan
2009
μPG2406T6R
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
(Top View)
1
G9
2
3
(Bottom View)
(Top View)
6
RF1
1
Vcont1
6
6
1
5
GND
2
RFC
5
5
2
RF2
4
3
Vcont2
4
4
3
Pin No.
Pin Name
1
RF1
2
GND
3
RF2
4
Vcont2
5
RFC
6
Vcont1
SW TRUTH TABLE
ON Path
Vcont1
Vcont2
RFC-RF1
High
Low
RFC-RF2
Low
High
ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified)
Parameter
Symbol
Ratings
+6.0
Unit
Note
Switch Control Voltage
Vcont
V
Input Power
f = 0.01 to 0.5 GHz
Pin1
+24.0
f = 0.5 to 3.0 GHz
Pin2
+31.0
Operating Ambient Temperature
TA
−45 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
dBm
Note ⎪Vcont1 − Vcont2⎪ ≤ 6.0 V
RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Switch Control Voltage (H)
Vcont (H)
1.8
2.7
3.3
V
Switch Control Voltage (L)
Vcont (L)
−0.2
0
0.2
V
Control Voltage Difference
ΔVcont (H),
ΔVcont (L)Note
−0.1
0
0.1
V
Note ΔVcont (H) = Vcont1 (H) − Vcont2 (H)
ΔVcont (L) = Vcont1 (L) − Vcont2 (L)
2
Data Sheet PG10759EJ01V0DS
μPG2406T6R
ELECTRICAL CHARACTERISTICS
(TA = +25°C, Vcont (H) = 2.7 V, Vcont (L) = 0 V, DC blocking capacitors = 56 pF, unless otherwise specified)
Parameter
Insertion Loss 1
Symbol
Lins1
Test Conditions
f = 0.01 to 0.05 GHz
Note 1
Note 2
MIN.
TYP.
MAX.
Unit
−
0.40
−
dB
−
0.40
0.45
dB
Insertion Loss 2
Lins2
f = 0.05 to 0.5 GHz
Insertion Loss 3
Lins3
f = 0.5 to 1.0 GHz
−
0.40
0.45
dB
Insertion Loss 4
Lins4
f = 1.0 to 2.0 GHz
−
0.45
0.50
dB
Insertion Loss 5
Lins5
f = 2.0 to 2.5 GHz
−
0.47
0.55
dB
Insertion Loss 6
Lins6
f = 2.5 to 3.0 GHz
−
0.53
0.60
dB
−
27
−
dB
23
27
−
dB
Isolation 1
ISL1
f = 0.01 to 0.05 GHz
Note 1
Note 2
Isolation 2
ISL2
f = 0.05 to 0.5 GHz
Isolation 3
ISL3
f = 0.5 to 1.0 GHz
23
27
−
dB
Isolation 4
ISL4
f = 1.0 to 2.0 GHz
16
19
−
dB
Isolation 5
ISL5
f = 2.0 to 2.5 GHz
14
17
−
dB
Isolation 6
ISL6
f = 2.5 to 3.0 GHz
14
17
−
dB
−
20
−
dB
15
20
−
dB
15
20
−
dB
−
20
−
dB
15
20
−
dB
15
20
−
dB
+26.0
+29.0
−
dBm
f = 0.5 to 3.0 GHz
−
+29.0
−
dBm
f = 0.5 to 3.0 GHz
−
+30.5
−
dBm
Input Return Loss 1
RLin1
f = 0.01 to 0.05 GHz
Input Return Loss 2
RLin2
f = 0.05 to 0.5 GHz
Input Return Loss 3
RLin3
f = 0.5 to 3.0 GHz
Output Return Loss 1
RLout1
RLout2
f = 0.05 to 0.5 GHz
Output Return Loss 3
RLout3
f = 0.5 to 3.0 GHz
0.1 dB Loss Compression
Input Power
Note 3
1 dB Loss Compression
Input Power
Pin (0.1 dB)
Pin (1 dB)
Note 2
f = 0.01 to 0.05 GHz
Output Return Loss 2
Note 1
Note 1
Note 2
f = 2.0/2.5 GHz
Note 4
2nd Harmonics
2f0
f = 2.0/2.5 GHz, Pin = +20 dBm
65
75
−
dBc
3rd Harmonics
3f0
f = 2.0/2.5 GHz, Pin = +20 dBm
65
75
−
dBc
Intermodulation Intercept Point
IIP3
f = 0.5 to 3.0 GHz, 2 tone,
−
+60
−
dBm
5 MHz spicing
Switch Control Current
Icont
No RF input
−
0.2
20
μA
Switch Control Speed
tSW
50% CTL to 90/10% RF
−
50
500
ns
Notes 1. DC blocking capacitors = 10 000 pF at f = 0.01 to 0.05 GHz
2. DC blocking capacitors = 1 000 pF at f = 0.05 to 0.5 GHz
3. Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of
linear range.
4. Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear
range.
Caution This device is used it is necessary to use DC blocking capacitors.
The value of DC blocking capacitors should be chosen to accommodate the frequency of
operation, bandwidth, switching speed and the condition with actual board of your system. The
range of recommended DC blocking capacitor value is less than 56 pF.
Data Sheet PG10759EJ01V0DS
3
μPG2406T6R
ELECTRICAL CHARACTERISTICS
(TA = +25°C, Vcont (H) = 1.8 V, Vcont (L) = 0 V, DC blocking capacitors = 56 pF, unless otherwise specified)
Parameter
Insertion Loss 7
Symbol
Lins7
Test Conditions
f = 0.01 to 0.05 GHz
Note 1
Note 2
MIN.
TYP.
MAX.
Unit
−
0.40
−
dB
−
0.40
0.46
dB
Insertion Loss 8
Lins8
f = 0.05 to 0.5 GHz
Insertion Loss 9
Lins9
f = 0.5 to 1.0 GHz
−
0.40
0.47
dB
Insertion Loss 10
Lins10
f = 1.0 to 2.0 GHz
−
0.46
0.52
dB
Insertion Loss 11
Lins11
f = 2.0 to 2.5 GHz
−
0.48
0.57
dB
Insertion Loss 12
Lins12
f = 2.5 to 3.0 GHz
−
0.54
0.62
dB
−
27
−
dB
23
27
−
dB
Isolation 7
ISL7
f = 0.01 to 0.05 GHz
Note 1
Note 2
Isolation 8
ISL8
f = 0.05 to 0.5 GHz
Isolation 9
ISL9
f = 0.5 to 1.0 GHz
23
27
−
dB
Isolation 10
ISL10
f = 1.0 to 2.0 GHz
16
19
−
dB
Isolation 11
ISL11
f = 2.0 to 2.5 GHz
14
17
−
dB
Isolation 12
ISL12
f = 2.5 to 3.0 GHz
14
17
−
dB
−
20
−
dB
15
20
−
dB
15
20
−
dB
−
20
−
dB
15
20
−
dB
15
20
−
dB
+19.0
+22.0
−
dBm
f = 0.5 to 3.0 GHz
−
+22.0
−
dBm
f = 0.5 to 3.0 GHz
−
+25.0
−
dBm
Input Return Loss 4
RLin4
f = 0.01 to 0.05 GHz
Input Return Loss 5
RLin5
f = 0.05 to 0.5 GHz
Input Return Loss 6
RLin6
f = 0.5 to 3.0 GHz
Output Return Loss 4
RLout4
RLout5
f = 0.05 to 0.5 GHz
Output Return Loss 6
RLout6
f = 0.5 to 3.0 GHz
0.1 dB Loss Compression
Input Power
Note 3
1 dB Loss Compression
Input Power
Pin (0.1 dB)
Pin (1 dB)
Note 2
f = 0.01 to 0.05 GHz
Output Return Loss 5
Note 1
Note 1
Note 2
f = 2.0/2.5 GHz
Note 4
Switch Control Current
Icont
No RF input
−
0.2
20
μA
Switch Control Speed
tSW
50% CTL to 90/10% RF
−
50
500
ns
Notes 1. DC blocking capacitors = 10 000 pF at f = 0.01 to 0.05 GHz
2. DC blocking capacitors = 1 000 pF at f = 0.05 to 0.5 GHz
3. Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of
linear range.
4. Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear
range.
Caution This device is used it is necessary to use DC blocking capacitors.
The value of DC blocking capacitors should be chosen to accommodate the frequency of
operation, bandwidth, switching speed and the condition with actual board of your system. The
range of recommended DC blocking capacitor value is less than 56 pF.
4
Data Sheet PG10759EJ01V0DS
μPG2406T6R
EVALUATION CIRCUIT
C2
C1
1
Vcont1
RF1
6
2
RFC
5
C1 Note
3
Vcont2
RF2
4
C1
C2
Note C1 : 0.01 to 0.05 GHz 10 000 pF
: 0.05 to 0.5 GHz
1 000 pF
: 0.5 to 3.0 GHz
56 pF
C2 : 1 000 pF
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
APPLICATION INFORMATION
C1
Switch
C1
LESD
C1
• LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the
antenna.
• The value may be tailored to provide specific electrical responses.
• The RF ground connections should be kept as short as possible and connected to directly to a good RF ground
for best performance.
Data Sheet PG10759EJ01V0DS
5
μPG2406T6R
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
C1
USING THE NEC EVALUATION BOARD
Symbol
C1
C2
6
Test Conditions
Values
f = 0.01 to 0.05 GHz
10 000 pF
f = 0.05 to 0.5 GHz
1 000 pF
f = 0.5 to 3.0 GHz
56 pF
1 000 pF
Data Sheet PG10759EJ01V0DS
C1
RFC
Out 2
C2
RF2
IN
RFC
RF 1
Out 1
C2
C1
RF 2
C1
6pin T5K/T6R SPDT SW
NEC
C1
G9
Vcont
Vcont2
VDD
Vcont1
RF1
μPG2406T6R
TYPICAL CHARACTERISTICS (TA = +25°C, DC blocking capacitors = 56 pF, unless otherwise specified)
RFC-RF1/RF2
ISOLATION vs. FREQUENCY
RFC-RF1/RF2
INSERTION LOSS vs. FREQUENCY
0
–0.1
Isolation ISL (dB)
Insertion Loss Lins (dB)
–5
–0.2
–0.3
Vcont (H) = 2.7 V
–0.4
Vcont (H) = 1.8 V
–15
–20
–25
2.7 V
–30
–0.5
–35
1.8 V
–0.6
0.0
0.5
1.0
1.5
2.5
2.0
–40
0.0
3.0
0.5
1.0
1.5
3.0
Frequency f (GHz)
RFC-RF1/RF2
INPUT RETURN LOSS vs. FREQUENCY
RFC-RF1/RF2
OUTPUT RETURN LOSS vs. FREQUENCY
Output Return Loss RLout (dB)
0
–5
–10
–15
Vcont (H) = 2.7 V
–20
–25
–5
–10
Vcont (H) = 2.7 V
–15
–20
–25
1.8 V
–30
0.0
0.5
1.0
1.5
1.8 V
2.5
2.0
–30
0.0
3.0
0.5
1.0
1.5
2.5
2.0
Frequency f (GHz)
Frequency f (GHz)
RFC-RF1/RF2 INSERTION LOSS,
Icont vs. SWITCH CONTROL VOLTAGE (H)
RFC-RF1/RF2 ISOLATION vs.
SWITCH CONTROL VOLTAGE (H)
6
–0.4
5
f = 1.0 GHz
4
Lins
2.5 GHz
–0.5
3
2
–0.6
1
–0.7
–5
Isolation ISL (dB)
–0.3
3.0
0
Switch Control Current Icont (μA)
–0.2
Insertion Loss Lins (dB)
2.5
2.0
Frequency f (GHz)
0
Input Return Loss RLin (dB)
–10
–10
–15
f = 2.5 GHz
–20
–25
1.0 GHz
–30
–35
Icont
–0.8
1.5
2.0
2.5
3.0
0
3.5
–40
1.5
2.0
2.5
3.0
3.5
Switch Control Voltage (H) Vcont (H) (V)
Switch Control Voltage (H) Vcont (H) (V)
Remark The graphs indicate nominal characteristics.
Data Sheet PG10759EJ01V0DS
7
μPG2406T6R
RFC-RF1/RF2 OUTPUT RETURN LOSS vs.
SWITCH CONTROL VOLTAGE (H)
0
0
–5
–5
Output Return Loss RLout (dB)
–10
–15
–20
f = 2.5 GHz
–25
–30
1.0 GHz
–35
–40
–45
–50
1.5
2.0
2.5
3.0
–10
–15
f = 2.5 GHz
–20
–25
–30
1.0 GHz
–35
–40
–45
–50
1.5
3.5
2.0
RFC-RF1/RF2 INSERTION LOSS,
Icont vs. INPUT POWER
RFC-RF1/RF2 INSERTION LOSS,
Icont vs. INPUT POWER
6
5
Lins
4
–1.0
1.8 V
3
–1.5
2
–2.0
2.7 V
1
–2.5
Icont
–3.0
15
20
1.8 V
3
–1.5
2
–2.0
2.7 V
1
Icont
0
35
30
–3.0
15
20
1.8 V
0
35
30
25
Input Power Pin (dBm)
Input Power Pin (dBm)
RFC-RF1/RF2 INPUT POWER vs.
SWITCH CONTROL VOLTAGE (H)
RFC-RF1/RF2
INPUT POWER vs. FREQUENCY
38
Input Power Pin (dBm)
30
Input Power Pin (dBm)
4
–1.0
–2.5
f = 2.5 GHz
28
Pin (0.1 dB)
26
24
22
This data has changed the value
36 of the DC blocking capacitors
according to the frequency.
34
Vcont (H) = 2.7 V
32
30
28
Pin (0.1 dB)
26
24
22
2.0
2.5
3.0
3.5
20
0.0
Switch Control Voltage (H) Vcont (H) (V)
0.5
1.0
1.5
2.0
Frequency f (GHz)
Remark The graphs indicate nominal characteristics.
8
5
Lins
1.8 V
25
f = 2.5 GHz
Vcont (H) = 2.7 V
–0.5
32
20
1.5
6
0
Insertion Loss Lins (dB)
Insertion Loss Lins (dB)
f = 1.0 GHz
Switch Control Current Icont (μA)
0
–0.5
3.5
Switch Control Voltage (H) Vcont (H) (V)
Switch Control Voltage (H) Vcont (H) (V)
Vcont (H) = 2.7 V
3.0
2.5
Data Sheet PG10759EJ01V0DS
2.5
3.0
Switch Control Current Icont (μA)
Input Return Loss RLin (dB)
RFC-RF1/RF2 INPUT RETURN LOSS vs.
SWITCH CONTROL VOLTAGE (H)
μPG2406T6R
MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS
6-PIN PLASTIC TSSON (T6R) (UNIT: mm)
MOUNTING PAD
0.58
1.2
6-0.22
0.35
0.35
SOLDER MASK
0.73
1.2
0.33
6-0.15
0.35
0.35
Remark The mounting pad and solder mask layouts in this document is for reference only.
When designing PCB, please consider workability of mounting, solder joint reliability, prevention of solder
bridge and so on, in order to optimize the design.
Data Sheet PG10759EJ01V0DS
9
μPG2406T6R
PACKAGE DIMENSIONS
6-PIN PLASTIC TSSON (T6R) (UNIT: mm)
(Top View)
1.0±0.1
1.0±0.1
(Bottom View)
0.15+0.07
–0.05
A
0.08 MIN.
A
0.15+0.07
–0.05
A
A
0.45 ±0.1
0.35±0.06
0.35±0.06
1.0±0.1
0.08 MIN.
1.0±0.1
0.13±0.07
0.175±0.075
0.23±0.07
Remark A > 0
10
Data Sheet PG10759EJ01V0DS
0.37+0.03
–0.05
μPG2406T6R
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Partial Heating
Soldering Conditions
Condition Symbol
Peak temperature (package surface temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220°C or higher
: 60 seconds or less
Preheating time at 120 to 180°C
: 120±30 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
: 350°C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
IR260
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10759EJ01V0DS
11
μPG2406T6R
Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A.
• The information in this document is current as of April, 2009. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or
data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all
products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
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property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
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customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
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redundancy, fire-containment and anti-failure features.
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The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC
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The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
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(Note)
(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E 02. 11-1
12
Data Sheet PG10759EJ01V0DS
μPG2406T6R
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.