POWERSEM PSHM40D-06

ECO-PACTM 2
CoolMOS Power MOSFET
PSHM 40D/06
in ECO-PAC 2
N-Channel Enhancement Mode
Low RDSon, High VDSS MOSFET
Package with Electrically Isolated Base
ID25
VDSS
RDSon
1)
L4
L6
L9
P18
R18
K12
NTC
F10
Preliminary Data Sheet
K13
MOSFET
Symbol
VDSS
VGS
ID25
ID90
dv/dt
EAS
EAR
Symbol
RDSon
VGSth
IDSS
IGSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
VF
RthJC
= 38 A
= 600 V
Ω
= 70 mΩ
Features
Conditions
TVJ = 25°C to 150°C
TC = 25°C
TC = 90°C
VDS < VDSS; IF ≤ 50A;diF/dt≤ 200A/µs
TVJ = 150°C
ID = 10 A; L = 36 mH; TC = 25°C
ID = 20 A; L = 5 µH; TC = 25°C
Maximum Ratings
600
V
±20
V
38
A
25
A
6
V/ns
1.8
1
J
mJ
Characteristic Values
(TVJ = 25°C, unless otherwise specified)
min.
typ. max.
VGS = 10 V; ID = ID90
70 m Ω
VDS = 20 V; ID = 3 mA;
3.5
5.5
V
VDS = VDSS; VGS = 0 V; TVJ = 25°C
25 µA
TVJ = 125°C
60
µA
VGS = ±20 V; VDS = 0 V
100 nA
220
nC
55
nC
VGS= 10 V; VDS = 350 V; ID = 50 A
125
nC
30
ns
95
ns
VGS= 10 V; VDS = 380 V;
100
ns
ID = 25 A; RG = 1.8 Ω
10
ns
(reverse conduction) IF = 20 A; VGS = 0 V
0.9
1.1
V
per MOSFET
0.45 K/W
•
ECO-PAC 2 with DCB Base
- Electrical isolation towards the
heatsink
- Low coupling capacitance to the heatsink
for reduced EMI
- High power dissipation
- High temperature cycling capability
of chip on DCB
- solderable pins for DCB mounting
•
fast CoolMOS power MOSFET - 2nd generation
- High blocking capability
- Low on resistance
- Avalanche rated for unclamped
inductive switching (UIS)
- Low thermal resistance
due to reduced chip thickness
•
•
Enhanced total power density
UL registered, E148688
Conditions
Applications
•
•
•
•
•
Switched mode power supplies (SMPS)
Uninterruptible power supplies (UPS)
Power factor correction (PFC)
Welding
Inductive heating
Advantages
•
•
•
Data according to IEC 60747 refer to a single diode or transistor unless otherwise stated
•
•
Caution: These Devices are sensitive
to electrostatic discharge. Users should
observe proper ESD handling precautions.
1)
Easy to mount with two screws
Space and weight savings
Improved temperature and power
cycling capability
High power density
Small and light weight
CoolMOS is a trademark of Infineon Technologies AG.
 2003 POWERSEM reserves the right to change limits, test conditions and dimensions
POWERSEM GmbH, Walpersdorfer Str. 53
D - 91126 Schwabach
Phone: 09122 - 9764 - 0 FAX: 09122 - 9764 - 20
ECO-PACTM 2
Reverse diodes (FRED)
Symbol
IF25
IF80
Conditions
TC = 25°C
TC = 80°C
Symbol
Conditions
VF
IRM
t rr
RthJC
RthJH
Maximum Ratings
18.5
A
12.0
A
Dimensions in mm (1 mm = 0.0394")
Characteristic Values
min.
typ. max.
IF = 15 A; TVJ = 25°C
2.58 2.64
V
TVJ = 125°C
1.8
V
IF = 10 A; diF/dt = 400 A/µs; TVJ = 125°C
7
A
VR = 300 V; VGE = 0 V
70
ns
3.5 K/W
with heatsink compound (0.42 K/m.K; 50 µm)
7
K/W
Temperature Sensor NTC
Symbol
Conditions
R25
B25/50
T = 25°C
Characteristic Values
min. typ. max.
4.75
5.0
5.25 kΩ
3375
K
Module
Symbol
TVJ
Tstg
VISOL
Md
Conditions
a
Max. allowable acceleration
Symbol
Conditions
dS
dA
Weight
Creepage distance on surface (Pin to heatsink)
Strike distance in air (Pin to heatsink)
IISOL ≤ 1 mA; 50/60 Hz; t = 1 s
Mounting torque (M4)
Maximum Ratings
-40...+150
-40...+125
3600
1.5 - 2.0
14 - 18
50
°C
°C
V~
Nm
lb.in.
m/s 2
Characteristic Values
min. typ. max.
11.2
mm
11.2
mm
24
g
 2003 POWERSEM reserves the right to change limits, test conditions and dimensions
POWERSEM GmbH, Walpersdorfer Str. 53
D - 91126 Schwabach
Phone: 09122 - 9764 - 0 FAX: 09122 - 9764 - 20