IXYS VHM40-06P1

VHM40-06P1
ID25 = 38 A
VDSS = 600 V
Ω
RDSon = 70 mΩ
CoolMOS Power MOSFET
in ECO-PAC 2
N-Channel Enhancement Mode
Low RDSon, High VDSS MOSFET
Package with Electrically Isolated Base
1)
L4
L6
K 12
Preliminary data sheet
L9
P 18
R 18
NTC
F10
K 13
K10
Pin arangement see outlines
T 18
V 18
X 18
Features
MOSFET
Symbol
Conditions
VDSS
TVJ = 25°C to 150°C
ID25
ID90
TC = 25°C
TC = 90°C
dv/dt
VDS < VDSS; IF ≤ 50A;diF/dt≤ 200A/µs
TVJ = 150°C
EAS
EAR
ID = 10 A; L = 36 mH; TC = 25°C
ID = 20 A; L = 5 µH; TC = 25°C
Conditions
600
V
±20
V
38
25
A
A
6
V/ns
1.8
1
J
mJ
Characteristic Values
(TVJ = 25°C, unless otherwise specified)
min.
typ. max.
RDSon
VGS = 10 V; ID = ID90
VGSth
VDS = 20 V; ID = 3 mA;
IDSS
VDS = VDSS; VGS = 0 V; TVJ = 25°C
TVJ = 125°C
IGSS
ECO-PAC 2 with DCB Base
- Electrical isolation towards the heatsink
- Low coupling capacitance to the heatsink for
reduced EMI
- High power dissipation
- High temperature cycling capability
of chip on DCB
- solderable pins for DCB mounting
●
fast CoolMOS power MOSFET - 2nd generation
- High blocking capability
- Low on resistance
- Avalanche rated for unclamped
inductive switching (UIS)
- Low thermal resistance
due to reduced chip thickness
●
Enhanced total power density
Maximum Ratings
VGS
Symbol
●
70 mΩ
3.5
5.5
60
VGS = ±20 V; VDS = 0 V
V
220
55
125
nC
nC
nC
td(on)
tr
td(off)
tf
VGS= 10 V; VDS = 380 V;
ID = 25 A; RG = 1.8 Ω
30
95
100
10
ns
ns
ns
ns
RthJC
per MOSFET
●
●
●
●
Switched mode power supplies (SMPS)
Uninterruptible power supplies (UPS)
Power factor correction (PFC)
Welding
Inductive heating
100 nA
VGS= 10 V; VDS = 350 V; ID = 50 A
(reverse conduction) IF = 20 A; VGS = 0 V
●
25 µA
µA
Qg
Qgs
Qgd
VF
Applications
0.9
1.1
V
0.45 K/W
Data according to IEC 60747 refer to a single diode or transistor unless otherwise stated
IXYS reserves the right to change limits, test conditions and dimensions.
© 2002 IXYS All rights reserved
CoolMOS is a trademark of Infineon Technologies AG.
238
1)
1-2
VHM40-06P1
Reverse diodes (FRED)
Dimensions in mm (1 mm = 0.0394")
Symbol
Conditions
Maximum Ratings
IF25
IF80
TC = 25°C
TC = 80°C
18.5
12.0
Symbol
Conditions
Characteristic Values
min.
typ. max.
VF
IF = 15 A;
IRM
t rr
IF = 10 A; diF/dt = 400 A/µs; TVJ = 125°C
VR = 300 V; VGE = 0 V
RthJC
RthJH
with heatsink compound (0.42 K/m.K; 50 µm)
TVJ = 25°C
TVJ = 125°C
2.58
1.8
A
A
2.64
V
V
7
70
A
ns
7
3.5 K/W
K/W
Temperature Sensor NTC
Symbol
Conditions
Characteristic Values
min. typ. max.
R25
B25/50
T = 25°C
4.75
5.0
3375
5.25 kΩ
K
Module
Conditions
Maximum Ratings
TVJ
Tstg
-40...+150
-40...+125
°C
°C
3600
V~
1.5 - 2.0
14 - 18
50
Nm
lb.in.
m/s2
VISOL
IISOL ≤ 1 mA; 50/60 Hz; t = 1 s
Md
mounting torque (M4)
a
Max. allowable acceleration
Symbol
Conditions
Characteristic Values
min. typ. max.
dS
dA
Creepage distance on surface (Pin to heatsink)
Strike distance in air (Pin to heatsink)
11.2
11.2
Weight
IXYS reserves the right to change limits, test conditions and dimensions.
© 2002 IXYS All rights reserved
mm
mm
24
g
238
Symbol
2-2