SCAS234B − JULY 1990 − REVISED OCTOBER 1996 D Members of the Texas Instruments D D D D D D 54AC16240 . . . WD PACKAGE 74AC16240 . . . DL PACKAGE (TOP VIEW) Widebus Family 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers Flow-Through Architecture Optimizes PCB Layout Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-µm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic 300-mil Shrink Small-Outline (DL) Package Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Pin Spacings 1OE 1Y1 1Y2 GND 1Y3 1Y4 VCC 2Y1 2Y2 GND 2Y3 2Y4 3Y1 3Y2 GND 3Y3 3Y4 VCC 4Y1 4Y2 GND 4Y3 4Y4 4OE description The ’AC16240 are 16-bit buffers and line drivers designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. They can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. These devices provide inverting outputs and symmetrical active-low output-enable (OE) inputs. 1 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 32 18 31 19 30 20 29 21 28 22 27 23 26 24 25 2OE 1A1 1A2 GND 1A3 1A4 VCC 2A1 2A2 GND 2A3 2A4 3A1 3A2 GND 3A3 3A4 VCC 4A1 4A2 GND 4A3 4A4 3OE The 74AC16240 is packaged in TI’s shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed circuit board area. The 54AC16240 is characterized for operation over the full military temperature range of −55°C to 125°C. The 74AC16240 is characterized for operation from −40°C to 85°C. FUNCTION TABLE (each 4-bit buffer) INPUTS OUTPUT Y OE A L H L L L H H X Z Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC and Widebus are trademarks of Texas Instruments Incorporated. Copyright 1996, Texas Instruments Incorporated !"#$%&' #"'(' ')"*%("' #$**&' ( ") +$,-#("' !(&. *"!$# #"')"*% " +&#)#("' +&* & &*% ") &/( '*$%&' ('!(*! 0(**('1. *"!$#"' +*"#&'2 !"& '" '&#&(*-1 '#-$!& &'2 ") (-+(*(%&&*. • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 1 SCAS234B − JULY 1990 − REVISED OCTOBER 1996 logic symbol† 1OE 2OE 3OE 4OE 1A1 1A2 1A3 1A4 2A1 2A2 2A3 2A4 3A1 3A2 3A3 3A4 4A1 4A2 4A3 4A4 1 48 25 24 EN1 EN2 EN3 EN4 47 1 1 46 3 44 5 43 6 41 1 2 8 40 9 38 11 37 12 36 1 3 13 35 14 33 16 32 17 30 19 1 4 29 20 27 22 26 23 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. 2 2 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 1Y1 1Y2 1Y3 1Y4 2Y1 2Y2 2Y3 2Y4 3Y1 3Y2 3Y3 3Y4 4Y1 4Y2 4Y3 4Y4 SCAS234B − JULY 1990 − REVISED OCTOBER 1996 logic diagram (positive logic) 1OE 1A1 1A2 1A3 1A4 2OE 2A1 2A2 2A3 2A4 1 3OE 47 2 46 3 44 5 43 6 1Y1 3A1 1Y2 3A2 1Y3 3A3 1Y4 3A4 48 4OE 41 8 40 9 38 11 37 12 2Y1 4A1 2Y2 4A2 2Y3 4A3 2Y4 4A4 25 36 13 35 14 33 16 32 17 3Y1 3Y2 3Y3 3Y4 24 30 19 29 20 27 22 26 23 4Y1 4Y2 4Y3 4Y4 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±400 mA Maximum power dissipation at TA = 55°C (in still air)(see Note 2): DL package . . . . . . . . . . . . . . . . . . . . 1.2 W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils. • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 3 SCAS234B − JULY 1990 − REVISED OCTOBER 1996 recommended operating conditions (see Note 3) 54AC16240 VCC VIH Supply voltage VCC = 3 V VCC = 4.5 V High-level input voltage VCC = 5.5 V VCC = 3 V VIL VI VO IOH IOL ∆t/∆v MIN NOM MAX 3 5 5.5 Input voltage 3 5 5.5 3.15 3.85 3.85 0.9 1.35 1.35 1.65 1.65 0 VCC VCC 0 −4 −4 −24 −24 VCC = 5.5 V VCC = 3 V −24 −24 12 12 VCC = 4.5 V VCC = 5.5 V 24 24 24 24 Input transition rise or fall rate TA Operating free-air temperature NOTE 3: Unused inputs must be held high or low to prevent them from floating. UNIT V V 0.9 VCC VCC 0 Low-level output current MAX 3.15 VCC = 3 V VCC = 4.5 V High-level output current NOM 2.1 0 Output voltage MIN 2.1 VCC = 4.5 V VCC = 5.5 V Low-level input voltage 74AC16240 V V V mA mA 0 10 0 10 ns/V −55 125 −40 85 °C electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = − 50 µA VOH VCC TA = 25°C MIN TYP MAX 54AC16240 MIN MIN 3V 2.9 2.9 2.9 4.5 V 4.4 4.4 4.4 5.5 V 5.4 5.4 5.4 3V 2.58 2.48 2.48 4.5 V 3.94 3.8 3.8 IOH = − 24 mA 5.5 V 4.94 IOH = − 75 mA† 5.5 V IOH = − 4 mA IOL = 50 µA 4.8 4.8 3.85 3.85 MAX V 3V 0.1 0.1 0.1 4.5 V 0.1 0.1 0.1 5.5 V 0.1 0.1 0.1 IOL = 12 mA UNIT 3V 0.36 0.44 0.44 4.5 V 0.36 0.44 0.44 IOL = 24 mA 5.5 V 0.36 0.44 0.44 IOL = 75 mA† 5.5 V 1.65 1.65 II IOZ VI = VCC or GND VO = VCC or GND 5.5 V ±0.1 ±1 ±1 µA 5.5 V ±0.5 ±5 ±5 µA ICC Ci VI = VCC or GND, VI = VCC or GND 8 80 80 µA VOL IO = 0 5.5 V 5V 4.5 Co VO = VCC or GND 5V 12 † Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms. ')"*%("' #"'#&*' +*"!$# ' & )"*%(3& "* !&2' +(& ") !&3&-"+%&'. (*(#&*# !(( ('! "&* +&#)#("' (*& !&2' 2"(-. &/( '*$%&' *&&*3& & *2 " #('2& "* !#"''$& && +*"!$# 0"$ '"#&. 4 MAX 74AC16240 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • V pF pF SCAS234B − JULY 1990 − REVISED OCTOBER 1996 switching characteristics over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A Y tPZH tPZL OE Y tPHZ tPLZ OE Y MIN TA = 25°C TYP MAX 54AC16240 MIN 74AC16240 MAX MIN MAX 1.8 5.4 7.5 1.8 8.3 1.8 8.3 2.5 7 9.3 2.5 10.2 2.5 10.2 2.1 6.1 8.5 2.1 9.5 2.1 9.5 2.9 8.4 11.3 2.9 12.6 2.9 12.6 4.3 6.2 8.3 4.3 8.7 4.3 8.7 3.6 6 7.8 3.6 8.4 3.6 8.4 UNIT ns ns ns switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A Y tPZH tPZL OE Y tPHZ tPLZ OE Y TA = 25°C MIN TYP MAX 54AC16240 74AC16240 MIN MAX MIN MAX 1.3 3.3 5.3 1.3 5.8 1.3 5.8 1.9 4.3 6.5 1.9 7.1 1.9 7.1 1.6 3.8 5.9 1.6 6.6 1.6 6.6 3.2 4.7 7.2 3.2 8.1 3.2 8.1 4.2 6 7.7 4.2 8.1 4.2 8.1 3.4 5.1 6.9 3.4 7.3 3.4 7.3 UNIT ns ns ns operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd TEST CONDITIONS Outputs enabled Power dissipation capacitance per latch Outputs disabled CL = 50 pF, f = 1 MHz TYP 42 6 UNIT pF ')"*%("' #"'#&*' +*"!$# ' & )"*%(3& "* !&2' +(& ") !&3&-"+%&'. (*(#&*# !(( ('! "&* +&#)#("' (*& !&2' 2"(-. &/( '*$%&' *&&*3& & *2 " #('2& "* !#"''$& && +*"!$# 0"$ '"#&. • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 5 SCAS234B − JULY 1990 − REVISED OCTOBER 1996 PARAMETER MEASUREMENT INFORMATION 2 × VCC S1 500 Ω From Output Under Test Open GND CL = 50 pF (see Note A) TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 2 × VCC GND 500 Ω LOAD CIRCUIT Output Control (low-level enabling) VCC 50% Input 50% 0V tPHL tPLH In-Phase Output tPLH tPHL Out-of-Phase Output Output Waveform 2 S1 at GND (see Note B) VOH 50% VCC VOL 50% VCC 0V tPZL tPLZ Output Waveform 1 S1 at 2 × VCC (see Note B) VOH 50% VCC VOL 50% VCC VCC 50% 50% 50% VCC VOL tPHZ tPZH VOLTAGE WAVEFORMS [ VCC 20% VCC 50% VCC 80% VCC VOH [0V VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns. D. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 6 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • PACKAGE OPTION ADDENDUM www.ti.com 30-Mar-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74AC16240DL OBSOLETE SSOP DL 48 TBD Call TI Call TI 74AC16240DLR OBSOLETE SSOP DL 48 TBD Call TI Call TI Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0°–ā8° 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DLP® Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com www.dlp.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2009, Texas Instruments Incorporated