Data Sheet, Revision 1 May 5, 2004 LCK4993/LCK4994 Low-Voltage PLL Clock Drivers 1 Features ■ 12 MHz—100 MHz (LCK4993), or 24 MHz—200 MHz (LCK4994) output operation ■ Matched pair output skew <200 ps ■ Zero input-to-output delay ■ 18 LVTTL 50% duty-cycle outputs capable of driving 50 Ω terminated lines ■ 3.3 V/2.5 V LVTTL/LV differential (LVPECL) fault tolerant and hot insertable reference inputs ■ Phase adjustments from 625 ps up to 1300 ps steps up to ±10.4 ns ■ Output divide ratios of (1—6, 8, 10, 12) ■ Multiply ratios of (1—6, 8) x input frequency ■ Individual output bank disable for aggressive power management and EMI reduction ■ Output high-impedance (HI-Z) option for testing purposes ■ Fully integrated PLL with lock indicator ■ Single 3.3 V/2.5 V ± 10% supply ■ 100-pin TQFP package ■ 100-ball FSBGA package ■ Pin-for-pin compatible with CYPRESS® CY7B993V and CY7B994V 2 Description The LCK4993 and LCK4994 low-voltage PLL clock drivers offer user-selectable control over system clock functions. The multiple-output clock drivers provide the system integrator with functions necessary to optimize the timing of high-performance computer and communication systems. Each of the eighteen configurable outputs drive terminated transmission lines with impedances as low as 50 Ω while delivering minimal and specified output skews at LVTTL levels. The outputs are arranged in five banks. Banks 1—4 allow a divide function of 1 to 12, while simultaneously allowing phase adjustments in 625 ps—1300 ps increments up to 10.4 ns. One of the output banks also includes an independent clock invert function. The feedback bank consists of two outputs that allow divide-by functionality from 1 to 12 and limited phase adjustments. Any one of these eighteen outputs can be connected to the feedback input or drive other inputs. Selectable reference input is a fault tolerance feature that allows smooth change over to the secondary clock source when the primary clock source is not in operation. The reference inputs and feedback inputs are configurable to accommodate both LVTTL or differential (LVPECL) inputs. The completely integrated PLL reduces jitter and simplifies board layout. LCK4993/LCK4994 Low-Voltage PLL Clock Drivers Data Sheet, Revision 1 May 5, 2004 Table of Contents Contents Page 1 Features .............................................................................................................................................................................1 2 Description ..........................................................................................................................................................................1 3 Functional Block Diagram ...................................................................................................................................................3 4 Pin Information ...................................................................................................................................................................4 4.1 100-Pin TQFP Diagram ...............................................................................................................................................4 4.2 Pin Descriptions ...........................................................................................................................................................5 5 Functional Description ........................................................................................................................................................7 5.1 Phase Frequency Detector and Filter ..........................................................................................................................7 5.2 VCO, Control Logic, Divider, and Phase Generator ....................................................................................................7 5.3 Time Unit Definition .....................................................................................................................................................7 5.4 Divide and Phase Select Matrix ...................................................................................................................................8 5.5 Timing Relationship of Programmable Skew Outputs .................................................................................................9 5.6 Output Disable Description ........................................................................................................................................10 5.7 INV3 Pin Function ......................................................................................................................................................10 5.8 Lock Detect Output Description .................................................................................................................................10 5.9 Factory Test Mode Description ..................................................................................................................................11 5.9.1 Factory Test Reset ...........................................................................................................................................11 5.10 Absolute Maximum Ratings .....................................................................................................................................11 5.11 Handling Precautions ..............................................................................................................................................12 5.12 Thermal Parameters (Definitions and Values) .........................................................................................................12 6 Electrical Characteristics ..................................................................................................................................................14 7 Timing ...............................................................................................................................................................................18 7.1 Switching Characteristics ..........................................................................................................................................18 7.2 ac Test Loads and Waveforms ..................................................................................................................................21 7.3 ac Timing Diagrams ...................................................................................................................................................22 8 Outline Diagrams ..............................................................................................................................................................23 8.1 100-Pin TQFP ............................................................................................................................................................23 8.2 100-Ball FSBGA ........................................................................................................................................................24 9 Ordering Information .........................................................................................................................................................25 Tables Table 4-1. 100-Pin FSBGA Pin Assignments .........................................................................................................................4 Table 4-2. 100-Pin TQFP Descriptions ...................................................................................................................................5 Table 5-1. Frequency Range Select .......................................................................................................................................7 Table 5-2. N Factor Determination..........................................................................................................................................7 Table 5-3. Output Skew Select Function ................................................................................................................................8 Table 5-4. Output Divider Function .........................................................................................................................................8 Table 5-5. DIS[1:4]/FBDIS Pin Functionality.........................................................................................................................10 Table 5-6. Factory Test Mode Frequency Divide Select ....................................................................................................... 11 Table 5-7. Absolute Maximum Ratings ................................................................................................................................. 11 Table 5-8. Handling Precautions...........................................................................................................................................12 Table 5-9. Thermal Parameter Values ..................................................................................................................................13 Table 6-1. Electrical Characteristics (TA –40 °C to +85 °C, VDD = 3.3 V ± 10%)..................................................................14 Table 6-2. Electrical Characteristics (TA –40 °C to +85 °C, VDD = 2.5 V ± 10%)..................................................................16 Table 7-1. Switching Characteristics (TA –40 °C to +85 °C, VDD = 3.3 V ± 10%) .................................................................18 Table 7-2. Switching Characteristics (TA –40 °C to +85 °C, VDD = 2.5 V ± 10%) .................................................................20 Table 9-1. LCK4993 Ordering Information............................................................................................................................25 Table 9-2. LCK4994 Ordering Information............................................................................................................................25 Figures Figure 3-1. LCK4993 and LCK4994 Functional Block Diagram .............................................................................................3 Figure 4-1. 100-Pin TQFP Package (Top View).....................................................................................................................4 Figure 5-1. Typical Outputs with FB Connected to a Zero-Skew Output................................................................................9 Figure 7-1. ac Test Loads and Waveforms ..........................................................................................................................21 Figure 7-2. ac Timing Diagrams ...........................................................................................................................................22 2 Agere Systems Inc. Data Sheet, Revision 1 May 5, 2004 LCK4993/LCK4994 Low-Voltage PLL Clock Drivers 3 Functional Block Diagram FBKA+ FBKA– FBKB+ FBKB– FBSEL LOCK PHASE FREQUENCY DETECTOR REFA+ REFA– REFB+ REFB– REFSEL FEEDBACK BANK BANK 4 BANK 3 BANK 2 BANK 1 FILTER VCO FS 3 OUTPUT_MODE 3 FBF0 FBDS0 3 FBDS1 FBDIS 3 4F0 4F1 3 4DS0 4DS1 DIS4 3 3F0 3 3F1 3 3DS0 3DS1 DIS3 INV3 3 2F0 2F1 2DS0 2DS1 DIS2 3 1F0 3 1F1 3 1DS0 1DS1 DIS1 3 3 3 3 3 3 3 3 3 DIVIDE AND PHASE SELECT MATRIX DIVIDE AND PHASE SELECT MATRIX CONTROL LOGIC DIVIDE AND PHASE GENERATOR QFA0 QFA1 4QA0 4QA1 4QB0 4QB1 DIVIDE AND PHASE SELECT MATRIX 3QA0 3QA1 3QB0 3QB1 DIVIDE AND PHASE SELECT MATRIX 2QA0 2QA1 2QB0 2QB1 DIVIDE AND PHASE SELECT MATRIX 1QA0 1QA1 1QB0 1QB1 Figure 3-1. LCK4993 and LCK4994 Functional Block Diagram Agere Systems Inc. 3 LCK4993/LCK4994 Low-Voltage PLL Clock Drivers Data Sheet, Revision 1 May 5, 2004 4 Pin Information 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 VDDQ REFA+ REFA– REFSEL REFB– REFB+ 2F0 FS GND 2QA0 VDDN 2QA1 GND GND 2QB0 VDDN 2QB1 GND FBF0 1F0 GND VDDQ FBDIS DIS4 DIS3 VDDQ GND 39 40 41 42 43 44 45 46 47 48 49 50 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 27 28 29 30 31 32 33 34 35 36 37 38 26 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 GND GND GND VDDQ VDDQ 2F1 1F1 DIS1 DIS2 GND 3QA0 VDDN 3QA1 GND GND 3QB0 VDDN 3QB1 GND VDDQ INV3 GND GND 3F1 4F1 3F0 4F0 4DS1 3DS1 GND 4QB1 VDDN 4QB0 GND GND 4QA1 VDDN 4QA0 GND 2DS1 1DS1 VDDQ 4DS0 3DS0 2DS0 1DS0 GND 100 99 98 97 96 95 LOCK FBDS1 FBDS0 GND 1QB1 VDDN 1QB0 GND GND 1QA1 VDDN 1QA0 GND GND QFA0 VDDN QFA1 GND GND FBKB+ FBKB– FBSEL FBKA– FBKA+ VDDQ 4.1 100-Pin TQFP Diagram OUTPUT_MODE 5-8885 (F) r.1 Figure 4-1. 100-Pin TQFP Package (Top View) Table 4-1. 100-Pin FSBGA Pin Assignments 4 1 2 3 4 5 6 7 8 9 10 A 1QB1 1QB0 1QA1 1QA0 QFA0 QFA1 FBKB+ VDDQ FBKA– FBKA+ B VDDN VDDN VDDN VDDN VDDN VDDN VDDQ FBKB– FBSEL REFA+ C GND GND GND GND GND GND VDDQ GND GND REFA– D LOCK 4F0 3F1 GND FBDS1 FBDS0 2F0 VDDQ REFSEL REFB– E 4QB1 VDDN 4DS1 GND 3F0 4F1 GND FS VDDN REFB+ F 4QB0 VDDN 3DS1 GND GND GND GND FBF0 VDDN 2QA0 G 4QA1 2DS1 VDDQ GND GND GND GND VDDQ 1F0 2QA1 H 4QA0 1DS1 1DS0 VDDQ GND GND VDDQ OUTPUT_ MODE FBDIS 2QB0 J 4DS0 3DS0 2DS0 DIS1 VDDN VDDN GND INV3 DIS3 2QB1 K 2F1 1F1 DIS2 VDDN 3QA0 3QA1 GND 3QB0 3QB1 DIS4 Agere Systems Inc. Data Sheet, Revision 1 May 5, 2004 LCK4993/LCK4994 Low-Voltage PLL Clock Drivers 4.2 Pin Descriptions For all 3-state inputs, low indicates a connection to GND, mid indicates an open connection, and high indicates a connection to VDD. Internal termination circuitry holds an unconnected input to VDD/2. Table 4-2. 100-Pin TQFP Descriptions Pin Symbol Type I/O 1, 8, 12, 13, 17, 25—28, 35, 39, 40, 44, 47, 50, 55, 58, 62, 63, 67, 82, 83, 87, 88, 92, 93, 97 2—5, 31, 32, 56, 69 GND Power — Ground. [1:4]F[0:1] 6, 7, 18, 19, 21—24 [1:4]DS[0:1] 9, 11, 14, 16, 36, 38, 41, 43, 59, 61, 64, 66, 89, 91, 94, 96 10, 15, 37, 42, 60, 65, 85, 90, 95 20, 29, 30, 45, 49, 54, 75, 76 33, 34, 51, 52 [1:4]Q[A:B][0:1] 3-Level Input 3-Level Input LVTTL VDDN Power Output Phase Function Select. Each pair controls the phase function of the respective bank of outputs, see Table 5-3. I Output Divider Function Select. Each pair controls the divide function of the respective bank of outputs, see Table 5-4. O Clock Output. These outputs provide numerous divide and phase select functions determined by the [1:4]DS[0:1] and [1:4]F[0:1] inputs. — Output Buffer Power. Power supply for each output pair. VDDQ Power — Internal Power. Power supply for the internal circuitry. DIS[1:4] LVTTL Id 46 INV3 3-Level Input I OUTPUT_MODE 3-Level Input I 48 I 53 FBDIS LVTTL Id 57 FBF0 3-Level Input I 68 FS 3-Level Input REFB+, REFB–, LVTTL/ REFA–, REFA+ LVDIFF I 70, 71, 73, 74 Description I Output Disable. Each input controls the state of the respective output bank. Low = the [1:4]Q[A:B][0:1] is enabled, see Table 5-5. High = the output bank is disabled to the hold-off or HI-Z state; the disable state is determined by OUTPUT_MODE. Invert Mode. This input only affects Bank3. Low = each matched output pair will become complementary (3QA0+, 3QA1–, 3QB0+, 3QB1–). Mid = all four outputs will be noninverting. High = all four outputs in the same bank will be inverted. Output Mode. This pin determines the clock outputs’ disable state. Low = the clock outputs will disable to hold-off mode. Mid = the device enters factory test mode. High = the clock outputs will disable to HI-Z. Feedback Disable. This input controls the state of QFA[0:1]. Low = the QFA[0:1] is enabled, see Table 5-5. High = the QFA[0:1] is disabled to the hold-off or HI-Z state; the disable state is determined by OUTPUT_MODE. Feedback Output Phase Function Select. This input determines the phase function of the feedback banks QFA[0:1] outputs, see Table 5-3. Frequency Select. This input must be set according to the nominal frequency (fNOM), see Table 5-1). Reference Inputs. These inputs can operate as differential PECL or single-ended TTL reference inputs to the PLL. When operating as a single-ended LVTTL input, the complementary input must be left open. Note: Id = each input has an internal pull-down resistor. Agere Systems Inc. 5 LCK4993/LCK4994 Low-Voltage PLL Clock Drivers Data Sheet, Revision 1 May 5, 2004 Table 4-2. 100-Pin TQFP Descriptions (continued) Pin 72 Symbol REFSEL Type I/O Description LVTTL d Reference Input Select. The REFSEL input controls how the reference input is configured. I 77, 78, 80, 81 FBKA+, FBKA–, FBKB–, FBKB+ LVTTL/ LVDIFF I 79 FBSEL LVTTL Id 84, 86 QFA[0:1] LVTTL 98, 99 FBDS[0:1] 100 LOCK 3-Level Input LVTTL Low = REFSEL uses the REFA pair as the reference input. High = REFSEL uses the REFB pair as the reference input. Feedback Inputs. One pair of inputs selected by the FBSEL is used to feedback the clock output xQn to the phase detector. The PLL will operate so that the rising edges of the reference and feedback signals are aligned in both phase and frequency. These inputs can operate as differential PECL or single-ended TTL inputs. When operating as a single-ended LVTTL input, the complementary input must be left open. Feedback Input Select. Low = FBKA inputs are selected. High = FBKB inputs are selected. O Clock Feedback Output. This pair of clock outputs is intended to be connected to the FB input. These outputs have numerous divide options and three choices of phase adjustments. The function is determined by setting the FBDS[0:1] pins and FBF0. I Feedback Divider Function Select. These inputs determine the function of the QFA0 and QFA1 outputs, see Table 5-4. O PLL Lock Indicator. Low = the PLL is attempting to acquire lock. High = this output indicates the internal PLL is locked to the reference signal. Note: Id = each input has an internal pull-down resistor. 6 Agere Systems Inc. Data Sheet, Revision 1 May 5, 2004 LCK4993/LCK4994 Low-Voltage PLL Clock Drivers 5 Functional Description 5.1 Phase Frequency Detector and Filter These two blocks accept signals from the REF inputs (REFA+, REFA–, REFB+, or REFB–) and the FB inputs (FBKA+, FBKA–, FBKB+, or FBKB–). Correction information is then generated to control the frequency of the voltage-controlled oscillator (VCO). These two blocks, along with the VCO, form a phase-locked loop (PLL) that tracks the incoming REF signal. The devices have a flexible REF and FB input scheme. These inputs allow using either differential LVPECL or single-ended LVTTL inputs. To configure as single-ended LVTTL inputs, the complementary input pin must be left open (internally pulled to 1.5 V), and the other input pin can then be used as an LVTTL input. The REF inputs are also tolerant to hot insertion. The REF inputs can be changed dynamically. When changing from one reference input to the other reference input of the same frequency, the PLL is optimized to ensure that the clock output period will not be less than the calculated system budget (tMIN = tREF (nominal reference clock period) – tCCJ (cycle-to-cycle jitter) – tPDEV (maximum period deviation)) while reacquiring lock. 5.2 VCO, Control Logic, Divider, and Phase Generator The VCO accepts analog control inputs from the PLL filter block. The FS control pin setting determines the nominal operational frequency (fNOM) range of the divide-by-one output of the device. fNOM is directly related to the VCO frequency. There are two versions of the device, a low-speed device (LCK4993) where fNOM ranges from 12 MHz to 100 MHz, and a high-speed device (LCK4994) where fNOM ranges from 24 MHz to 200 MHz. The FS setting for each device is shown in Table 5-1. The fNOM frequency is seen on divide-by-one outputs. For the LCK4994, the upper fNOM range extends from 96 MHz to 200 MHz. Table 5-1. Frequency Range Select FS* LCK4993 fNOM (MHz) Min 12 24 48 Low Mid High LCK4994 fNOM (MHz) Max 26 52 100 Min 24 48 96 Max 52 100 200 * The level to be set on FS is determined by the fNOM of the VCO and phase generator. fNOM always appears on an output when the output is operating in the divide by 1 mode. The REF and FB are at fNOM when the output connected to FB is in the divide by 1 mode. 5.3 Time Unit Definition Selectable skew is in discrete increments of time unit (tU). The value of tU is determined by the FS setting and the fNOM frequency. The equation to be used to determine the tU is as follows: 1 t U = ------------------------f NOM × N (eq. 1) Where N is a multiplication factor, determined by the FS setting and is defined in Table 5-2; where fNOM is the nominal operating frequency of the VCO. Table 5-2. N Factor Determination FS Low Mid High Agere Systems Inc. N 64 32 16 LCK4993 fNOM (MHz) at which tU = 1.0 ns 15.265 31.25 62.5 N 32 16 8 LCK4994 fNOM (MHz) at which tU = 1.0 ns 31.25 62.5 125 7 LCK4993/LCK4994 Low-Voltage PLL Clock Drivers Data Sheet, Revision 1 May 5, 2004 5.4 Divide and Phase Select Matrix The divide and phase select matrix is comprised of five independent banks as follows: four banks for clock outputs and one bank for feedback. Each clock output bank has two pairs of low-skew, high-fanout output buffers ([1:4]Q[A:B][0:1]), two phase function select inputs ([1:4]F[0:1]), two divider function selects ([1:4]DS[0:1]), and one output disable (DIS[1:4]). The feedback bank has one pair of low-skew, high-fanout output buffers (QFA[0:1]). One of these outputs may connect to the selected feedback input (FBK[A:B]±). This feedback bank also has one phase function select input (FBF0), two divider function selects FSDS[0:1], and one output disable (FBDIS). The phase capabilities that are chosen by the phase function select pins are shown in Table 5-3. The divide capabilities for each bank are shown in Table 5-4. Table 5-3. Output Skew Select Function Function Selects Output Skew Function [1:4]F1 [1:4]F0 and FBF0 Bank1 Bank2 Bank3 Bank4 Feedback Bank Low Low –4 tU –4 tU –8 tU –8 tU –4 tU Low Mid –3 tU –3 tU –7 tU –7 tU NA Low High –2 tU –2 tU –6 tU –6 tU NA BK1* BK1* NA Mid Low – 1tU –1 tU Mid Mid 0 tU 0 tU 0 tU 0 tU 0 tU Mid High 1 tU 1 tU BK2† BK2† NA High Low 2 tU 2 tU 6 tU 6 tU NA High Mid 3 tU 3 tU 7 tU 7 tU NA High High 4 tU 4 tU 8 tU 8 tU 4 tU * BK1 denotes following the skew of Bank1. † BK2 denotes following the skew of Bank2. Table 5-4. Output Divider Function Function Selects* Output Divider Function [1:4]DS1 and FBDS1 [1:4]DS0 and FBDS0 Bank1 Bank2 Bank3 Bank4 Feedback Bank Low Low /1 /1 /1 /1 /1 Low Mid /2 /2 /2 /2 /2 Low High /3 /3 /3 /3 /3 Mid Low /4 /4 /4 /4 /4 Mid Mid /5 /5 /5 /5 /5 Mid High /6 /6 /6 /6 /6 High Low /8 /8 /8 /8 /8 High Mid /10 /10 /10 /10 /10 High High /12 /12 /12 /12 /12 * Output frequency = fNOM (VCO frequency)/value of output divisor. 8 Agere Systems Inc. Data Sheet, Revision 1 May 5, 2004 LCK4993/LCK4994 Low-Voltage PLL Clock Drivers 5.5 Timing Relationship of Programmable Skew Outputs t0 + 8 tU t0 + 7 tU t0 + 6 tU t0 + 5 tU t0 + 4 tU t0 + 3 tU t0 + 2 tU t0 + 1 tU t0 t0 – 1 tU t0 – 2 tU t0 – 3 tU t0 – 4 tU t0 – 5 tU t0 – 6 tU t0 – 7 tU t0 – 8 tU Figure 5-1 illustrates the timing relationship of programmable skew outputs. All times are measured with respect to REF, with the output used for feedback programed with 0 tU skew. The PLL naturally aligns the rising edge of the FB input and REF input. If the output used for feedback is programmed to another skew position, then the whole tU matrix will shift with respect to REF. For example, if the output used for feedback is programmed to shift –8 tU, then the whole matrix is shifted forward in time by 8 tU. Therefore, an output programed with 8 tU of skew will effectively be skewed 16 tU with respect to REF. FB Input REF Input 1F[1:0] 2F[1:0] 3F[1:0] 4F[1:0] NA LL –8 tU NA LM –7 tU NA LH –6 tU LL NA –4 tU LM NA –3 tU LH NA –2 tU ML NA –1 tU MM MM 0 tU MH NA 1 tU HL NA 2 tU HM NA 3 tU HH NA 4 tU NA HL 6 tU NA HM 7 tU NA HH 8 tU Note: FB connected to an output selected for zero skew (i.e., FBF0 = mid or xF[1:0] = mid). Figure 5-1. Typical Outputs with FB Connected to a Zero-Skew Output Agere Systems Inc. 9 LCK4993/LCK4994 Low-Voltage PLL Clock Drivers Data Sheet, Revision 1 May 5, 2004 5.6 Output Disable Description The feedback divide and phase select matrix bank has two outputs, each of the four divide and phase select matrix banks have four outputs. The outputs of each bank can be independently put into a hold-off, or HI-Z state. The combination of the OUTPUT_MODE and DIS[1:4]/FBDIS inputs determines the clock outputs’ state for each bank. When the DIS[1:4]/FBDIS is low, the outputs of the corresponding bank will be enabled. When the DIS[1:4]/FBDIS is high the outputs for that bank will be disabled to a HI-Z or hold-off state, depending on the OUTPUT_MODE input. Table 5-5 defines the disabled output functions. The hold-off state is intended to be a power saving feature. An output bank is disabled to the hold-off state in a maximum of six output clock cycles from the time when the disable input (DIS[1:4]/FBDIS) is high. When disabled to the hold-off state, noninverting outputs are driven to a logic-low state on its falling edge. Inverting outputs are driven to a logic-high state on its rising edge. This ensures the output clocks are stopped without a glitch. When a bank of outputs is disabled to a HI-Z state, the respective bank of outputs will go HI-Z immediately. Table 5-5. DIS[1:4]/FBDIS Pin Functionality OUTPUT_MODE DIS[1:4]/FBDIS Output Mode High/Low High Low Mid Low High High X Enabled HI-Z Hold-off Factory Test 5.7 INV3 Pin Function Bank3 has signal invert capability. The four outputs of Bank3 will act as two pairs of complementary outputs when the INV3 pin is driven low. In complementary output mode, 3QA0 and 3QB0 are noninverting; 3QA1 and 3QB1 are inverting outputs. All four outputs will be inverted when the INV3 pin is driven high. When the INV3 pin is left in mid, the outputs will not invert. Inversion of the outputs are independent of the skew and divide functions. Therefore, clock outputs of Bank3 can be inverted, divided, and skewed at the same time. 5.8 Lock Detect Output Description The LOCK detect output indicates the lock condition of the integrated PLL. Lock detection is accomplished by comparing the phase difference between the reference and feedback inputs. Phase error is declared when the phase difference between the two inputs is greater than the specified device propagation delay limit (tPD). When in the locked state, after four or more consecutive feedback clock cycles with phase-errors, the LOCK output will be forced low to indicate out-of-lock state. When in the out-of-lock state, 32 consecutive phase-errorless feedback clock cycles are required to allow the LOCK output to indicate lock condition (LOCK = high). If the feedback clock is removed after LOCK has gone high, a watchdog circuit is implemented to indicate the out-of-lock condition after a time-out period by deasserting LOCK low. This time-out period is based on a divided down reference clock. This assumes that there is activity on the selected REF input. If there is no activity on the selected REF input, then the LOCK detect pin may not accurately reflect the state of the internal PLL. 10 Agere Systems Inc. Data Sheet, Revision 1 May 5, 2004 LCK4993/LCK4994 Low-Voltage PLL Clock Drivers 5.9 Factory Test Mode Description The device will enter factory test mode when the OUTPUT_MODE input is driven to a mid level. In factory test mode, the device will operate with its internal PLL disconnected. The reference input will replace the PLL output. While operating in factory test mode, the selected FB input(s) must both be tied low. The output frequency is a function of the input level set on the FS pin (see Table 5-6). When operating in factory test mode, all outputs must be set to the divide by 1 function. Output skew select function operates normally, output bank disable is unavailable while operating in factory test mode. The OUTPUT_MODE input is designed to be a static input. Dynamically toggling this input from low to high may temporarily cause the device to go into factory test mode (when passing through the mid state). 5.9.1 Factory Test Reset When operating in factory test mode (OUTPUT_MODE = mid), the device can be reset to a deterministic state by forcing the DIS4 input to a logic high. With DIS4 in a logic high state, all clock outputs will go to HI-Z. After the selected reference clock pin has five positive transitions, all the internal finite state machines (FSM) will be set to a deterministic state. The deterministic state of the state machines will depend on the configuration of the divide select, skew select, and frequency select inputs. All clock outputs will stay in high-impedance mode, and all FSMs will stay in the deterministic state until DIS4 is deasserted. When DIS4 is deasserted (with OUTPUT_MODE still at mid), the device will re-enter factory test mode. Table 5-6. Factory Test Mode Frequency Divide Select FS LCK4993 LCK4994 Output Frequency Output Frequency Divide By Divide By 32 16 8 16 8 4 Low Mid High 5.10 Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect device reliability. Table 5-7. Absolute Maximum Ratings Parameter Storage Temperature Supply Voltage dc Input Voltage Output Current into Outputs (low) Latch-Up Current Agere Systems Inc. Symbol Min Max Unit Tstg VDD VDC IOUT IL –40 –0.5 –0.3 — — 125 4.6 VDD + 0.5 40 ±200 °C V V mA mA 11 LCK4993/LCK4994 Low-Voltage PLL Clock Drivers Data Sheet, Revision 1 May 5, 2004 5.11 Handling Precautions Although electrostatic discharge (ESD) protection circuitry has been designed into this device, proper precautions must be taken to avoid exposure to ESD and electrical overstress (EOS) during all handling, assembly, and test operations. Agere employs both a human-body model (HBM) and a charged-device model (CDM) qualification requirement in order to determine ESD susceptibility limits and protection design evaluation. ESD voltage thresholds are dependent on the circuit parameters used in each of the models, as defined by JEDEC's JESD22-A114 (HBM) and JESD22-C101 (CDM) standards. Table 5-8. Handling Precautions Device LCK4993 LCK4994 Minimum Threshold HBM CDM 2000 V 2000 V 500 V 500 V Caution: MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and packaging MOS devices should be observed. 5.12 Thermal Parameters (Definitions and Values) System and circuit board level performance depends not only on device electrical characteristics, but also on device thermal characteristics. The thermal characteristics frequently determine the limits of circuit board or system performance, and they can be a major cost adder or cost avoidance factor. When the die temperature is kept below 125 °C, temperature-activated failure mechanisms are minimized. The thermal parameters that Agere provides for its packages help the chip and system designer choose the best package for their applications, including allowing the system designer to thermally design and integrate their systems. It should be noted that all the parameters listed below are affected, to varying degrees, by package design (including paddle size) and choice of materials, the amount of copper in the test board or system board, and system airflow. ΘJA - Junction to Air Thermal Resistance ΘJA is a number used to express the thermal performance of a part under JEDEC standard natural convection conditions. ΘJA is calculated using the following formula: ΘJA = (TJ – Tamb) / P; where P = power ΘJMA - Junction to Moving Air Thermal Resistance ΘJMA is effectively identical to ΘJA but represents performance of a part mounted on a JEDEC four-layer board inside a wind tunnel with forced air convection. ΘJMA is reported at airflows of 200 LFPM and 500 LFPM (linear feet per minute), which roughly correspond to 1 m/s and 2.5 m/s (respectively). ΘJMA is calculated using the following formula: ΘJMA = (TJ – Tamb) / P ΘJC - Junction to Case Thermal Resistance ΘJC is the thermal resistance from junction to the top of the case. This number is determined by forcing nearly 100% of the heat generated in the die out the top of the package by lowering the top case temperature. This is done by placing the top of the package in contact with a copper slug kept at room temperature using a liquid refrigeration unit. ΘJC is calculated using the following formula: ΘJC = (TJ – TC) / P 12 Agere Systems Inc. Data Sheet, Revision 1 May 5, 2004 LCK4993/LCK4994 Low-Voltage PLL Clock Drivers ΘJB - Junction to Board Thermal Resistance ΘJB is the thermal resistance from junction to board. This number is determined by forcing the heat generated in the die out of the package through the leads or balls by lowering the board temperature and insulating the package top. This is done using a special fixture, which keeps the board in contact with a water chilled copper slug around the perimeter of the package while insulating the package top. ΘJB is calculated using the following formula: ΘJB = (TJ – TB) / P ΨJT ΨJT correlates the junction temperature to the case temperature. It is generally used by the customer to infer the junction temperature while the part is operating in their system. It is not considered a true thermal resistance. ΨJT is calculated using the following formula: ΨJT = (TJ – TC) / P Table 5-9. Thermal Parameter Values Parameter Temperature °C/Watt 100-Pin TQFP 100-Ball FSBGA 38 71.9 ΘJMA (1 m/s) 32.9 66.6 ΘJMA (2.5 m/s) 30.4 64.7 ΘJC 32.9 24.5 ΘJB 29.9 56.8 ΨJT 1 1 ΘJA Agere Systems Inc. 13 LCK4993/LCK4994 Low-Voltage PLL Clock Drivers Data Sheet, Revision 1 May 5, 2004 6 Electrical Characteristics . Table 6-1. Electrical Characteristics (TA –40 °C to +85 °C, VDD = 3.3 V ± 10%) Parameter Symbol High-Voltage Output (LVTTL) VOH Low-Voltage Output (LVTTL) VOL Description Test Conditions Min LVTTL Compatible Output Pins (QFA[0:1], [1:4]Q[A:B], LOCK QFA[0:1], [1:4]Q[A:B][0:1] VDD = min, IOH = –30 mA 2.4 2.4 LOCK VDD = min, IOH = –2 mA QFA[0:1], [1:4]Q[A:B][0:1] VDD = min, IOH = 30 mA — LOCK VDD = min, IOH = 2 mA — — — –100 Max Unit — — 0.5 0.5 100 V V V V µA High-ImpedIOZ ance State Leakage Current LVTTL Compatible Pins (FBKA±, FBKB±, REFA±, REFB±, FBSEL, REFSEL, FBDIS, DIS[1:4]) High-Voltage VIH FBK[A:B]±, REF[A:B]± Min ≤ VDD ≤ max 2.0 VDD + 0.3 Input (LVTTL) REFSEL, FBSEL, FBDIS, DIS[1:4] — 2.0 VDD + 0.3 FBK[A:B]±, REF[A:B]± Min ≤ VDD ≤ max –0.3 0.8 Low-Voltage VIL Input (LVTTL) REFSEL, FBSEL, FBDIS, DIS[1:4] — –0.3 0.8 High-Input IIH FBK[A:B]±, REF[A:B]± VDD = max, VIN = VDD — 500 Current (LVTTL) — 500 REFSEL, FBSEL, FBDIS, DIS[1:4] VIN = VDD Low-Input IIL FBK[A:B]±, REF[A:B]± VDD = max, VIN = GND –500 — Current (LVTTL) REFSEL, FBSEL, FBDIS, DIS[1:4] VIN = GND –500 — 3-Level Input Pins (FBF0, FBDS[0:1], [1:4]F[0:1], [1:4]DS[0:1], FS, OUTPUT_MODE(TEST) Low-Voltage — Min ≤ VDD ≤ max — 0.13 x VDD VILL 3-Level Input1 VIMM — Min ≤ VDD ≤ max 0.47 x VDD 0.53 x VDD Mid-Voltage 3-Level Input1 High-Voltage VIHH — Min ≤ VDD ≤ max 0.87 x VDD — 3-Level Input1 3-level input pins excluding FBF0 VIN = GND –200 — Low-Current IILL 3-Level Input FBF0 VIN = GND –400 — 3-level input pins excluding FBF0 VIN = VDD/2 –50 50 Mid-Current IIMM 3-Level Input FBF0 VIN = VDD/2 –100 100 High-Current IIHH 3-level input pins excluding FBF0 VIN = VDD — 200 3-Level Input FBF0 VIN = VDD — 400 V V V V µA µA µA µA V V V µA µA µA µA µA µA 1. These inputs are normally wired to VDD, GND, or left unconnected (actual threshold voltages vary as a percentage of VDD). Internal termination resistors hold the unconnected inputs at VDD/2. If these inputs are switched, the function and timing of the outputs may glitch and the PLL may require an additional tLOCK time before all data sheet limits are achieved. 14 Agere Systems Inc. Data Sheet, Revision 1 May 5, 2004 LCK4993/LCK4994 Low-Voltage PLL Clock Drivers Table 6-1. Electrical Characteristics (TA –40 °C to +85 °C, VDD = 3.3 V ± 10%) (continued) Parameter Symbol Input Differential Voltage Lowest Input Low Voltage Highest Input High Voltage Common-mode Range (crossing voltage) VDIFF Description Test Conditions LVDIFF Input Pins (FBK[A:B]±, REF[A:B]±) — — Max Unit 400 VDD mV VILLP — — GND VDD – 0.4 V VIHHP — — 1.0 VDD V VCOM — — 0.8 VDD V — — — 250 250 40 mA mA mA — 50 mA — 5 pF Internal Operating Current ICCI Output Current Dissipation/Pair2 ICCN LCK4993 LCK4994 LCK4993 LCK4994 Input Capacitance Min CIN — Operating Current VDD = max, fmax VDD = max, fmax1 VDD = max, CLOAD = 25 pF, RLOAD = 50 Ω at VDD/2, fmax VDD = max, CLOAD = 25 pF, RLOAD = 50 Ω at VDD/2, fmax Capacitance TA = 25 °C, f = 1 MHz, VDD = 3.3 V/2.5 V 1. ICCI measurements are performed with Bank1 and FB bank configured to run at maximum frequency (fNOM = 100 MHz for LCK4993, fNOM = 200 MHz for LCK4994), and all other clock output banks to run at half the maximum frequency. FS and OUTPUT_MODE are asserted to the high state. 2. This is dependent upon frequency and number of outputs of a bank being loaded. The value indicates maximum ICCN at maximum frequency and maximum load of 25 pF terminated to 50 Ω at VDD/2. Agere Systems Inc. 15 LCK4993/LCK4994 Low-Voltage PLL Clock Drivers Data Sheet, Revision 1 May 5, 2004 Table 6-2. Electrical Characteristics (TA –40 °C to +85 °C, VDD = 2.5 V ± 10%) Parameter Symbol High-Voltage Output (LVTTL) VOH Low-Voltage Output (LVTTL) VOL Description Test Conditions LVTTL Compatible Output Pins (QFA[0:1], [1:4]Q[A:B], LOCK) QFA[0:1], [1:4]Q[A:B][0:1] VDD = min, IOH = –30 mA LOCK VDD = min, IOH = –2 mA QFA[0:1], [1:4]Q[A:B][0:1] VDD = min, IOH = 30 mA LOCK VDD = min, IOH = 2 mA — — Min Max Unit 1.6 1.6 — — –100 — — 0.5 0.5 100 V V V V µA High-ImpedIOZ ance State Leakage Current LVTTL Compatible Pins (FBKA±, FBKB±, REFA±, REFB±, FBSEL, REFSEL, FBDIS, DIS[1:4]) High-Voltage VIH FBK[A:B]±, REF[A:B]± Min ≤ VDD ≤ max 2.0 VDD + 0.3 Input (LVTTL) REFSEL, FBSEL, FBDIS, DIS[1:4] — 2.0 VDD + 0.3 FBK[A:B]±, REF[A:B]± Min ≤ VDD ≤ max –0.3 0.8 Low-Voltage VIL Input (LVTTL) REFSEL, FBSEL, FBDIS, DIS[1:4] — –0.3 0.8 High-Input IIH FBK[A:B]±, REF[A:B]± VDD = max, VIN = VDD — 500 Current (LVTTL) — 500 REFSEL, FBSEL, FBDIS, DIS[1:4] VIN = VDD Low-Input IIL FBK[A:B]±, REF[A:B]± VDD = max, VIN = GND — 500 Current (LVTTL) REFSEL, FBSEL, FBDIS, DIS[1:4] — –500 — 3-Level Input Pins (FBF0, FBDS[0:1], [1:4]F[0:1], [1:4]DS[0:1], FS, OUTPUT_MODE(TEST)) Low-Voltage — Min ≤ VDD ≤ max — 0.13 x VDD VILL 3-Level Input1 VIMM — Min ≤ VDD ≤ max 0.47 x VDD 0.53 x VDD Mid-Voltage 3-Level Input1 High-Voltage VIHH — Min ≤ VDD ≤ max 0.87 x VDD — 3-Level Input1 3-level input pins excluding FBF0 VIN = GND –200 — Low-Current IILL 3-Level Input FBF0 VIN = GND –400 — 3-level input pins excluding FBF0 VIN = VDD/2 –50 50 Mid-Current IIMM 3-Level Input FBF0 VIN = VDD/2 –100 100 High-Current IIHH 3-level input pins excluding FBF0 VIN = VDD — 200 3-Level Input FBF0 VIN = VDD — 400 V V V V µA µA µA µA V V V µA µA µA µA µA µA 1. These inputs are normally wired to VDD, GND, or left unconnected (actual threshold voltages vary as a percentage of VDD). Internal termination resistors hold the unconnected inputs at VDD/2. If these inputs are switched, the function and timing of the outputs may glitch and the PLL may require an additional tLOCK time before all data sheet limits are achieved. 16 Agere Systems Inc. Data Sheet, Revision 1 May 5, 2004 LCK4993/LCK4994 Low-Voltage PLL Clock Drivers Table 6-2. Electrical Characteristics (TA –40 °C to +85 °C, VDD = 2.5 V ± 10%) (continued) Parameter Symbol Input Differential Voltage Lowest Input Low Voltage Highest Input High Voltage Common-mode Range (crossing voltage) VDIFF Description Test Conditions LVDIFF Input Pins (FBK[A:B]±, REF[A:B]±) — — Max Unit 400 VDD mV VILLP — — GND VDD – 0.4 V VIHHP — — 1.0 VDD V VCOM — — 0.8 VDD V — — — 250 250 40 mA mA mA — 50 mA — 5 pF Internal Operating Current ICCI Output Current Dissipation/Pair2 ICCN LCK4993 LCK4994 LCK4993 LCK4994 Input Capacitance Min CIN — Operating Current VDD = max, fmax VDD = max, fmax1 VDD = max, CLOAD = 25 pF, RLOAD = 50 Ω at VDD/2, fmax VDD = max, CLOAD = 25 pF, RLOAD = 50 Ω at VDD/2, fmax Capacitance TA = 25 °C, f = 1 MHz, VDD = 3.3 V/2.5 V 1. ICCI measurements are performed with Bank1 and FB bank configured to run at maximum frequency (fNOM = 100 MHz for LCK4993, fNOM = 200 MHz for LCK4994), and all other clock output banks to run at half the maximum frequency. FS and OUTPUT_MODE are asserted to the high state. 2. This is dependent upon frequency and number of outputs of a bank being loaded. The value indicates maximum ICCN at maximum frequency and maximum load of 25 pF terminated to 50 Ω at VDD/2. Agere Systems Inc. 17 LCK4993/LCK4994 Low-Voltage PLL Clock Drivers Data Sheet, Revision 1 May 5, 2004 7 Timing 7.1 Switching Characteristics The following switching characteristics and assumptions apply for non 3-level inputs. ■ A maximum 25 pF load capacitance is used for frequencies up to 185 MHz. A maximum 10 pF load capacitance is used for the frequency of 200 MHz. ■ Both outputs of the pair must be terminated, even if only one is being used. ■ ac parameters are measured at 50%, unless otherwise indicated. Table 7-1. Switching Characteristics (TA –40 °C to +85 °C, VDD = 3.3 V ± 10%) Parameter Clock Input Frequency Clock Output Frequency REF Input Symbol fIN fOUT Matched-Pair Skew1, 2 tREFPWL tREFPWH tSKEWPR Interbank Skew tSKEWBNK Output-Output Skew tSKEW0 tSKEW1 tSKEW2 tSKEW3 Complementary Outputs Skew Cycle-to-Cycle Jitter Propagation Delay Output Rise/Fall Time5 tSKEWCPR tCCJ tPD tPDDELTA tR/tF Description LCK4993 LCK4994 LCK4993 LCK4994 Pulse width low.8 Pulse width high.8 Same frequency and phase, rise-to-rise and fall-tofall. (Matched pair outputs within a bank.)1, 2 Same frequency and phase, rise-to-rise and fall-tofall. (All outputs within a bank.)1, 2 Same frequency and phase, rise-to-rise and fall-tofall. (All outputs across all banks.)1, 2 Different frequency same phase, rise-to-rise and fall-to-fall. (All outputs all banks.)1, 2 Same frequency and phase, rise-to-fall and fall-torise. (Bank 3 inverted to all other banks.)1, 2, 3 All output configurations outside tSKEW1 and tSKEW2.1, 2 Crossing to crossing, complementary outputs. (Bank 3 only.)1, 2, 3, 4 Divide by 1 output frequency, FB = divide by 1—8. REF to FB rise. Difference between two devices.4 — Min 12 24 12 24 2.0 2.0 — Max 100 200 100 200 — — 200 Unit MHz MHz MHz MHz ns ns ps — 200 ps — 250 ps — 250 ps — 250 ps — 500 ps — 200 ps — –250 — 0.15 150 250 200 2.0 ps ps ps ns 1. Test load CL maximum 25 pF (fnom ≤185 MHz) and maximum 10 pF (fnom = 200 MHz) both terminated 50 Ω to VDD/2. 2. SKEW is defined as the time between the earliest and latest output transition among all outputs for which the same phase delay has been selected and all outputs are equally loaded and properly terminated. 3. Complementary output skews are measured at complementary signal pair intersections. 4. Guaranteed by statistical correlation. Tested initially and after any design or process changes that may affect these parameters. 5. Rise and fall times are measured at 20% and 80% of the output voltage swing. 6. fNOM must be within the frequency range defined by the FS state (see Table 5-1). 7. ac parameters are measured at 50%, unless otherwise indicated. 8. tPWL is measured at 20%. tPWH is measured at 80%. 9. UI = unit interval. Examples: 1 UI is a full period. 0.1 UI is 10% of a period. 10. Measured at 0.5 V deviation from starting voltage. 11. For tOZA minimum, CL = 0 pF. For tOZA maximum, CL = 25 pF to 185 MHz or 10 pF at 200 MHz. 18 Agere Systems Inc. Data Sheet, Revision 1 May 5, 2004 LCK4993/LCK4994 Low-Voltage PLL Clock Drivers Table 7-1. Switching Characteristics (TA –40 °C to +85 °C, VDD = 3.3 V ± 10%) (continued) Parameter PLL Lock Time from Powerup PLL Relock Time Symbol Description Min Max Unit tLOCK — — 10 ms tRELOCK1 From same frequency, different phase, and with stable power supply. From different frequency, different phase, and with stable power supply.6 — When changing from reference to reference. DIS[1:4]/FBDIS low to output active from output is high-impedance.10, 11 DIS[1:4]/FBDIS high to output high-impedance from active.1, 10 — 500 µs — 1000 µs 45 — 0.5 55 0.025 14 % UI9 ns 1.0 10 ns tRELOCK2 Output Duty Cycle 7 Period Deviation Output Disable Time tODCV tPDEV tOZA Output Enable Time tOAZ 1. Test load CL maximum 25 pF (fnom ≤185 MHz) and maximum 10 pF (fnom = 200 MHz) both terminated 50 Ω to VDD/2. 2. SKEW is defined as the time between the earliest and latest output transition among all outputs for which the same phase delay has been selected and all outputs are equally loaded and properly terminated. 3. Complementary output skews are measured at complementary signal pair intersections. 4. Guaranteed by statistical correlation. Tested initially and after any design or process changes that may affect these parameters. 5. Rise and fall times are measured at 20% and 80% of the output voltage swing. 6. fNOM must be within the frequency range defined by the FS state (see Table 5-1). 7. ac parameters are measured at 50%, unless otherwise indicated. 8. tPWL is measured at 20%. tPWH is measured at 80%. 9. UI = unit interval. Examples: 1 UI is a full period. 0.1 UI is 10% of a period. 10. Measured at 0.5 V deviation from starting voltage. 11. For tOZA minimum, CL = 0 pF. For tOZA maximum, CL = 25 pF to 185 MHz or 10 pF at 200 MHz. Agere Systems Inc. 19 LCK4993/LCK4994 Low-Voltage PLL Clock Drivers Data Sheet, Revision 1 May 5, 2004 Table 7-2. Switching Characteristics (TA –40 °C to +85 °C, VDD = 2.5 V ± 10%) Parameter Clock Input Frequency Clock Output Frequency REF Input Symbol Description Min Max Unit fIN LCK4993. LCK4994. LCK4993. LCK4994. Pulse width low.8 Pulse width high.8 Same frequency and phase, rise-to-rise and fall-tofall. (Matched pair outputs within a bank.)1, 2 Same frequency and phase, rise-to-rise and fall-tofall. (All outputs within a bank.)1, 2 Same frequency and phase, rise-to-rise and fall-tofall. (All outputs across all banks.)1, 2 Different frequency same phase, rise-to-rise and fall-to-fall. (All outputs all banks.)1, 2 Same frequency and phase, rise-to-fall and fall-torise. (Bank 3 inverted to all other banks.)1, 2, 3 All output configurations outside tSKEW1 and tSKEW2.1, 2 Crossing to crossing, complementary outputs. (Bank 3 only.) 1, 2, 3, 4 Divide by 1 output frequency, FB = divide by 1—8. REF to FB rise. Difference between two devices.4 — 12 24 12 24 2.0 2.0 — 100 200 100 200 — — 200 MHz MHz MHz MHz ns ns ps — 200 ps — 250 ps — 250 ps — 250 ps — 500 ps — 200 ps — –250 — 0.15 150 250 200 2.0 ps ps ps ns fOUT Matched-Pair Skew1, 2 tREFPWL tREFPWH tSKEWPR Interbank Skew tSKEWBNK Output-Output Skew tSKEW0 tSKEW1 tSKEW2 tSKEW3 Complementary Outputs Skew Cycle-to-Cycle Jitter Propagation Delay Output Rise/Fall Time5 tSKEWCPR tCCJ1—3 tPD tPDDELTA tR/tF 1. Test load CL maximum 25 pF (fnom ≤185 MHz) and maximum 10 pF (fnom = 200 MHz) both terminated 50 Ω to VDD/2. 2. SKEW is defined as the time between the earliest and latest output transition among all outputs for which the same phase delay has been selected and all outputs are equally loaded and properly terminated. 3. Complementary output skews are measured at complementary signal pair intersections. 4. Guaranteed by statistical correlation. Tested initially and after any design or process changes that may affect these parameters. 5. Rise and fall times are measured at 20% and 80% of the output voltage swing. 6. fNOM must be within the frequency range defined by the FS state (see Table 5-1). 7. ac parameters are measured at 50%, unless otherwise indicated. 8. tPWL is measured at 20%. tPWH is measured at 80%. 9. UI = unit interval. Examples: 1 UI is a full period. 0.1 UI is 10% of a period. 10. Measured at 0.5 V deviation from starting voltage. 11. For tOZA minimum, CL = 0 pF. For tOZA maximum, CL = 25 pF to 185 MHz or 10 pF at 200 MHz. 20 Agere Systems Inc. Data Sheet, Revision 1 May 5, 2004 LCK4993/LCK4994 Low-Voltage PLL Clock Drivers Table 7-2. Switching Characteristics (TA –40 °C to +85 °C, VDD = 2.5 V ± 10%) (continued) Parameter PLL Lock Time from Powerup PLL Relock Time Symbol Description Min Max Unit tLOCK — — 10 ms tRELOCK1 From same frequency, different phase, and with stable power supply. From different frequency, different phase, and with stable power supply.6 — When changing from reference to reference. DIS[1:4]/FBDIS low to output active from output is high-impedance.10, 11 DIS[1:4]/FBDIS high to output high-impedance from active.1, 10 — 500 µs — 1000 µs 45 — 0.5 55 0.025 14 % UI9 ns 1.0 10 ns tRELOCK2 Output Duty Cycle 7 Period Deviation Output Disable Time tODCV tPDEV tOZA Output Enable Time tOAZ 1. Test load CL maximum 25 pF (fnom ≤185 MHz) and maximum 10 pF (fnom = 200 MHz) both terminated 50 Ω to VDD/2. 2. SKEW is defined as the time between the earliest and latest output transition among all outputs for which the same phase delay has been selected and all outputs are equally loaded and properly terminated. 3. Complementary output skews are measured at complementary signal pair intersections. 4. Guaranteed by statistical correlation. Tested initially and after any design or process changes that may affect these parameters. 5. Rise and fall times are measured at 20% and 80% of the output voltage swing. 6. fNOM must be within the frequency range defined by the FS state (see Table 5-1). 7. ac parameters are measured at 50%, unless otherwise indicated. 8. tPWL is measured at 20%. tPWH is measured at 80%. 9. UI = unit interval. Examples: 1 UI is a full period. 0.1 UI is 10% of a period. 10. Measured at 0.5 V deviation from starting voltage. 11. For tOZA minimum, CL = 0 pF. For tOZA maximum, CL = 25 pF to 185 MHz or 10 pF at 200 MHz. 7.2 ac Test Loads and Waveforms Note: Figure 7-1 is for illustrative purposes only. The actual ATE loads may vary. ■ ■ For LOCK output only: — R1 = 910 Ω — R2 = 910 Ω — CL < 30 pF For all other outputs: — R1 = 100 Ω — R2 = 100 Ω — CL max = 25 pF to 185 MHz or CL max = 10 pF at 200 MHz TTL Input Test Waveform 3.3 V LVTTL ac Test Load 3.3 V 2.0 V R1 2.0 V OUTPUT 0.8 V 0.8 V CL GND ≤ 1 ns R2 ≤ 1 ns TTL Input Waveform LVTTL ac Test Load (The above include fixture and probe capacitances.) Figure 7-1. ac Test Loads and Waveforms Agere Systems Inc. 21 LCK4993/LCK4994 Low-Voltage PLL Clock Drivers Data Sheet, Revision 1 May 5, 2004 7.3 ac Timing Diagrams ac parameters are measured at 50%, unless otherwise indicated. tREFPWH tREFPWL QFA0 OR [1:4]Q[A:B]0 REF tSKEWPR tSKEWPR tPD tPWH tPWL QFA1 OR [1:4]Q[A:B]1 80% FB 20% tCCJ1—3, 4—12 [1:4]QA[0:1] tSKEWBNK tSKEWBNK Q [1:4]QB[0:1] tODCV REF TO DEVICE 1 AND 2 tODCV Q tPD tSKEW0,1 tSKEW0, 1 FB DEVICE 1 OTHER Q tPDELTA tPDELTA FB DEVICE 2 tSKEWCPR Q COMPLEMENTARY A tSKEW2 INVERTED Q CROSSING tSKEW2 COMPLEMENTARY B CROSSING Figure 7-2. ac Timing Diagrams 22 Agere Systems Inc. Data Sheet, Revision 1 May 5, 2004 LCK4993/LCK4994 Low-Voltage PLL Clock Drivers 8 Outline Diagrams 8.1 100-Pin TQFP Controlling dimensions are in millimeters. 16.00 ± 0.25 14.00 ± 0.05 PIN #1 IDENTIFIER ZONE 100 76 1 75 14.00 ± 0.05 16.00 ± 0.25 25 51 26 50 DETAIL A DETAIL B 1.40 ± 0.05 1.60 MAX SEATING PLANE 0.08 0.20 MAX 0.50 TYP 1.00 REF 0.25 0.05/0.15 GAGE PLANE 0.22 ± 0.05 SEATING PLANE 0.45/0.75 DETAIL A 0.08 M DETAIL B 5-2146 (F) r.1 Agere Systems Inc. 23 LCK4993/LCK4994 Low-Voltage PLL Clock Drivers Data Sheet, Revision 1 May 5, 2004 8.2 100-Ball FSBGA Controlling dimensions are in millimeters. 11.00 ± 0.10 A1 INDICATOR 11.00 ± 0.10 0.53 ± 0.05 0.40 ± 0.05 0.15 0.36 1.45 MAX 10 TOP VIEW A1 INDICATOR 9 8 7 6 5 4 3 2 1 A B C D 1.00 TYP E BOTTOM VIEW F G H J ∅ 0.45 ± 0.05 TYP 1.00 SOLDER BALLS K 11.00 ± 0.10 5-8159.a (F) r.1 Note: The ball diameter, ball pitch, and stand-off and package thicknesses are different from JEDEC spec M0192 (low-profile BGA family). 24 Agere Systems Inc. Data Sheet, Revision 1 May 5, 2004 LCK4993/LCK4994 Low-Voltage PLL Clock Drivers 9 Ordering Information Table 9-1. LCK4993 Ordering Information Device Package Type Comcode Delivery LCK4993YH-DB LCK4993YH-DT LCK4993KB-DB LCK4993KB-DT 100FSBGA 100FSBGA 100TQFP 100TQFP 700034618 700034619 700024614 700024615 Tray Tape Tray Tape Table 9-2. LCK4994 Ordering Information Device Package Type Comcode Delivery LCK4994YH-DB LCK4994YH-DT LCK4994KB-DB LCK4994KB-DT 100FSBGA 100FSBGA 100TQFP 100TQFP 700042835 700042836 700025705 700025708 Tray Tape Tray Tape Cypress is a registered trademark of Cypress Semiconductor Corporation. For additional information, contact your Agere Systems Account Manager or the following: INTERNET: http://www.agere.com E-MAIL: [email protected] N. AMERICA: Agere Systems Inc., Lehigh Valley Central Campus, Room 10A-301C, 1110 American Parkway NE, Allentown, PA 18109-9138 1-800-372-2447, FAX 610-712-4106 (In CANADA: 1-800-553-2448, FAX 610-712-4106) ASIA: Agere Systems Hong Kong Ltd., Suites 3201 & 3210-12, 32/F, Tower 2, The Gateway, Harbour City, Kowloon Tel. (852) 3129-2000, FAX (852) 3129-2020 CHINA: (86) 21-54614688 (Shanghai), (86) 755-25881122 (Shenzhen) JAPAN: (81) 3-5421-1600 (Tokyo), KOREA: (82) 2-767-1850 (Seoul), SINGAPORE: (65) 6778-8833, TAIWAN: (886) 2-2725-5858 (Taipei) EUROPE: Tel. (44) 1344 296 400 Agere Systems Inc. reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application. Agere is a registered trademark of Agere Systems Inc. Agere Systems and the Agere logo are trademarks of Agere Systems Inc. Copyright © 2004 Agere Systems Inc. All Rights Reserved May 5, 2004 DS04-014LCK-1 (Replaces DS04-014LCK)