AVAGO HDJD-J822

HDJD-J822-SCR00
Color Management System Feedback Controller
Data Sheet
Description
Features
The HDJD-J822 is a CMOS mixed-signal IC designed to
be the optical feedback controller of an LED-based lighting system. A typical system consists of an array of red,
green and blue LEDs, LED drivers, a tri-color photosensor
that samples the light output, and the HDJD-J822. The
IC interfaces directly to the photosensor, processes the
color information and adjusts the light output from the
LEDs until the desired color is achieved. To achieve this,
the IC integrates a high-accuracy 10-bit analog-to-digital
converter front-end, a color data processing logic core,
and a high-resolution 12-bit PWM output generator.
• –40 to 85°C operation
By employing a feedback system and the HDJD-J822,
the light output produced by the LED array maintains its
color over time and temperature. In addition, the desired
color can be specified using a standard CIE color space.
In addition, by incorporating a standard I2C serial interface, specifying the color of the LED array’s light output
is as simple as picking the color coordinates from the
CIE color space and writing several bytes of data to the
device.
The output PWM signals are connected directly to the
LED drivers as enable signals. The PWM signals control
the on-time duration of the red, green and blue LEDs.
That duration is continually adjusted in real-time to
match the light output from the LED array to the specified, desired color.
• I2C serial interface
• Robust CMOS-Schmitt input
• CMOS/TTL compatible output
• Multiple color input formats
– CIE XYZ, Yxy, Yu’v’ and RGB
• 3-channel analog interface to color sensor
– X, Y and Z channels
• 3-channel 12-bit PWM output
– Red, Green, and Blue LED channels
• Internal computation of calibration data
• Internal clock generator
• Internal reference voltage generator
• Error flag output
• External push-button interface
• Only passive components required externally
Applications
• Backlighting
• General illumination
• Mood/accent lighting
• Color context sensitive appliances
ESD WARNING: Standard CMOS handling precautions should be observed to avoid static discharge.
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Package Dimensions
C
h x 45°
E
H
0° MIN.
PIN 1 INDICATOR
SEE DETAIL A
SEATING PLANE
D
7° TYP.
A2
A
PARTING LINE
alpha°
e
B
A1
L
DIMENSIONS IN INCHES
SYMBOL
MIN.
A
0.093
A1
0.004
A2
0.088
B
0.013
C
0.0090
D
0.599
E
0.292
e H
0.394
h
0.010
L
0.016
alpha
0°
NOM.
0.099
0.008
0.094
0.016
0.0100
0.606
0.296
0.050 BSC.
0.402
0.015
0.033
5°
MAX.
0.104
0.012
0.100
0.020
0.0125
0.613
0.299
0.419
0.019
0.050
8°
DETAIL A
Part Numbering System
HDJD - J822 - XX X XX
Option
00: Default
Packaging Type
R: Tape and Reel Standard Pack
Product Packaging
SC: SOIC
Pinout of HDJD-J822 Color Management System Feedback Controller
XRST
P1
P24
AVDD
SLEEP
P2
P23
SENSE_X
CLK_SEL
P3
P22
SENSE_Y
A1
P4
P21
SENSE_Z
A0
P5
P20
VREF_EXT
SDA
P6
P19
ROSC
SCL
P7
P18
AVSS
TEST
P8
P17
ERR_FLAG
COLOR
P9
P16
PWM_R
BRIGHT
P10
P15
PWM_G
CLK_EXT
P11
P14
PWM_B
DVDD
P12
P13
DVSS
Top View
24-Pin SOIC
Pin
1
2
3
4
5
6
7
8
9
10
11
12
Name
XRST
SLEEP
CLK_SEL
A1
A0
SDA
SCL
TEST
COLOR
BRIGHT
CLK_EXT
DVDD
Type
DI
DI
DI
DI
DI
DIO
DI
DI
DI
DI
DI
DP
Legend
DI
Digital input pin
DO Digital output pin
DIO Digital bi-directional pin
Pin
13
14
15
16
17
18
19
20
21
22
23
24
Name
DVSS
PWM_B
PWM_G
PWM_R
ERR_FLAG
AVSS
ROSC
VREF_EXT
SENSE_Z
SENSE_Y
SENSE_X
AVDD
Type
DP
DO
DO
DO
DO
AP
ANA
ANA
ANA
ANA
ANA
AP
DP Digital supply/ground pin
ANA Analog interface pin
AP Analog supply/ground pin
Pin Descriptions
XRST (Pin 1)
COLOR, BRIGHT (Pin 9, Pin 10)
Global, asynchronous, active-low system reset. When asserted low, XRST resets all registers. Minimum reset pulse
low is 10 µs and must be provided by external circuitry.
COLOR and BRIGHT are button interface pins. Asserting
COLOR high with BRIGHT low makes the output color go
up a color selection ‘slider.’ To effect a direction change,
COLOR and BRIGHT must be asserted simultaneously for
at least 0.1 second. Now, asserting COLOR with BRIGHT
low makes the output color go down the color selection
slider.
SLEEP (Pin 2)
When asserted high, SLEEP puts the device into sleep
mode. In sleep mode, all analog circuits are powered
down and the clock signal is gated away from the core
logic.
CLK_SEL (Pin 3)
CLK_SEL is used to select between internal and external clock modes. Internal clock mode is selected when
CLK_SEL=0 and external clock mode is selected when
CLK_SEL=1.
A1, A0 (Pin 4, Pin 5)
A1 (MSB) and A0 (LSB) define the lower two bits of the
I2C slave address.
SDA (Pin 6)
The SDA pin is the I2C data I/O pin. SDA is a bi-directional
pin. The I/O direction is defined by an internal signal
generated by the I2C interface block.
SCL (Pin 7)
The SCL pin is the I2C clock pin.
TEST (Pin 8)
Connect to digital ground (DVSS).
Button brightness control follows a similar procedure.
Asserting BRIGHT high with COLOR low increases or decreases brightness depending on the direction. To effect
a direction change, COLOR and BRIGHT must be asserted
simul­taneously for at least 0.1 second. (Refer to Application Note 5070 for color selection ‘slider.’)
CLK_EXT (Pin 11)
CLK_EXT is the external clock input pin. Users can choose
to use an external clock instead of the internal clock generator by setting CLK_SEL to high.
PWM_R, PWM_G, PWM_B (Pin 16, Pin 15, Pin 14)
The PWM_R, PWM_G, and PWM_B output pins drive the
external LED drivers that drive the LED arrays. Typically
PWM_R drives only the red LEDs, PWM_G drives only the
green LEDs and PWM_B drives only the blue LEDs. They
are the output enable signals of the red, green and blue
LED drivers. So, they control the on-time duration of the
LEDs.
The assertion level of the PWM* signals can be toggled
by the user to support both active-low and active-high
enable input pins at the LED driver side. This is done by
configuring the PWML bit of register CONFIG1.
ERR_FLAG (Pin 17)
ROSC (Pin 19)
The ERR_FLAG pin is asserted high when an error condition is detected. The user can determine the type of error
by reading the ERROR register. The error conditions are
described in the ‘High Level Description’ section.
A 68 kΩ precision 1% resistor is connected from the ROSC
to AVSS pin for use by the internal oscillator. In external
clock mode, ROSC can be left floating. (Refer to Application Note 5070 for resistor selection.)
SENSE_X, SENSE_Y, SENSE_Z (Pin 23, Pin 22, Pin 21)
DVDD, DVSS, AVDD, AVSS (Pin 12, Pin 13, Pin 24, Pin 18)
The SENSE_X, SENSE_Y and SENSE_Z pins are analog
input pins which are tied to the X-channel, Y-channel
and Z-channel of the photosensor output respectively. An averaging filter is placed in between the sensor
output and the SENSE_X, SENSE_Y and SENSE_Z pins. The
filter is typically a 68 kΩ -1 µF single-pole low-pass filter.
HDJD-J822 has separate power ground nets for the analog and digital section. A star connection from a central
power source is recommended when designing the wiring to these supply pins.
VREF_EXT (Pin 20)
The VREF_EXT pin is an analog input pin, which provides
an external reference voltage for the ADC. Typically, users
will use the internal reference generator to operate the
ADC. However, in specific application conditions, an external reference may be required. The external reference
is enabled by setting the VREFS bit of register CONFIG1
high.
DVDD = Digital positive supply
DVSS = Digital ground
AVDD = Analog positive supply
AVSS = Analog ground
General Specifications
Feature
Interface
Input Color Format
Input Sensor Signal
Minimum Dynamic Range
Output PWM Frequency
Output PWM Resolution
Error Flag
Device Address Control
Supply
I/O
Value
I2C 100 kHz
CIE XYZ, Yxy, Yu’v’ and RGB (illuminant E)
0 to 2.5 V (typical configuration)
Sensor output > 500 (ADC output code, each channel) during calibration
610 Hz nominal (typical configuration)
12 bits
Assertion on ERR_FLAG pin indicates an error condition
Upper 5 bits 10101 binary, lower 2 bits defined by A1:A0 pins in that order
5 V digital, 5 V analog (nominal)
Schmitt-CMOS input and CMOS/TTL compatible output
Block Diagram
VREF_EXT
CLK_EXT
ROSC
XRST
VREF
CLOCK
REFERENCE
VOLTAGE
MUX
INTERNAL
OSCILLATOR
SENSE_X
SENSE_Y
ADC
SENSE_Z
BRIGHT
PUSH_BUTTON
SENSOR
COLOR
PROGRAMMABLE
AMPLIFIER
DUTY FACTOR
SLEEP
MODE SELECT
CLK_SEL
INTERNAL REGISTERS
CONTROL
CONFIG
DATA:
SETPOINT
CALIBRATION
SDA
SCL
A1
I2C
INTERFACE
CONTROL
COLOR
CONTROLLER
PWM GENERATOR
TEST
PWM_R
PWM_G
PWM_B
A0
CONTROL
SIGNALS
DVDD
ERR_FLAG
DVSS
SYSTEM CONTROLLER
AVDD
AVSS
HDJD-J822 Block Diagram Description
Function
Description
Programmable
Amplifier
If the sensor output is not within the required dynamic range, the amplifier’s gain can be
changed from unity to 2 to boost the sensor signal.
ADC
Analog-to-digital converter. Converts the sensor signal from analog to digital.
VREF
Reference voltage generator. Provides a stable voltage level to the ADC. Can be bypassed with
an external reference generator.
Internal Oscillator
Generates a clock signal for the logic circuits. Can be bypassed with an external clock signal.
Mode Select
The device operation mode (normal, sleep, internal/external clock) is determined by the
status of the SLEEP and CLK_SEL pins.
I2C Interface Control
Serial interface controller. Manages the I2C communications protocol.
Internal Registers
The primary method in which the device is configured. Contains a bank of registers. Each bit is
mapped to a specification, function or mode of operation. The internal registers also contain a
range of calibration registers. (Refer to the ‘High Level Description’ section and the Application
Note 5070 for calibration procedures).
Color Controller
Contains the color processing algorithms that operate on the sensor data. The algorithms correct
the PWM output duty factors if there is a mismatch between the desired color and actual color
produced.
Converts the input color coordinates into an internally understood format. Default input format is
CIE RGB (illuminant E).
PWM Generator
Receives the duty factor values from the Color Controller and generates 3 PWM signals.
System Controller
Performs internal functions – housekeeping, interfacing between blocks, generating control
signals, etc.
High Level Description
A hardware reset (by asserting XRST) should be performed before starting any operation. It is assumed that
factory calibration was performed prior to deployment
of HDJD-J822. Calibration is discussed at the end of this
section.
The user controls and configures HDJD-J822 by programming a set of internal registers. The registers are
programmed through the I2C protocol – a standard, synchronous, serial interface. The registers define operation
modes such as sensor slope, reference voltage selection,
color space format, PWM assertion level, etc. Selection
between internal and external clock can only be made
through pin setup.
A typical set-up would be:
• Positive sensor slope
• Internal reference voltage
• 100 Hz (nominal) sensor sample rate
• 610 Hz PWM (nominal)
• Active-high PWM output
• 2.5 MHz (nominal) internal oscillator
HDJD-J822 resets into an “idle” mode and the PWM outputs are held low.
If the PWM assertion level bit (PWML) of register CONFIG1
is changed to high, the PWM outputs will then be held
high. However, since the reset condition for that register
bit is low, HDJD-J822 always resets with the PWM outputs
held low.
The next step after setting up the device is to write the
calibration data to the calibration registers (address 0x8A
to 0xA8). The calibration data is typically stored in an external non-volatile memory. After writing the data, the user
can set the PWM enable bit (PWME) of register CTRL1 to
begin normal operation.
The operation begins with the processor taking in the tricolor sensor’s digitized readings from the internal ADC.
That data is compared to the desired color/brightness
setting. The PWM duty factor is adjusted in response to
any error signal generated by that comparison operation.
The user can change the color/brightness setting at any
time by writing to the appropriate device registers (address 0xE8 to 0xED during normal operation).
The feedback and processing operation is repeated at a
rate of 100 Hz (nominal).
The PWM signal is applied to the LED drivers and controls
the on-time duration of the red, green and blue LEDs.
The user can input the desired color/brightness in a variety of color formats such as CIE XYZ, Yxy, Yu’v’ and RGB
(illuminant E).
There are three indicators in register ERROR that monitor
the status of the color management system. Refer to Application Note 5070.
Factory calibration is needed at a system level to create a
‘snapshot’ of the initial conditions of the system. The color
management algorithm references the snapshot data. In
effect, the calibration data trims out variation in the entire signal chain from LEDs to sensor to filter to ADC. The
calibration discussion below is brief. Refer to Application
Note 5070 for detailed calibration procedures.
First, the device is put into “open loop” mode by setting
the OPMD bit of register CONFIG1 to high. In open loop
mode, the color management algorithm is turned off.
Second, all LEDs are switched on to maximum PWM. During this, the ADC output is read out to check if the sensor
output is within the dynamic range of the system i.e., 400
< pass < 800. An optional internal 2x gain (1) can be selected if the ADC reading is less than 400. This procedure
is performed for each sensor channel.
Next, only the RED LEDs are switched on. An external
camera must be set up to capture the CIE co-ordinates
(preferably XYZ) of the RED LEDs. The scaled XYZ readings
are then sent to the RED LED camera calibration registers
(address 0xE8 to 0xED during calibration mode). Next,
the GSSR bit of register CTRL2 is set to capture the sensor
readings of the RED LEDs. The readings are stored in the
ADC reading registers (SENSOR_ADCZ, SENSOR_ADCY,
SENSOR_ADCX registers). The user must read those registers and transfer them to the RED LED sensor calibration
registers (address 0xFA to 0xFF).
This is repeated for GREEN and BLUE LEDs.
The RCAL bit of register CTRL2 is then set, after which
HDJD-J822 will compute the 31 bytes of calibration data
:
CAL_DATA0 to CAL_DATA30 (2)
The 2 pieces of calibration data is noted as (1), and (2)
above. The user will need to read them from the device
registers via I2C and store them in an external non-volatile memory. They will have to be written to the appropriate registers prior to the start of normal operation, and
should be part of the system boot-up sequence.
Electrical Specifications
Absolute Maximum Ratings (Note 1 & 2)
Parameter
Symbol
Minimum
Maximum
Units
Storage Temperature
TSTG_ABS
-65
150
°C
Digital Supply Voltage, DVDD to DVSS
VDDD_ABS
-0.3
6.0
V
Analog Supply Voltage, AVDD to AVSS
VDDA_ABS
-0.3
6.0
V
Input Voltage
VIN_ABS
-0.3
VDDD + 0.3 V
Solder Reflow Peak Temperature
TL_ABS
260
°C
Latch-Up Current IL_ABS
100
mA
-100
Human Body Model ESD Rating
ESDHBM_ABS
2
kV
Machine Model ESD Rating ESDMM_ABS
200
Notes
All I/O pins
All pins, human body
model MIL883
Method 3015
V
Recommended Operating Conditions
Parameter
Symbol
Minimum
Typical
Maximum
Units
Free Air Operating Temperature
TA
-40
25
85
°C
Digital Supply Voltage, DVDD to DVSS
VDDD
4.5
5
5.5
V
Analog Supply Voltage, AVDD to AVSS
VDDA
4.5
5
5.5
V
HIGH Level Output Current
IOH
3
mA
LOW Level Output Current
IOL
3
mA
External Clock Frequency
fCLK_EXT
1.8
2.5
3.3
MHz
ROSC Resistor
Rosc
68
kΩ
Notes
(Note 3)
VREF_EXT Analog Input Pin Input Voltage VREF_EXT
2.5
4.0
V
SENSE_* Input Pins Input Voltage
VSENSE
0.0
VREF
V
(Note 4)
VDDD or VDDA Minus SENSE_*
VDIFF_SENSE 1.0
V
(Note 5)
Internal Reference Nominal Voltage
VREF_INT
2.45
2.5
2.55
V
(Note 6)
Internal Oscillator Nominal Frequency
with Rosc = 68 kΩ
fCLK_INT
1.8
2.5
3.3
MHz
(Note 6)
5
%
Internal Oscillator Frequency Variation
over Temperature with Rosc = 68 kΩ
-5
DC Electrical Specifications
Over Recommended free air Operating Temperature Range, and VDDD = VDDA = 4.5 V/5 V/5.5 V (unless otherwise
specified).
Parameter
Symbol
Conditions
Minimum
Typical
Maximum
Units
Minimum HIGH Level Input Voltage
(Note 7)
VIH
0.7 VDDD
VDDD
V
Maximum LOW Level Input Voltage
(Note 7)
VIL
0
0.3 VDDD
V
Digital Input Pin Schmitt +ve Threshold VIPOS
(Note 7)
0.8 VDDD
V
Digital Input Pin Schmitt -ve Threshold VINEG
(Note 7)
0.2 VDDD
V
Digital Input Pin Schmitt Hysteresis
(Note 7) (Note 8)
1.0
V
VIHYS
Minimum HIGH Level Output Voltage VOH
(Note 9)
VIN = VIH or VIL
IOH = 3 mA
0.9 VDDD
VDDD
V
Maximum LOW Level Output Voltage VOL
(Note 10)
VIN = VIH or VIL
IOL = 3 mA
0
0.4
V
Dynamic Digital Supply Current
IDDD_DYN
(Note 11)
CLK_SEL=1
fCLK_EXT = 3.3 MHz
4
mA
Sleep-Mode Digital Supply Current
IDDD_SLP
15
µA
Standby Digital Supply Current
IDDD_STNBY
CLK_SEL=1
15
µA
CLK_SEL=1
fCLK_EXT = 3.3 MHz
3
mA
Dynamic Analog Supply Current
IDDA_DYN
(Note 11)
Sleep-mode Analog Supply Current
IDDA_SLP
15
µA
Standby Analog Supply Current
IDDA_STNBY
15
µA
CLK_SEL=1
I2C Timing (SDA, SCL)
Symbol
Parameter
Min.
Max.
Units
fscl
SCL clock frequency
0
100
kHz
tHD:STA
(Repeated) START condition hold time
4.0
-
µs
tHD:DAT
Data hold time
0 (note 12)
3.45
µs
tLOW
SCL clock low period
4.7
-
µs
tHIGH
SCL clock high period
4.0
-
µs
tSU:STA
Repeated START condition setup time
4.7
-
µs
tSU:DAT
Data setup time
250
-
ns
tSU:STO
STOP condition setup time
4.0
-
µs
tBUF
Bus free time between START and STOP conditions
4.7
-
µs
t HD:STA
t HIGH
t SU:DAT
t SU:STA
t SU:STO
t BUF
SDA
SCL
S
Sr
t LOW
t HD:DAT
P
S
t HD:STA
Figure 1. I2C bus timing waveforms.
Notes:
1. The “Absolute Maximum Ratings” are those values beyond which damage to the device may occur. The device should not be operated at these
limits. The parametric values defined in the “Electrical Characteristics” table are not guaranteed at the absolute maximum ratings. The “Recommended Operating Conditions” table will define the conditions for actual device operation.
2. Unless otherwise specified, all voltages are referenced to ground.
3. A 1% precision resistor is recommended. This resistor is tied from the ROSC pin to ground.
4. VREF = VREF_INT in internal reference configuration. VREF = VREF_EXT in external reference configuration.
5. The voltage level at any of the SENSE_* pins must be lower than VDDD or VDDA (whichever is lower) by at least VDIFF_SENSE volts.
6. TA = 25°C. Room temperature.
7. Applies to all DI pins.
8. Guaranteed by design.
9. Applies to all DO pins. SDA is an open-drain NMOS. Minimum VOH depends on the pull-up resistor value.
10. Applies to all DO and DIO pins.
11. Dynamic testing is performed when the IC is operating in a mode representative of typical operation.
12. A hold time of at least 300ns must be provided internally by a device for the SDA signal ( with reference to the minimum VIH of SCL) to bridge
the undefined region of the falling edge of SCL.
Notes on Sampling Frequency and PWM Output Frequency
that sends data to the bus and a receiver as a device that
receives data from the bus.
The sampling frequency, fSAMP, which is the frequency
at which HDJD-J822 samples the tricolor photosensor, is
related to the system clock frequency, fCLK. The output
PWM frequency, fPWM, is also related to fCLK. The system
clock is sourced from either the internal oscillator or an
external clock.
A master is a device that initiates a data transfer on the
bus, generates the clock signal and terminates the data
transfer. A device addressed by the master is called a
slave. Both master and slave can act as a transmitter or
a receiver but the master controls the direction for data
transfer.
Calculation example:
The bus consists of a serial clock (SCL) and a serial data
(SDA) line. Both lines are bi-directional and connected
to the positive power supply through a pull-up resistor.
When the bus is free, both lines are HIGH.
fCLK = 2.5 MHz (nominal)
fSAMP = fCLK/25087 = 100 Hz (nominal)
fPWM = fCLK/4095 = 610 Hz (nominal)
The internal oscillator frequency varies from part-to-part
but it will not vary significantly during operation.
Register Description
The user controls and configures HDJD-J822 by programming a set of internal registers, through the I2C protocol.
Refer to Application Note 5070 for programming guide
and register description.
I2C Interface
Description
The programming interface to HDJD-J822 is a standard
2-wire serial bus, which follows the I2C data transmission
protocol. This protocol defines a transmitter as a device
HDJD-J822’s I2C bus interface always operates as a slave
transceiver in standard mode. Standard mode has a data
transfer rate of up to 100 kbit/s.
START/STOP Condition
To begin an I2C data transfer, the master must send a
unique signal to the bus called a START condition. This
is defined as a HIGH to LOW transition on the SDA line
while SCL is HIGH.
The master terminates the transfer by sending another
unique signal to the bus called a STOP condition. This
is defined as a LOW to HIGH transition on the SDA line
while SCL is HIGH.
The bus is considered to be busy after a START (S) condition. It will be considered free a certain time after the
STOP (P) condition. The bus stays busy if a repeated
START (Sr) is sent instead of a STOP condition.
The START and repeated START conditions are functionally identical.
SDA
SCL
S
P
START CONDITION
STOP CONDITION
Figure 2. START/STOP condition.
10
Data Transfer
The master initiates data transfer after a START condition.
Data is transferred in bits with the master generating one
clock pulse for each bit sent. For a data bit to be valid, the
SDA data line must be stable during the HIGH period of
the SCL clock line. Only during the LOW period of the SCL
clock line can the SDA data line change state to either
HIGH or LOW.
SDA
SCL
DATA VALID
DATA CHANGE
Figure 3. Data bit transfer.
A complete data transfer is 8-bits long or 1-byte. Each
byte is sent most significant bit (MSB) first followed by an
acknowledge or not acknowledge bit. Each data transfer
can send an unlimited number of bytes.
P
SDA
MSB
LSB
ACK
MSB
LSB
NO
ACK
Sr
SCL
S
or
Sr
1
2
8
9
1
2
8
START or REPEATED
START CONDITION
Acknowledge/Not Acknowledge
The receiver must always acknowledge each byte sent
in a data transfer. In the case of the slave-receiver and
master-transmitter, if the slave-receiver does not send
an acknowledge bit, the master-transmitter can either
STOP the transfer or generate a repeated START to start
a new transfer.
SDA PULLED LOW
BY RECEIVER
SDA
(SLAVE-RECEIVER)
SCL
(MASTER)
ACKNOWLEDGE
LSB
SDA LEFT HIGH
BY TRANSMITTER
8
9
ACKNOWLEDGE
CLOCK PULSE
11
Sr
or
P
STOP or REPEATED
START CONDITION
Figure 4. Data byte transfer.
SDA
(MASTER-TRANSMITTER)
9
In the case of the master-receiver and slave-transmitter,
the master generates a not acknowledge to signal the
end of the data transfer to the slave-transmitter. The master can then send a STOP or repeated START condition to
begin a new data transfer.
In all cases, the master generates the acknowledge or not
acknowledge SCL clock pulse.
SDA
(SLAVE-TRANSMITTER)
SDA LEFT HIGH
BY TRANSMITTER
LSB
P
SDA
(MASTER-RECEIVER)
SDA LEFT HIGH
BY RECEIVER
SCL
(MASTER)
8
NOT
ACKNOWLEDGE
Sr
9
ACKNOWLEDGE
CLOCK PULSE
STOP OR REPEATED
START CONDITION
Figure 6. Master-receiver acknowledge.
Addressing
Each device on the I2C bus needs to have a unique address. This is the first byte that is sent by the master-transmitter after the START condition. The protocol defines the
address as the first seven bits of the first byte.
The eighth bit or least significant bit (LSB) determines
the direction of data transfer. A ‘one’ in the LSB of the
first byte indicates that the master will read data from
the addressed slave (master-receiver and slave-transmitter). A ‘zero’ in this position indicates that the master will
write data to the addressed slave (master-transmitter and
slave-receiver).
master will respond with an acknowledge for the first
byte and set itself up as a slave-transmitter or slave-receiver depending on the LSB of the first byte.
The slave address in HDJD-J822 is made up of a fixed
part and a programmable part. The fixed part is A6 to A2
and is set as shown in Figure 7. The programmable part
is A1 and A0, which is set by external package pins. The
programmable address pins allows a maximum of four
HDJD-J822 chips on the same I2C bus to be addressed
(address range from 54h to 57h).
A device whose address matches the address sent by the
MSB
LSB
A6
A5
A4
A3
A2
1
0
1
0
1
SLAVE ADDRESS
Figure 7. Slave addressing.
12
A1
A0
R/W
Data Format
HDJD-J822 uses a register-based programming architecture. Each register has a unique address and controls a
specific function inside the chip.
then acknowledge the master.
The master writes the register address it wants to access
and waits for the slave to acknowledge. The master then
writes the new register data. Once the slave acknowledges, the master generates a STOP condition to end the
data transfer.
To write to a register, the master first generates a START
condition. Then it sends the slave address for the device
it wants to communicate with. The least significant bit
(LSB) of the slave address must indicate that the master
wants to write to the slave. The addressed device will
START CONDITION
S
MASTER WILL WRITE DATA
A6 A5 A4 A3 A2 A1 A0 W
A
MASTER SENDS
SLAVE ADDRESS
STOP CONDITION
D7 D6 D5 D4 D3 D2 D1 D0
A
D7 D6 D5 D4 D3 D2 D1 D0
MASTER WRITES
REGISTER ADDRESS
SLAVE ACKNOWLEDGE
A
P
MASTER WRITES
REGISTER DATA
SLAVE ACKNOWLEDGE
SLAVE ACKNOWLEDGE
Figure 8. Register byte write protocol.
To read from a register, the master first generates a START
condition. Then it sends the slave address for the device
it wants to communicate with. The least significant bit
(LSB) of the slave address must indicate that the master
wants to write to the slave. The addressed device will
then acknowledge the master.
The master writes the register address it wants to access
and waits for the slave to acknowledge. The master then
generates a repeated START condition and resends the
START CONDITION
S
MASTER WILL WRITE DATA
A6 A5 A4 A3 A2 A1 A0 W
MASTER SENDS
SLAVE ADDRESS
A
The master reads the register data sent by the slave and
sends a no acknowledge signal to stop reading. The
master then generates a STOP condition to end the data
transfer.
REPEATED START CONDITION
D7 D6 D5 D4 D3 D2 D1 D0
A
Figure 9. Register Byte Read Protocol.
MASTER WILL READ DATA
Sr A6 A5 A4 A3 A2 A1 A0
MASTER WRITES
REGISTER ADDRESS
SLAVE ACKNOWLEDGE
13
slave address sent previously. The least significant bit
(LSB) of the slave address must indicate that the master
wants to read from the slave. The addressed device will
then acknowledge the master.
SLAVE ACKNOWLEDGE
R
A
STOP CONDITION
D7 D6 D5 D4 D3 D2 D1 D0
MASTER SENDS
SLAVE ADDRESS
A
P
MASTER READS
REGISTER DATA
SLAVE ACKNOWLEDGE
MASTER NOT ACKNOWLEDGE
Application Diagrams
DVDD
vref = internal = 2.5 V
DVDD
68 KΩ, 1 µF
PASSIVE LOW PASS FILTER
LPF
SENSE_*
2.5 V
AVDD
0V
SENSOR
AVDD
XRST
SLEEP
SENSE_X
LPF
CH_X
CLK_SEL
A1
SENSE_Y
SENSE_Z
LPF
CH_Y
CH_Z
A0
SDA
VREF_EXT
ROSC
SCL
TEST
AVSS
ERR_FLAG
LPF
68 KΩ
LED DRIVER
COLOR
PWM_R
EN_RED
BRIGHT
CLK_EXT
PWM_G
PWM_B
EN_GREEN
EN_BLUE
DVDD
DVSS
CONTROL BUS
Typical Operation*
2.5 V
DVDD
vref = internal = 2.5 V
DVDD
68 KΩ, 1 µF
PASSIVE LOW PASS FILTER
LPF
SENSE_*
AVDD
0V
DVDD
SLEEP
SENSE_X
LPF
CH_X
CLK_SEL
A1
SENSE_Y
SENSE_Z
LPF
CH_Y
CH_Z
A0
SDA
VREF_EXT
ROSC
SCL
TEST
AVSS
ERR_FLAG
LPF
68 KΩ
LED DRIVER
COLOR
PWM_R
EN_RED
BRIGHT
CLK_EXT
PWM_G
PWM_B
EN_GREEN
EN_BLUE
DVDD
DVSS
CONTROL BUS
Button Mode Operation*
Refer to Application Note 5070 for implementation details.
*The SDA pull-up is only required at system level. It is
shown in the diagram for reference only.
14
SENSOR
AVDD
XRST
Package Tape and Reel Dimensions
24 Pin Wide Body Carrier Tape
4 ± 0.1
*SEE NOTE 1
∅1.5 ± 0.1
0.3 ± 0.1
2 ± 0.1
*SEE NOTE 6
1.75 ± 0.1
A
R0.3 MAX.
11.5 ± 0.1
*SEE NOTE 6
24 ± 0.3
B0
R0.5 TYP.
K0
SECTION A-A
12 ± 0.1
A
1.55 + 1.00/–0.05 DIA.
A0 = 10.9 mm ± 0.1
B0 = 16.0 mm ± 0.1
K0 = 3.0 mm ± 0.1
A0
Notes:
1. 10 sprocket hole pitch cumulative tolerance is ± 0.2mm.
2. Camber not to exceed 1 mm in 100 mm.
3. Material: Black Conductive Advantek Polystyrene.
4. A0 and B0 measured on a plane 0.3 mm above the bottom of the pocket.
5. K0 measured from a plane on the inside bottom of the pocket to the top surface of the carrier.
6. Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole.
7. Dimensions are in millimeters.
15
Peak Fixed Reels
LEGEND
W – Width
A – Shaft Diameter
B – Hub Diameter
C – Window Size
D – Total Reel Diameter
E – Shaft Key Hole
F – Reel Thickness
30
D3 5045 4
P 24/
W
PART NO. (VARIABLE)
SIZE (VARIABLE)
E
A
B
C
D
Notes:
1. Material: Polystyrene (Blue).
2. Antistatic coated.
3. Flange warpage: 3 mm maximum.
4. All dimensions are in millimeters.
5. ESD – Surface resistivity: 105 to 1011 ý/sq.
K
PEA
F
W Min. Max.
W
A Min. Max.
24.4 26.4 12.80 13.20
B
Min. Max.
C
Min. Max.
D Min. Max.
E
F
Min. Max.
Min. Max.
98 102 225.75226.25 326330.25 1.95 2.45
2 2.8
ESD WARNING: Standard CMOS handling precautions should be observed to avoid static discharge.
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Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0211EN
AV02-0494EN - June 14, 2007