CEL UPA811T-T1-A

NPN SILICON HIGH
FREQUENCY TRANSISTOR
UPA811T
OUTLINE DIMENSIONS (Units in mm)
FEATURES
•
SMALL PACKAGE STYLE:
2 NE680 Die in a 2 mm x 1.25 mm package
•
LOW NOISE FIGURE:
NF = 1.9 dB TYP at 2 GHz
•
HIGH GAIN:
|S21E|2 = 7.5 dB TYP at 2 GHz
•
EXCELLENT LOW VOLTAGE, LOW CURRENT
PERFORMANCE
PACKAGE OUTLINE S06
(Top View)
2.1 ± 0.1
1.25 ± 0.1
0.65
1
6
2
5
3
4
2.0 ± 0.2
DESCRIPTION
NEC's UPA811T is two NPN high frequency silicon epitaxial
transistors encapsulated in an ultra small 6 pin SMT package.
Each transistor is independently mounted and easily configured for either dual transistor or cascode operation. The high
fT, low voltage bias and small size make this device ideally
suited for pager and other hand-held wireless applications.
0.9 ± 0.1
ABSOLUTE MAXIMUM RATINGS1 (TA = 25°C)
SYMBOLS
PARAMETERS
UNITS
RATINGS
VCBO
Collector to Base Voltage
V
20
VCEO
Collector to Emitter Voltage
V
10
VEBO
Emitter to Base Voltage
V
1.5
IC
Collector Current
mA
35
PT
Total Power Dissipation
1 Die
2 Die
mW
mW
110
200
TJ
Junction Temperature
°C
150
TSTG
Storage Temperature
°C
-65 to +150
0.2 (All Leads)
1.3
0.7
+0.10
0.15 - 0.05
0 ~ 0.1
PIN OUT
1. Collector Transistor 1
2. Base Transistor 2
3. Collector Transistor 2
4. Emitter Transistor 2
5. Emitter Transistor 1
6. Base Transistor 1
Note:
Pin 3 is identified with a circle on the bottom of the package.
Note:
1. Operation in excess of any one of these parameters may result
in permanent damage.
ELECTRICAL CHARACTERISTICS (TA = 25°C)
PART NUMBER
PACKAGE OUTLINE
SYMBOLS
PARAMETERS AND CONDITIONS
UPA811T
S06
UNITS
ICBO
Collector Cutoff Current at VCB = 10 V, IE = 0
µA
IEBO
Emitter Cutoff Current at VEB = 1 V, IC = 0
µA
hFE1
Forward Current Gain at VCE = 3 V, IC = 5 mA
fT
Cre2
|S21E|2
NF
Gain Bandwidth at VCE = 3 V, IC = 5 mA
Feedback Capacitance at VCB = 3 V, IE = 0, f = 1 MHz
MIN
1.0
5.5
pF
Insertion Power Gain at VCE = 3 V, IC = 5 mA, f = 2 GHz
dB
Noise Figure at VCE = 3 V, IC = 5 mA, f = 2 GHz
dB
MAX
1.0
80
GHz
TYP
120
8.0
0.3
5.5
200
0.7
7.5
1.9
3.2
Notes:
1.Pulsed measurement, pulse width ≤ 350 µs, duty cycle ≤ 2 %.
2.The emitter terminal should be connected to the ground terminal of the 3 terminal capacitance bridge.
For Tape and Reel version use part number UPA811T-T1, 3K per reel.
California Eastern Laboratories
UPA811T
TYPICAL PERFORMANCE CURVES (TA = 25°C)
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
TOTAL POWER DISSIPATION vs.
AMBIENT TEMPERATURE
160 µA
Free Air
2
200
El
Pe
em
rE
en
ts
lem
in
en
To
t
Collector Current, IC (mA)
Total Power Dissipation, PT (mW)
25
al
t
100
20
140 µA
15
100 µA
120 µA
80 µA
10
60 µA
40 µA
5
lB=20 µA
0
50
100
0
150
0.5
1.0
Ambient Temperature, TA (°C)
Collector to Emitter Voltage, VCE (V)
COLLECTOR CURRENT vs.
BASE TO EMITTER VOLTAGE
DC CURRENT GAIN vs.
COLLECTOR CURRENT
20
200
VCE = 3 V
DC Current Gain, hFE
Collector Current, IC (mA)
VCE = 3 V
10
100
50
20
10
0
0.5
1.0
0.5
5
10
Base to Emitter Voltage, VBE (V)
Collector Current, IC (mA)
FEEDBACK CAPACITANCE vs.
COLLECTOR TO BASE VOLTAGE
GAIN BANDWIDTH PRODUCT vs.
COLLECTOR CURRENT
5.0
50
10
Gain Bandwidth Product, fT (GHz)
f = 1 MHz
Feddback Capacitance, CRE (pF)
1
2.0
1.0
0.5
0.2
VCE = 3 V
f = 2 GHz
8
6
4
2
0
0.1
1
2
5
10
20
Collector to Base Voltage, VCB (V)
50
0.5
1
5
10
Collector Current, IC (mA)
50
UPA811T
TYPICAL PERFORMANCE CURVES (TA = 25°C)
INSERTION POWER GAIN vs.
FREQUENCY
INSERTION POWER GAIN vs.
COLLECTOR CURRENT
25
VCE = 3 V
f = 2 GHz
Insertion Power Gain, IS21eI2 (dB)
Insertion Power Gain, IS21eI2 (dB)
12
8
4
1
5
10
20
15
10
5
0
0.1
0
0.5
VCE = 3 V
lc = 5 mA
50
0.2
0.5
1.0
2.0
5.0
Frequency, f (GHz)
Collector Current, lC (mA)
NOISE FIGURE vs.
COLLECTOR CURRENT
5
Noise Figure, NF (dB)
VCE = 3 V
f = 2 GHz
4
3
2
1
0
0.5
1
5
10
50
Collector Current, lC (mA)
ORDERING INFORMATION
PART NUMBER
UPA811T-T1-A
QUANTITY
3000
PACKAGING
Tape & Reel
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
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RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS
CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279
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PRINTED IN USA ON RECYCLED PAPER -1/99
DATA SUBJECT TO CHANGE WITHOUT NOTICE
4590 Patrick Henry Drive
Santa Clara, CA 95054-1817
Telephone: (408) 919-2500
Facsimile: (408) 988-0279
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CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant
with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous
Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive
2003/11/EC Restriction on Penta and Octa BDE.
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that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are
exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals.
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go into its products as of the date of disclosure of this information.
Restricted Substance
per RoHS
Concentration Limit per RoHS
(values are not yet fixed)
Concentration contained
in CEL devices
-A
Not Detected
Lead (Pb)
< 1000 PPM
Mercury
< 1000 PPM
Not Detected
Cadmium
< 100 PPM
Not Detected
Hexavalent Chromium
< 1000 PPM
Not Detected
PBB
< 1000 PPM
Not Detected
PBDE
< 1000 PPM
Not Detected
-AZ
(*)
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standards, please do not hesitate to contact your local representative.
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