AGILENT ACMD-7401

Agilent ACMD-7401
Miniature PCS Band Duplexer
Data Sheet
Features
• Miniature size: less than 1.4 mm
high, 5 x 5 mm footprint
• Rx Band: 1930 – 1990 MHz typical
performance:
Description
The ACMD-7401 is a miniaturized
duplexer designed using Agilent's
Film Bulk Acoustic Resonator
(FBAR) technology. The ACMD7401 is the first duplexer built
with Agilent's innovative
Microcap bonded-wafer chip
scale packaging technology. This
process allows the ultra small
filters to be assembled in a
molded chip-on-board (MCOB)
module that is less than 1.4 mm
high with a 5 x 5 mm footprint.
The ACMD-7401 enhances the
sensitivity and dynamic range of
CDMA receivers, providing more
than 50 dB attenuation of transmitted signal at the receiver input, and
more than 40 dB rejection of the
transmit-generated noise in the
receive band. Typical insertion loss
in the Tx channel is only 1.8 dB,
minimizing current drain from the
power amplifier. Typical insertion
loss in the Rx channel is 2.2 dB,
improving receiver sensitivity.
Agilent’s thin-film Bulk Acoustic
Resonator (FBAR) technology
makes possible high-Q filters at a
fraction their usual size. The
excellent power handling of the
bulk-mode resonators supports
the high output powers needed in
PCS handsets, with virtually no
added distortion.
Rx Noise Blocking: 44 dB
Insertion Loss: 2.2 dB typical,
3.0 dB band edge
• Tx Band: 1850 – 1910 MHz typical
performance:
Tx Interferer Blocking: 54 dB
Insertion Loss: 1.8 dB typical,
2.5 dB band edge
• 30 dBm Tx Power Handling
Applications
• Handsets or data terminals
operating in the US PCS frequency
band
ACMD-7401 Electrical Specifications, ZO = 50Ω, TC[1] as indicated
Symbol
Parameters
Units
+25°C[1,3]
Min Typ Max
+85°C[1,2,3,4]
Min Typ Max
–30°C[1,2,3]
Min Typ Max
Path from Antenna Port to Receiver Port
S23
Attenuation in Transmit Band
(1850.6 – 1909.4 MHz)
dB
50
54
—
50
52
—
50
52
—
S23
Insertion Loss, lower band edge
(1930.6– 1935 MHz)
dB
—
2.6
3.5
—
2.7
3.5
—
3.2
4.5
S23
Insertion Loss, mid-band
(1935– 1987 MHz)
dB
—
2.2
3.5
—
32.3
3.0
—
2.2
3.5
S23
Insertion Loss, upper band edge
(1987– 1989.4 MHz)
dB
—
2.8
3.5
—
2.8
3.8
—
2.7
3.5
∆ S23
Ripple in Receive Band
dB
—
1.5
2.6
—
1.5
3.0
—
2.0
3.0
S22
Rx Port Return Loss in Receive Band
dB
8.0
10
—
8.0
10
—
8.0
10
—
Path from Transmitter Port to Antenna Port
S31
Attenuation in Receive Band
(1930.6 – 1935 MHz)
dB
40
44
—
40
42
—
37
42
—
S31
Attenuation in Receive Band
(1935– 1989.4 MHz)
dB
40
42
—
40
42
—
40
42
—
S31
Insertion Loss, lower band edge
(1850.6– 1853 MHz)
dB
—
2.3
3.0
—
2.3
3.0
—
2.3
3.6
S31
Insertion Loss, mid-band
(1853– 1907 MHz)
dB
—
2.2
3.0
—
2.2
3.0
—
2.2
3.0
S31
Insertion Loss, upper band edge
(1907– 1909.4 MHz)
dB
—
1.6
3.0
—
2.4
3.8
—
1.2
3.0
∆ S31
Ripple in Transmit Band
dB
—
2.0
2.5
—
2.0
3.0
—
2.0
3.0
S11
Tx Port Return Loss in Transmit Band
dB
8.0
10
—
8.0
10
—
8.0
10
—
S33
Antenna Port Return Loss,
Tx and Rx bands
dB
8.0
10
—
8.0
10
—
8.0
10
—
S21
Tx-Rx Isolation, 1850.6 – 1909.4 MHz
(Transmit Band)
dB
50
54
—
50
54
—
50
54
—
S21
Tx-Rx Isolation, 1930.6 – 1935 MHz
(Receive Band)
dB
40
44
—
40
44
—
38
44
—
S21
Tx-Rx Isolation, 1935– 1989.4 MHz
(Receive Band)
dB
40
44
—
40
44
—
40
44
—
Notes:
1. TC is defined as case temperature, the temperature of the underside of the
duplexer where it makes contact with the circuit board. Port 1 = Tx,
Port 2 = Rx, Port 3 = Ant
2. Specifications are given at operating temperature limits and room
temperature. To estimate performance at some intermediate temperature,
use linear interpolation.
3. Specifications are guaranteed over the given temperature range, with the
input power to the Tx port equal to +29 dBm (or lower) over all Tx
frequencies. Upper transmit band edge maximum Insertion Loss at 85°C
is guaranteed to +26 dBm of input power. For higher input power, derate
maximum temperature as: Tmax = 95°C – 25°C * Pin (Watts). Input power
between +26 dBm and +30 dBm is safe, but the Insertion Loss at the
upper transmit band edge will degrade slightly.
4. High temperature specifications are guaranteed with thermal pads in
thermal contact with the motherboard. (See Figure 1.)
2
Thermal Pads ensure good
thermal contact to the motherboard.
Figure 1. Underside of the duplexer.
0
-35
-40
S21 (Tx to Rx isolation), (dB)
S31 (Ant-Tx), (dB)
-10
-20
-30°C
25°C
85°C
-30
-40
-30°C
25°C
85°C
-45
-50
-55
-60
-65
-50
1.82
1.84
1.86
1.88
1.90
1.92
1.94
1.96
1.98
2.00
-70
1.82
2.02
1.84
1.86
1.88
1.90
1.92
1.94
1.96
1.98
2.00
2.02
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 3. Isolation (Tx to Rx ports).
Figure 2. Loss, Tx port to antenna port.
0
0
S11 (Tx Return Loss), (dB)
S23 (Ant-Rx), (dB)
-10
-20
-30°C
25°C
85°C
-30
-40
-50
-60
1.82
1.84
1.86
1.88
1.90
1.92
1.94
1.96
1.98
2.00
-5
-10
-30°C
25°C
85°C
-15
-20
1.82 1.84
2.02
FREQUENCY (GHz)
1.86
1.88
1.90
1.92
1.94
1.96
1.98
2.00 2.02
FREQUENCY (GHz)
Figure 5. Return Loss, Tx port.
Figure 4. Loss, antenna port to Rx port.
S22 (Rx Return Loss), (dB)
0
-5
-30°C
25°C
85°C
-30°C
25°C
85°C
-10
-15
-20
1.82
1.84
1.86
1.88
1.90
1.92
1.94
1.96
1.98
2.00
2.02
FREQUENCY (GHz)
Figure 6. Return loss, Rx port.
freq (1.850 GHz to 1.909 GHz)
Figure 7. Tx port impedance (8 dB circle).
3
S33 (Ant Return Loss), (dB)
0
-30°C
25°C
85°C
-5
-30°C
25°C
85°C
-10
-15
-20
1.82
1.84
1.86
1.88
1.90
1.92
1.94
1.96
1.98
2.00
2.02
FREQUENCY (GHz)
Figure 8. Return loss, antenna port.
freq (1.930 GHz to 1.990 GHz)
Figure 9. Rx port impedance (8 dB circle).
-30°C
25°C
85°C
freq (1.850 GHz to 1.910 GHz)
Figure 10. Antenna port impedance, Tx band (8 dB circle).
4
-30°C
25°C
85°C
freq (1.930 GHz to 1.990 GHz)
Figure 11. Antenna port impedance, Rx band (8 dB circle).
Areas where care in design must
be observed are thermal ground,
RF ground, in/out connection
design, and solder mask/solder
stencil design. These four design
areas, which are sometimes
interrelated, will be considered
one at a time below.
Thermal Ground
FBAR resonators have a negative
temperature coefficient of
frequency — as temperature goes
up, the frequency response of the
filter shifts down in frequency.
See Figure 12. Typical coefficients are 57 KHz/° C for the Tx
filter and 40 KHz/° C for the Rx
filter. In Figure 13, the same data
are presented with the scale
narrowed down to the upper end
of the Tx band. Note that all
these data are taken at low input
power levels (+10 dBm).
When input power is +29 dBm,
heating in the Tx filter due to RF
losses causes the filter membranes
to heat up beyond 85°C. This, in
turn, causes the filter response to
shift further left (down in frequency), resulting in increased
insertion loss at the high end of
the Tx band (1910 MHz). Agilent
Technologies takes this into
account in the manufacture and
final test of the duplexer — all
specifications for insertion loss
5
the heat to be removed in all
directions. Via holes, necessary
for RF grounding, should be filled
with copper plating to further
remove heat from the duplexer’s
Tx filter and dump it into a
second ground plane located in a
lower layer of the motherboard.
The motherboard must be designed to remove heat from the
duplexer with the lowest possible
thermal resistance. Mount the
duplexer on a large surface of
1/ ounce copper ground plane
2
(as shown in Figure 14), to enable
FBAR duplexers have extremely
low thermal mass and must be
properly heat sunk, as well as
isolated from external sources of
heat (such as a nearby power
amplifier). Failure to provide an
adequate thermal design to cool
0
-10
-20
S31 (Ant-Rx), (dB)
Agilent’s ACMD-7401 duplexers
provide high RF performance in
a very small package. However, in
order to achieve all the performance available from the
duplexer, care must be taken in
the design of the board onto
which it is mounted. The purpose
of this information is to provide
Agilent’s recommendations on
the design of that board (called
the motherboard in this note).
(and other parameters) will be met
at the specified input power level
and motherboard temperature.
Note that high power/high temperature testing done at Agilent is
performed with the duplexer
soldered down to a test board
having a very good heat sink.
-30°C
25°C
85°C
-30
-40
-50
-60
1.82
1.86
1.90
1.94
1.98
2.02
FREQUENCY (GHz)
Figure 12. Tx Filter Response with Temperature.
0.0
-0.5
S31 (TX to Ant Loss), (dB)
Applications Information
-1.0
-1.5
-2.0
-30°C
25°C
85°C
-2.5
-3.0
-3.5
-4.0
-4.5
-5.0
1.845
1.855
1.865
1.875
1.885
1.895
1.905
FREQUENCY (GHz)
Figure 13. Tx Filter Response with Temperature (expanded).
1.915
the duplexer may result in
degradation of insertion loss at
the high end of the Tx band, or
other performance issues.
RF Ground
Many of the same considerations,
which apply to the thermal
ground plane, also apply to the
RF ground plane. A large surface
ground area, as shown in Figure
14, provides data sheet performance for the duplexer. In addition,
a series of 56 (or more) plated
patch of solder mask, but RF
coupling to the ground may affect
duplexer performance. Agilent
Technologies recommends that
the user remove the ground in
the 1.0 x 1.4 mm rectangle
shown. Note that the mounting
includes a solder mask frame,
4.6 mm x 4.6 mm (shown in
green). This solder mask assists
with the alignment of the duplexer during soldering.
and plugged via holes to a lower
ground plane (0.25 to 0.30 mm in
diameter) should be provided
under the perimeter of the
duplexer, as shown in Figure 15.
The rectangular opening in the
center of the duplexer ground
plane (Figure 15) is strongly
suggested. The 5 mm x 5 mm
miniature FBAR duplexer has
two via hole openings on the
underside. They are DC insulated
from any ground plane with a
Details of the input/output pads
are shown in Figure 16.
0.5
-0.5
0.5mm typ
Hole spacing
2.3 (solder mask)
0.25mm filled plated-thru
hole, 56 places, on a
See detail
0.5mm X 0.5mm grid
0.7
having 44 empty places.
0.25
Duplexer (source of heat)
0.55
Tx
Rx
-0.55
0.0 Ref
-0.7
-1.6
-0.55
0.55
0.0 Ref
-2.3 (solder mask)
.
-2.3 (solder mask)
Figure 14. Thermal and Electrical Ground Plane.
1.6
2.3 (solder mask)
Ant
-1.6
Etched rectangle in the center of
the pattern, 1.0mm X 1.4mm.
Reference lines cross in the
center of the duplexer.
Green = solder mask
Brown = exposed dielectric
Gold = exposed conductor
Figure 15. Thermal and Electrical Ground Plane Details.
0.7
Input/output pad
0.4
0.35
0.4
0.35
Exposed dielectric (brown)
Solder mask (green)
Exposed ground plane
( ld)
Figure 16. Detail of Input/output Pads.
6
All
dimensions
are in mm
In/out Connection Design
High isolation between ports is a
characteristic of Agilent FBAR
duplexers, and values often
exceed 50 dB. To achieve these
isolation numbers, the user’s
motherboard must have 60 dB or
more of isolation between each
pair of the three input/output
lines. This is measured as shown
in Figure 17, using copper pins to
short out all three of the lines to
ground. Isolation is then measured between the Tx, Rx and
Ant lines, with 60 dB as a minimum acceptable level.
In order to achieve 60 dB of
isolation in the motherboard
itself using microstrip transmission lines, extreme care must be
taken in the design due to the
poorly contained field lines in
microstrip. Ground areas between the lines and other good
techniques will have to be used.
The use of coplanar waveguide
over a groundplane (CPWG)
provides for higher line-to-line
isolation.
εr
CPWG (Coplanar waveguide)
Design guidelines for CPWG
transmission lines can be found
in AppCAD, the design/analysis
software found on the Web at
http://www.agilent.com/view/
appcad
Better performance can be obtained using symmetrical stripline,
where a buried conductor has a
ground plane above and below.
εr
Stripline
Shorting pin, soldered to in/out pad and to ground on
both sides, three places.
Figure 17. Motherboard Isolation Test Method.
7
Such transmission lines have
excellent shielding, and line-toline values in excess of 80 dB can
easily be achieved using this
transmission line. Via holes are
used to bring the signal down to
the stripline conductor from the
in/out pads on the surface.
In order to obtain the maximum
isolation between lines in the
buried stripline layer, fill in the
area between lines with large
patches of copper, connected to the
upper (and other) ground planes.
Solder Mask and Solder Stencil
Solder mask is used on all
motherboards, to prevent solder
from adhering to places where it
is not desired. In mounting the
duplexer, it serves as an aid to
alignment during reflow soldering.
The motherboard solder mask
(shown in green in Figures 15, 16
and 17) is 4.6 mm x 4.6 mm,
slightly smaller than the duplexer
and corresponding to the metal
pattern on the underside. This
will contain the solder during
reflow, and prevent the duplexer
from rotating or slipping out of
alignment while it is floating on
molten solder.
A solder stencil is used to print a
pattern of solder paste onto the
motherboard, with the duplexer
placed upon this paste before the
reflow process begins. The design
of the solder stencil is critical to
obtaining good yields in reflow
soldering.
The solder stencil pattern
recommended by Agilent Technologies is shown in Figure 18,
along with the recommended
opening in the solder mask on
the top surface.
Solder Materials
The recommended solder profile
for the FBAR duplexer is shown
in Figure 20.
1.9
1.2
0.6
2.4
Duplexer center line
Marking Code
The marking code for the
ACMD-7401 is as shown below:
0.4 typical
1.48
ABCDEFG
Rx
LLLLLLL
TTTT t t t t
Tx
Reference point, internal pattern
0.6
0.4 typical
1.3
Notes:
All dimensions in mm.
Gray = solder mask
Dark gray = solder (0.004" thick)
The pattern of 24 square solder pads and
the opening in the gray solder mask are
symmetrical about the two center lines.
1.9
2.4
RRRR r r r r
1.25
Center line
Ant
A = Device Code
(U = USPCS, G = GSM)
0.2 typical
B = Manufacturing location
C = Year (3 = year 2003)
DE = Workweek
F = PCB Manufacturer
G = PCB Revision
LLLLLLL = Lot#
1.9
3.9
1.6
3.7
3.2
2.7
1.4
1.4 1.5
1.1
1.0
1.0
0.6
2.6
2.3
2.9
0.5
0.2
2.1
2.2
TTTTtttt = TTTT Wafer lot #,
tttt wafer #
RRRRrrrr = RRRR Wafer lot #,
rrrr wafer #
0.5
1.0
Reference point
1.4
1.9
0.5
1.0
1.4
Internal pattern
Figure 18. Solder Mask/Solder Stencil.
8
2.4
3.4
Green is area covered by solder mask
Gold is contact pad
Gray is exposed PCB material
Black is filled via holes
All dimensions in mm
Tolerance is ±0.1mm
Pin assignments are shown in red
4.0
3.0
2.0
BOTTOM VIEW
1.0
Tx
Rx
4.8 5.0
3.2
1.8
1.9
1.0
2.3
2.7
3.1
0.6
Ant
0.2
0.2
SIDE VIEW
0.6
1.9
2.3
1.4 max.
2.7
3.1
4.4
4.8
5.0
5.0
Figure 19. Outline drawing.
Solder Compositions
300
Shaded line is the alloy type recommended by Agilent Technologies.
Melting temp.
(oC)
Recommended working
temperature (oC)
Sn42Bi58
138
160 – 180
Sn43Pb43Bi14
144 – 163
165 – 185
Sn63Pb37
183
200 – 240
Sn60Pb40
186
200 – 240
Sn91/Zn9
199
200 – 240
Sn96.2Ag2.5Cu0.8Sb0.5
216
235 – 255
Sn95.8Ag3.5Cu0.7
217
235 – 255
Sn96.5Ag3.5
221
240 – 260
250
TEMPERATURE (°C)
Alloy type
200
150
100
50
Tested profile shown.
0
0
9
50
100
150
200
TIME (seconds)
Figure 20. Recommended Solder Profile.
250
300
A
B
E
SPK
D
FRONT VIEW
SIDE VIEW
BACK VIEW
F
SPECIFICATION
TAPE
A
B
WIDTH MAX +1.5-0.0
C1
±0.5
D
±0.5
12mm
4.40
55.0
18.00
12.4
E
F
(max) (min)
178
1.50
G
±0.2
H
(min)
13.50
20.20
G
H
C1
TAPE SLOT
PLANE VIEW
Note: Surface resistivity to be <1012 Ohms/square
ARBOR HOLE
Figure 21. Reel Dimensions (all dimensions in mm).
P10
0.20
1.40 REF
T
P2
P0
A
D0
E
W
1234567
0000002
T123456
R123456
6° B0
SECTION A-A
B
A
B
F
D1
P1
SYMBOL SIZE (mm)
A0
B0
D0
D1
K0
K1
P1
P0
P2
P10
E
F
T
W
5.40 ± 0.10
5.40 ± 0.10
0.10
1.50 +
–0
1.60 ± 0.10
1.90±0.10
1.50±0.10
8.00±0.10
4.00±0.10
2.00±0.10
40.00±0.20
1.75±0.10
5.50±0.10
0.30±0.30
12.00±0.30
A0
6°
K0 K1
SECTION B-B
Notes:
Allowable camber to be 1 mm per 100 mm in length.
All dimensions in mm.
Figure 22. Tape Dimensions (all dimensions in mm).
10
45°REF
Sprocket holes
ABCDEFG
LLLLLLL
TTTTtttt
RRRRrrrr
ABCDEFG
LLLLLLL
TTTTtttt
RRRRrrrr
Pocket cavity
Package pin 1 orientation
Figure 23. Unit Orientation in Tape.
Ordering Information
Part Number
No. of Devices
Container
ACMD-7401-BLK
100
Anti-static bag
ACMD-7401-TR1
1000
7” Reel
www.agilent.com/semiconductors
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distributors, please go to our web site.
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Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
May 25, 2004
5989-0533EN