VDSS = 1200 V ID (cont) = 12 A RDS(on)= 1.4 Ω IXTH 12N120 Power MOSFET, Avalanche Rated High Voltage Preliminary Data Sheet Symbol Test Conditions Maximum Ratings VDSS TJ = 25°C to 150°C 1200 V VDGR TJ = 25°C to 150°C; RGS = 1 MΩ 1200 V VGS Continuous ±30 V VGSM Transient ±40 V ID25 TC = 25°C 12 A IDM TC = 25°C, pulse width limited by TJM 48 A 12 A IAR TO-247 AD D (TAB) G = Gate, S = Source, EAR EAS TC TC = 25°C = 25°C 30 1.0 mJ J PD TC = 25°C 500 W -55 ... +150 °C TJM 150 °C Features Tstg -55 ... +150 °C z TJ Md Mounting torque 1.13/10 Nm/lb.in. Weight Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s 6 g 300 °C D = Drain, TAB = Drain International standard package JEDEC TO-247 AD z Low RDS (on) HDMOSTM process z Rugged polysilicon gate cell structure z Fast switching times Applications z Symbol Test Conditions VDSS VGS = 0 V, ID = 1 mA VGS(th) VDS = VGS, ID = 250 µA IGSS VGS = ±30 VDC, VDS = 0 IDSS VDS = VDSS VGS = 0 V RDS(on) Characteristic Values (TJ = 25°C, unless otherwise specified) min. typ. max. 1200 3 TJ = 25°C TJ = 125°C VGS = 10 V, ID = 0.5 • ID25 Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 % © 2004 IXYS All rights reserved z z Uninterruptible Power Supplies (UPS) z DC choppers V 5 V ±100 nA 25 3 µA mA 1.4 Ω Switch-mode and resonant-mode power supplies Motor controls Advantages z z z Easy to mount with 1 screw (isolated mounting screw hole) Space savings High power density DS98937E(04/04) IXTH 12N120 Symbol Test Conditions Characteristic Values (TJ = 25°C, unless otherwise specified) min. typ. max. gfs VDS = 20 V; ID = 0.5 ID25, pulse test 6 Ciss Coss VGS = 0 V, VDS = 25 V, f = 1 MHz 10 S 3400 pF 280 pF C rss 105 pF td(on) 24 ns tr VGS = 10 V, VDS = 0.5 • VDSS, 0.5 ID25 25 ns td(off) RG = 1.5 Ω (External) 35 ns tf 17 ns Qg(on) 95 nC 22 nC 50 nC Qgs VGS = 10 V, VDS = 0.5 • VDSS, ID = 0.5 ID25 Qgd RthJC 0.25 RthCK 0.25 Source-Drain Diode TO-247 AD Outline K/W K/W Characteristic Values (TJ = 25°C, unless otherwise specified) min. typ. max. Symbol Test Conditions IS VGS = 0 V 12 A ISM Repetitive; pulse width limited by TJM 48 A VSD IF = IS, VGS = 0 V, Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 % 1.5 V t rr IF = IS, -di/dt = 100 A/µs, VR = 100 V 850 1 2 3 Terminals: 1 - Gate 3 - Source Dim. 2 - Drain Tab - Drain Millimeter Min. Max. A 4.7 5.3 2.2 2.54 A1 A2 2.2 2.6 b 1.0 1.4 b1 1.65 2.13 b2 2.87 3.12 C .4 .8 D 20.80 21.46 E 15.75 16.26 e 5.20 5.72 L 19.81 20.32 L1 4.50 ∅P 3.55 3.65 Q 5.89 6.40 R 4.32 5.49 S 6.15 BSC Inches Min. Max. .185 .209 .087 .102 .059 .098 .040 .055 .065 .084 .113 .123 .016 .031 .819 .845 .610 .640 0.205 0.225 .780 .800 .177 .140 .144 0.232 0.252 .170 .216 242 BSC ns IXYS reserves the right to change limits, test conditions, and dimensions. IXYS MOSFETs and IGBTs are covered by one or more of the following U.S. patents: 4,850,072 4,835,592 4,931,844 4,881,106 5,034,796 5,017,508 5,063,307 5,049,961 5,237,481 5,187,117 5,381,025 5,486,715 6,404,065B1 6,306,728B1 6,162,665 6,534,343 6,583,505 6,259,123B1 6,306,728B1 6,683,344 IXTH 12N120 Fig. 1. Output Characteristics Fig. 2. Extended Output Characteristics @ 25ºC @ 25º C 20 12 VGS = 10V 11 8V 16 14 7V 8 I D - Amperes I D - Amperes 9 VGS = 10V 18 8V 7.5V 10 7 6 6.5V 5 4 3 10 7V 8 6 6.5V 4 6V 2 6.5V 12 6V 2 1 0 0 0 2 4 6 8 10 12 14 16 18 0 3 6 9 V D S - Volts Fig. 3. Output Characteristics @ 125ºC 18 21 24 27 30 3.1 VGS = 10V 11 2.8 9 8 R D S ( o n ) - Normalized 8V 7V 10 I D - Amperes 15 V D S - Volts Fig. 4. RDS(on) Norm alized to 0.5 ID25 Value vs . Junction Tem perature 12 6.5V 7 6 6V 5 4 3 5.5V 2 VGS = 10V 2.5 2.2 1.9 I D = 12A 1.6 I D = 6A 1.3 1 0.7 5V 1 0.4 0 0 4 8 12 16 20 24 V D S - Volts 28 32 36 -50 40 0 25 50 75 100 125 150 Fig. 6. Drain Curre nt vs . Cas e Tem pe rature 0.5 ID25 Value vs. ID 14 2.8 2.6 -25 TJ - Degrees Centigrade Fig. 5. RDS(on) Norm alize d to VGS = 10V 12 2.4 10 TJ = 125ºC 2.2 I D - Amperes R D S ( o n ) - Normalized 12 2 1.8 1.6 1.4 8 6 4 TJ = 25ºC 1.2 2 1 0.8 0 0 2 4 6 8 10 12 I D - Amperes © 2004 IXYS All rights reserved 14 16 18 20 -50 -25 0 25 50 75 100 TC - Degrees Centigrade 125 150 IXTH 12N120 Fig. 8. Trans conductance Fig. 7. Input Adm ittance 20 16 18 14 16 10 8 6 TJ = 125ºC 4 TJ = -40ºC 14 g f s - Siemens I D - Amperes 12 25ºC 125ºC 12 10 8 6 25ºC -40ºC 4 2 2 0 0 4.5 5 5.5 6 6.5 7 0 7.5 2 4 6 V G S - Volts Fig. 9. Source Current vs. Source -To-Drain Voltage 10 33 9 VDS = 600V 8 I D = 6A 7 I G = 10mA 30 27 24 VG S - Volts I S - Amperes 10 12 14 16 18 90 100 Fig. 10. Gate Charge 36 21 18 15 TJ = 125ºC 12 8 I D - Amperes 6 5 4 3 9 2 TJ = 25ºC 6 1 3 0 0 0.4 0.5 0.6 0.7 V S D - Volts 0.8 0.9 0 1 10 20 30 40 50 60 70 80 Q G - nanoCoulombs Fig. 12. Maxim um Trans ient Therm al Resistance Fig. 11. Capacitance 10000 1.00 C iss R( t h ) J C - ºC / W Capacitance - picoFarads f = 1MHz 1000 C oss 100 0.10 C rss 10 0.01 0 5 10 15 20 25 V D S - Volts 30 35 40 IXYS reserves the right to change limits, test conditions, and dimensions. 1 10 100 Pulse Width - milliseconds 1000