NIEC PDMB100B12C2

PDMB100B12C2
IGBT MODULE Dual 100A 1200V
CIRCUIT
OUTLINE DRAWING
4- fasten- tab No 110
Dimension(mm)
Approximate Weight : 220g
MAXMUM RATINGS (Tc=25°C)
Item
Collector-Emitter Voltage
Gate - Emitter Voltage
DC
1 ms
Collector Current
Collector Power Dissipation
Junction Temperature Range
Storage Temperature Range
Isolation Voltage Terminal to Base AC, 1 min.)
Module Base to Heat sink
Bus Bar to Main Terminals
Mounting Torque
Symbol
PDMB100B12C2
VCES
VGES
IC
IC
PC
Tj
Tstg
VISO
1200
+/ - 20
100
200
500
-40 to +150
-40 to +125
2500
FTOR
2.04
Unit
V
V
A
W
°C
°C
V
N•m
ELECTRICAL CHARACTERISTICS (Tc=25°C)
Characteristic
Symbol
Collector-Emitter Cut-Off Current
Gate-Emitter Leakage Current
Collector-Emitter Saturation Voltage
Gate-Emitter Threshold Voltage
Input Capacitance
Rise Time
Switching Time
ICES
IGES
VCE(sat)
VGE(th)
C ies
tr
ton
tf
toff
Turn-on Time
Fall Time
Turn-off Time
Test Condition
VCE=1200V,VGE=0V
VGE=+/- 20V,VCE=0V
IC=100A,VGE=15V
VCE=5V,IC=100mA
VCE=10V,VGE=0V,f=1MHz
VCC= 600V
RL= 6 ohm
RG=10 ohm
VGE= +/- 15V
Min.
Typ.
Max.
Unit
4.0
−
−
−
−
1.9
8300
0.25
0.40
0.25
0.80
2.0
1.0
2.4
8.0
0.45
0.7
0.35
1.10
mA
µA
V
V
pF
FREE WHEELING DIODES RATINGS & CHARACTERISTICS (Tc=25°C)
Item
Symbol
Rated Value
Forward Current
Characteristic
DC
1 ms
IF
IFM
Symbol
Unit
100
200
Test Condition
µs
A
Min.
Typ.
Max.
Unit
Peak Forward Voltage
VF
IF=100A,VGE=0V
-
1.9
2.4
V
Reverse Recovery Time
trr
IF=100A,VGE=-10V,di/dt=200A/µs
-
0.2
0.3
µs
Min.
Typ.
Max.
Unit
-
-
0.24
0.42
°C/W
THERMAL CHARACTERISTICS
Characteristic
Thermal Impedance
IGBT
DIODE
Symbol
Rth(j-c)
Test Condition
Junction to Case
PDMB100B12C2
PDMB100B12C2
IGBT MODULE Dual 100A 1200V
Fig.2- Collector to Emitter On Voltage
vs. Gate to Emitter Voltage (Typical)
Fig.1- Output Characteristics (Typical)
TC=25℃
200
VGE=20V
12V
IC=50A
Collector to Emitter Voltage V CE (V)
15V
Collector Current I C (A)
150
9V
100
8V
50
7V
0
0
2
TC=25℃
16
10V
4
6
8
14
100A
12
10
8
6
4
2
0
10
0
4
Collector to Emitter Voltage VCE (V)
Collector to Emitter Voltage V CE (V)
Collector to Emitter Voltage V CE (V)
12
10
8
6
4
2
8
12
16
R L=6Ω
TC=25℃
16
700
14
600
12
500
10
8
400
V CE=600V
6
300
400V
200
4
200V
2
100
0
0
20
0
150
300
Gate to Emitter Voltage VGE (V)
450
600
750
Total Gate Charge Qg (nC)
Fig.6- Collector Current vs. Switching Time (Typical)
Fig.5- Capacitance vs. Collector to Emitter Voltage (Typical)
1.6
20000
VGE=0V
f=1MHZ
TC=25℃
10000
Cies
5000
2000
Coes
1000
500
VCC=600V
R G=10Ω
VGE=±15V
TC=25℃
1.4
1.2
Switching Time t (μs)
50000
Capacitance C (pF)
20
tOFF
1
0.8
tf
0.6
0.4
200
Cres
100
50
0.1
0.2
0.5
1
2
5
10
20
Collector to Emitter Voltage VCE (V)
50
100
200
tON
tr
0.2
0
0
25
50
Collector Current IC (A)
75
100
Gate to Emitter Voltage VGE (V)
100A
4
16
800
200A
14
0
12
Fig.4- Gate Charge vs. Collector to Emitter Voltage (Typical)
TC=125℃
16
0
8
Gate to Emitter Voltage VGE (V)
Fig.3- Collector to Emitter On Voltage
vs. Gate to Emitter Voltage (Typical)
IC=50A
200A
PDMB100B12C2
IGBT MODULE Dual 100A 1200V
Fig.8- Forward Characteristics of Free Wheeling Diode
Fig.7- Series Gate Impedance vs. Switching Time (Typical)
(Typical)
10
VCC=600V
IC=100A
VGE=±15V
TC=25℃
TC=25℃
TC=125℃
toff
ton
2
Forward Current I F (A)
5
Switching Time t (μs)
200
tr
1
tf
0.5
0.2
150
100
50
0.1
0.05
5
10
20
50
100
0
200
0
1
2
I F=100A
TC=25℃
200
trr
100
Collector Current I C (A)
100
50
20
10
IRrM
RG=10Ω
VGE=±15V
TC≦125℃
50
20
10
5
2
1
0.5
2
0.2
100
200
300
400
500
0.1
600
0
400
800
Fig.11- Transient Thermal Impedance
1
5x10 -1
2x10 -1
FRD
IGBT
1x10 -1
5x10 -2
2x10 -2
1x10 -2
TC=25℃
5x10 -3
1 Shot Pulse
2x10
-3
10 -5
1200
Collector to Emitter Voltage V CE (V)
-di/dt (A/μs)
(℃/W)
0
(J-C)
1
Transient Thermal Impedance Rth
Peak Reverse Recovery Current I RrM (A)
Reverse Recovery Time trr (ns)
500
200
5
4
Fig.10- Reverse Bias Safe Operating Area
Fig.9- Reverse Recovery Characteristics (Typical)
500
3
Forward Voltage V F (V)
Series Gate Impedance RG (Ω)
10 -4
10 -3
10 -2
Time t (s)
10 -1
1
10 1
1600