NSC 54F00DMQB

General Description
Features
This device contains four independent gates, each of which
performs the logic NAND function.
n Guaranteed 4000V minimum ESD protection
Ordering Code:
See Section 0
Commercial
Military
Package
Package Description
Number
74F00PC
54F00DM (Note 2)
N14A
14-Lead (0.300" Wide) Molded Dual-In-Line
J14A
14-Lead Ceramic Dual-In-Line
74F00SC (Note 1)
M14A
14-Lead (0.150" Wide) Molded Small Outline, JEDEC
74F00SJ (Note 1)
M14D
14-Lead (0.300" Wide) Molded Small Outline, EIAJ
54F00FM (Note 2)
W14B
14-Lead Cerpack
54F00LM (Note 2)
E20A
20-Lead Ceramic Leadless Chip Carrier, Type C
54F/74F00
54F/74F00
Quad 2-Input NAND Gate
54F/74F00 Quad 2-Input NAND Gate
December 1994
DSXXX
Note 1: Devices also available in 13" reel. Use suffix = SCX and SJX.
Note 2: Military grade device with environmental and burn-in processing. Use suffix = DMQB, FMQB and LMQB.
Logic Symbol
Connection Diagrams
IEEE/IEC
Pin Assignment
for DIP, SOIC and Flatpak
DS009454-3
DS009454-2
Pin Assignment
for LCC
DS009454-1
TRI-STATE ® is a registered trademark of National Semiconductor Corporation.
© 1997 National Semiconductor Corporation
www.national.com
DS009454
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Unit Loading/Fan Out
See Section 0 for U.L. definitions
DSXXX
54F/74F
Pin Names
Description
U.L.
Input IIH/IIL
HIGH/LOW
Output IOH/IOL
An, Bn
Inputs
1.0/1.0
20 µA/−0.6 mA
On
Outputs
50/33.3
−1 mA/20 mA
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Absolute Maximum Ratings
Storage Temperature
Ambient Temperature under Bias
Junction Temperature under Bias
Plastic
VCC Pin Potential to
Ground Pin
Input Voltage (Note 4)
Input Current (Note 4)
Voltage Applied to Output
in HIGH State (with VCC = 0V)
Standard Output
TRI-STATE ® Output
Current Applied to Output
in LOW State (Max)
ESD Last Passing Voltage (Min)
(Note 3)
−65˚C
−55˚C
−55˚C
−55˚C
to
to
to
to
+150˚C
+125˚C
+175˚C
+150˚C
twice the rated IOL (mA)
4000V
Recommended Operating
Conditions
Free Air Ambient Temperature
Commercial
Supply Voltage
Commercial
−0.5V to +7.0V
−0.5V to +7.0V
−30 mA to +5.0 mA
0˚C to +70˚C
+4.5V to +5.5V
Note 3: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under these
conditions is not implied.
−0.5V to VCC
−0.5V to +5.5V
Note 4: Either voltage limit or current limit is sufficient to protect inputs.
DC Electrical Characteristics
Symbol
Parameter
54F/74F
Min
Typ
Units
VCC
Conditions
Max
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
0.8
V
VCD
Input Clamp Diode Voltage
−1.2
V
Min
V
Min
V
Min
IOH = −1 mA
IOH = −1 mA
IOL = 20 mA
µA
Max
IOL = 20 mA
VIN = 2.7V
µA
Max
VIN = 7.0V
µA
Max
VOUT = VCC
V
0.0
IID = 1.9 µA
VOH
VOL
IIH
IBVI
ICEX
VID
2.0
Output HIGH
54F 10% VCC
2.5
Voltage
74F 10% VCC
2.5
74F 5% VCC
2.7
V
Output LOW
54F 10% VCC
0.5
Voltage
74F 10% VCC
0.5
Input HIGH
54F
20.0
Current
74F
5.0
Input HIGH Current
54F
100
Breakdown Test
74F
7.0
Output HIGH
54F
250
Leakage Current
74F
50
Input Leakage
74F
4.75
Recognized as a HIGH Signal
Test
IOD
Output Leakage
74F
3.75
µA
0.0
All other pins grounded
VIOD = 150 mV
−0.6
mA
Max
All other pins grounded
VIN = 0.5V
Circuit Current
IIL
Input LOW Current
IOS
Output Short-Circuit Current
−150
mA
Max
ICCH
Power Supply Current
1.9
2.8
mA
Max
ICCL
Power Supply Current
6.8
10.2
mA
Max
−60
Recognized as a LOW Signal
IIN = −18 mA
IOH = −1 mA
VOUT = 0V
VO = HIGH
VO = LOW
AC Electrical Characteristics
See Section 0 for Waveforms and Load Configurations
Symbol
DSXXX
74F
TA = +25˚C
VCC = +5.0V
Parameter
54F
TA, VCC = Mil
CL = 50 pF
74F
TA, VCC = Com
CL = 50 pF
Fig.
Units
No.
ns
kk-kk
CL = 50 pF
Min
Typ
Max
Min
Max
Min
tPLH
Propagation Delay
2.4
3.7
5.0
2.0
7.0
2.4
6.0
tPHL
An, Bn to On
1.5
3.2
4.3
1.5
6.5
1.5
5.3
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DSXXX
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THIS PAGE IS IGNORED IN THE DATABOOK
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Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows:
DS009454-4
Physical Dimensions
inches (millimeters) unless otherwise noted
20-Lead Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
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Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
14-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J14A
14-Lead (0.150" Wide) Molded Small Outline Package, JEDEC (S)
NS Package Number M14A
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Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
14-Lead (0.300" Wide) Molded Small Outline Package, EIAJ (SJ)
NS Package Number M14D
14-Lead (0.300" Wide) Molded Dual-In-Line Package (P)
NS Package Number N14A
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54F/74F00 Quad 2-Input NAND Gate
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
14-Lead Ceramic Flatpak (F)
NS Package Number W14B
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
1. Life support devices or systems are devices or sysdevice or system whose failure to perform can be reatems which, (a) are intended for surgical implant into
sonably expected to cause the failure of the life support
the body, or (b) support or sustain life, and whose faildevice or system, or to affect its safety or effectiveness.
ure to perform when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.
National Semiconductor
Corporation
Americas
Tel: 1-800-272-9959
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Email: [email protected]
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Tel: 81-3-5620-6175
Fax: 81-3-5620-6179
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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