NSC LMC6035IBP

LMC6035/LMC6036
Low Power 2.7V Single Supply CMOS Operational
Amplifiers
General Description
Features
The LMC6035/6 is an economical, low voltage op amp capable of rail-to-rail output swing into loads of 600Ω.
LMC6035 is available in a chip sized package (8-Bump micro SMD) using National’s micro SMD package technology.
Both allow for single supply operation and are guaranteed
for 2.7V, 3V, 5V and 15V supply voltage. The 2.7 supply voltage corresponds to the End-of-Life voltage (0.9V/cell) for
three NiCd or NiMH batteries in series, making the
LMC6035/6 well suited for portable and rechargeable systems. It also features a well behaved decrease in its specifications at supply voltages below its guaranteed 2.7V operation. This provides a “comfort zone” for adequate operation
at voltages significantly below 2.7V. Its ultra low input currents (IIN) makes it well suited for low power active filter application, because it allows the use of higher resistor values
and lower capacitor values. In addition, the drive capability of
the LMC6035/6 gives these op amps a broad range of applications for low voltage systems.
(Typical Unless Otherwise Noted)
n LMC6035 in micro SMD Package
n Guaranteed 2.7V, 3V, 5V and 15V Performance
n Specified for 2 kΩ and 600Ω Loads
n Wide Operating Range: 2.0V to 15.5V
n Ultra Low Input Current: 20 fA
n Rail-to-Rail Output Swing
@ 600Ω: 200 mV from either rail at 2.7V
@ 100 kΩ: 5 mV from either rail at 2.7V
n High Voltage Gain: 126dB
n Wide Input Common-Mode Voltage Range
-0.1V to 2.3V at Vs = 2.7V
n Low Distortion: 0.01% at 10 kHz
Applications
n
n
n
n
Filters
High Impedance Buffer or Preamplifier
Battery Powered Electronics
Medical Instrumentation
Connection Diagrams
8-Pin SO/MSOP
8-Bump micro SMD
DS012830-1
Top View
14-Pin SO/TSSOP
DS012830-65
Top View
(Bump Side Down)
DS012830-2
Top View
© 2000 National Semiconductor Corporation
DS012830
www.national.com
LMC6035/LMC6036 Low Power 2.7V Single Supply CMOS Operational Amplifiers
January 2000
LMC6035/LMC6036
Ordering Information
Package
Temperature
Range
Transport
Media
NSC
Drawing
Industrial
−40˚C to +85˚C
8-pin Small Outline (SO)
8-pin Mini Small Outline
(MSOP)
LMC6035IM
2.5k Units
Tape and
Reel
LMC6035IMM
1k Units Tape
and Reel
LMC6035IMMX
14-pin Small Outline (SO)
LMC6036IM
LMC6036IMX
3.5k Units
Tape and
Reel
LMC6036IMT
LMC6036IMTX
2.5k Units
Tape and
Reel
8-Bump micro SMD
LMC6035IBP
250 Units
Tape and
Reel
2
M08A
MUA08A
Rails
2.5k Units
Tape and
Reel
14-pin Thin Shrink Small
Outline (TSSOP)
LMC6035IBPX
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Rails
LMC6035IMX
M14A
Rails
3k Units Tape
and Reel
MTC14
BPA08FFB
Storage Temperature Range
Junction Temperature (Note 4)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
ESD Tolerance (Note 2)
Human Body Model
Machine Model
Differential Input Voltage
Supply Voltage (V+ − V−)
Output Short Circuit to V +
Output Short Circuit to V −
Lead Temperature (soldering, 10 sec.)
Current at Output Pin
Current at Input Pin
Current at Power Supply Pin
−65˚C to +150˚C
150˚C
Operating Ratings (Note 1)
Supply Voltage
Temperature Range
LMC6035I and LMC6036I
Thermal Resistance (θ JA)
MSOP, 8-pin Mini Surface Mount
M Package, 8-pin Surface Mount
M Package, 14-pin Surface Mount
MTC Package, 14-pin TSSOP
BP, 8-Bump micro SMD Package
3000V
300V
± Supply Voltage
16V
(Note 8)
(Note 3)
260˚C
± 18 mA
± 5 mA
35 mA
2.0V to 15.5V
−40˚C ≤ T
J
≤ +85˚C
230˚C/W
175˚C/W
127˚C/W
137˚C/W
220˚C/W
DC Electrical Characteristics
Unless otherwise specified, all limits guaranteed for TJ = 25˚C, V+ = 2.7V, V− = 0V, VCM = 1.0V, VO = 1.35V and RL > 1 MΩ.
Boldface limits apply at the temperature extremes.
LMC6035I
Symbol
Parameter
Conditions
Typ
(Note 5)
LMC6036I
Units
Limit (Note 6)
VOS
TCVOS
Input Offset Voltage
0.5
Input Offset Voltage
5
mV
6
max
2.3
µV/˚C
Average Drift
IIN
Input Current
(Note 11)
0.02
pA
90
IOS
Input Offset Current
RIN
Input Resistance
CMRR
Common Mode
+PSRR
Positive Power Supply
(Note 11)
0.01
pA
45
Rejection Ratio
Rejection Ratio
96
5V ≤ V+ ≤ 15V,
VO = 2.5V
93
−PSRR
Negative Power Supply
VCM
Input Common-Mode
0V ≤ V− ≤ −10V
VO = 2.5V, V+ = 5V
V+ = 2.7V
Voltage Range
For CMRR ≥ 40 dB
Rejection Ratio
min
dB
97
74
dB
70
min
−0.1
0.3
V
0.5
max
2.6
2.0
V
1.7
min
0.1
V
0.3
max
2.3
V
2.0
min
−0.5
−0.2
V
0.0
max
4.5
4.2
V
3.9
min
For CMRR ≥ 50 dB
−0.5
For CMRR ≥ 50 dB
14.4
3
60
min
−0.3
V+ = 15V
dB
60
For CMRR ≥ 40 dB
V+ = 5V
63
63
2.3
V+ = 3V
max
Tera Ω
> 10
0.7V ≤ VCM ≤ 12.7V
V+ = 15V
max
−0.2
V
0.0
max
14.0
V
13.7
min
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LMC6035/LMC6036
Absolute Maximum Ratings (Note 1)
LMC6035/LMC6036
DC Electrical Characteristics
(Continued)
Unless otherwise specified, all limits guaranteed for TJ = 25˚C, V+ = 2.7V, V− = 0V, VCM = 1.0V, VO = 1.35V and RL > 1 MΩ.
Boldface limits apply at the temperature extremes.
LMC6035I
Symbol
Parameter
Typ
(Note 5)
Conditions
LMC6036I
Units
Limit (Note 6)
AV
Large Signal Voltage Gain
R
L
= 600Ω
Sourcing
1000
(Note 7)
Sinking
250
Sourcing
2000
Sinking
500
100
min
25
V/mV
20
RL = 2 kΩ
VO
Output Swing
V
+
R
L
V
+
R
L
= 2.7V
= 600Ω to 1.35V
= 2.7V
= 2 kΩ to 1.35V
+
R
L
V
R
+
V
1.8
min
0.2
0.5
V
0.7
max
L
14.5
= 15V
= 2 kΩ to 7.5V
Output Current
V
V
IS
Supply Current
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O
O
= 0V
Sourcing
= 2.7V
Sinking
V
2.2
min
0.2
V
0.4
max
V
13.0
min
0.36
1.25
V
1.50
max
14.8
14.2
V
13.5
min
0.4
V
0.5
max
8
5
LMC6035 for Both Amplifiers
V O = 1.35V
0.65
LMC6036 for All Four Amplifiers
V O = 1.35V
1.3
4
2.4
13.5
0.12
IO
V/mV
2.0
2.62
= 15V
= 600Ω to 7.5V
min
V/mV
2.5
0.07
V
V/mV
75
4
mA
3
min
3
mA
2
min
1.6
mA
1.9
max
2.7
mA
3.0
max
Unless otherwise specified, all limits guaranteed for TJ = 25˚C, V+ = 2.7V, V− = 0V, VCM = 1.0V, V
1 MΩ. Boldface limits apply at the temperature extremes.
Symbol
Parameter
Conditions
O
= 1.35V and RL >
Typ
Units
(Note 5)
SR
Slew Rate
GBW
Gain Bandwidth Product
θm
Phase Margin
48
˚
Gm
Gain Margin
17
dB
130
dB
Amp-to-Amp Isolation
(Note 9)
V + = 15V
1.5
V/µs
1.4
MHz
en
Input-Referred Voltage Noise
(Note 10)
f = 1 kHz
in
Input Referred Current Noise
V CM = 1V
f = 1 kHz
0.2
THD
Total Harmonic Distortion
f = 10 kHz, AV = −10
R L = 2 kΩ, VO = 8 VPP
0.01
V
+
27
%
= 10V
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.
Note 2: Human body model, 1.5 kΩ in series with 100 pF.
Note 3: Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the
maximum allowed junction temperature of 150˚C. Output currents in excess of 30 mA over long term may adversely affect reliabilty.
Note 4: The maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max)
−TA)/θ JA. All numbers apply for packages soldered directly onto a PC board with no air flow.
Note 5: Typical Values represent the most likely parametric norm or one sigma value.
Note 6: All limits are guaranteed by testing or statistical analysis.
Note 7: V+ = 15V, VCM = 7.5V and R L connected to 7.5V. For Sourcing tests, 7.5V ≤ VO ≤ 11.5V. For Sinking tests, 3.5V ≤ VO ≤ 7.5V.
Note 8: Do not short circuit output to V+ when V+ is greater than 13V or reliability will be adversely affected.
Note 9: V+ = 15V. Connected as voltage follower with 10V step input. Number specified is the slower of the positive and negative slew rates.
Note 10: Input referred, V + = 15V and RL = 100 kΩ connected to 7.5V. Each amp excited in turn with 1 kHz to produce VO = 12 VPP.
Note 11: Guaranteed by design.
5
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LMC6035/LMC6036
AC Electrical Characteristics
LMC6035/LMC6036
Typical Performance Characteristics
Supply Current vs
Supply Voltage (Per Amplifier)
Unless otherwise specified, VS = 2.7V, single supply, TA = 25˚C
Input Current vs
Temperature
Sourcing Current vs
Output Voltage
DS012830-52
Sourcing Current vs
Output Voltage
DS012830-53
Sinking Current vs
Output Voltage
DS012830-55
Output Voltage Swing vs
Supply Voltage
Sinking Current vs
Output Voltage
DS012830-56
Input Noise vs
Frequency
DS012830-57
Input Noise vs
Frequency
DS012830-58
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DS012830-54
DS012830-59
6
DS012830-60
Unless otherwise specified, VS = 2.7V, single supply, TA =
25˚C (Continued)
Amp to Amp Isolation vs
Frequency
Amp to Amp Isolation vs
Frequency
+PSRR vs Frequency
DS012830-32
DS012830-61
−PSRR vs Frequency
DS012830-62
CMRR vs Frequency
DS012830-33
CMRR vs Input Voltage
DS012830-34
DS012830-35
CMRR vs Input Voltage
Input Voltage vs
Output Voltage
Input Voltage vs
Output Voltage
DS012830-36
DS012830-14
7
DS012830-15
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LMC6035/LMC6036
Typical Performance Characteristics
LMC6035/LMC6036
Typical Performance Characteristics
Unless otherwise specified, VS = 2.7V, single supply, TA =
25˚C (Continued)
Frequency Response
vs Temperature
Frequency Response
vs Temperature
DS012830-16
Gain and Phase vs
Capacitive Load
Gain and Phase vs
Capacitive Load
DS012830-17
Slew Rate vs
Supply Voltage
DS012830-18
Non-Inverting
Large Signal Response
DS012830-20
DS012830-37
DS012830-19
Non-Inverting
Large Signal Response
Non-Inverting
Large Signal Response
DS012830-21
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Non-Inverting
Small Signal Response
DS012830-22
8
DS012830-23
Unless otherwise specified, VS = 2.7V, single supply, TA =
25˚C (Continued)
Non-Inverting
Small Signal Response
Non-Inverting
Large Signal Response
DS012830-24
Inverting Large
Signal Response
Inverting Large
Signal Response
DS012830-25
Inverting Large
Signal Response
Inverting Small
Signal Response
DS012830-27
Inverting Small
Signal Response
DS012830-26
DS012830-28
Inverting Small
Signal Response
DS012830-29
Stability vs
Capacitive Load
DS012830-30
DS012830-31
DS012830-38
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LMC6035/LMC6036
Typical Performance Characteristics
LMC6035/LMC6036
Typical Performance Characteristics
Unless otherwise specified, VS = 2.7V, single supply, TA =
25˚C (Continued)
Stability vs
Capacitive Load
Stability vs
Capacitive Load
Stability vs
Capacitive Load
DS012830-39
Stability vs
Capacitive Load
DS012830-40
Stability vs
Capacitive Load
DS012830-42
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DS012830-43
10
DS012830-41
LMC6035/LMC6036
1.0 Application Notes
1.1 Background
The LMC6035/6 is exceptionally well suited for low voltage
applications. A desirable feature that the LMC6035/6 brings
to low voltage applications is its output drive capability — a
hallmark for National’s CMOS amplifiers. The circuit of Figure 1 illustrates the drive capability of the LMC6035/6 at 3V
of supply. It is a differential output driver for a one-to-one audio transformer, like those used for isolating ground from the
telephone lines. The transformer (T1) loads the op amps
with about 600Ω of AC load, at 1 kHz. Capacitor C1 functions
to block DC from the low winding resistance of T1. Although
the value of C1 is relatively high, its load reactance (Xc) is
negligible compared to inductive reactance (XI) of T1.
DS012830-45
FIGURE 2. Output Swing Performance of
the LMC6035 per the Circuit of Figure 1
DS012830-44
FIGURE 1. Differential Driver
DS012830-46
The circuit in Figure 1 consists of one input signal and two
output signals. U1A amplifies the input with an inverting gain
of −2, while the U1B amplifies the input with a noninverting
gain of +2. Since the two outputs are 180˚ out of phase with
each other, the gain across the differential output is 4. As the
differential output swings between the supply rails, one of
the op amps sources the current to the load, while the other
op amp sinks the current.
How good a CMOS op amp can sink or source a current is
an important factor in determining its output swing capability.
The output stage of the LMC6035/6 — like many op
amps — sources and sinks output current through two
complementary transistors in series. This “totem pole” arrangement translates to a channel resistance (Rdson) at each
supply rail which acts to limit the output swing. Most CMOS
op amps are able to swing the outputs very close to the
rails — except, however, under the difficult conditions of low
supply voltage and heavy load. The LMC6035/6 exhibits exceptional output swing capability under these conditions.
The scope photos of Figure 2 and Figure 3 represent measurements taken directly at the output (relative to GND) of
U1A, in Figure 1. Figure 2 illustrates the output swing capability of the LMC6035, while Figure 3 provides a benchmark
comparison. (The benchmark op amp is another low voltage
(3V) op amp manufactured by one of our reputable
competitors.)
FIGURE 3. Output Swing Performance of
Benchmark Op Amp per the Circuit of Figure 1
Notice the superior drive capability of LMC6035 when compared with the benchmark measurement — even though the
benchmark op amp uses twice the supply current.
Not only does the LMC6035/6 provide excellent output swing
capability at low supply voltages, it also maintains high open
loop gain (A VOL) with heavy loads. To illustrate this, the
LMC6035 and the benchmark op amp were compared for
their distortion performance in the circuit of Figure 1. The
graph of Figure 4 shows this comparison. The y-axis represents percent Total Harmonic Distortion (THD plus noise)
across the loaded secondary of T1. The x-axis represents
the input amplitude of a 1 kHz sine wave. (Note that T1 loses
about 20% of the voltage to the voltage divider of RL (600Ω)
and T1’s winding resistances — a performance deficiency of
the transformer.)
11
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LMC6035/LMC6036
1.0 Application Notes
1.2.1.1 Low-Pass Frequency Scaling Procedure
(Continued)
The actual component values represented in bold of Figure 5
were obtained with the following scaling procedure:
1.
First determine the frequency scaling factor (FSF) for
the desired cutoff frequency. Choosing fc at 3 kHz, provides the following FSF computation:
FSF = 2π x 3 kHz (desired cutoff freq.) = 18.84 x 10 3
2.
Then divide all of the normalized capacitor values by the
FSF as follows:
C1’ = C(Normalized)/FSF
C1’ = 0.707/18.84 x 103 = 37.93 x 10−6
C2’ = 1.414/18.84 x 103 = 75.05 x 10−6
(C1’ and C2’: prior to impedance scaling)
3. Last, choose an impedance scaling factor (Z). This Z
factor can be calculated from a standard value for C2.
Then Z can be used to determine the remaining component values as follows:
Z = C2’/C2(chosen) = 75.05 x 10 −6/6.8 nF = 8.4k
C1 = C1’/Z = 37.93 x 10−6 /8.4k = 4.52 nF
(Standard capacitor value chosen for C1 is 4.7 nF )
R1 = R1(normalized) x Z = 1Ω x 8.4k = 8.4 kΩ
R2 = R2(normalized) x Z = 1Ω x 8.4k = 8.4 kΩ
DS012830-47
(Standard value chosen for R1 and R2 is 8.45 kΩ )
FIGURE 4. THD+Noise Performance of LMC6035 and
“Benchmark” per Circuit of Figure 1
1.2.2 High Pass Active Filter
The previous low-pass filter circuit of Figure 5 converts to a
high-pass active filter per Figure 6.
Figure 4 shows the superior distortion performance of
LMC6035/6 over that of the benchmark op amp. The heavy
loading of the circuit causes the AVOL of the benchmark part
to drop significantly which causes increased distortion.
1.2 APPLICATION CIRCUITS
1.2.1 Low-Pass Active Filter
A common application for low voltage systems would be active filters, in cordless and cellular phones for example. The
ultra low input currents (IIN) of the LMC6035/6 makes it well
suited for low power active filter applications, because it allows the use of higher resistor values and lower capacitor
values. This reduces power consumption and space.
DS012830-49
Figure 5 shows a low pass, active filter with a Butterworth
(maximally flat) frequency response. Its topology is a Sallen
and Key filter with unity gain. Note the normalized component values in parenthesis which are obtainable from standard filter design handbooks. These values provide a 1 Hz
cutoff frequency, but they can be easily scaled for a desired
cutoff frequency (fc). The bold component values of Figure 5
provide a cutoff frequency of 3 kHz. An example of the scaling procedure follows Figure 5.
FIGURE 6. 2 Pole, 300 Hz, Sallen and Key,
High-Pass Filter
1.2.2.1 High-Pass Frequency Scaling Procedure
Choose a standard capacitor value and scale the impedances in the circuit according to the desired cutoff frequency
(300 Hz) as follows:
C = C1 = C2
Z = 1 Farad/C(chosen) x 2π x (desired cutoff freq.)
= 1 Farad/6.8 nF x 2π x 300 Hz = 78.05k
R1 = Z x R1(normalized) = 78.05k x (1/0.707) = 110.4 kΩ
(Standard value chosen for R1 is 110 kΩ )
R2 = Z x R2(normalized) = 78.05k x (1/1.414) = 55.2 kΩ
(Standard value chosen for R1 is 54.9 kΩ )
1.2.3 Dual Amplifier Bandpass Filter
The dual amplifier bandpass (DABP) filter features the ability
to independently adjust fc and Q. In most other bandpass topologies, the fc and Q adjustments interact with each other.
The DABP filter also offers both low sensitivity to component
values and high Qs. The following application of Figure 7,
provides a 1 kHz center frequency and a Q of 100.
DS012830-48
FIGURE 5. 2-Pole, 3 kHz, Active, Sallen and Key,
Lowpass Filter with Butterworth Response
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12
the user must not ignore the surface leakage of the PC
board, even though it may at times appear acceptably low.
Under conditions of high humidity, dust or contamination, the
surface leakage will be appreciable.
(Continued)
To minimize the effect of any surface leakage, lay out a ring
of foil completely surrounding the LMC6035 or LMC6036 inputs and the terminals of capacitors, diodes, conductors, resistors, relay terminals, etc. connected to the op amp’s inputs. See Figure 8. To have a significant effect, guard rings
should be placed on both the top and bottom of the PC
board. This PC foil must then be connected to a voltage
which is at the same voltage as the amplifier inputs, since no
leakage current can flow between two points at the same potential. For example, a PC board trace-to-pad resistance of
1012Ω, which is normally considered a very large resistance,
could leak 5 pA if the trace were a 5V bus adjacent to the pad
of an input. This would cause a 100 times degradation from
the amplifiers actual performance. However, if a guard ring is
held within 5 mV of the inputs, then even a resistance of
1011Ω would cause only 0.05 pA of leakage current, or perhaps a minor (2:1) degradation of the amplifier’s performance. See Figure 9a, b, c for typical connections of guard
rings for standard op amp configurations. If both inputs are
active and at high impedance, the guard can be tied to
ground and still provide some protection; see Figure 9 d.
DS012830-50
FIGURE 7. 2 Pole, 1 kHz Active, Bandpass Filter
1.2.3.1 DABP Component Selection Procedure
Component selection for the DABP filter is performed as follows:
1. First choose a center frequency (fc). Figure 7 represents
component values that were obtained from the following
computation for a center frequency of 1 kHz.
R2 = R3 = 1/(2 πf cC)
Given: fc = 1 kHz and C (chosen) = 6.8 nF
R2 = R3 = 1/(2π x 3 kHz x 6.8 nF) = 23.4 kΩ
(Chosen standard value is 23.7 kΩ )
2. Then compute R1 for a desired Q (fc/BW) as follows:
R1 = Q x R2.
Choosing a Q of 100,
R1 = 100 x 23.7 kΩ = 2.37 MΩ.
1.3 PRINTED-CIRCUIT-BOARD LAYOUT
FOR HIGH-IMPEDANCE WORK
It is generally recognized that any circuit which must operate
with < 1000 pA of leakage current requires special layout of
the PC board. If one wishes to take advantage of the
ultra-low bias current of the LMC6035/6, typically < 0.04 pA,
it is essential to have an excellent layout. Fortunately, the
techniques for obtaining low leakages are quite simple. First,
DS012830-7
FIGURE 8. Example, using the LMC6036
of Guard Ring in P.C. Board Layout
13
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LMC6035/LMC6036
1.0 Application Notes
LMC6035/LMC6036
1.0 Application Notes
(Continued)
DS012830-10
(c) Follower
DS012830-8
(a) Inverting Amplifier
DS012830-9
(b) Non-Inverting Amplifier
DS012830-11
(d) Howland Current Pump
FIGURE 9. Guard Ring Connections
1.3.1 CAPACITIVE LOAD TOLERANCE
Like many other op amps, the LMC6035/6 may oscillate
when its applied load appears capacitive. The threshold of
oscillation varies both with load and circuit gain. The configuration most sensitive to oscillation is a unity-gain follower.
See the Typical Performance Characteristics.
The load capacitance interacts with the op amp’s output resistance to create an additional pole. If this pole frequency is
sufficiently low, it will degrade the op amp’s phase margin so
that the amplifier is no longer stable at low gains. As shown
in Figure 10, the addition of a small resistor (50Ω–100Ω) in
series with the op amp’s output, and a capacitor (5 pF–10
pF) from inverting input to output pins, returns the phase
margin to a safe value without interfering with
lower-frequency circuit operation. Thus, larger values of capacitance can be tolerated without oscillation. Note that in all
cases, the output will ring heavily when the load capacitance
is near the threshold for oscillation.
1.4 Micro SMD Considerations
Contrary to what might be guessed, the micro SMD package
does not follow the trend of smaller packages having higher
thermal resistance. LMC6035 in micro SMD has thermal resistance of 220˚C/W compared to 230˚C/W in MSOP. Even
when driving a 600Ω load and operating from ± 7.5V supplies, the maximum temperature raise will be under 4.5˚C.
For application information specific to micro SMD, see Application note AN-1112.
DS012830-5
FIGURE 10. Rx, Cx Improve Capacitive Load Tolerance
Capacitive load driving capability is enhanced by using a pull
up resistor to V+ (Figure 11). Typically a pull up resistor conducting 500 µA or more will significantly improve capacitive
load responses. The value of the pull up resistor must be determined based on the current sinking capability of the amplifier with respect to the desired output swing. Open loop gain
of the amplifier can also be affected by the pull up resistor
(see Electrical Characteristics).
DS012830-6
FIGURE 11. Compensating for Large
Capacitive Loads with a Pull Up Resistor
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14
LMC6035/LMC6036
Physical Dimensions
inches (millimeters) unless otherwise noted
8-Lead (0.150" Wide) Molded
Small Outline Package, JEDEC
NS Package Number M08A
15
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LMC6035/LMC6036
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
8-Lead (0.150" Wide) Molded
Mini Small Outline Package, JEDEC
NS Package Number MUA08A
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16
LMC6035/LMC6036
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
14-Lead (0.150" Wide) Molded
Small Outline Package, JEDEC
NS Package Number M14A
17
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LMC6035/LMC6036
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
14-Pin TSSOP
NS Package Number MTC14
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18
LMC6035/LMC6036
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
NOTE: UNLESS OTHERWISE SPECIFIED.
1. EPOXY COATING.
2. 63Sn/37Pb EUTECTIC BUMP.
3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN 1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION PINS ARE NUMBERED
COUNTERCLOCKWISE.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS PACKAGE HEIGHT.
6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC.
8-Bump micro SMD
NS Package Number BPA08FFB
X1 = 1.412 X2 = 1.412 X3 = 0.850
19
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LMC6035/LMC6036 Low Power 2.7V Single Supply CMOS Operational Amplifiers
Notes
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
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Email: [email protected]
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2. A critical component is any component of a life
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Fax: 81-3-5639-7507
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.