0.9V Battery Flash A/D Type 8-Bit MCU HT66F016L/HT66F017L Revision: V1.00 Date: ������������� July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Table of Contents Features............................................................................................................. 6 CPU Features.......................................................................................................................... 6 Peripheral Features.................................................................................................................. 6 General Description.......................................................................................... 7 Selection Table.................................................................................................. 7 Block Diagram................................................................................................... 8 Pin Assignment................................................................................................. 8 Pin Description................................................................................................. 9 Absolute Maximum Ratings........................................................................... 10 D.C. Characteristics........................................................................................ 10 A.C. Characteristics.........................................................................................11 LVD & LVR Electrical Characteristics........................................................... 12 ADC Characteristics....................................................................................... 13 Comparator Electrical Characteristics......................................................... 13 DC/DC Converter Electrical Characteristics................................................ 14 Power on Reset Electrical Characteristics................................................... 14 Bandgap Reference (VBG) Characteristic Curve........................................... 15 System Architecture....................................................................................... 15 Clocking and Pipelining.......................................................................................................... 15 Program Counter.................................................................................................................... 16 Stack...................................................................................................................................... 17 Arithmetic and Logic Unit – ALU............................................................................................ 17 Flash Program Memory.................................................................................. 18 Structure................................................................................................................................. 18 Special Vectors...................................................................................................................... 18 Look-up Table......................................................................................................................... 19 Table Program Example......................................................................................................... 19 In Circuit Programming.......................................................................................................... 20 On-Chip Debug Support – OCDS.......................................................................................... 21 RAM Data Memory.......................................................................................... 22 Structure................................................................................................................................. 22 General Purpose Data Memory Structure.............................................................................. 22 Rev. 1.00 2 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Special Function Register Description......................................................... 24 Indirect Addressing Registers – IAR0, IAR1.......................................................................... 24 Memory Pointers – MP0, MP1............................................................................................... 24 Bank Pointer – BP.................................................................................................................. 25 Accumulator – ACC................................................................................................................ 25 Program Counter Low Register – PCL................................................................................... 25 Look-up Table Registers – TBLP, TBHP, TBLH...................................................................... 25 Status Register – STATUS..................................................................................................... 26 EEPROM Data Memory................................................................................... 28 EEPROM Data Memory Structure......................................................................................... 28 EEPROM Registers............................................................................................................... 28 Reading Data from the EEPROM.......................................................................................... 30 Writing Data to the EEPROM................................................................................................. 30 Write Protection...................................................................................................................... 30 EEPROM Interrupt................................................................................................................. 30 Programming Considerations................................................................................................. 31 Programming Examples......................................................................................................... 31 Oscillator......................................................................................................... 32 Oscillator Overview................................................................................................................ 32 System Clock Configurations................................................................................................. 32 External Crystal/Ceramic Oscillator – HXT............................................................................ 33 High Speed Internal RC Oscillator – HIRC............................................................................ 34 Internal 32kHz Oscillator – LIRC............................................................................................ 34 Supplementary Oscillator....................................................................................................... 34 Operating Modes and System Clocks.......................................................... 35 System Clocks....................................................................................................................... 35 System Operation Modes....................................................................................................... 36 Control Register..................................................................................................................... 37 Fast Wake-up......................................................................................................................... 38 Operating Mode Switching and Wake-up............................................................................... 39 Standby Current Considerations............................................................................................ 43 Wake-up................................................................................................................................. 43 Programming Considerations................................................................................................. 44 Watchdog Timer.............................................................................................. 44 Watchdog Timer Clock Source............................................................................................... 44 Watchdog Timer Control Register.......................................................................................... 44 Watchdog Timer Operation.................................................................................................... 46 Reset and Initialisation................................................................................... 47 Reset Functions..................................................................................................................... 47 Reset Initial Conditions.......................................................................................................... 50 Rev. 1.00 3 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Input/Output Ports.......................................................................................... 52 Pull-high Resistors................................................................................................................. 52 Port A Wake-up...................................................................................................................... 53 I/O Port Control Registers...................................................................................................... 53 Pin-remapping Functions....................................................................................................... 54 Pin-remapping Registers........................................................................................................ 54 I/O Pin Structures................................................................................................................... 55 Programming Considerations................................................................................................. 56 Timer Modules – TM....................................................................................... 57 Introduction............................................................................................................................ 57 TM Operation......................................................................................................................... 57 TM Clock Source.................................................................................................................... 58 TM Interrupts.......................................................................................................................... 58 TM External Pins.................................................................................................................... 58 TM Input/Output Pin Control Registers.................................................................................. 59 Programming Considerations................................................................................................. 60 Compact Type TM – CTM............................................................................... 61 Compact TM Operation.......................................................................................................... 61 Compact Type TM Register Description................................................................................ 61 Compact Type TM Operating Modes..................................................................................... 66 Compare Match Output Mode................................................................................................ 66 Timer/Counter Mode.............................................................................................................. 69 PWM Output Mode................................................................................................................. 69 Standard Type TM – STM............................................................................... 72 Standard TM Operation.......................................................................................................... 72 Standard Type TM Register Description................................................................................ 72 Standard Type TM Operating Modes..................................................................................... 77 Compare Match Output Mode................................................................................................ 77 Timer/Counter Mode.............................................................................................................. 80 PWM Output Mode................................................................................................................. 80 Single Pulse Mode................................................................................................................. 83 Capture Input Mode............................................................................................................... 85 Analog to Digital Converter........................................................................... 86 A/D Overview......................................................................................................................... 86 A/D Converter Register Description....................................................................................... 86 A/D Converter Data Registers – ADRL, ADRH...................................................................... 87 A/D Converter Control Registers – ADCR0, ADCR1, ACERL................................................ 87 A/D Operation........................................................................................................................ 90 A/D Input Pins........................................................................................................................ 91 Summary of A/D Conversion Steps........................................................................................ 92 Programming Considerations................................................................................................. 93 A/D Transfer Function............................................................................................................ 93 A/D Programming Examples.................................................................................................. 94 Rev. 1.00 4 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Comparators................................................................................................... 96 Comparator Operation........................................................................................................... 96 Comparator Interrupt.............................................................................................................. 96 Programming Considerations................................................................................................. 96 Interrupts......................................................................................................... 98 Interrupt Registers.................................................................................................................. 98 Interrupt Operation............................................................................................................... 103 External Interrupt.................................................................................................................. 104 Comparator Interrupt............................................................................................................ 105 Multi-function Interrupt......................................................................................................... 105 A/D Converter Interrupt........................................................................................................ 105 Time Base Interrupts............................................................................................................ 106 EEPROM Interrupt............................................................................................................... 107 LVD Interrupt........................................................................................................................ 107 TM Interrupts........................................................................................................................ 107 Interrupt Wake-up Function.................................................................................................. 107 Programming Considerations............................................................................................... 108 Low Voltage Detector – LVD........................................................................ 109 LVD Register........................................................................................................................ 109 LVD Operation.......................................................................................................................110 DC/DC Converter...........................................................................................110 DC/DC Converter Register....................................................................................................111 Configuration Options...................................................................................112 Application Circuits.......................................................................................112 Instruction Set................................................................................................113 Introduction...........................................................................................................................113 Instruction Timing..................................................................................................................113 Moving and Transferring Data...............................................................................................113 Arithmetic Operations............................................................................................................113 Logical and Rotate Operation...............................................................................................114 Branches and Control Transfer.............................................................................................114 Bit Operations.......................................................................................................................114 Table Read Operations.........................................................................................................114 Other Operations...................................................................................................................114 Instruction Set Summary..............................................................................115 Table Conventions.................................................................................................................115 Instruction Definition.....................................................................................117 Package Information.................................................................................... 126 16-pin NSOP (150mil) Outline Dimensions.......................................................................... 127 Rev. 1.00 5 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Features CPU Features • Operating Voltage: ♦♦ fSYS= 4MHz: 2.0V~3.3V ♦♦ fSYS= 8MHz: 2.2V~3.3V ♦♦ fSYS= 12MHz: 2.7V~3.3V • Power down and wake-up functions to reduce power consumption • Three oscillators ♦♦ External crystal – HXT ♦♦ Internal RC – HIRC ♦♦ Internal 32kHz RC – LIRC • Multi-mode operation: NORMAL, SLOW, IDLE and SLEEP • Fully integrated internal 8MHz oscillator requires no external components • All instructions executed in one or two instruction cycles • Table read instructions • 63 powerful instructions • 8 subroutine nesting levels • Bit manipulation instruction Peripheral Features • Flash Program Memory: up to 16 • RAM Data Memory: up to 128×8 • EEPROM Memory: 64×8 • Watchdog Timer function • Up to 13 bidirectional I/O lines • Two external interrupt lines shared with I/O pins • Multiple Timer Module for time measure, input capture, compare match output, PWM output or single pulse output functions • Comparator function • Dual Time-Base functions for generation of fixed time interrupt signals • Low voltage reset function • Low voltage detect function • 4 channels 12-bit resolution A/D converter • Package types: 16-pin NSOP Rev. 1.00 6 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU General Description The devices are Flash Memory type 8-bit high performance RISC architecture microcontrollers. Offering users the convenience of Flash Memory multi-programming features, these devices also include a wide range of functions and features. Other memory includes an area of RAM Data Memory as well as an area of EEPROM memory for storage of non-volatile data such as serial numbers, calibration data etc. Analog features include a multi-channel 12-bit A/D converter and a comparator functions. Multiple and extremely flexible Timer Modules provide timing, pulse generation and PWM generation functions. Protective features such as an internal Watchdog Timer, Low Voltage Reset and Low Voltage Detector coupled with excellent noise immunity and ESD protection ensure that reliable operation is maintained in hostile electrical environments. A full choice of HXT, HIRC and LIRC oscillator functions are provided including a fully integrated system oscillator which requires no external components for its implementation. The ability to operate and switch dynamically between a range of operating modes using different clock sources gives users the ability to optimise microcontroller operation and minimize power consumption. The inclusion of flexible I/O programming features, Time-Base functions along with many other features ensure that the devices will find excellent use in applications such as electronic metering, environmental monitoring, handheld instruments, household appliances, electronically controlled tools, motor driving in addition to many others. Selection Table Most features are common to all devices. The main features distinguishing them are memory capacity and the A/D Converter. The following table summarises the main features of each device. Part No. Program Data Data External A/D I/O Memory Memory EEPROM Interrupt Converter 16-bit Timer Module Comparator Time Stacks Package Base HT66F016L 1k×16 64×8 64×8 13 2 12-bit×4 CTM×1 STM×1 1 2 8 16NSOP HT66F017L 2k×16 128×8 64×8 13 2 12-bit×4 CTM×1 STM×1 1 2 8 16NSOP Note: As devices exist in more than one package format, the table reflects the situation for the package with the most pins. Rev. 1.00 7 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Block Diagram Pin Assignment PB�/CX_� PB1/[TCK0/TP1] PB0/[TP0] PA�/INT0/TCK1/TP0/CX_1/AN� PA�/[INT0]/[TCK1]/[TP0]/CX_0/AN�/ICPDA/OCDSDA PA1/C-/AN1/VREF PA0/C+/AN0 VSS/AVSS 1 16 � 15 � 1� � 1� 5 1� 6 11 7 10 8 9 PB� PB� PA7/[TCK0/TP1]/ICPCK/OCDSCK PA�/[INT1]/TCK0/TP1 PA5/INT1/[TP0]/OSC� PA6/[TCK0/TP1]/OSC1 VDD/AVDD/VOUT LX HT66F016L/HT66F017L 16 NSOP-A Note: 1. Bracketed pin names indicate non-default pinout remapping locations. 2. If the pin-shared pin functions have multiple outputs simultaneously, its pin names at the right side of the “/” sign can be used for higher priority. 3. VDD and AVDD means the VDD and AVDD are the double bonding. 4. VSS and AVSS means the VSS and AVSS are the double bonding. Rev. 1.00 8 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Pin Description With the exception of the power pins, all pins on these devices can be referenced by their Port name, e.g. PA.0, PA.1 etc, which refer to the digital I/O function of the pins. However these Port pins are also shared with other function such as the Analog to Digital Converter, Timer Module pins etc. The function of each pin is listed in the following table, however the details behind how each pin is configured is contained in other sections of the datasheet. The following tables only include the pins which are directly related to the MCU. The pin descriptions of the additional peripheral functions are located at the end of the datasheet along with the relevant peripheral function functional description. Pin Name Function OP I/T O/T Pin-Shared Mapping PAWU PAPU ST CMOS — PA0~PA7 Port A PB0~PB4 Port B PBPU ST CMOS AN0~AN3 A/D Converter Input ACERL AN — PA0~PA3 — VREF A/D Converter Reference Input ADCR1 AN — PA1 C- Comparator Input CPC AN — PA1 C+ Comparator Input CPC AN — PA0 CX_0, CX_1, CX_2 Comparator Output CPC — TCK0 TM0 Input PRM ST TCK1 TM1 Input PRM ST TP0 TM0 I/O PRM ST CMOS PA3 or PB0 or PA5 or PA2 TP1 TM1 I/O CMOS PA4 or PB1 or PA6 or PA7 CMOS PA2, PA3, PB2 — PA4 or PB1 or PA6 or PA7 — PA3 or PA2 PRM ST ST — PA3 or PA2 — PA5 or PA4 INT0 External Interrupt 0 INTC0 INTEG INT1 External Interrupt 1 INTC2 INTEG ST OSC1 HXT Pin CO HXT — PA6 OSC2 HXT Pin CO — HXT PA5 ICPCK ICP Clock Pin — ST — PA7 ICPDA ICP Data/Address Pin — ST OCDSCK OCDS Clock Pin — ST OCDSDA OCDS Data/Address Pin — ST LX External Inductor Connection Pin for DC/DC Converter — PWR — — VOUT DC/DC Converter Voltage Output* — PWR — — CMOS PA2 — PA7 CMOS PA2 VDD Power Supply* — PWR — — AVDD A/D Converter Power Supply* — PWR — — VSS Ground** — PWR — — AVSS A/D Converter Ground** — PWR — — Note: I/T: Input type O/T: Output type OP: Optional by configuration option (CO) or register option PWR: Power CO: Configuration option ST: Schmitt Trigger input CMOS: CMOS output AN: Analog input pin HXT: High frequency crystal oscillator *: The AVDD and VOUT pins are bonded together internally with VDD. **: The AVSS pin is bonded together internally with VSS. Rev. 1.00 9 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Absolute Maximum Ratings Supply Voltage.................................................................................................VSS−0.3V to VSS+6.0V Input Voltage...................................................................................................VSS−0.3V to VDD+0.3V Storage Temperature.....................................................................................................-50˚C to 125˚C Operating Temperature...................................................................................................-40˚C to 85˚C IOH Total.....................................................................................................................................-80mA IOL Total...................................................................................................................................... 80mA Total Power Dissipation ......................................................................................................... 500mW Note: These are stress ratings only. Stresses exceeding the range specified under "Absolute Maximum Ratings" may cause substantial damage to these devices. Functional operation of these devices at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect devices reliability. D.C. Characteristics Ta= 25˚C Symbol VDD Parameter Operating Voltage (HXT) Test Conditions — 2V 3V IDD1 Operating Current (HXT), (fSYS= fH) 2.2V 3V 3V 3.3V IDD2 IDD3 Min. Typ. Max. Unit fSYS= 4MHz 2.0 — 3.3 V fSYS= 8MHz 2.0 — 3.3 V fSYS= 12MHz 2.7 — 3.3 V Conditions VDD No load, fH= 4MHz No load, fH= 8MHz No load, fH= 12MHz — 0.4 0.6 mA — 0.7 1.1 mA — 0.5 0.8 mA — 1.0 1.5 mA — 1.5 2.5 mA — 2.0 3.0 mA — 1.1 (TBC) 1.6 (TBC) mA Operating Current (HIRC), Normal Mode, fSYS= fH 2V 3V — 1.4 2.0 mA Operating Current (LIRC), (fSYS= fL= fLIRC, fSUB= fLIRC) 2V — 5 10 µA 3V No load, fH= 8MHz No load, fSYS= fLIRC — 10 20 µA — 1.00 2.00 µA IIDLE0 IDLE0 Mode Standby Current (LIRC On) 2.2V IIDLE11 IDLE1 Mode Standby Current (HXT) 2.0V IIDLE12 IDLE1 Mode Standby Current (HXT) 2.2V IIDLE121 IDLE1 Mode Standby Current (HIRC) 2.2V 3V — IIDLE13 IDLE1 Mode Standby Current (HXT) 3V — ISLEEP1 SLEEP1 Mode Standby Current (LIRC On) Rev. 1.00 3V 3V 3V 3.3V 2.2V 3V No load No load, fSYS= 4MHz on No load, fSYS= 8MHz on No load, fSYS= 8MHz on No load, fSYS= 12MHz on No load 10 — 1.30 3.00 µA — 0.20 0.40 mA — 0.40 0.80 mA — 0.25 0.50 mA — 0.50 1.00 mA — 0.7 (TBC) 1.0 (TBC) mA 0.9 1.3 mA 0.60 1.20 mA — 0.80 1.60 mA — 1.00 3.00 µA — 1.30 5.00 µA July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Symbol Parameter Test Conditions VDD Conditions Min. Typ. Max. Unit VIL Input Low Voltage for I/O Ports or Input Pins — — 0 — 0.2VDD V VIH Input High Voltage for I/O Ports or Input Pins — — 0.8VDD — VDD V IOL I/O Port Sink Current IOH I/O Port, Source Current RPH Pull-high Resistance for I/O Ports 2.2V VOL= 0.1VDD 2 4 — mA 3V VOL= 0.1VDD 4 8 — mA 2.2V VOH= 0.9VDD −1 −2 — mA 3V VOH= 0.9VDD −2 −4 — mA 30 100 200 kΩ 20 60 100 kΩ 2.2V — 3V A.C. Characteristics Ta= 25˚C Symbol Parameter Test Condition VDD Condition 2.0~3.3V fCPU Operating Clock — 2.0~3.3V 2.7~3.3V 2.0~3.3V fSYS System clock (HXT) fHIRC System Clock (HIRC) tHIRCST HIRC stable time after enabled 2.0~3.3V — 2.7~3.3V 2.0~3.3V Ta= -40°C to 85°C 2.0~3.3V Ta= -40°C to 85°C 2.0V~3.3V Ta= 25°C Min. Typ. Max. Unit DC — 4 MHz DC — 8 MHz DC — 12 MHz 0.4 — 4 MHz 0.4 — 8 MHz 0.4 — 12 MHz -2% 8MHz +2% MHz — — 300 μs -10% 32 +10% kHz fLIRC System Clock (LIRC) -30% 32 +60% kHz tTCK TCKn Input Pulse Width — — 0.3 — — μs tINT Interrupt Pulse Width — — 10 — — μs tEERD EEPROM Read Time — — — 2 4 tSYS tEEWR EEPROM Write Time — — — 2 4 ms System Start-up Timer Period (Wake-up From HALT, fSYS Off at HALT state) — fSYS= fHXT 128 — — tSYS — fSYS= fHIRC 16 — — tSYS — fSYS= fLIRC 2 — — tSYS tSST tRSTD 2.0V~3.3V Ta= -40°C to 85°C System Start-up Timer Period (Wake-up From HALT, fSYS On at HALT state) — — 2 — — tSYS System Reset Delay Time (Power On Reset) — — 25 50 100 ms System Reset Delay Time (Any Reset except Power On Reset) — — 8.3 16.7 33.3 ms Note: 1. tSYS= 1/fSYS; tSUB = 1/fSUB 2. To maintain the accuracy of the internal HIRC oscillator frequency, a 0.1μF decoupling capacitor should be connected between VDD and VSS and located as close to the device as possible. Rev. 1.00 11 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU LVD & LVR Electrical Characteristics Ta= 25˚C Symbol Parameter Test Conditions VDD VLVR1 VLVR2 Conditions LVR Enable, 1.8V option Low Voltage Reset Voltage — LVR Enable, 2.0V option Min. Typ. Max. Unit 1.7 (TBC) 1.8 (TBC) 1.9 (TBC) V −5%× Typ. 2.0 V VLVR3 LVR Enable, 2.4V option VLVR4 LVR Enable, 2.7V option VLVD1 LVDEN= 1, VLVD= 2.0V 2.0 V VLVD2 LVDEN= 1, VLVD= 2.2V 2.2 V VLVD3 LVDEN= 1, VLVD= 2.4V 2.4 V VLVD4 LVDEN= 1, VLVD= 2.6V 2.6 VLVD5 Low Voltage Detector Voltage — LVDEN= 1, VLVD= 2.8V −5%× Typ. 2.4 −5%× Typ. 2.7 2.8 +5%× Typ. V V V V VLVD6 LVDEN= 1, VLVD= 3.0V 3.0 V VLVD7 LVDEN= 1, VLVD= 3.1V 3.1 V VLVD8 LVDEN= 1, VLVD= 3.2V 3.2 LVR enable, LVDEN= 0 — 40 µA 40 70 µA 240 480 µs 90 µs ILV — — tLVR Low Voltage Width to Reset — — 120 tLVD Low Voltage Width to Interrupt — — 20 45 tLVDS LVDO Stable Time — tSRESET Software Reset Width to Reset — Rev. 1.00 LVR enable, LVDEN= 1 For LVD off → on — 12 V 70 Additional Power Consumption if LVD is Used 15 — — µs 45 90 120 µs July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU ADC Characteristics Ta= 25˚C Symbol Parameter Test Conditions VDD Conditions Min. Typ. Max. Unit AVDD A/D Converter Operating Voltage — — 2.2 — 3.3 V VADI A/D Converter Input Voltage — — 0 — VREF V VREF A/D Converter Reference Voltage — — 2 — AVDD V VBG Reference with Buffer Voltage — — -3% 1.09 +3% V -3 — +3 LSB DNL1 Differential Non-linearity 2.2V~ VREF= AVDD= VDD 3.0V tADCK= 0.5μs, Ta= 25˚C DNL2 Differential Non-linearity 2.2V~ VREF= AVDD= VDD, 3.0V tADCK= 0.5μs, Ta= -40˚C~85˚C -4 — +4 LSB INL1 Integral Non-linearity 2.2V~ VREF= AVDD= VDD 3.0V tADC= 0.5μs, Ta= 25˚C -4 — +4 LSB INL2 Integral Non-linearity 2.2V~ VREF= AVDD= VDD 3.0V tADCK= 0.5μs, Ta= -40˚C~85˚C -8 — +8 LSB IADC Additional Power Consumption if A/D Converter is Used 2.2V No load (tADCK= 0.5μs ) — 0.5 1.0 mA 3V No load (tADCK= 0.5μs ) — 0.9 1.35 mA I109 Additional Power Consumption if 1.09V Reference with Buffer is used — — — 200 300 μA tADCK A/D Converter Clock Period — — 0.5 — 10 μs tADC A/D Conversion Time (Include Sample and Hold Time) — — 16 — tADCK tADS A/D Converter Sampling Time — — — 4 — tADCK tON2ST A/D Converter On-to-Start Time — — 2 — — μs tBGS VBG Turn on Stable Time — — 10 — — ms 12-bit ADC Comparator Electrical Characteristics Ta= 25˚C Symbol Parameter Test Conditions VDD Conditions Min. Typ. Max. Unit VCMP Comparator Operating Voltage — — 2.2 — 3.3 V ICMP Comparator Operating Current 3V — — 37 56 µA VCMPOS Comparator Input Offset Voltage — — −10 — +10 mV VHYS Hysteresis Width — — 20 40 60 mV VCM Comparator Common Mode Voltage Range — — VSS — VDD − 1.4V V AOL Comparator Open Loop Gain — — 60 80 — dB tPD Comparator Response Time — With 100mV overdrive (Note) — 370 560 ns Note: Measured with comparator one input pin at VCM = (VDD−1.4)/2 while the other pin input transition from VSS to (VCM +100mV) or from VDD to (VCM -100mV). Rev. 1.00 13 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU DC/DC Converter Electrical Characteristics Ta= 25˚C Symbol Test Conditions Parameter VDD Conditions Min. Typ. Max. Unit VBAT Battery Input Voltage Range ─ ─ 0.9 ─ 1.8 V LIN Input Inductor Value ─ ─ ─ 2.2 ─ μH RIL Inductor DC Resistance ─ ─ ─ ─ 0.5 Ω CIN Input Capacitor Value ─ ─ ─ 10 ─ μF -5%× Typ. 2.0V 2.2V 2.4V 2.7V 2.85V 3.0V 3.15V 3.3V +5%× Typ. V ─ % VOUT Output Voltage Range ΔVOUT Output Load Regulation ─ VOUT= 2.0V VOUT= 2.2V VOUT= 2.4V VOUT= 2.7V VOUT= 2.85V VOUT= 3.0V VOUT= 3.15V VOUT= 3.3V ─ VOUT= 2.0V, 1 to 45 mA ─ ±2 ─ VOUT= 3.0V, 1 to 30 mA ─ ±2 ─ % VOUT= 2.0V VOUT= 2.2V VOUT= 2.4V VOUT= 2.7V VOUT= 2.85V VOUT= 3.0V VOUT= 3.15V VOUT= 3.3V ─ 45 41 38 33 31 30 28 27 mA mW IOUT Output Current (based on output power spec) ─ POUT Output Power ─ IQ Quiescent Current ─ fDC-DC Clock Frequency ─ IDCLOAD Maximum DC Load Current During Startup ─ COUT Capacitance Connect to Output ─ TSTART DC to DC Start-up Time ─ ─ ─ ─ ─ 90 ─ 80 120 μA ─ 0.5 1.0 1.5 MHz ─ ─ ─ 1 mA ─ 0.8 1.0 2.0 μF ─ 1 ─ ms VFB= 1.4V, VOUT= 3.3V VBAT= 0.9V, VOUT= 2.2V Power on Reset Electrical Characteristics Ta=25˚C Symbol Test Conditions Parameter VDD Condition Min. Typ. Max. Unit VPOR VDD Start Voltage to ensure Power-on Reset — — — — 100 mV RPOR AC VDD Raising Rate to Ensure Power-on Reset — — 0.035 — — V/ms tPOR Minimum Time for VDD to remain at VPOR to ensure Power-on Reset — — 1 — — ms Rev. 1.00 14 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU ADC Internal Reference Voltage (VBG) Characteristic Curve VBG Curve Bandgap Voltage 1.12 1.11 2.2V 2.4V 2.7V 3.3V 1.1 1.09 1.08 1.07 -45℃ 25℃ 90℃ Operating Temperature System Architecture A key factor in the high-performance features of the Holtek range of is attributed to their internal system architecture. The range of devices take advantage of the usual features found within RISC providing increased speed of operation and enhanced performance. The pipelining scheme is implemented in such a way that instruction fetching and instruction execution are overlapped, hence instructions are effectively executed in one cycle, with the exception of branch or call instructions. An 8-bit wide ALU is used in practically all instruction set operations, which carries out arithmetic operations, logic operations, rotation, increment, decrement, branch decisions, etc. The internal data path is simplified by moving data through the Accumulator and the ALU. Certain internal registers are implemented in the Data Memory and can be directly or indirectly addressed. The simple addressing methods of these registers along with additional architectural features ensure that a minimum of external components is required to provide a functional I/O and A/D control system with maximum reliability and flexibility. This makes the device suitable for low-cost, high-volume production for controller applications. Clocking and Pipelining The main system clock, derived from either a HXT, HIRC or LIRC oscillator is subdivided into four internally generated non-overlapping clocks, T1~T4. The Program Counter is incremented at the beginning of the T1 clock during which time a new instruction is fetched. The remaining T2~T4 clocks carry out the decoding and execution functions. In this way, one T1~T4 clock cycle forms one instruction cycle. Although the fetching and execution of instructions takes place in consecutive instruction cycles, the pipelining structure of the ensures that instructions are effectively executed in one instruction cycle. The exception to this are instructions here the contents of the Program Counter are changed, such as subroutine calls or jumps, in which case the instruction will take one more instruction cycle to execute. For instructions involving branches, such as jump or call instructions, two machine cycles are required to complete instruction execution. An extra cycle is required as the program takes one cycle to first obtain the actual jump or call address and then another cycle to actually execute the branch. The requirement for this extra cycle should be taken into account by programmers in timing sensitive applications. Rev. 1.00 15 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU System Clocking and Pipelining Instruction Fetching Program Counter During program execution, the Program Counter is used to keep track of the address of the next instruction to be executed. It is automatically incremented by one each time an instruction is executed except for instructions, such as ″JMP″ or ″CALL″ that demand a jump to a nonconsecutive Program Memory address. Only the lower 8 bits, known as the Program Counter Low Register, are directly addressable by the application program. When executing instructions requiring jumps to non-consecutive addresses such as a jump instruction, a subroutine call, interrupt or reset, etc., the manages program control by loading the required address into the Program Counter. For conditional skip instructions, once the condition has been met, the next instruction, which has already been fetched during the present instruction execution, is discarded and a dummy cycle takes its place while the correct instruction is obtained. Device Program Counter High Byte Low Byte (PCL Register) HT66F016L PC9~PC8 PCL7~PCL0 HT66F017L PC10~PC8 PCL7~PCL0 Program Counter The lower byte of the Program Counter, known as the Program Counter Low register or PCL, is available for program control and is a readable and writeable register. By transferring data directly into this register, a short program jump can be executed directly, however, as only this low byte is available for manipulation, the jumps are limited to the present page of memory, that is 256 locations. When such program jumps are executed it should also be noted that a dummy cycle will be inserted. Manipulating the PCL register may cause program branching, so an extra cycle is needed to pre-fetch. Rev. 1.00 16 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Stack This is a special part of the memory which is used to save the contents of the Program Counter only. The stack has multiple levels depending upon the device and is neither part of the data nor part of the program space, and is neither readable nor writeable. The activated level is indexed by the Stack Pointer, and is neither readable nor writeable. At a subroutine call or interrupt acknowledge signal, the contents of the Program Counter are pushed onto the stack. At the end of a subroutine or an interrupt routine, signaled by a return instruction, RET or RETI, the Program Counter is restored to its previous value from the stack. After a device reset, the Stack Pointer will point to the top of the stack. If the stack is full and an enabled interrupt takes place, the interrupt request flag will be recorded but the acknowledge signal will be inhibited. When the Stack Pointer is decremented, by RET or RETI, the interrupt will be serviced. This feature prevents stack overflow allowing the programmer to use the structure more easily. However, when the stack is full, a CALL subroutine instruction can still be executed which will result in a stack overflow. Precautions should be taken to avoid such cases which might cause unpredictable program branching. If the stack is overflow, the first Program Counter save in the stack will be lost. P ro g ra m T o p o f S ta c k S ta c k L e v e l 1 S ta c k L e v e l 2 S ta c k P o in te r B o tto m C o u n te r S ta c k L e v e l 3 o f S ta c k P ro g ra m M e m o ry S ta c k L e v e l 8 Arithmetic and Logic Unit – ALU The arithmetic-logic unit or ALU is a critical area of the that carries out arithmetic and logic operations of the instruction set. Connected to the main data bus, the ALU receives related instruction codes and performs the required arithmetic or logical operations after which the result will be placed in the specified register. As these ALU calculation or operations may result in carry, borrow or other status changes, the status register will be correspondingly updated to reflect these changes. The ALU supports the following functions: • Arithmetic operations: ADD, ADDM, ADC, ADCM,SUB, SUBM, SBC, SBCM, DAA • Logic operations: AND, OR, XOR, ANDM, ORM,XORM, CPL, CPLA • Rotation RRA, RR, RRCA, RRC, RLA, RL, RLCA, RLC • Increment and Decrement INCA, INC, DECA, DEC • Branch decision, JMP, SZ, SZA, SNZ, SIZ, SDZ,SIZA, SDZA, CALL, RET, RETI Rev. 1.00 17 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Flash Program Memory The Program Memory is the location where the user code or program is stored. For this device series the Program Memory is Flash type, which means it can be programmed and re-programmed a large number of times, allowing the user the convenience of code modification on the same device. By using the appropriate programming tools, these Flash devices offer users the flexibility to conveniently debug and develop their applications while also offering a means of field programming and updating. Structure The Program Memory has a capacity of up to 2K×16 bits. The Program Memory is addressed by the Program Counter and also contains data, table information and interrupts entries. Table data, which can be setup in any location within the Program Memory, is addressed by a separate table pointer register. Device Capacity HT66F016L 1K×16 HT66F017L 2K×16 HT66F017L HT66F016L 0000H 0000H Reset 000�H 000�H Interr�pt Vector Interr�pt Vector 00��H 00��H 0�FFH Reset 16 bits 07FFH 16 bits Program Memory Structure Special Vectors Within the Program Memory, certain locations are reserved for the reset and interrupts. The location 000H is reserved for use by the device reset for program initialisation. After a device reset is initiated, the program will jump to this location and begin execution. Rev. 1.00 18 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Look-up Table Any location within the Program Memory can be defined as a look-up table where programmers can store fixed data. To use the look-up table, the table pointer must first be setup by placing the address of the look up data to be retrieved in the table pointer register, TBLP and TBHP. These registers define the total address of the look-up table. After setting up the table pointer, the table data can be retrieved from the Program Memory using the ″TABRD[m]″ or ″TABRDL[m]″ instructions, respectively. When the instruction is executed, the lower order table byte from the Program Memory will be transferred to the user defined Data Memory register [m] as specified in the instruction. The higher order table data byte from the Program Memory will be transferred to the TBLH special register. Any unused bits in this transferred higher order byte will be read as ″0″. The accompanying diagram illustrates the addressing data flow of the look-up table. A d d re s s L a s t p a g e o r T B H P R e g is te r T B L P R e g is te r D a ta 1 6 b its R e g is te r T B L H U s e r S e le c te d R e g is te r H ig h B y te L o w B y te Table Program Example The following example shows how the table pointer and table data is defined and retrieved from the microcontroller. This example uses raw table data located in the Program Memory which is stored there using the ORG statement. The value at this ORG statement is ″700H″ which refers to the start address of the last page within the 2K words Program Memory of the device. The table pointer is setup here to have an initial value of ″06H″. This will ensure that the first data read from the data table will be at the Program Memory address ″706H″ or 6 locations after the start of the last page. Note that the value for the table pointer is referenced to the first address of the present page if the ″TABRD [m]″ instruction is being used. The high byte of the table data which in this case is equal to zero will be transferred to the TBLH register automatically when the ″TABRD [m]″ instruction is executed. Because the TBLH register is a read-only register and cannot be restored, care should be taken to ensure its protection if both the main routine and Interrupt Service Routine use table read instructions. If using the table read instructions, the Interrupt Service Routines may change the value of the TBLH and subsequently cause errors if used again by the main routine. As a rule it is recommended that simultaneous use of the table read instructions should be avoided. However, in situations where simultaneous use cannot be avoided, the interrupts should be disabled prior to the execution of any main routine table-read instructions. Note that all table related instructions require two instruction cycles to complete their operation. Rev. 1.00 19 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Table Read Program Example tempreg1db ? tempreg2db ? : : mov a,06h mov tblp,a mov a,07h mov tbhp,a : : tabrd tempreg1 ; temporary register #1 ; temporary register #2 ; transfers value in table referenced by table pointer data at program ; memory address ″706H″ transferred to tempreg1 and TBLH dec tblp ; reduce value of table pointer by one ; initialise low table pointer - note that this address ; is referenced ; initialise high table pointer tabrd tempreg2 ; ; ; ; : : org 700h ; transfers value in table referenced by table pointer data at program memory address ″705H″ transferred to tempreg2 and TBLH in this example the data ″1AH″ is transferred to tempreg1 and data ″0FH″ to register tempreg2 sets initial address of program memory dc 00Ah, 00Bh, 00Ch, 00Dh, 00Eh, 00Fh, 01Ah, 01Bh : : In Circuit Programming The provision of Flash type Program Memory provides the user with a means of convenient and easy upgrades and modifications to their programs on the same device. As an additional convenience, Holtek has provided a means of programming the microcontroller incircuit using a 4-pin interface. This provides manufacturers with the possibility of manufacturing their circuit boards complete with a programmed or un-programmed microcontroller, and then programming or upgrading the program at a later stage. This enables product manufacturers to easily keep their manufactured products supplied with the latest program releases without removal and reinsertion of the device. Holtek Writer Pins MCU Programming Pins Pin Description ICPDA PA2 Programming Serial Data ICPCK PA7 Programming Clock VDD VDD Power Supply VSS VSS Ground The Program Memory can be programmed serially in-circuit using this 4-wire interface. Data is downloaded and uploaded serially on a single pin with an additional line for the clock. Two additional lines are required for the power supply and one line for the reset. The technical details regarding the in-circuit programming of the devices are beyond the scope of this document and will be supplied in supplementary literature. During the programming process, taking control of the PA2 and PA7 pins for data and clock programming purposes. The user must there take care to ensure that no other outputs are connected to these two pins. Rev. 1.00 20 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU M C U P r o g r a m m in g P in s W r ite r C o n n e c to r S ig n a ls V D D V D D IC P D A P A 2 IC P C K P A 7 V S S V S S * * T o o th e r C ir c u it Note: * may be resistor or capacitor. The resistance of * must be greater than 1kΩ or the capacitance of * must be less than 1nF. On-Chip Debug Support – OCDS There is an EV chip which is used to emulate the HT66F01xL devices series. The EV chip device also provides an “On-Chip Debug” function to debug the devices during the development process. The EV chip and the actual MCU devices are almost functionally compatible except for “OnChip Debug” function. Users can use the EV chip device to emulate the real chip device behavior by connecting the OCDSDA and OCDSCK pins to the Holtek HT-IDE development tools. The OCDSDA pin is the OCDS Data/Address input/output pin while the OCDSCK pin is the OCDS clock input pin. When users use the EV chip for debugging, other functions which are shared with the OCDSDA and OCDSCK pins in the actual MCU device will have no effect in the EV chip. However, the two OCDS pins which are pin-shared with the ICP programming pins are still used as the Flash Memory programming pins for ICP. For more detailed OCDS information, refer to the corresponding document named “Holtek e-Link for 8-bit MCU OCDS User’s Guide”. Rev. 1.00 Holtek e-Link Pins EV Chip Pins OCDSDA OCDSDA On-Chip Debug Support Data/Address input/output Pin Description OCDSCK OCDSCK On-Chip Debug Support Clock input VDD VDD Power Supply GND VSS Ground 21 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU RAM Data Memory The Data Memory is a volatile area of 8-bit wide RAM internal memory and is the location where temporary information is stored. Structure Divided into two sections, the first of these is an area of RAM, known as the Special Function Data Memory. Here are located registers which are necessary for correct operation of the device. Many of these registers can be read from and written to directly under program control, however, some remain protected from user manipulation. Device Capacity Bank 0 Bank 1 HT66F016L 64×8 80H~BFH Unimplemented 128×8 80H~FFH Unimplemented HT66F017L General Purpose Data Memory Structure Note: 80H~BFH for HT66F016L 80H~FFH for HT66F017L General Purpose Data Memory Structure General Purpose Data Memory Structure The second area of Data Memory is known as the General Purpose Data Memory, which is reserved for general purpose use. All locations within this area are read and write accessible under program control. The overall Data Memory is subdivided into two banks for all the devices. The Special Purpose Data Memory registers are accessible in all banks, with the exception of the EEC register at address 40H, which is only accessible in Bank 1. Switching between the different Data Memory banks is achieved by setting the Bank Pointer to the correct value. The start address of the Data Memory for all devices is the address 00H. Rev. 1.00 22 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU 00H 01H 0�H 0�H 0�H 05H 06H 07H 08H 09H 0AH 0BH 0CH 0DH 0EH 0FH 10H 11H 1�H 1�H 1�H 15H 16H 17H 18H 19H 1AH 1BH 1CH 1DH 1EH 1FH Bank 0 Bank 1 IAR0 MP0 IAR1 MP1 BP ACC PCL TBLP TBLH TBHP STATUS SMOD LVDC INTEG INTC0 INTC1 INTC� MFI0 MFI1 MFI� PA PAC PAPU PAWU PRM TMPC WDTC TBC Un�sed Un�sed EEA EED Bank 0 Bank 1 �0H ADRL �1H ADRH ��H ADCR0 ��H ADCR1 ��H ACERL CPC �5H �6H CTRL LVRC �7H TM0C0 �8H �9H TM0C1 �AH TM0DL TM0DH �BH TM0AL �CH TM0AH �DH TM0RP �EH �FH TM1C0 �0H TM1C1 �1H TM1DL ��H TM1DH ��H TM1AL ��H TM1AH TM1RP �5H �6H : Un�sed �AH �BH DCC �CH Un�sed �DH PB PBC �EH �FH PBPU �0H Un�sed EEC �1H : Un�sed 7FH : Un�sed� read as 00H HT66F016L/HT66F017L Special Purpose Data Memory Rev. 1.00 23 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Special Function Register Description Most of the Special Function Register details will be described in the relevant functional section, however several registers require a separate description in this section. Indirect Addressing Registers – IAR0, IAR1 The Indirect Addressing Registers, IAR0 and IAR1, although having their locations in normal RAM register space, do not actually physically exist as normal registers. The method of indirect addressing for RAM data manipulation uses these Indirect Addressing Registers and Memory Pointers, in contrast to direct memory addressing, where the actual memory address is specified. Actions on the IAR0 and IAR1 registers will result in0. no actual read or write operation to these registers but rather to the memory location specified by their corresponding Memory Pointers, MP0 or MP1. Acting as a pair, IAR0 and MP0 can together access data from Bank 0 while the IAR1 and MP1 register pair can access data from any bank. As the Indirect Addressing Registers are not physically implemented, reading the Indirect Addressing Registers indirectly will return a result of ″00H″ and writing to the registers indirectly will result in no operation. Memory Pointers – MP0, MP1 Two Memory Pointers, known as MP0 and MP1 are provided. These Memory Pointers are physically implemented in the Data Memory and can be manipulated in the same way as normal registers providing a convenient way with which to address and track data. When any operation to the relevant Indirect Addressing Registers is carried out, the actual address that the microcontroller is directed to, is the address specified by the related Memory Pointer. MP0, together with Indirect Addressing Register, IAR0, are used to access data from Bank 0, while MP1 and IAR1 are used to access data from all banks according to BP register. Direct Addressing can only be used with Bank 0, all other Banks must be addressed indirectly using MP1 and IAR1. Note that for this series of devices, the Memory Pointers, MP0 and MP1, are both 8-bit registers and used to access the Data Memory together with their corresponding indirect addressing registers IAR0 and IAR1. The following example shows how to clear a section of four Data Memory locations already defined as locations adres1 to adres4. Indirect Addressing Program Example data .section data adres1 db ? adres2 db ? adres3 db ? adres4 db ? block db ? code .section at 0 'code' org00h start: mov a,04h; setup size of block mov block,a mov a,offset adres1 ; Accumulator loaded with first RAM address mov mp0,a ; setup memory pointer with first RAM address loop: clr IAR0 ; clear the data at address defined by MP0 inc mp0; increment memory pointer sdz block ; check if last memory location has been cleared jmp loop continue: The important point to note here is that in the example shown above, no reference is made to specific RAM addresses. Rev. 1.00 24 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Bank Pointer – BP For this series of devices, the Data Memory is divided into two banks. Selecting the required Data Memory area is achieved using the Bank Pointer. Bit 0 is used to select Data Memory Banks 0~1. The Data Memory is initialised to Bank 0 after a reset, except for a WDT time-out reset in the Power Down Mode, in which case, the Data Memory bank remains unaffected. It should be noted that the Special Function Data Memory is not affected by the bank selection, which means that the Special Function Registers can be accessed from within any bank. Directly addressing the Data Memory will always result in Bank 0 being accessed irrespective of the value of the Bank Pointer. Accessing data from banks other than Bank 0 must be implemented using indirect addressing. BP Register Bit 7 6 5 4 3 2 1 0 Name — — — — — — — DMBP0 R/W — — — — — — — R/W POR — — — — — — — 0 Bit 7~1 Unimplemented, read as “0” Bit 0DMBP0: Select Data Memory Banks 0: Bank 0 1: Bank 1 Accumulator – ACC The Accumulator is central to the operation of any microcontroller and is closely related with operations carried out by the ALU. The Accumulator is the place where all intermediate results from the ALU are stored. Without the Accumulator it would be necessary to write the result of each calculation or logical operation such as addition, subtraction, shift, etc., to the Data Memory resulting in higher programming and timing overheads. Data transfer operations usually involve the temporary storage function of the Accumulator; for example, when transferring data between one user defined register and another, it is necessary to do this by passing the data through the Accumulator as no direct transfer between two registers is permitted. Program Counter Low Register – PCL To provide additional program control functions, the low byte of the Program Counter is made accessible to programmers by locating it within the Special Purpose area of the Data Memory. By manipulating this register, direct jumps to other program locations are easily implemented. Loading a value directly into this PCL register will cause a jump to the specified Program Memory location, however, as the register is only 8-bit wide, only jumps within the current Program Memory page are permitted. When such operations are used, note that a dummy cycle will be inserted. Look-up Table Registers – TBLP, TBHP, TBLH These three special function registers are used to control operation of the look-up table which is stored in the Program Memory. TBLP and TBHP are the table pointer and indicates the location where the table data is located. Their value must be setup before any table read commands are executed. Their value can be changed, for example using the ″INC″ or ″DEC″ instructions, allowing for easy table data pointing and reading. TBLH is the location where the high order byte of the table data is stored after a table read data instruction has been executed. Note that the lower order table data byte is transferred to a user defined location. Rev. 1.00 25 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Status Register – STATUS This 8-bit register contains the zero flag (Z), carry flag (C), auxiliary carry flag (AC), overflow flag (OV), power down flag (PDF), and watchdog time-out flag (TO). These arithmetic/logical operation and system management flags are used to record the status and operation of the microcontroller. With the exception of the TO and PDF flags, bits in the status register can be altered by instructions like most other registers. Any data written into the status register will not change the TO or PDF flag. In addition, operations related to the status register may give different results due to the different instruction operations. The TO flag can be affected only by a system power-up, a WDT time-out or by executing the ″CLR WDT″ or ″HALT″ instruction. The PDF flag is affected only by executing the ″HALT″ or ″CLR WDT″ instruction or during a system power-up. The Z, OV, AC and C flags generally reflect the status of the latest operations. • C is set if an operation results in a carry during an addition operation or if a borrow does not take place during a subtraction operation; otherwise C is cleared. C is also affected by a rotate through carry instruction. • AC is set if an operation results in a carry out of the low nibbles in addition, or no borrow from the high nibble into the low nibble in subtraction; otherwise AC is cleared. • Z is set if the result of an arithmetic or logical operation is zero; otherwise Z is cleared. • OV is set if an operation results in a carry into the highest-order bit but not a carry out of the highest-order bit, or vice versa; otherwise OV is cleared. • PDF is cleared by a system power-up or executing the “CLR WDT” instruction. PDF is set by executing the “HALT” instruction. • TO is cleared by a system power-up or executing the “CLR WDT” or “HALT” instruction. TO is set by a WDT time-out. In addition, on entering an interrupt sequence or executing a subroutine call, the status register will not be pushed onto the stack automatically. If the contents of the status registers are important and if the subroutine can corrupt the status register, precautions must be taken to correctly save it. Rev. 1.00 26 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU STATUS Register Bit 7 6 5 4 3 2 1 0 Name — — TO PDF OV Z AC C R/W — — R R R/W R/W R/W R/W POR — — 0 0 x x x x "x" unknown Bit 7, 6 Unimplemented, read as “0” Bit 5TO: Watchdog Time-Out flag 0: After power up or executing the “CLR WDT” or “HALT” instruction 1: A watchdog time-out occurred. Bit 4PDF: Power down flag 0: After power up or executing the “CLR WDT” instruction 1: By executing the “HALT” instruction Bit 3OV: Overflow flag 0: No overflow 1: An operation results in a carry into the highest-order bit but not a carry out of the highest-order bit or vice versa. Bit 2Z: Zero flag 0: The result of an arithmetic or logical operation is not zero 1: The result of an arithmetic or logical operation is zero Bit 1AC: Auxiliary flag 0: No auxiliary carry 1: An operation results in a carry out of the low nibbles in addition, or no borrow from the high nibble into the low nibble in subtraction Bit 0C: Carry flag 0: No carry-out 1: An operation results in a carry during an addition operation or if a borrow does not take place during a subtraction operation C is also affected by a rotate through carry instruction. Rev. 1.00 27 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU EEPROM Data Memory The device contains an area of internal EEPROM Data Memory. EEPROM, which stands for Electrically Erasable Programmable Read Only Memory, is by its nature a non-volatile form of re-programmable memory, with data retention even when its power supply is removed. By incorporating this kind of data memory, a whole new host of application possibilities are made available to the designer. The availability of EEPROM storage allows information such as product identification numbers, calibration values, specific user data, system setup data or other product information to be stored directly within the product microcontroller. The process of reading and writing data to the EEPROM memory has been reduced to a very trivial affair. EEPROM Data Memory Structure The EEPROM Data Memory capacity is 64×8 bits for this series of devices. Unlike the Program Memory and RAM Data Memory, the EEPROM Data Memory is not directly mapped into memory space and is therefore not directly addressable in the same way as the other types of memory. Read and Write operations to the EEPROM are carried out in single byte operations using an address and data register in Bank 0 and a single control register in Bank 1. Device All devices Capacity Address 64×8 00H ~ 3FH EEPROM Registers Three registers control the overall operation of the internal EEPROM Data Memory. These are the address register, EEA, the data register, EED and a single control register, EEC. As both the EEA and EED registers are located in Bank 0, they can be directly accessed in the same was as any other Special Function Register. The EEC register however, being located in Bank1, cannot be addressed directly and can only be read from or written to indirectly using the MP1 Memory Pointer and Indirect Addressing Register, IAR1. Because the EEC control register is located at address 40H in Bank 1, the MP1 Memory Pointer must first be set to the value 40H and the Bank Pointer register, BP, set to the value, 01H, before any operations on the EEC register are executed.. EEPROM Register List Name Bit 7 6 5 4 3 2 1 0 D0 EEA — — D5 D4 D3 D2 D1 EED D7 D6 D5 D4 D3 D2 D1 D0 EEC — — — — WREN WR RDEN RD Bit 7 6 5 4 3 2 1 0 Name — — D5 D4 D3 D2 D1 D0 R/W — — R/W R/W R/W R/W R/W R/W POR — — x x x x x EEA Register x “x” unknown Rev. 1.00 Bit 7~6 Unimplemented, read as “0” Bit 5~0 Data EEPROM address Data EEPROM address bit 5~bit 0 28 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU EED Register Bit 7 6 5 4 3 2 1 0 Name D7 D6 D5 D4 D3 D2 D1 D0 R/W R/W R/W R/W R/W R/W R/W R/W R/W POR x x x x x x x x “x” unknown Bit 7~0 Data EEPROM address Data EEPROM address bit 7~bit 0 EEC Register Bit 7 6 5 4 3 2 1 0 Name — — — — WREN WR RDEN RD R/W — — — — R/W R/W R/W R/W POR — — — — 0 0 0 0 Bit 7~4 Unimplemented, read as “0” Bit 3WREN: Data EEPROM Write Enable 0: Disable 1: Enable This is the Data EEPROM Write Enable Bit which must be set high before Data EEPROM write operations are carried out. Clearing this bit to zero will inhibit Data EEPROM write operations. Bit 2WR: EEPROM Write Control 0: Write cycle has finished 1: Activate a write cycle This is the Data EEPROM Write Control Bit and when set high by the application program will activate a write cycle. This bit will be automatically reset to zero by the hardware after the write cycle has finished. Setting this bit high will have no effect if the WREN has not first been set high. Bit 1 RDEN: Data EEPROM Read Enable 0: Disable 1: Enable This is the Data EEPROM Read Enable Bit which must be set high before Data EEPROM read operations are carried out. Clearing this bit to zero will inhibit Data EEPROM read operations. Bit 0 RD : EEPROM Read Control 0: Read cycle has finished 1: Activate a read cycle This is the Data EEPROM Read Control Bit and when set high by the application program will activate a read cycle. This bit will be automatically reset to zero by the hardware after the read cycle has finished. Setting this bit high will have no effect if the RDEN has not first been set high. Note: The WREN, WR, RDEN and RD can not be set to “1” at the same time in one instruction. The WR and RD can not be set to “1” at the same time. Rev. 1.00 29 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Reading Data from the EEPROM To read data from the EEPROM, the read enable bit, RDEN, in the EEC register must first be set high to enable the read function. The EEPROM address of the data to be read must then be placed in the EEA register. If the RD bit in the EEC register is now set high, a read cycle will be initiated. Setting the RD bit high will not initiate a read operation if the RDEN bit has not been set. When the read cycle terminates, the RD bit will be automatically cleared to zero, after which the data can be read from the EED register. The data will remain in the EED register until another read or write operation is executed. The application program can poll the RD bit to determine when the data is valid for reading. Writing Data to the EEPROM The EEPROM address of the data to be written must first be placed in the EEA register and the data placed in the EED register. To write data to the EEPROM, the write enable bit, WREN, in the EEC register must first be set high to enable the write function. After this, the WR bit in the EEC register must be immediately set high to initiate a write cycle. These two instructions must be executed consecutively. The global interrupt bit EMI should also first be cleared before implementing any write operations, and then set again after the write cycle has started. Note that setting the WR bit high will not initiate a write cycle if the WREN bit has not been set. As the EEPROM write cycle is controlled using an internal timer whose operation is asynchronous to microcontroller system clock, a certain time will elapse before the data will have been written into the EEPROM. Detecting when the write cycle has finished can be implemented either by polling the WR bit in the EEC register or by using the EEPROM interrupt. When the write cycle terminates, the WR bit will be automatically cleared to zero by the microcontroller, informing the user that the data has been written to the EEPROM. The application program can therefore poll the WR bit to determine when the write cycle has ended. Write Protection Protection against inadvertent write operation is provided in several ways. After the device is powered-on the Write Enable bit in the control register will be cleared preventing any write operations. Also at power-on the Bank Pointer, BP, will be reset to zero, which means that Data Memory Bank 0 will be selected. As the EEPROM control register is located in Bank 1, this adds a further measure of protection against spurious write operations. During normal program operation, ensuring that the Write Enable bit in the control register is cleared will safeguard against incorrect write operations. EEPROM Interrupt The EEPROM write interrupt is generated when an EEPROM write cycle has ended. The EEPROM interrupt must first be enabled by setting the DEE bit in the relevant interrupt register. However as the EEPROM is contained within a Multi-function Interrupt, the associated multi-function interrupt enable bit must also be set. When an EEPROM write cycle ends, the DEF request flag and its associated multi-function interrupt request flag will both be set. If the global, EEPROM and Multifunction interrupts are enabled and the stack is not full, a jump to the associated Multi-function Interrupt vector will take place. When the interrupt is serviced only the Multi-function interrupt flag will be automatically reset, the EEPROM interrupt flag must be manually reset by the application program. More details can be obtained in the Interrupt section. Rev. 1.00 30 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Programming Considerations Care must be taken that data is not inadvertently written to the EEPROM. Protection can be enhanced by ensuring that the Write Enable bit is normally cleared to zero when not writing. Also the Bank Pointer could be normally cleared to zero as this would inhibit access to Bank 1 where the EEPROM control register exist. Although certainly not necessary, consideration might be given in the application program to the checking of the validity of new write data by a simple read back process. When writing data the WR bit must be set high immediately after the WREN bit has been set high, to ensure the write cycle executes correctly. The global interrupt bit EMI should also be cleared before a write cycle is executed and then re-enabled after the write cycle starts. Programming Examples Reading data from the EEPROM – polling method MOV A, EEPROM_ADRES MOV EEA, A MOV A, 040H MOV MP1, A MOV A, 01H MOV BP, A SET IAR1.1 SET IAR1.0 BACK: SZ IAR1.0 JMP BACK CLR IAR1 CLR BP MOV A, EED MOV READ_DATA, A ; user defined address ; setup memory pointer MP1 ; MP1 points to EEC register ; setup Bank Pointer ; set RDEN bit, enable read operations ; start Read Cycle - set RD bit ; check for read cycle end ; disable EEPROM read/write ; move read data to register Writing data from the EEPROM – polling method CLR EMI MOV A, EEPROM_ADRES MOV EEA, A MOV A, EEPROM_DATA MOV EED, A MOV A, 040H MOV MP1, A MOV A, 01H MOV BP, A SET IAR1.3 SET IAR1.2 SET EMI BACK: SZ IAR1.2 JMP BACK CLR IAR1 CLR BP Rev. 1.00 ; user defined address ; user defined data ; setup memory pointer MP1 ; MP1 points to EEC register ; setup Bank Pointer ; set WREN bit, enable write operations ; Start Write Cycle - set WR bit - executed immediately ; after set WREN bit ; check for write cycle end ; disable EEPROM read/write 31 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Oscillator Various oscillator options offer the user a wide range of functions according to their various application requirements. The flexible features of the oscillator functions ensure that the best optimisation can be achieved in terms of speed and power saving. Oscillator selections and operation are selected through a combination of configuration options and registers. Oscillator Overview In addition to being the source of the main system clock the oscillators also provide clock sources for the Watchdog Timer and Time Base Interrupts. External oscillators requiring some external components as well as fully integrated internal oscillators, requiring no external components, are provided to form a wide range of both fast and slow system oscillators. All oscillator options are selected through the configuration options. The higher frequency oscillators provide higher performance but carry with it the disadvantage of higher power requirements, while the opposite is of course true for the lower frequency oscillators. With the capability of dynamically switching between fast and slow system clock, the device has the flexibility to optimize the performance/ power ratio, a feature especially important in power sensitive portable applications. Type Name Freq. 400kHz~12MHz Pins External Crystal HXT OSC1/OSC2 Internal High Speed RC HIRC 8MHz — Internal Low Speed RC LIRC 32kHz — Oscillator Types System Clock Configurations There are methods of generating the system clock, two high speed oscillators and one low speed oscillators. The high speed oscillators are the external crystal/ceramic oscillator - HXT and the internal 8MHz RC oscillator - HIRC. The low speed oscillator is the internal 32kHz oscillator - LIRC. Selecting whether the low or high speed oscillator is used as the system oscillator is implemented using the HLCLK bit and CKS2~CKS0 bits in the SMOD register and as the system clock can be dynamically selected. The actual source clock used for each of the high speed oscillator is chosen via configuration options. The frequency of the slow speed or high speed system clock is also determined using the HLCLK bit and CKS2~CKS0 bits in the SMOD register. Note that two oscillator selections must be made namely one high speed and one low speed system oscillators. It is not possible to choose a nooscillator selection for either the high or low speed oscillator. The OSC1 and OSC2 pins are used to connect the external components for the external crystal. Rev. 1.00 32 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU System Clock Configurations External Crystal/Ceramic Oscillator – HXT The External Crystal/ Ceramic System Oscillator is one of the high frequency oscillator choices, which is selected via configuration option. For most crystal oscillator configurations, the simple connection of a crystal across OSC1 and OSC2 will create the necessary phase shift and feedback for oscillation, without requiring external capacitors. However, for some crystal types and frequencies, to ensure oscillation, it may be necessary to add two small value capacitors, C1 and C2. Using a ceramic resonator will usually require two small value capacitors, C1 and C2, to be connected as shown for oscillation to occur. The values of C1 and C2 should be selected in consultation with the crystal or resonator manufacturer′s specification. Crystal/Resonator Oscillator – HXT Rev. 1.00 33 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Crystal Oscillator C1 and C2 Values Crystal Frequency C1 C2 12MHz 0pF 0pF 8MHz 0pF 0pF 4MHz 0pF 0pF 1MHz 100pF 100pF Note: C1 and C2 values are for guidance only. Crystal Recommended Capacitor Values High Speed Internal RC Oscillator – HIRC The internal RC oscillator is a fully integrated system oscillator requiring no external components. The internal RC oscillator has a fixed frequency of 8MHz. Device trimming during the manufacturing process and the inclusion of internal frequency compensation circuits are used to ensure that the influence of the power supply voltage, temperature and process variations on the oscillation frequency are minimised. As a result, in a power supply range of 2.0V~3.3V and at a temperature of -40˚C~85˚C degrees, the fixed oscillation frequency of the high speed internal 8MHz RC oscillator will have a tolerance within 2%. Note that if this internal system clock option is selected as the high speed oscillator, as it requires no external pins for its operation, I/O pins PA6 and PA5 can only be used as normal I/O pins. Internal 32kHz Oscillator – LIRC The Internal 32kHz System Oscillator is the low frequency oscillator. It is a fully integrated RC oscillator with a typical frequency of 32kHz at 3V, requiring no external components for its implementation. Device trimming during the manufacturing process and the inclusion of internal frequency compensation circuits are used to ensure that the influence of the power supply voltage, temperature and process variations on the oscillation frequency are minimised. As a result, in a power supply range of 2.0V~3.3V and at a temperature of 25˚C degrees, the fixed oscillation frequency of 32kHz will have a tolerance within 10%. Supplementary Oscillator The low speed oscillator, in addition to providing a system clock source is also used to provide a clock source to two other device functions. These are the Watchdog Timer and the Time Base Interrupts. Rev. 1.00 34 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Operating Modes and System Clocks Present day applications require that their microcontrollers have high performance but often still demand that they consume as little power as possible, conflicting requirements that are especially true in battery powered portable applications. The fast clocks required for high performance will by their nature increase current consumption and of course vice-versa, lower speed clocks reduce current consumption. As Holtek has provided these devices with both high and low speed clock sources and the means to switch between them dynamically, the user can optimise the operation of their microcontroller to achieve the best performance/power ratio. System Clocks The device has many different clock sources for both the CPU and peripheral function operation. By providing the user with a wide range of clock options using configuration options and register programming, a clock system can be configured to obtain maximum application performance. The main system clock, can come from either a high frequency, fH, or low frequency, fL, source, and is selected using the HLCLK bit and CKS2~CKS0 bits in the SMOD register. The high speed system clock can be sourced from either an HXT or HIRC oscillator, selected via a configuration option. The low speed system clock source can be sourced from internal clock fL. The other choice, which is a divided version of the high speed system oscillator has a range of fH/2~fH/64. There are two additional internal clocks for the peripheral circuits, the substitute clock, fSUB, and the Time Base clock, fTBC. Each of these internal clocks are sourced by the LIRC oscillators. The fSUB clock is used to provide a substitute clock for the microcontroller just after a wake-up has occurred to enable faster wake-up times. High Speed Osci��ators HXT fH 6-stage Presca�er HIRC fH/� fH/� High Speed Osci��ator Config�ration Options fH/8 fH/16 fH/�� Low Speed Osci��ator LIRC fH/6� fL fLIRC fSYS fSUB HLCLK� CKS�~CKS0 bits Fast Wake-�p from SLEEP Mode or IDLE Mode Contro� (for HXT on��) fS WDT fTBC fTB fSYS/� Time Base TBCK System Clock Configurations Note: When the system clock source fSYS is switched to fL from fH, the high speed oscillation will stop to conserve the power. Thus there is no fH~fH/64 for peripheral circuits to use. Rev. 1.00 35 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU System Operation Modes There are six different modes of operation for the microcontroller, each one with its own special characteristics and which can be chosen according to the specific performance and power requirements of the application. There are two modes allowing normal operation of the microcontroller, the NORMAL Mode and SLOW Mode. The remaining four modes, the SLEEP0, SLEEP1, IDLE0 and IDLE1 Mode are used when the microcontroller CPU is switched off to conserve power. Operation Mode Description CPU fSYS fSUB fS fTBC On NORMAL Mode On fH~fH/64 On On SLOW Mode On fL On On On IDLE0 Mode Off Off On On On On IDLE1 Mode Off On On On SLEEP0 Mode Off Off Off Off Off SLEEP1 Mode Off Off On On Off • NORMAL Mode As the name suggests this is one of the main operating modes where the microcontroller has all of its functions operational and where the system clock is provided by one of the high speed oscillators. This mode operates allowing the microcontroller to operate normally with a clock source will come from one of the high speed oscillators, either the HXT or HIRC oscillators. The high speed oscillator will however first be divided by a ratio ranging from 1 to 64, the actual ratio being selected by the CKS2~LCKS0 and HLCLK bits in the SMOD register. Although a high speed oscillator is used, running the microcontroller at a divided clock ratio reduces the operating current. • SLOW Mode This is also a mode where the microcontroller operates normally although now with a slower speed clock source. The clock source used will be from the low speed oscillators LIRC. Running the microcontroller in this mode allows it to run with much lower operating currents. In the SLOW Mode, the fH is off. • SLEEP0 Mode The SLEEP Mode is entered when an HALT instruction is executed and when the IDLEN bit in the SMOD register is low. In the SLEEP0 mode the CPU will be stopped, and the fSUB and fS clocks will be stopped too, and the Watchdog Timer function is disabled. In this mode, the LVDEN is must set to ″0″. If the LVDEN is set to ″1″, it won′t enter the SLEEP0 Mode. • SLEEP1 Mode The SLEEP Mode is entered when an HALT instruction is executed and when the bit, IDLEN, in the SMOD register is low. In the SLEEP1 mode the CPU will be stopped. However the fSUB and fS clocks will continue to operate if the LVDEN is 1 or the Watchdog Timer function is enabled as its clock source is derived from the fSUB. • IDLE0 Mode The IDLE0 Mode is entered when a HALT instruction is executed and when the IDLEN bit in the SMOD register is high and the FSYSON bit in the CTRL register is low. In the IDLE0 Mode the system oscillator will be inhibited from driving the CPU but some peripheral functions will remain operational such as the Time Base and TMs. In the IDLE0 Mode, the system oscillator will be stopped. Rev. 1.00 36 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU • IDLE1 Mode The IDLE1 Mode is entered when a HALT instruction is executed and when the IDLEN bit in the SMOD register is high and the FSYSON bit in the CTRL register is high. In the IDLE1 Mode the system oscillator will be inhibited from driving the CPU but may continue to provide a clock source to keep some peripheral functions operational such as the Timer Base and TMs. In the IDLE1 Mode, the system oscillator will continue to run, and this system oscillator may be high speed or low speed system oscillator. Control Register A single register, SMOD, is used for overall control of the internal clocks within the device. SMOD Register Bit 7 6 5 4 3 2 1 0 Name CKS2 CKS1 CKS0 FSTEN LTO HTO IDLEN HLCLK R/W R/W R/W R/W R/W R R R/W R/W POR 1 1 0 0 0 0 1 0 Bit 7~5CKS2~CKS0: The system clock selection when HLCLK is “0” 000: fL (fLIRC) 001: fL (fLIRC) 010: fH/64 011: fH/32 100: fH/16 101: fH/8 110: fH/4 111: fH/2 These three bits are used to select which clock is used as the system clock source. In addition to the system clock source, which can be the LIRC, a divided version of the high speed system oscillator can also be chosen as the system clock source. Bit 4FSTEN: Fast Wake-up Control (only for HXT) 0: Disable 1: Enable This is the Fast Wake-up Control bit which determines if the fLIRC clock source is initially used after the device wake up. When the bit is high, the fLIRC clock source can be used as a temporary system clock to provide a faster wake up time as the fLIRC clock is available. Bit 3LTO: Low speed system oscillator ready flag 0: Not ready 1: Ready This is the low speed system oscillator ready flag which indicates when the low speed system oscillator is stable after power on reset or a wake-up has occurred. The flag will be low when in the SLEEP0 Mode but after a wake-up has occurred, the flag will change to a high level after 1~2 clock cycles if the LIRC oscillator is used. Bit 2HTO: High speed system oscillator ready flag 0: Not ready 1: Ready This is the high speed system oscillator ready flag which indicates when the high speed system oscillator is stable. This flag is cleared to “0” by hardware when the devices are powered on and then changes to a high level after the high speed system oscillator is stable. Therefore this flag will always be read as “1” by the application program after device power-on. The flag will be low when in the SLEEP or IDLE0 Mode but after a wake-up has occurred, the flag will change to a high level after 1024 clock cycles if the HXT oscillator is used. Rev. 1.00 37 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Bit 1IDLEN: IDLE Mode control 0: Disable 1: Enable This is the IDLE Mode Control bit and determines what happens when the HALT instruction is executed. If this bit is high, when a HALT instruction is executed the devices will enter the IDLE Mode. In the IDLE1 Mode the CPU will stop running but the system clock will continue to keep the peripheral functions operational, if FSYSON bit is high. If FSYSON bit is low, the CPU and the system clock will all stop in IDLE0 mode. If the bit is low the devices will enter the SLEEP Mode when a HALT instruction is executed. Bit 0HLCLK: System clock selection 0: fH/2~fH/64 or fL 1: fH This bit is used to select if the fH clock or the fH/2~fH/64 or fL clock is used as the system clock. When the bit is high the f H clock will be selected and if low the fH/2~fH/64 or fL clock will be selected. When system clock switches from the fH clock to the fL clock and the fH clock will be automatically switched off to conserve power. Fast Wake-up To minimise power consumption the device can enter the SLEEP or IDLE0 Mode, where the system clock source to the device will be stopped. However when the device is woken up again, it can take a considerable time for the original system oscillator to restart, stabilise and allow normal operation to resume. To ensure the device is up and running as fast as possible a Fast Wake-up function is provided, which allows fSUB, namely the LIRC oscillator, to act as a temporary clock to first drive the system until the original system oscillator has stabilised. As the clock source for the Fast Wakeup function is fSUB, the Fast Wake-up function is only available in the SLEEP1 and IDLE0 modes. When the device is woken up from the SLEEP0 mode, the Fast Wake-up function has no effect because the fSUB clock is stopped. The Fast Wake-up enable/disable function is controlled using the FSTEN bit in the SMOD register. If the HXT oscillator is selected as the NORMAL Mode system clock, and if the Fast Wake-up function is enabled, then it will take one to two tSUB clock cycles of the LIRC oscillator for the system to wake-up. The system will then initially run under the fSUB clock source until 128 HXT clock cycles have elapsed, at which point the HTO flag will switch high and the system will switch over to operating from the HXT oscillator. If the HIRC oscillators or LIRC oscillator is used as the system oscillator then it will take 15~16 clock cycles of the HIRC or 1~2 cycles of the LIRC to wake up the system from the SLEEP or IDLE0 Mode. The Fast Wake-up bit, FSTEN will have no effect in these cases. System FSTEN Oscillator Bit Wake-up Time (SLEEP0 Mode) Wake-up Time (SLEEP1 Mode) Wake-up Time (IDLE0 Mode) Wake-up Time (IDLE1 Mode) 128 HXT cycles 128 HXT cycles 1~2 HXT cycles 1 128 HXT cycles 1~2 fLIRC cycles (System runs first with fLIRC for 128 HXT cycles and then switches over to run with the HXT clock) 1~2 HXT cycles HIRC x 15~16 HIRC cycles 15~16 HIRC cycles 1~2 HIRC cycles LIRC x 1~2 LIRC cycles 1~2 LIRC cycles 0 HXT 1~2 LIRC cycles Wake-Up Times “x”: don’t care Note that if the Watchdog Timer is disabled, which means that the LIRC is off, then there will be no Fast Wake-up function available when the device wakes-up from the SLEEP0 Mode. Rev. 1.00 38 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Operating Mode Switching and Wake-up The device can switch between operating modes dynamically allowing the user to select the best performance/power ratio for the present task in hand. In this way microcontroller operations that do not require high performance can be executed using slower clocks thus requiring less operating current and prolonging battery life in portable applications. In simple terms, Mode Switching between the NORMAL Mode and SLOW Mode is executed using the HLCLK bit and CKS2~CKS0 bits in the SMOD register while Mode Switching from the NORMAL/SLOW Modes to the SLEEP/IDLE Modes is executed via the HALT instruction. When a HALT instruction is executed, whether the device enters the IDLE Mode or the SLEEP Mode is determined by the condition of the IDLEN bit in the SMOD register and FSYSON in the CTRL register. When the HLCLK bit switches to a low level, which implies that clock source is switched from the high speed clock source, fH, to the clock source, fH/2~fH/64 or fL. If the clock is from the fL, the high speed clock source will stop running to conserve power. When this happens it must be noted that the fH/16 and fH/64 internal clock sources will also stop running, which may affect the operation of other internal functions such as the TMs. The accompanying flowchart shows what happens when the device moves between the various operating modes. Rev. 1.00 39 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU NORMAL Mode to SLOW Mode Switching When running in the NORMAL Mode, which uses the high speed system oscillator, and therefore consumes more power, the system clock can switch to run in the SLOW Mode by setting the HLCLK bit to ″0″ and setting the CKS2~CKS0 bits to ″000″ or ″001″ in the SMOD register. This will then use the low speed system oscillator which will consume less power. Users may decide to do this for certain operations which do not require high performance and can subsequently reduce power consumption. The SLOW Mode is sourced from the the LIRC oscillators and therefore requires these oscillators to be stable before full mode switching occurs. This is monitored using the LTO bit in the SMOD register. Rev. 1.00 40 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU SLOW Mode to NORMAL Mode Switching In SLOW Mode the system uses the LIRC low speed system oscillator. To switch back to the NORMAL Mode, where the high speed system oscillator is used, the HLCLK bit should be set to ″1″ or HLCLK bit is ″0″, but CKS2~CKS0 is set to ″010″, ″011″, ″100″, ″101″, ″110″ or ″111″. As a certain amount of time will be required for the high frequency clock to stabilise, the status of the HTO bit is checked. The amount of time required for high speed system oscillator stabilization depends upon which high speed system oscillator type is used. Entering the SLEEP0 Mode There is only one way for the device to enter the SLEEP0 Mode and that is to execute the ″HALT″ instruction in the application program with the IDLEN bit in SMOD register equal to ″0″ and the WDT and LVD both off. When this instruction is executed under the conditions described above, the following will occur: • The system clock, WDT clock and Time Base clock will be stopped and the application program will stop at the ″HALT″ instruction. • The Data Memory contents and registers will maintain their present condition. • The WDT will be cleared and stopped. • The I/O ports will maintain their present conditions. • In the status register, the Power Down flag, PDF, will be set and the Watchdog time-out flag, TO, will be cleared. Rev. 1.00 41 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Entering the SLEEP1 Mode There is only one way for the device to enter the SLEEP1 Mode and that is to execute the ″HALT″ instruction in the application program with the IDLEN bit in SMOD register equal to ″0″ and the WDT or LVD on. When this instruction is executed under the conditions described above, the following will occur: • The system clock and Time Base clock will be stopped and the application program will stop at the ″HALT″ instruction, but the WDT or LVD will remain with the clock source coming from the fSUB clock. • The Data Memory contents and registers will maintain their present condition. • The WDT will be cleared and resume counting if the WDT is enabled. • The I/O ports will maintain their present conditions. • In the status register, the Power Down flag, PDF, will be set and the Watchdog time-out flag, TO, will be cleared. Entering the IDLE0 Mode There is only one way for the device to enter the IDLE0 Mode and that is to execute the ″HALT″ instruction in the application program with the IDLEN bit in SMOD register equal to ″1″ and the FSYSON bit in CTRL register equal to ″0″. When this instruction is executed under the conditions described above, the following will occur: • The system clock will be stopped and the application program will stop at the ″HALT″ instruction, but the Time Base clock and fSUB clock will be on. • The Data Memory contents and registers will maintain their present condition. • The WDT will be cleared and resume counting if the WDT is enabled. • The I/O ports will maintain their present conditions. • In the status register, the Power Down flag, PDF, will be set and the Watchdog time-out flag, TO, will be cleared. Entering the IDLE1 Mode There is only one way for the device to enter the IDLE1 Mode and that is to execute the ″HALT″ instruction in the application program with the IDLEN bit in SMOD register equal to ″1″ and the FSYSON bit in CTRL register equal to ″1″. When this instruction is executed under the with conditions described above, the following will occur: • The system clock and Time Base clock and fSUB clock will be on and the application program will stop at the ″HALT″ instruction. • The Data Memory contents and registers will maintain their present condition. • The WDT will be cleared and resume counting if the WDT is enabled. • The I/O ports will maintain their present conditions. • In the status register, the Power Down flag, PDF, will be set and the Watchdog time-out flag, TO, will be cleared. Rev. 1.00 42 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Standby Current Considerations As the main reason for entering the SLEEP or IDLE Mode is to keep the current consumption of the device to as low a value as possible, perhaps only in the order of several micro-amps except in the IDLE1 Mode, there are other considerations which must also be taken into account by the circuit designer if the power consumption is to be minimised. Special attention must be made to the I/O pins on the device. All high-impedance input pins must be connected to either a fixed high or low level as any floating input pins could create internal oscillations and result in increased current consumption. This also applies to devices which have different package types, as there may be unbonbed pins. These must either be setup as outputs or if setup as inputs must have pull-high resistors connected. Care must also be taken with the loads, which are connected to I/O pins, which are setup as outputs. These should be placed in a condition in which minimum current is drawn or connected only to external circuits that do not draw current, such as other CMOS inputs. Also note that additional standby current will also be required if the configuration options have enabled the LIRC oscillator. In the IDLE1 Mode the system oscillator is on, if the system oscillator is from the high speed system oscillator, the additional standby current will also be perhaps in the order of several hundred microamps. Wake-up After the system enters the SLEEP or IDLE Mode, it can be woken up from one of various sources listed as follows: • An external reset • An external falling edge on Port A • A system interrupt • A WDT overflow If the system is woken up by an external reset, the device will experience a full system reset, however, if the device is woken up by a WDT overflow, a Watchdog Timer reset will be initiated. Although both of these wake-up methods will initiate a reset operation, the actual source of the wake-up can be determined by examining the TO and PDF flags. The PDF flag is cleared by a system power-up or executing the clear Watchdog Timer instructions and is set when executing the ″HALT″ instruction. The TO flag is set if a WDT time-out occurs, and causes a wake-up that only resets the Program Counter and Stack Pointer, the other flags remain in their original status. Each pin on Port A can be setup using the PAWU register to permit a negative transition on the pin to wake-up the system. When a Port A pin wake-up occurs, the program will resume execution at the instruction following the ″HALT″ instruction. If the system is woken up by an interrupt, then two possible situations may occur. The first is where the related interrupt is disabled or the interrupt is enabled but the stack is full, in which case the program will resume execution at the instruction following the ″HALT″ instruction. In this situation, the interrupt which woke-up the device will not be immediately serviced, but will rather be serviced later when the related interrupt is finally enabled or when a stack level becomes free. The other situation is where the related interrupt is enabled and the stack is not full, in which case the regular interrupt response takes place. If an interrupt request flag is set high before entering the SLEEP or IDLE Mode, the wake-up function of the related interrupt will be disabled. Rev. 1.00 43 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Programming Considerations The high speed and low speed oscillators both use the same SST counter. For example, if the system is woken up from the SLEEP0 Mode and both the HIRC and LIRC oscillators need to start-up from an off state. The LIRC oscillator uses the SST counter after HIRC oscillator has finished its SST period. • If the device is woken up from the SLEEP0 Mode to the NORMAL Mode, the high speed system oscillator needs an SST period. The device will execute first instruction after HTO is ″1″. At this time, the LIRC oscillator may not be stability. The same situation occurs in the power-on state. The LIRC oscillator is not ready yet when the first instruction is executed. • If the device is woken up from the SLEEP1 Mode to NORMAL Mode, and the system clock source is from HXT oscillator and FSTEN is ″1″, the system clock can be switched to the LIRC oscillator after wake up. • There are peripheral functions, such as TMs, for which the fSYS is used. If the system clock source is switched from fH to fL, the clock source to the peripheral functions mentioned above will change accordingly. • The on/off condition of the LIRC oscillator depends upon whether the WDT function is enabled or disabled. Watchdog Timer The Watchdog Timer is provided to prevent program malfunctions or sequences from jumping to unknown locations, due to certain uncontrollable external events such as electrical noise. Watchdog Timer Clock Source The Watchdog Timer clock source is provided by the internal clock, fS, which is in turn supplied by the LIRC oscillator. The LIRC internal oscillator has an approximate period of 32kHz at a supply voltage of 3V. However, it should be noted that this specified internal clock period can vary with VDD, temperature and process variations. The Watchdog Timer source clock is then subdivided by a ratio of 28 to 218 to give longer timeouts, the actual value being chosen using the WS2~WS0 bits in the WDTC register. Watchdog Timer Control Register A single register, WDTC, controls the required timeout period as well as the enable/disable operation. This register together with the corresponding configuration option control the overall operation of the Watchdog Timer. Rev. 1.00 44 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU WDTC Register Bit 7 6 5 4 3 2 1 0 Name WE4 WE3 WE2 WE1 WE0 WS2 WS1 WS0 R/W R/W R/W R/W R/W R/W R/W R/W R/W POR 0 1 0 1 0 0 1 1 Bit 7~3WE4~WE0: WDT function software control If the WDT configuration option is ″always enable″: 10101 or 01010: WDT Enabled Other values: Reset MCU If the WDT configuration option is ″controlled by the WDT control register″: 10101: WDT Disabled 01010: WDT Enabled Other values: Reset MCU When these bits are changed by the environmental noise or software setting to reset the microcontroller, the reset operation will be activated after 2~3 LIRC clock cycles and the WRF bit in the CTRL register will be set to 1. Bit 2~0 WS2, WS1, WS0: WDT time-out period selection 000: 28/fS 001: 210/fS 010: 212/fS 011: 214/fS 100: 215/fS 101: 216/fS 110: 217/fS 111: 218/fS These three bits determine the division ratio of the Watchdog Timer source clock, which in turn determines the timeout period. CTRL Register Bit 7 6 5 4 3 2 Name FSYSON — — R/W R/W — — POR 0 — — — 1 0 — — — — LVRF LRF WRF R/W R/W — R/W x 0 0 ″x″ unknown Bit 7FSYSON: fSYS Control in IDLE Mode 0: Disable 1: Enable Bit 6~3 Unimplemented, read as “0” Bit 2LVRF: LVR function reset flag 0: Not occur 1: Occurred This bit is set to 1 when a specific Low Voltage Reset situation condition occurs. This bit can only be cleared to 0 by the application program. Bit 1LRF: LVR Control register software reset flag 0: Not occur 1: Occurred This bit is set to 1 if the LVRC register contains any non defined LVR voltage register values. This in effect acts like a software reset function. This bit can only be cleared to 0 by the application program. Bit 0WRF: WDT Control register software reset flag 0: Not occurred 1: Occurred This bit is set to 1 by the WDT Control register software reset and cleared by the application program. Note that this bit can only be cleared to 0 by the application program. Rev. 1.00 45 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Watchdog Timer Operation The Watchdog Timer operates by providing a device reset when its timer overflows. This means that in the application program and during normal operation the user has to strategically clear the Watchdog Timer before it overflows to prevent the Watchdog Timer from executing a reset. This is done using the clear watchdog instruction. If the program malfunctions for whatever reason, jumps to an unknown location, or enters an endless loop, the clear watchdog instruction will not be executed in the correct manner, in which case the Watchdog Timer will overflow and reset the device. The Watchdog Timer enable/disable control is selected using the configuration option. With regard to the Watchdog Timer enable/disable function, there are also five bits, WE4~WE0, in the WDTC register to offer additional enable/disable and reset control of the Watchdog Timer. If the WDT configuration option is determined that the WDT function is always enabled, the WE4~WE0 bits still have effects on the WDT function. When the WE4~WE0 bits value is equal to 01010B or 10101B, the WDT function is enabled. However, if the WE4~WE0 bits are changed to any other values except 01010B and 10101B, which is caused by the environmental noise or software setting, it will reset the microcontroller after 2~3 LIRC clock cycles. If the WDT configuration option is determined that the WDT function is controlled by the WDT control register, the WE4~WE0 values can determine which mode the WDT operates in. The WDT function will be disabled when the WE4~WE0 bits are set to a value of 10101B. The WDT function will be enabled if the WE4~WE0 bits value is equal to 01010B. If the WE4~WE0 bits are set to any other values by the environmental noise or software setting, except 01010B and 10101B, it will reset the device after 2~3 LIRC clock cycles. After power on these bits will have the value of 01010B. WDT Configuration Option Always Enabled Controlled by WDT Control Register WE4 ~ WE0 Bits WDT Function 01010B or 10101B Enable Any other value Reset MCU 10101B Disable 01010B Enable Any other value Reset MCU Watchdog Timer Enable/Disable Control Under normal program operation, a Watchdog Timer time-out will initialise a device reset and set the status bit TO. However, if the system is in the SLEEP or IDLE Mode, when a Watchdog Timer time-out occurs, the TO bit in the status register will be set and only the Program Counter and Stack Pointer will be reset. Three methods can be adopted to clear the contents of the Watchdog Timer. The first is a WDT reset, which means a certain value except 01010B and 10101B written into the WE4~WE0 bit filed, the second is using the Watchdog Timer software clear instructions and the third is via a HALT instruction. There is only one method of using software instruction to clear the Watchdog Timer. That is to use the single ″CLR WDT″ instruction to clear the WDT. The maximum time out period is when the 218 division ratio is selected. As an example, with a 32kHz LIRC oscillator as its source clock, this will give a maximum watchdog period of around 8 second for the 218 division ratio, and a minimum timeout of 7.8ms for the 28 division ration. Rev. 1.00 46 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU WDTC Register Reset MCU WE4~WE0 bits CLR “CLR WDT”Instruction LIRC fS fLIRC 8-stage Divider fS/28 WS2~WS0 (fS/28 ~ fS/218) WDT Prescaler 8-to-1 MUX WDT Time-out (28/fS ~ 218/fS) Watchdog Timer Reset and Initialisation A reset function is a fundamental part of any microcontroller ensuring that the device can be set to some predetermined condition irrespective of outside parameters. The most important reset condition is after power is first applied to the microcontroller. In this case, internal circuitry will ensure that the microcontroller, after a short delay, will be in a well defined state and ready to execute the first program instruction. After this power-on reset, certain important internal registers will be set to defined states before the program commences. One of these registers is the Program Counter, which will be reset to zero forcing the microcontroller to begin program execution from the lowest Program Memory address. Another type of reset is when the Watchdog Timer overflows and resets the . All types of reset operations result in different register conditions being setup. Another reset exists in the form of a Low Voltage Reset, LVR, where a full reset is implemented in situations where the power supply voltage falls below a certain threshold. Reset Functions There are several ways in which a microcontroller reset can occur, through events occurring both internally and externally: • Power-on Reset The most fundamental and unavoidable reset is the one that occurs after power is first applied to the . As well as ensuring that the Program Memory begins execution from the first memory address, a power-on reset also ensures that certain other registers are preset to known conditions. All the I/O port and port control registers will power up in a high condition ensuring that all pins will be first set to inputs. Note: tRSTD is power-on delay, typical time=50ms Power-on Reset Timing Chart Rev. 1.00 47 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU • Low Voltage Reset – LVR The microcontroller contains a low voltage reset circuit in order to monitor the supply voltage of the device. The LVR function is always enabled with a specific LVR voltage VLVR. If the supply voltage of the device drops to within a range of 0.9V~VLVR such as might occur when changing the battery, the LVR will automatically reset the device internally and the LVRF bit in the CTRL register will also be set to 1. For a valid LVR signal, a low supply voltage, i.e., a voltage in the range between 0.9V~VLVR must exist for a time greater than that specified by tLVR in the A.C. characteristics. If the low supply voltage state does not exceed this value, the LVR will ignore the low supply voltage and will not perform a reset function. The actual VLVR value is selected by the LVS bits in the LVRC register. If the LVS7~LVS0 bits are changed to some certain values by the environmental noise or software setting, the LVR will reset the device after 2~3 LIRC clock cycles. When this happens, the LRF bit in the CTRL register will be set to 1. After power on the register will have the value of 01010101B. Note that the LVR function will be automatically disabled when the device enters the power down mode. Note: tRSTD is power-on delay, typical time=16.7ms Low Voltage Reset Timing Chart • Watchdog Time-out Reset during Normal Operation The Watchdog time-out Reset during normal operation is the same as a Power-on reset except that the Watchdog time-out flag TO will be set to “1”. Note: tRSTD is power-on delay, typical time=16.7ms WDT Time-out Reset during Normal Operation Timing Chart • Watchdog Time-out Reset during SLEEP or IDLE Mode The Watchdog time-out Reset during SLEEP or IDLE Mode is a little different from other kinds of reset. Most of the conditions remain unchanged except that the Program Counter and the Stack Pointer will be cleared to “0” and the TO flag will be set to “1”. Refer to the A.C. Characteristics for tSST details. Note: The tSST is 15~16 clock cycles if the system clock source is provided by HIRC. The tSST is 128 clock for HXT. The tSST is 1~2 clock for LIRC. WDT Time-out Reset during SLEEP or IDLE Timing Chart Rev. 1.00 48 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU LVRC Register Bit 7 6 5 4 3 2 1 0 Name LVS7 LVS6 LVS5 LVS4 LVS3 LVS2 LVS1 LVS0 R/W R/W R/W R/W R/W R/W R/W R/W R/W POR 0 1 0 1 0 1 0 1 Bit 7~0LVS7~LVS0: LVR Voltage Select 01010101B: 1.8V(default) 00110011B: 2.0V 10011001B: 2.4V 10101010B: 2.7V Any other value: Generates MCU reset – LVRC register is reset to POR value When an actual low voltage condition occurs, as specified by one of the four defined LVR voltage values above, an MCU reset will be generated. The reset operation will be activated after 2~3 LIRC clock cycles. In this situation the register contents will remain the same after such a reset occurs. Any register value, other than the four defined LVR values above, will also result in the generation of an MCU reset. The reset operation will be activated after 2~3 LIRC clock cycles.However in this situation the register contents will be reset to the POR value. CTRL Register Bit 7 6 5 4 3 2 Name FSYSON — — R/W R/W — — POR 0 — — — 1 0 — — — — LVRF LRF WRF R/W R/W — R/W x 0 0 ″x″ unknown Bit 7FSYSON: fSYS Control in IDLE Mode Describe elsewhere. Bit 6~3 Unimplemented, read as “0” Bit 2LVRF: LVR function reset flag 0: Not occur 1: Occurred This bit is set to 1 when a specific Low Voltage Reset situation condition occurs. This bit can only be cleared to 0 by the application program. Bit 1LRF: LVR Control register software reset flag 0: Not occur 1: Occurred This bit is set to 1 if the LVRC register contains any non defined LVR voltage register values. This in effect acts like a software reset function. This bit can only be cleared to 0 by the application program. Bit 0WRF: WDT Control register software reset flag Describe elsewhere. Rev. 1.00 49 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Reset Initial Conditions The different types of reset described affect the reset flags in different ways. These flags, known as PDF and TO are located in the status register and are controlled by various microcontroller operations, such as the SLEEP or IDLE Mode function or Watchdog Timer. The reset flags are shown in the table: TO PDF RESET Conditions 0 0 Power-on reset u u LVR reset during NORMAL or SLOW Mode operation 1 u WDT time-out reset during NORMAL or SLOW Mode operation 1 1 WDT time-out reset during IDLE or SLEEP Mode operation “u” stands for unchanged The following table indicates the way in which the various components of the microcontroller are affected after a power-on reset occurs. Item Condition After RESET Program Counter Reset to zero Interrupts All interrupts will be disabled WDT Clear after reset, WDT begins counting Timer Modules Timer Counter will be turned off Input/Output Ports I/O ports will be setup as inputs, and AN0~AN3 as A/D input pins Stack Pointer Stack Pointer will point to the top of the stack The different kinds of resets all affect the internal registers of the in different ways. To ensure reliable continuation of normal program execution after a reset occurs, it is important to know what condition the is in after a particular reset occurs. The following table describes how each type of reset affects each of the internal registers. Note that where more than one package type exists the table will reflect the situation for the larger package type. HT66F017L HT66F016L Register Reset (Power On) LVR Reset WDT Time-out (Normal Operation) WDT Time-out (IDLE)* MP0 ● ● xxxx xxxx xxxx xxxx xxxx xxxx uuuu uuuu MP1 ● ● xxxx xxxx xxxx xxxx xxxx xxxx uuuu uuuu BP ● ● ---- ---0 ---- ---0 ---- ---0 ---- ---u ACC ● ● xxxx xxxx uuuu uuuu uuuu uuuu uuuu uuuu PCL ● ● 0000 0000 0000 0000 0000 0000 0000 0000 TBLP ● ● xxxx xxxx uuuu uuuu uuuu uuuu uuuu uuuu TBLH ● ● xxxx xxxx uuuu uuuu uuuu uuuu uuuu uuuu ● ---- -xxx - - - - - uuu - - - - - uuu - - - - - uuu ---- --xx - - - - - - uu - - - - - - uu - - - - - - uu TBHP TBHP ● STATUS ● ● --00 xxxx - - uu uuuu - - 1 u uuuu - - 1 1 uuuu SMOD ● ● 11 0 0 0 0 1 0 11 0 0 0 0 1 0 11 0 0 0 0 1 0 uuuu uuuu LVDC ● ● --00 -000 --00 -000 --00 -000 - - uu - uuu INTEG ● ● ---- 0000 ---- 0000 ---- 0000 - - - - uuuu INTC0 ● ● -000 0000 -000 0000 -000 0000 - uuu uuuu INTC1 ● ● 0000 0000 0000 0000 0000 0000 uuuu uuuu INTC2 ● ● --00 --00 --00 --00 --00 --00 - - uu - - uu MFI0 ● ● --00 --00 --00 --00 --00 --00 - - uu - - uu Rev. 1.00 50 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU HT66F017L HT66F016L Register Reset (Power On) LVR Reset WDT Time-out (Normal Operation) WDT Time-out (IDLE)* MFI1 ● ● --00 --00 --00 --00 --00 --00 - - uu - - uu MFI2 ● ● --00 --00 --00 --00 --00 --00 - - uu - - uu PA ● ● 1111 1111 1111 1111 1111 1111 uuuu uuuu PAC ● ● 1111 1111 1111 1111 1111 1111 uuuu uuuu PAPU ● ● 0000 0000 0000 0000 0000 0000 uuuu uuuu PAWU ● ● 0000 0000 0000 0000 0000 0000 uuuu uuuu PB ● ● - - - 1 1111 - - - 1 1111 - - - 1 1111 - - - u uuuu PBC ● ● - - - 1 1111 - - - 1 1111 - - - 1 1111 - - - u uuuu PBPU ● ● ---0 0000 ---0 0000 ---0 0000 - - - u uuuu PRM ● ● 0101 0000 0101 0000 0101 0000 uuuu uuuu TMPC ● ● ---- --00 ---- --00 ---- --00 - - - - - - uu WDTC ● ● 0 1 0 1 0 0 11 0 1 0 1 0 0 11 0 1 0 1 0 0 11 uuuu uuuu TBC ● ● 0 0 11 - 111 0 0 11 - 111 0 0 11 - 111 uuuu - uuu EEC ● ● ---- 0000 ---- 0000 ---- 0000 - - - - uuuu EEA ● ● --00 0000 --00 0000 --00 0000 - - uu uuuu EED ● ● 0000 0000 0000 0000 0000 0000 uuuu uuuu ADRL(ADRFS=0) ● ● xxxx ---- xxxx ---- xxxx ---- uuuu - - - - ADRL(ADRFS=1) ● ● xxxx xxxx xxxx xxxx xxxx xxxx uuuu uuuu ADRH(ADRFS=0) ● ● xxxx xxxx xxxx xxxx xxxx xxxx uuuu uuuu ADRH(ADRFS=1) ● ● ---- xxxx ---- xxxx ---- xxxx - - - - uuuu ADCR0 ● ● 0 11 0 - - 0 0 0 11 0 - - 0 0 0 11 0 - - 0 0 uuu - uuuu ADCR1 ● ● 00-0 -000 00-0 -000 00-0 -000 uu - u - uuu ACERL ● ● - - - - 1111 - - - - 1111 - - - - 1111 - - - - uuuu CPC ● ● 1000 00-1 1000 00-1 1000 00-1 uuuu uu - u CTRL ● ● 0--- -x00 0--- -000 0--- -000 u - - - - uuu LVRC ● ● 0101 0101 0101 0101 0101 0101 uuuu uuuu TM0C0 ● ● 0000 0--- 0000 0--- 0000 0--- uuuu u - - - TM0C1 ● ● 0000 0000 0000 0000 0000 0000 uuuu uuuu TM0DL ● ● 0000 0000 0000 0000 0000 0000 uuuu uuuu TM0DH ● ● 0000 0000 0000 0000 0000 0000 uuuu uuuu TM0AL ● ● 0000 0000 0000 0000 0000 0000 uuuu uuuu TM0AH ● ● 0000 0000 0000 0000 0000 0000 uuuu uuuu TM0RP ● ● 0000 0000 0000 0000 0000 0000 uuuu uuuu TM1C0 ● ● 0000 0--- 0000 0--- 0000 0--- uuuu u - - - TM1C1 ● ● 0000 0000 0000 0000 0000 0000 uuuu uuuu TM1DL ● ● 0000 0000 0000 0000 0000 0000 uuuu uuuu TM1DH ● ● 0000 0000 0000 0000 0000 0000 uuuu uuuu TM1AL ● ● 0000 0000 0000 0000 0000 0000 uuuu uuuu TM1AH ● ● 0000 0000 0000 0000 0000 0000 uuuu uuuu TM1RP ● ● 0000 0000 0000 0000 0000 0000 uuuu uuuu DCC ● ● --00 0000 --00 0000 --00 0000 - - uu uuuu Note: ″u″ stands for unchanged ″x″ stands for unknown ″−″ stands for unimplemented Rev. 1.00 51 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Input/Output Ports Holtek microcontrollers offer considerable flexibility on their I/O ports. With the input or output designation of every pin fully under user program control, pull-high selections for all ports and wake-up selections on certain pins, the user is provided with an I/O structure to meet the needs of a wide range of application possibilities. The device provides bidirectional input/output lines labeled with port names PA and PB. These I/O ports are mapped to the RAM Data Memory with specific addresses as shown in the Special Purpose Data Memory table. All of these I/O ports can be used for input and output operations. For input operation, these ports are non-latching, which means the inputs must be ready at the T2 rising edge of instruction ″MOV A,[m]″, where m denotes the port address. For output operation, all the data is latched and remains unchanged until the output latch is rewritten. I/O Register List Bit Register Name 7 6 5 4 3 2 1 0 PAWU D7 D6 D5 D4 D3 D2 D1 D0 PAPU D7 D6 D5 D4 D3 D2 D1 D0 PAC D7 D6 D5 D4 D3 D2 D1 D0 PA D7 D6 D5 D4 D3 D2 D1 D0 PBPU — — — D4 D3 D2 D1 D0 PB — — — D4 D3 D2 D1 D0 PBC — — — D4 D3 D2 D1 D0 PRM PRML3 PRML2 PRML1 PRML0 PRMS3 PRMS2 PRMS1 PRMS0 Pull-high Resistors Many product applications require pull-high resistors for their switch inputs usually requiring the use of an external resistor. To eliminate the need for these external resistors, all I/O pins, when configured as an input have the capability of being connected to an internal pull-high resistor. These pull-high resistors are selected using the register PAPU and PBPU, and are implemented using weak PMOS transistors. PAPU Register Bit 7 6 5 4 3 2 1 0 Name D7 D6 D5 D4 D3 D2 D1 D0 R/W R/W R/W R/W R/W R/W R/W R/W R/W POR 0 0 0 0 0 0 0 0 Bit 7~0 Rev. 1.00 I/O Port A bit 7~bit 0 Pull-high Control 0: Disable 1: Enable 52 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU PBPU Register Bit 7 6 5 4 Name ─ ─ ─ D4 D3 D2 D1 D0 R/W ─ ─ ─ R/W R/W R/W R/W R/W POR ─ ─ ─ 0 0 0 0 0 Bit 7~5 ″─″ Unimplemented, read as 0 Bit 4~0 I/O Port B bit 4~bit 0 Pull-high Control 0: Disable 1: Enable 3 2 1 0 Port A Wake-up The HALT instruction forces the microcontroller into the SLEEP or IDLE Mode which preserves power, a feature that is important for battery and other low-power applications. Various methods exist to wake-up the microcontroller, one of which is to change the logic condition on one of the Port A pins from high to low. This function is especially suitable for applications that can be woken up via external switches. Each pin on Port A can be selected individually to have this wake-up feature using the PAWU register. PAWU Register Bit 7 6 5 4 3 2 1 0 Name D7 D6 D5 D4 D3 D2 D1 D0 R/W R/W R/W R/W R/W R/W R/W R/W R/W POR 0 0 0 0 0 0 0 0 Bit 7~0PAWU: Port A bit 7~bit 0 Wake-up Control 0: Disable 1: Enable I/O Port Control Registers The I/O port has its own control register known as PAC and PBC, to control the input/output configuration. With this control register, each CMOS output or input can be reconfigured dynamically under software control. Each pin of the I/O port is directly mapped to a bit in its associated port control register. For the I/O pin to function as an input, the corresponding bit of the control register must be written as a ″1″. This will then allow the logic state of the input pin to be directly read by instructions. When the corresponding bit of the control register is written as a ″0″, the I/O pin will be setup as a CMOS output. If the pin is currently setup as an output, instructions can still be used to read the output register. However, it should be noted that the program will in fact only read the status of the output data latch and not the actual logic status of the output pin. PAC Register Bit 7 6 5 4 3 2 1 0 Name D7 D6 D5 D4 D3 D2 D1 D0 R/W R/W R/W R/W R/W R/W R/W R/W R/W POR 1 1 1 1 1 1 1 1 Bit 7~0 Rev. 1.00 I/O Port A bit 7 ~ bit 0 Input/Output Control 0: Output 1: Input 53 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU PBC Register Bit 7 6 5 4 3 Name ─ ─ ─ D4 D3 D2 D1 D0 R/W ─ ─ ─ R/W R/W R/W R/W R/W POR ─ ─ ─ 1 1 1 1 1 Bit 7~5 ″─″ Unimplemented, read as 0 Bit 4~0 I/O Port A bit 4 ~ bit 0 Input/Output Control 0: Output 1: Input 2 1 0 Pin-remapping Functions The flexibility of the microcontroller range is greatly enhanced by the use of pins that have more than one function. Limited numbers of pins can force serious design constraints on designers but by supplying pins with multi-functions, many of these difficulties can be overcome. The way in which the pin function of each pin is selected is different for each function and a priority order is established where more than one pin function is selected simultaneously. Additionally there is a PRM register to establish certain pin functions. Generally speaking, the analog function has higher priority than the digital function. However, if more than two analog functions are enabled and the analog signal input comes from the same external pin, the analog input will be internally connected to all of these active analog functional modules. Pin-remapping Registers The limited number of supplied pins in a package can impose restrictions on the amount of functions a certain device can contain. However by allowing the same pins to share several different functions and providing a means of function selection, a wide range of different functions can be incorporated into even relatively small package sizes. PRM Register Bit Register Name 7 6 5 4 3 2 1 0 Name PRML3 PRML2 PRML1 PRML0 PRMS3 PRMS2 PRMS1 PRMS0 R/W R/W R/W R/W R/W R/W R/W R/W R/W POR 0 1 0 1 0 0 0 0 Bit 7~4PRML3~PRML0: pin-remapping function lock bits (default: 0101) 1010: PRM register write operation is enabled Others: PRM register write operation is disabled Bit 3PRMS3: INT1 pin-remapping function selection bit 0: INT1 on PA5 1: INT1 on PA4 Bit 2PRMS2: INT0/TCK1 pin-remapping function selection bit 0: INT0 on PA3, TCK1 on PA3 1: INT0 on PA2, TCK1 on PA2 Bit 1~0PRMS1~PRMS0: pin-remapping function selection bits 00: TP0 on PA3, TP1/TCK0 on PA4 01: TP0 on PB0, TP1/TCK0 on PB1 10: TP0 on PA5, TP1/TCK0 on PA6 11: TP0 on PA2, TP1/TCK0 on PA7 Rev. 1.00 54 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU I/O Pin Structures The accompanying diagrams illustrate the internal structures of some generic I/O pin types. As the exact logical construction of the I/O pin will differ from these drawings, they are supplied as a guide only to assist with the functional understanding of the I/O pins. The wide range of pin-shared structures does not permit all types to be shown. Generic Input/Output Structure A/D Input/Output Structure Rev. 1.00 55 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Programming Considerations Within the user program, one of the first things to consider is port initialisation. After a reset, all of the I/O data and port control registers will be set high. This means that all I/O pins will default to an input state, the level of which depends on the other connected circuitry and whether pullhigh selections have been chosen. If the port control registers, PAC and PBC, are then programmed to setup some pins as outputs, these output pins will have an initial high output value unless the associated port data registers, PA and PB, are first programmed. Selecting which pins are inputs and which are outputs can be achieved byte-wide by loading the correct values into the appropriate port control register or by programming individual bits in the port control register using the ″SET [m]. i″ and ″CLR [m].i″ instructions. Note that when using these bit control instructions, a read-modifywrite operation takes place. The microcontroller must first read in the data on the entire port, modify it to the required new bit values and then rewrite this data back to the output ports. The power-on reset condition of the A/D converter control registers ensures that any A/D input pins - which are always shared with other I/O functions - will be setup as analog inputs after a reset. Although these pins will be configured as A/D inputs after a reset, the A/D converter will not be switched on. It is therefore important to note that if it is required to use these pins as I/O digital input pins or as other functions, the A/D converter control registers must be correctly programmed to remove the A/D function. Note also that as the A/D channel is enabled, any internal pull-high resistor connections will be removed. Port A has the additional capability of providing wake-up functions. When the device is in the SLEEP or IDLE Mode, various methods are available to wake the device up. One of these is a high to low transition of any of the Port A pins. Single or multiple pins on Port A can be setup to have this function. Rev. 1.00 56 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Timer Modules – TM One of the most fundamental functions in any microcontroller device is the ability to control and measure time. To implement time related functions each device includes several Timer Modules, abbreviated to the name TM. The TMs are multi-purpose timing units and serve to provide operations such as Timer/Counter, Input Capture, Compare Match Output and Single Pulse Output as well as being the functional unit for the generation of PWM signals. Each of the TMs has two individual interrupts. The addition of input and output pins for each TM ensures that users are provided with timing units with a wide and flexible range of features. The common features of the different TM types are described here with more detailed information provided in the individual Compact and Standard TM sections. Introduction The devices contain two TMs with each TM having a reference name of TM0 and TM1. Each individual TM can be categorised as a certain type, namely Compact Type TM (CTM) or Standard Type TM (STM). Although similar in nature, the different TM types vary in their feature complexity. The common features to all of the Compact and Standard TMs will be described in this section and the detailed operation regarding each of the TM types will be described in separate sections. The main features and differences between the two types of TMs are summarised in the accompanying table. Function CTM STM Timer/Counter √ √ I/P Capture ─ √ Compare Match Output √ √ PWM Channels 1 1 Single Pulse Output ─ 1 Edge Edge Duty or Period Duty or Period PWM Alignment PWM Adjustment Period & Duty TM Function Summary Each device in the series contains a Compact Type and Standard Type TM units which are shown in the table together with their individual reference name, TM0 and TM1. Device TM0 TM1 HT66F016L / HT66F017L 16-bit CTM 16-bit STM TM Name/Type Reference TM Operation The two different types of TM offer a diverse range of functions, from simple timing operations to PWM signal generation. The key to understanding how the TM operates is to see it in terms of a free running counter whose value is then compared with the value of pre-programmed internal comparators. When the free running counter has the same value as the pre-programmed comparator, known as a compare match situation, a TM interrupt signal will be generated which can clear the counter and perhaps also change the condition of the TM output pin. The internal TM counter is driven by a user selectable clock source, which can be an internal clock or an external pin. Rev. 1.00 57 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU TM Clock Source The clock source which drives the main counter in each TM can originate from various sources. The selection of the required clock source is implemented using the TnCK2~TnCK0 bits in the TM control registers. The clock source can be a ratio of either the system clock fSYS or the internal high clock fH, the fTBC clock source or the external TCKn pin. The TCKn pin clock source is used to allow an external signal to drive the TM as an external clock source or for event counting. TM Interrupts The Compact and Standard type TMs each have two internal interrupts, one for each of the internal comparator A or comparator P, which generate a TM interrupt when a compare match condition occurs. When a TM interrupt is generated it can be used to clear the counter and also to change the state of the TM output pin. TM External Pins Each of the TMs, irrespective of what type, has one TM input pin, with the label TCKn. The TM input pin, is essentially a clock source for the TM and is selected using the TnCK2~TnCK0 bits in the TMnC0 register. This external TM input pin allows an external clock source to drive the internal TM. This external TM input pin is shared with other functions but will be connected to the internal TM if selected using the TnCK2~TnCK0 bits. The TM input pin can be chosen to have either a rising or falling active edge. The TMs each have one output pin with the label TPn. When the TM is in the Compare Match Output Mode, these pins can be controlled by the TM to switch to a high or low level or to toggle when a compare match situation occurs. The external TPn output pin is also the pin where the TM generates the PWM output waveform. The TPn pin acts as an input when the TM is setup to operate in the Capture Input Mode. As the TPn pins are pin-shared with other functions, the TPn pin function is enabled or disabled according to the internal TM on/off control, operation mode and output control settings. When the corresponding TM configuration selects the TPn pin to be used as an output pin, the associated pin will be setup as an external TM output pin. If the TM configuration selects the TPn pin to be setup as an input pin, the input signal supplied on the associated pin can be derived from an external signal and other pin-shared output function. If the TM configuration determines that the TPn pin function is not used, the associated pin will be controlled by other pin-shared functions. The details of the TPn pin for each TM type and device are provided in the accompanying table. Device HT66F016L HT66F017L CTM STM TP0 TP1 TM Output Pins Rev. 1.00 58 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU TM Function Pin Control Block Diagram TM Input/Output Pin Control Registers Selecting to have a TM input/output or whether to retain its other shared functions is implemented using one register with a single bit in each register corresponding to a TM input/output pin. Setting the bit high will setup the corresponding pin as a TM input/output if reset to zero the pin will retain its original other functions. TMPC Register Bit Rev. 1.00 7 6 5 4 3 2 1 0 Name — — — — — — T1CP T0CP R/W — — — — — — R/W R/W POR — — — — — — 0 0 Bit 7~2 Unimplemented, read as "0" Bit 1 T1CP: TP1 pin control 0: disable TP1 pin function 1: enable TP1 pin function Bit 1 T0CP: TP0 pin control 0: disable TP0 pin function 1: enable TP0 pin function 59 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Programming Considerations The TM Counter Registers and the Capture/Compare CCRA registers, being 16-bit, all have a low and high byte structure. The high bytes can be directly accessed, but as the low bytes can only be accessed via an internal 8-bit buffer, reading or writing to these register pairs must be carried out in a specific way. The important point to note is that data transfer to and from the 8-bit buffer and its related low byte only takes place when a write or read operation to its corresponding high byte is executed. As the CCRA registers are implemented in the way shown in the following diagram and accessing these register pairs is carried out in a specific way described above, it is recommended to use the "MOV" instruction to access the CCRA low byte registers, named TMxAL, using the following access procedures. Accessing the CCRA low byte registers without following these access procedures will result in unpredictable values. The following steps show the read and write procedures: • Writing Data to CCRA ♦♦ Step 1. Write data to Low Byte TMxAL ––note that here data is only written to the 8-bit buffer. ♦♦ Step 2. Write data to High Byte TMxAH ––here data is written directly to the high byte registers and simultaneously data is latched from the 8-bit buffer to the Low Byte registers. • Reading Data from the Counter Registers and CCRA ♦♦ Step 1. Read data from the High Byte TMxDH, TMxAH ––here data is read directly from the High Byte registers and simultaneously data is latched from the Low Byte register into the 8-bit buffer. ♦♦ Step 2. Read data from the Low Byte TMxDL, TMxAL ––this step reads data from the 8-bit buffer. Rev. 1.00 60 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Compact Type TM – CTM Although the simplest form of the TM types, the Compact TM type still contains three operating modes, which are Compare Match Output, Timer/Event Counter and PWM Output modes. The Compact TM can also be controlled with an external input pin and can drive one external output pin. CTM Name TM No. TM Input Pin TM Output Pin HT66F016L HT66F017L 16-bit CTM 0 TCK0 TP0 Compact Type TM Block Diagram Compact TM Operation At its core is a 16-bit count-up counter which is driven by a user selectable internal or external clock source. There are also two internal comparators with the names, Comparator A and Comparator P. These comparators will compare the value in the counter with CCRP and CCRA registers. The CCRP is 8-bit wide whose value is compared with the highest eight bits in the counter while the CCRA is 16-bit wide and therefore compares with all counter bits. The only way of changing the value of the 16-bit counter using the application program, is to clear the counter by changing the TnON bit from low to high. The counter will also be cleared automatically by a counter overflow or a compare match with one of its associated comparators. When these conditions occur, a TM interrupt signal will also usually be generated. The Compact Type TM can operate in a number of different operational modes, can be driven by different clock sources including an input pin and can also control an output pin. All operating setup conditions are selected using relevant internal registers. Compact Type TM Register Description Overall operation of the Compact TM is controlled using a series of registers. A read only register pair exists to store the internal counter 16-bit value, while a read/write register pair exists to store the internal 16-bit CCRA value. There is also a read/write register used to store the internal 8-bit CCRP value. The remaining two registers are control registers which setup the different operating and control modes. Rev. 1.00 61 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU CTM Register List Name Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 TM0C0 T0PAU T0CK2 T0CK1 T0CK0 T0ON — — — TM0C1 T0M1 T0M0 T0IO1 T0IO0 T0OC T0POL T0DPX T0CCLR TM0DL D7 D6 D5 D4 D3 D2 D1 D0 TM0DH D15 D14 D13 D12 D11 D10 D9 D8 TM0AL D7 D6 D5 D4 D3 D2 D1 D0 TM0AH D15 D14 D13 D12 D11 D10 D9 D8 TM0RP T0RP7 T0RP6 T0RP5 T0RP4 T0RP3 T0RP2 T0RP1 T0RP0 16-bit Compact TM Register List TM0DL Register Bit 7 6 5 4 3 2 1 0 Name D7 D6 D5 D4 D3 D2 D1 D0 R/W R R R R R R R R POR 0 0 0 0 0 0 0 0 Bit 7~0 TM0DL: TM0 counter low byte register bit 7 ~ bit 0 TM0 16-bit Counter bit 7 ~ bit 0 TM0DH Register Bit 7 6 5 4 3 2 1 0 Name D15 D14 D13 D12 D11 D10 D9 D8 R/W R R R R R R R R POR 0 0 0 0 0 0 0 0 2 1 0 Bit 7~0 TM0DH: TM0 counter high byte register bit 7 ~ bit 0 TM0 16-bit counter bit 15 ~ bit 8 TM0AL Register Bit 7 6 5 4 3 Name D7 D6 D5 D4 D3 D2 D1 D0 R/W R/W R/W R/W R/W R/W R/W R/W R/W POR 0 0 0 0 0 0 0 0 2 1 0 Bit 7~0 TM0AL: TM0 CCRA low byte register bit 7 ~ bit 0 TM0 16-bit CCRA bit 7 ~ bit 0 TM0AH Register Bit 6 5 4 3 Name D15 D14 D13 D12 D11 D10 D9 D8 R/W R/W R/W R/W R/W R/W R/W R/W R/W POR 0 0 0 0 0 0 0 0 Bit 7~0 Rev. 1.00 7 TM0AH: TM0 CCRA high byte register bit 7 ~ bit 0 TM0 16-bit CCRA bit 15 ~ bit 8 62 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU TM0C0 Register Bit 7 6 5 4 3 2 1 0 Name T0PAU T0CK2 T0CK1 T0CK0 T0ON — — — R/W R/W R/W R/W R/W R/W — — — POR 0 0 0 0 0 — — — Bit 7 T0PAU: TM0 counter pause control 0: run 1: pause The counter can be paused by setting this bit high. Clearing the bit to zero restores normal counter operation. When in a Pause condition the TM will remain powered up and continue to consume power. The counter will retain its residual value when this bit changes from low to high and resume counting from this value when the bit changes to a low value again. Bit 6~4 T0CK2~T0CK0: Select TM0 Counter clock 000: fSYS/4 001: fSYS 010: fH/16 011: fH/64 100: fTBC 101: fH/8 110: TCK0 rising edge clock 111: TCK0 falling edge clock These three bits are used to select the clock source for the TM. The external pin clock source can be chosen to be active on the rising or falling edge. The clock source fSYS is the system clock, while fH and fTBC are other internal clocks, the details of which can be found in the oscillator section. Bit 3 T0ON: TM0 Counter On/Off Control 0: Off 1: On This bit controls the overall on/off function of the TM. Setting the bit high enables the counter to run, clearing the bit disables the TM. Clearing this bit to zero will stop the counter from counting and turn off the TM which will reduce its power consumption. When the bit changes state from low to high the internal counter value will be reset to zero, however when the bit changes from high to low, the internal counter will retain its residual value. If the TM is in the Compare Match Output Mode then the TM output pin will be reset to its initial condition, as specified by the T0OC bit, when the T0ON bit changes from low to high. Bit 2~0 "—": Unimplemented, read as 0 TM0C1 Register Bit 7 6 5 4 3 2 1 0 Name T0M1 T0M0 T0IO1 T0IO0 T0OC T0POL T0DPX T0CCLR R/W R/W R/W R/W R/W R/W R/W R/W R/W POR 0 0 0 0 0 0 0 0 Bit 7~6 Rev. 1.00 T0M1~T0M0: select TM0 operating mode 00: compare match output mode 01: undefined 10: PWM mode 11: Timer/Counter mode These bits setup the required operating mode for the TM. To ensure reliable operation the TM should be switched off before any changes are made to the T0M1 and T0M0 bits. In the Timer/Counter Mode, the TM output pin control must be disabled. 63 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Rev. 1.00 Bit 5~4 T0IO1~T0IO0: Select TP0 output function compare match output mode 00: no change 01: output low 10: output high 11: toggle output PWM Mode 00: PWM output inactive state 01: PWM output active state 10: PWM output 11: Undefined Timer/Counter mode unused These two bits are used to determine how the TM output pin changes state when a certain condition is reached. The function that these bits select depends upon in which mode the TM is running. In the Compare Match Output Mode, the T0IO1 and T0IO0 bits determine how the TM output pin changes state when a compare match occurs from the Comparator A. The TM output pin can be setup to switch high, switch low or to toggle its present state when a compare match occurs from the Comparator A. When the bits are both zero, then no change will take place on the output. The initial value of the TM output pin should be setup using the T0OC bit in the TM0C1 register. Note that the output level requested by the T0IO1 and T0IO0 bits must be different from the initial value setup using the T0OC bit otherwise no change will occur on the TM output pin when a compare match occurs. After the TM output pin changes state it can be reset to its initial level by changing the level of the T0ON bit from low to high. In the PWM Mode, the T0IO1 and T0IO0 bits determine how the TM output pin changes state when a certain compare match condition occurs. The PWM output function is modified by changing these two bits. It is necessary to change the values of the T0IO1 and T0IO0 bits only after the TMn has been switched off. Unpredictable PWM outputs will occur if the T0IO1 and T0IO0 bits are changed when the TM is running Bit 3 T0OC: TP0 output control bit compare match output mode 0: initial low 1: initial high PWM mode 0: active low 1: active high This is the output control bit for the TM output pin. Its operation depends upon whether TM is being used in the Compare Match Output Mode or in the PWM Mode. It has no effect if the TM is in the Timer/Counter Mode. In the Compare Match Output Mode it determines the logic level of the TM output pin before a compare match occurs. In the PWM Mode it determines if the PWM signal is active high or active low. Bit 2 T0POL: TP0 output polarity control 0: non-invert 1: invert This bit controls the polarity of the TP0 output pin. When the bit is set high the TM output pin will be inverted and not inverted when the bit is zero. It has no effect if the TM is in the Timer/Counter Mode. Bit 1 T0DPX: TM0 PWM period/duty control 0: CCRP - period; CCRA - duty 1: CCRP - duty; CCRA - period This bit, determines which of the CCRA and CCRP registers are used for period and duty control of the PWM waveform. 64 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Bit 0 T0CCLR: select TM0 counter clear condition 0: TM0 Comparatror P match 1: TM0 Comparatror A match This bit is used to select the method which clears the counter. Remember that the Compact TM contains two comparators, Comparator A and Comparator P, either of which can be selected to clear the internal counter. With the T0CCLR bit set high, the counter will be cleared when a compare match occurs from the Comparator A. When the bit is low, the counter will be cleared when a compare match occurs from the Comparator P or with a counter overflow. A counter overflow clearing method can only be implemented if the CCRP bits are all cleared to zero. The T0CCLR bit is not used in the PWM Mode. TM0RP Register Bit 7 6 5 4 3 2 1 0 Name T0RP7 T0RP6 T0RP5 T0RP4 T0RP3 T0RP2 T0RP1 T0RP0 R/W R/W R/W R/W R/W R/W R/W R/W R/W POR 0 0 0 0 0 0 0 0 Bit 7~0 Rev. 1.00 T0RP7~T0RP0: TM0 CCRP register bit 7~bit 0, compared with the TM0 counter bit 15~bit 8 Comparator P match period = 0: 65536 TM0 clocks 1~255: (1~255) × 256 TM0 clocks These eight bits are used to setup the value on the internal CCRP 8-bit register, which are then compared with the internal counter's highest eight bits. The result of this comparison can be selected to clear the internal counter if the T0CCLR bit is set to zero. Setting the T0CCLR bit to zero ensures that a compare match with the CCRP values will reset the internal counter. As the CCRP bits are only compared with the highest eight counter bits, the compare values exist in 256 clock cycle multiples. Clearing all eight bits to zero is in effect allowing the counter to overflow at its maximum value 65 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Compact Type TM Operating Modes The Compact Type TM can operate in one of three operating modes, Compare Match Output Mode, PWM Mode or Timer/Counter Mode. The operating mode is selected using the TnM1 and TnM0 bits in the TMnC1 register. Compare Match Output Mode To select this mode, bits TnM1 and TnM0 in the TMnC1 register, should be set to 00B respectively. In this mode once the counter is enabled and running it can be cleared by three methods. These are a counter overflow, a compare match from Comparator A and a compare match from Comparator P. When the TnCCLR bit is low, there are two ways in which the counter can be cleared. One is when a compare match occurs from Comparator P, the other is when the CCRP bits are all zero which allows the counter to overflow. Here both TnAF and TnPF interrupt request flags for the Comparator A and Comparator P respectively, will both be generated. If the TnCCLR bit in the TMnC1 register is high then the counter will be cleared when a compare match occurs from Comparator A. However, here only the TnAF interrupt request flag will be generated even if the value of the CCRP bits is less than that of the CCRA registers. Therefore when TnCCLR is high no TnPF interrupt request flag will be generated. If the CCRA bits are all zero, the counter will overflow when its reaches its maximum 16-bit, FFFF Hex, value, however here the TnAF interrupt request flag will not be generated. As the name of the mode suggests, after a comparison is made, the TM output pin will change state. The TM output pin condition however only changes state when a TnAF interrupt request flag is generated after a compare match occurs from Comparator A. The TnPF interrupt request flag, generated from a compare match occurs from Comparator P, will have no effect on the TM output pin. The way in which the TM output pin changes state are determined by the condition of the TnIO1 and TnIO0 bits in the TMnC1 register. The TM output pin can be selected using the TnIO1 and TnIO0 bits to go high, to go low or to toggle from its present condition when a compare match occurs from Comparator A. The initial condition of the TM output pin, which is setup after the TnON bit changes from low to high, is setup using the TnOC bit. Note that if the TnIO1 and TnIO0 bits are zero then no pin change will take place. Rev. 1.00 66 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Counter Value CCRP = 0 TnCCLR = 0; TnM[1:0] = 00 Counter overflow 0xFFFF CCRP > 0 Counter cleared by CCRP value CCRP > 0 CCRP Pause Resume CCRA Stop Counter Reset Time TnON bit TnPAU bit TnAPOL bit CCRP Int. Flag TnPF CCRA Int. Flag TnAF TPnA O/P Pin Output Pin set to Initial Level Low if TnOC = 0 Output Toggle with TnAF flag Now TnIO1, TnIO0 = 10 Active High Output Select Output not affected by TnAF flag. Remains High until reset by TnON bit Here TnIO1, TnIO0 = 11 Toggle Output Select Output inverts when TnPOL is high Output Pin Reset to initial value Output controlled by other pin-shared function Compare Match Output Mode – TnCCLR=0 Note: 1. With TnCCLR=0, a Comparator P match will clear the counter 2. The TM output pin is controlled only by the TnAF flag 3. The output pin is reset to its initial state by a TnON bit rising edge Rev. 1.00 67 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU TnCCLR = 1; TnM1, TnM0 = 00 Counter Value CCRA = 0 Counter overflows CCRA > 0 Counter cleared by CCRA value 0xFFFF CCRA = 0 CCRA Pause Resume Counter Reset Stop CCRP Time TnON bit TnPAU bit TnPOL bit No TnAF flag generated on CCRA overflow CCRA Int. Flag TnAF CCRP Int. Flag TnPF TM O/P Pin Output does not change TnPF not generated Output Pin set to Initial Level Low if TnOC = 0 Output not affected by TnAF flag remains High until reset by TnON bit Output Toggle with TnAF flag Now TnIO1, TnIO0 = 10 Active High Output Select Output controlled by other pin-shared function Output inverts when TnPOL is high Output Pin Reset to initial value Here TnIO1, TnIO0 = 11 Toggle Output Select Compare Match Output Mode – TnCCLR=1 Note: 1. With TnCCLR=1, a Comparator A match will clear the counter 2. The TM output pin is controlled only by the TnAF flag 3. The output pin is reset to its initial state by a TnON bit rising edge 4. The TnPF flag is not generated when TnCCLR=1 Rev. 1.00 68 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Timer/Counter Mode To select this mode, bits TnM1 and TnM0 in the TMnC1 register should be set to 11 respectively. The Timer/Counter Mode operates in an identical way to the Compare Match Output Mode generating the same interrupt flags. The exception is that in the Timer/Counter Mode the TM output pin is not used. Therefore the above description and Timing Diagrams for the Compare Match Output Mode can be used to understand its function. As the TM output pin is not used in this mode, the pin can be used as a normal I/O pin or other pin-shared function. PWM Output Mode To select this mode, bits TnM1 and TnM0 in the TMnC1 register should be set to 10 respectively. The PWM function within the TM is useful for applications which require functions such as motor control, heating control, illumination control etc. By providing a signal of fixed frequency but of varying duty cycle on the TM output pin, a square wave AC waveform can be generated with varying equivalent DC RMS values. As both the period and duty cycle of the PWM waveform can be controlled, the choice of generated waveform is extremely flexible. In the PWM mode, the TnCCLR bit has no effect on the PWM operation. Both of the CCRA and CCRP registers are used to generate the PWM waveform, one register is used to clear the internal counter and thus control the PWM waveform frequency, while the other one is used to control the duty cycle. Which register is used to control either frequency or duty cycle is determined using the TnDPX bit in the TMnC1 register. The PWM waveform frequency and duty cycle can therefore be controlled by the values in the CCRA and CCRP registers. An interrupt flag, one for each of the CCRA and CCRP, will be generated when a compare match occurs from either Comparator A or Comparator P. The TnOC bit in the TMnC1 register is used to select the required polarity of the PWM waveform while the two TnIO1 and TnIO0 bits are used to enable the PWM output or to force the TM output pin to a fixed high or low level. The TnPOL bit is used to reverse the polarity of the PWM output waveform. 16-bit CTM, PWM Mode, Edge-aligned Mode, TnDPX=0 CCRP 1~255 Period CCRP×256 Duty 0 65536 CCRA If fSYS= 16MHz, TM clock source is fSYS/4, CCRP= 2 and CCRA= 128 The CTM PWM output frequency= (fSYS/4)/(2×256)= fSYS/2048= 7.8125kHz, duty= 128/ (2×256)= 25%. If the Duty value defined by the CCRA register is equal to or greater than the Period value, then the PWM output duty is 100%. 16-bit CTM, PWM Mode, Edge-aligned Mode, TnDPX=1 CCRP 1~255 Period 0 CCRA Duty CCRP×256 65536 The PWM output period is determined by the CCRA register value together with the TM clock while the PWM duty cycle is defined by the (CCRP×256) except when the CCRP value is equal to 0. Rev. 1.00 69 July 04, 2013 HT66F016L/HT66F017L 0.9V Battery Flash A/D Type 8-Bit MCU Co�nter Va��e Co�nter C�eared b� CCRP TnDPX = 0; TnM [1:0] = 10 CCRP Co�nter reset Co�nter Stop when TnON if TnON bit �ow ret�rns high Pa�se Res�me CCRA Time TnON TnPAU TnPOL CCRA Int. F�ag TnAF CCRP Int. F�ag TnPF TM O/P Pin TnOC = 1 TM O/P Pin TnOC =